双光子微纳加工技术结合化学镀工艺制备三维金属微弹簧结构

利用飞秒激光双光子微纳加工技术与化学镀工艺制备了三维金属微弹簧结构.采用扫描电子显微镜(SEM)及选区电子能谱(EDS)对镀层进行了表征,当化学镀时间为15 min时,所得到的镀层厚度约为130 nm.对不同电镀时间下获得的镀层电阻率进行了测定,实验结果表明,当电镀时间为35 min时得到的镀层电阻率约为80×10^-9 Ω·m,仅为银块体材料电阻率16×10^-9 Ω·m的5倍.利用这种方法,我们制备了总长度为28.75 μm、周期为2.93 μm的悬空金属弹簧结构,其中弹簧圈数为9圈,直径为6 μm,弹簧线分辨率为1.17 μm.文中所述的将双光子微纳加工技术与化学镀技术相结合的方法可以实现任意三维微金属结构与器件的制备,在微光学器件、微机电系统(MEMS)及微传感器等领域有着广泛的应用前景.     

化学镀钴和超级化学镀填充的研究进展

随着半导体集成度的不断提高,铜互连线的电阻率迅速提高。当互连线宽度接近7 nm时,铜互连线的电阻率与钴接近。IBM和美国半导体公司（ASE）已经使用金属钴取代铜作为下一代互连线材料。然而,钴种子层的形成和超级电镀钴填充7 nm微孔的技术工艺仍是一个很大的挑战。化学镀是在绝缘体表面形成金属种子层的一种非常简单的方法, 通过超级化学镀填充方式, 直径为几纳米的盲孔可以无空洞和无缝隙的方式完全填充。本文综述了化学镀钴的研究进展,并分析了还原剂种类对化学镀钴沉积速率和镀膜质量的影响。同时, 在长期从事超级化学填充研究的基础上, 作者提出了通过超级化学镀钴技术填充7 nm以及一下微盲孔的钴互连线工艺。     

Selective growth of ag nanowires on Si(111) surfaces by electroless deposition

Electroless deposition of Ag on atomically flat H-terminated Si(111) surfaces in aqueous alkaline solutions containing Ag ions produced two different sizes of Ag nanowires along atomic step edges: (1) a narrow nanowire of 10 nm in width and 0.5 nm in height and (2) a wide nanowire of 35 nm in width and 11 nm in height. The narrow and wide nanowires were formed by immersion in the solutions containing less than 1 ppb and 8 ppm dissolved-oxygen concentrations, respectively. This result indicates that the dissolved oxygen initiates the formation of Ag nucleation sites and that the fabrication method has a possibility of controlling the size of Ag nanowires.     

Electroless plating of honeycomb and pincushion polymer films prepared by self-organization

This report describes the fabrication and electroless plating of regular porous and pincushion-like polymer structures prepared by self-organization. Honeycomb-patterned films were prepared by simple casting of polymer solution under applied humid air and pincushion structures by peeling off the top layer of the former films. Silver-deposited honeycomb-patterned films and pincushion films were obtained by simple electroless plating of the respective original structures. XPS revealed Ag deposition on the honeycomb-patterned film. After thermal decomposition or solvent elution of the template polymer, unique metal mesoscopic structures were obtained.     

Extremely superhydrophobic surfaces with micro- and nanostructures fabricated by copper catalytic etching

We demonstrate a simple method for the fabrication of rough silicon surfaces with micro- and nanostructures, which exhibited superhydrophobic behaviors. Hierarchically rough silicon surfaces were prepared by copper (Cu)-assisted chemical etching process where Cu nanoparticles having particle size of 10-30 nm were deposited on silicon surface, depending on the period of time of electroless Cu plating. Surface roughness was controlled by both the size of Cu nanoparticles and etching conditions. As-synthesized rough silicon surfaces showed water contact angles ranging from 93° to 149°. Moreover, the hierarchically rough silicon surfaces were chemically modified by spin-coating of a thin layer of Teflon precursor with low surface energy. And thus it exhibited nonsticky and enhanced hydrophobic properties with extremely high contact angle of nearly 180°.     

粉末化学镀法制备NiB/NaBETA催化剂及其加氢催化性能

粉末化学镀法制备NiB/NaBETA催化剂及其加氢催化性能;非晶态合金催化剂     

Facile method to prepare surface-enhanced-Raman-scattering-active Ag nanostructures on silica spheres

In this paper we describe a very simple electroless plating method used to prepare Ag-coated silica beads. Robust Ag nanostructures can be reproducibly fabricated by soaking silica beads in ethanolic solutions of AgNO(3) and butylamine. When the molar ratio of butylamine to AgNO(3) is far below 1.0, distinct nanosized Ag particles are formed on the silica beads, but by increasing the amount of butylamine, network-like Ag nanostructures are formed that possess very broad UV/vis absorption characteristics extending from near-UV to near-infrared regions. In conformity with the UV/vis absorption characteristics, the Ag-deposited silica beads were highly efficient surface-enhanced Raman scattering (SERS) substrates, with the enhancement factor estimated using benzenethiol as a model adsorbate to be larger than 10(6). Since another silica layer can be readily deposited onto the Ag surface, the Ag-coated silica beads should be invaluable in the development of SERS-based biosensors.     

Synthesis and optical properties of three-dimensional porous core-shell nanoarchitectures

Three-dimensional porous core-shell nanostructures consisting of gold skeletons and silver shells were fabricated by controllable electroless plating. Optical properties of the 3D nanocomposite with a heterogeneous interface exhibit a significant shell-thickness dependence. The porous core-shell structure with an optimized shell thickness of approximately 3-5 nm exhibits a considerable improvement in surface-enhanced Raman scattering. This study has important implications in the functionalization of nanoporous metals by surface modification.     

Synthesis of nickel nanoparticles supported on metal oxides using electroless plating: Controlling the dispersion and size of nickel nanoparticles

Nickel nanoparticles supported on metal oxides were prepared by a modified electroless nickel-plating method. The process and mechanism of electroless plating were studied by changing the active metal (Ag) loading, acidity, and surface area of metal oxides and were characterized by UV–vis spectroscopy, transmission electron microscopy, scanning electron microscopy, and H₂ chemisorption. The results showed that the dispersion of nickel nanoparticles was dependent on the interface reaction between the metal oxide and the plating solution or the active metal and the plating solution. The Ag loading and acidity of the metal oxide mainly affected the interface reaction to change the dispersion of nickel nanoparticles. The use of ultrasonic waves and microwaves and the change of solvents from water to ethylene glycol in the electroless plating could affect the dispersion and size of nickel nanoparticles.     

Fabrication of a gold microelectrode for amperometric detection on a polycarbonate electrophoresis chip by photodirected electroless plating

A novel method of photoresist-free micropatterning coupled with electroless gold plating is described for the fabrication of an integrated gold electrode for electrochemical detection (ED) on a polycarbonate (PC) electrophoresis microchip. The microelectrode layout was photochemically patterned onto the surface of a PC plate by selective exposure of the surface coated without photoresist to 254 nm UV light through a chromium/quartz photomask. Thus, the PC plate was selectively sensitized by formation of reactive chemical moieties in the exposed areas. After a series of wet chemistry reactions, the UV-exposed area was activated with a layer of gold nanoparticles that served as a seed to catalyze the electroless plating. The gold microelectrode was then selectively plated onto the activated area by using an electroless gold plating bath. Nonselective gold deposition on the unwanted areas was eliminated by sonication of the activated PC plate in a KSCN solution before electroless plating, and the adhesion of the plated electrodes to the PC surface was strengthened with thermal annealing. Compared with the previously reported electroless plating technique for fabrication of microelectrodes on a microchip, the present method avoided the use of a membrane stencil with an electrode pattern to restrict the area to be wet-chemically sensitized. The CE with integrated ED (CE-ED) microchip was assembled by thermal bonding an electrode-plated PC cover plate to a microchannel-embossed PC substrate. The novel method allows one to fabricate low-cost, electrode-integrated, complete PC CE-ED chips with no need of a clean room. The fabricated CE-ED microchip was demonstrated for separation and detection of model analytes, including dopamine (DA) and catechol (CA). Detection limits of 0.65 and 1.03 microM were achieved for DA and CA, respectively, and theoretical plate number of 1.4 x 10(4) was obtained for DA. The plated gold electrode can be used for about 4 h, bearing usually more than 100 runs before complete failure.     

Synthesis and optical properties of nanorattles and multiple-walled nanoshells/nanotubes made of metal alloys

The galvanic replacement reaction between silver and chloroauric acid has been exploited as a powerful means for preparing metal nanostructures with hollow interiors. Here, the utility of this approach is further extended to produce complex core/shell nanostructures made of metals by combining the replacement reaction with electroless deposition of silver. We have fabricated nanorattles consisting of Au/Ag alloy cores and Au/Ag alloy shells by starting with Au/Ag alloy colloids as the initial template. We have also prepared multiple-walled nanoshells/nanotubes (or nanoscale Matrioshka) with a variety of shapes, compositions, and structures by controlling the morphology of the template and the precursor salt used in each step of the replacement reaction. There are a number of interesting optical features associated with these new core/shell metal nanostructures. For example, nanorattles made of Au/Ag alloys displayed two well-separated extinction peaks, a feature similar to that of gold or silver nanorods. The peak at approximately 510 nm could be attributed to the Au/Ag alloy cores, while the other peak was associated with the Au/Ag alloy shells and could be continuously tuned in the spectral range from red to near-infrared.     

Fabrication of nanoscale metallic spirals using phospholipid microtubule organizational templates

We describe the fabrication of metallic Cu spiral/helical nanostructures prepared via selective electroless metallization of a phospholipid microtubule template. The metallization template is created through selective, sequential adsorption of the oppositely charged polyelectrolytes, sodium poly(styrenesulfonate) (PSS) and poly(ethyleneimine) (PEI), onto nanoscale seams naturally occurring on the microtubule surface. A negatively charged Pd(II) nanoparticle catalyst is bound to the terminal cationic PEI layer of the multilayer film and initiates selective template metallization to form the helical Cu nanostructures. Details of the process are presented, and a mechanism and factors affecting the control of the feature critical dimensions are discussed.     

Ultrahigh density arrays of toroidal ZnO nanostructures by one-step cooperative self-assembly processes: mechanism of structural evolution and hybridization with Au nanoparticles

A quick protocol for the fabrication of ultrahigh density arrays of toroidal ZnO nanostructures with tailored structures on a substrate surface is presented based on the one-step spin coating of a common solution composed of inverse micelles of polystyrene-block-poly(4-vinyl pyridine) copolymers (PS-b-P4VP) and sol-gel precursors without the need of conventional complex lithographic techniques. ZnO toroids decorated with gold nanoparticles are also obtained by subsequent loading and reduction of metallic precursors. It was elucidated that the diethanolamine moiety in the sol-gel precursors, which induces selective swelling and structural reorganization of the P4VP core blocks, plays a key role in the generation of toroidal nanostructures. Toroidal ZnO nanostructures embedded in a PS-b-P4VP matrix films or arrays of pure wurtzite ZnO nanorings are obtained by calcination under inert atmosphere. The structural parameters of the toroidal nanostructures such as the width, height, diameter of the rims as well as the spacing of their 2D arrays are controlled by employing PS-b-P4VP with different molecular weight and varying the mixing protocols.     

Comparison of Bottom-up Filling in Electroless Plating with an Addition of PEG,PPG and EPE

The bottom‐up filling capabilities of electroless copper plating bath with an addition of additives, such as polyethylene glycol (PEG), polypropylene glycol (PPG) and triblock copolymers of PEG and PPG with ethylene oxide terminal blocks termed EPE, were investigated by the cross‐sectional scanning electron microscopy (SEM) observation of sub‐micrometer trenches. Though three additives had inhibition for electroless copper deposition, the suppression degrees of three additives were different. EPE‐2000 had the strongest suppression for electroless copper deposition, and the suppression of PEG‐2000 was the weakest. The bottom‐up filling capability of electroless copper was investigated in a plating bath containing different additives with the concentration of 2.0 mg/L. The cross‐sectional SEM observation indicated the trenches with the width of 280 nm and the depth of 475 nm were all completely filled by the plating bath with an addition of EPE‐2000, but the trenches were not completely filled by the plating bath with an addition of PEG‐2000 or PPG‐2000, and some voids appeared. Linear sweep voltammetry measurement indicated that three additives all inhibited the cathodic reduction reaction and the anodic oxidation reaction, and the inhibition of EPE‐2000 was the strongest among three additives, which agreed with that of the deposition rate of electroless copper. Significant differences in surface roughness of deposited copper film were observed by UV‐visible near‐infrared for different suppressors, and the bright and smooth of deposited copper film were in accordance with the inhibition of three additives.     

Controllable Silver Plating on Silica for Surface-enhanced Raman Scattering

We proposed a facile and rapid method for preparing silica-silver core-shell(SSCS) substrates to use Ag electroless plating on SiO2@Au-seed particles.UV-Vis-NIR absorption spectrometer and SEM were employed to monitor the reaction process of the formation of Ag on the surfaces of silica beads,and the optical resonance of the substrate could shift from visible to NIR region.It has been found that surface-enhanced Raman scattering(SERS) enhancement changes with the electroless plating time and the SSCS substr...     

Nanoinks in inkjet metallization — Evolution of simple additive-type metal patterning

Recent advances in the development of stable dispersions of nanophase metal particles have allowed the direct fabrication of metal patterns (e.g., printed circuits, RFID tags, touch screens, etc.) by simple additive type inkjet processes. Such processes replace the more costly and less environmentally friendly subtractive lithographic type photoprocesses involving selective etching of photoresists and metal layers and more complex additive type process using photocatalysts for patterned metal deposition by electroless plating processes and inkjet patterning of metal catalyst or catalyst precursor for subsequent metallization by electroless plating. The recent development of electrohydrodynamic jet printing (e-jet printing), in which the ink drop is ejected under the influence of an electric field, has allowed a significant resolution increase vs. conventional inkjet printing with a piezoelectric head (printing resolution of ca. 100 nm for e-jet printing vs. ca. 20 μm for inkjet printing).     

Electroless Pd and Ag deposition kinetics of the composite Pd and Pd/Ag membranes synthesized from agitated plating baths

The atomic absorption spectroscopy (AAS) has been successfully utilized for the measurement of the Pd and Ag ion concentrations in the plating baths and to elucidate the effects of temperature, initial metal ion and reducing agent concentrations and agitation on the electroless plating kinetics of Pd and Ag metals. The initial metal ion concentrations for Pd and Ag were varied over a range of 8.2–24.5 mM and 3.1–12.5 mM, respectively. The plating reactions were conducted in a constant temperature electroless plating bath over a temperature range of 20–60 °C and an initial hydrazine concentration range of 1.8–5.4 mM. It was found that the electroless plating of both Pd and Ag were strongly affected by the external mass transfer in the absence of bath agitation. The external mass transfer limitations for both Pd and Ag deposition have been minimized at or above an agitation rate of 400 rpm, resulting in a maximum conversion of the plating reaction at 60 °C and dramatically shortened plating times with the added advantage of uniform deposition morphology. The derivation of the differential rate laws and the estimation of the reaction orders and the activation energies for the electroless Pd and Ag kinetics were conducted via non-linear regression analysis based on the method of initial rates. For a constant-volume batch reactor, the integrated rate law was solved to calculate the conversion and the reactant concentrations as a function of plating time. The model fits were in good agreement with the experimental data. Furthermore, the bath agitation and the plating conditions used in the kinetics study were adopted for the synthesis of 16–20 μm thick composite Pd/Ag membranes (10–12 wt% Ag) and a pure-Pd membrane with a hydrogen selective dense Pd layer as thin as 4.7 μm. While hydrogen permeance of the Pd/Ag membranes A and B at 450 °C were 28 and 32 m³/m²-h-atm^0.5, the H₂ permeance for the 4.7 μm thick pure-Pd membrane at 400 °C was as high as 63 m³/m²-h-atm^0.5_. The long-term permeance testing of all the membranes synthesized from agitated plating baths resulted in a relatively slow leak growth due primarily to the improved morphology obtained via the bath agitation and modified plating conditions.     

Site-selective chemical etching of silicon using patterned silver catalyst

Si convex arrays and Si hole arrays with ordered periodicities were fabricated by the site-selective chemical etching of a Si substrate using patterned Ag nanoparticles as a catalyst. Ag particles were deposited selectively on the Si substrate by a combination of colloidal crystal templating, hydrophobic treatment and subsequent electroless plating. The obtained Ag patterns were of two different types: network-like honeycomb and isolated-island microarrays. The transfer of ordered patterns fabricated by Ag plating onto the Si substrate could be achieved by the selective chemical etching of a Ag-coated Si area using Ag particles as the etching catalyst. On the basis of this process, it is possible to fabricate negative and positive patterns by changing the arrangement of deposited Ag patterns.     

Site-selective catalytic surface activation via aerosol nanoparticles for use in metal micropatterning

There is great interest in the fabrication of micro- and nanopatterned metallic structures on substrates for a wide range of electronic, photonic, and magnetic devices. One of the most widely used techniques is the electroless deposition (ELD) of metal, which requires the surface activation of the substrates with a metal catalyst. This paper introduces a method of catalytic surface activation by producing platinum aerosol nanoparticles via spark generation and then thermophoretically depositing the particles onto a flexible polyimide (PI) substrate through the pattern hole of a mask. After annealing, the catalytically activated substrate is placed into a solution for electroless silver deposition. The silver is then formed only on the activated regions of the substrate. Silver line patterns having a width of 18 microm and a height of 1 microm are created with the ability to be effectively reproduced. The average value of the resistivities is approximately 6.8 mu Omega.cm, which is almost comparable to the theoretical resistivity of bulk silver (1.6 mu Omega.cm). Other silver micropatterns containing square dot array, line, line array, Y-branched line, and tapered line using different pattern masks are also demonstrated.     

用化学镀法制备 Pd/Ag 膜时膜厚和组成的控制

 研究了不同 Pd2+含量的镀液在多孔陶瓷载体上的化学沉积规律, 发现当 Pd 沉积层厚度达到约 5 μm 后, 即使镀液中反应物的消耗比例很小, 膜厚增长也明显变缓, 沉积反应主要受膜层表面的催化活性位控制; 当镀液中 Pd2+含量只能沉积形成小于 4 μm 的 Pd 膜时, 在 323 K 化学镀 180 min 后, 镀液中 Pd2+的转化率高于 90%. 与之相似, 当 Ag 镀液中的 Ag+含量等于 0.5~2 μm 的 Ag 膜层所需量时, 在 333 K 化学镀 120 min 后, Ag+的转化率可达 95%. Ag+的高转化率与 Ag 颗粒的择向生长特性有关. 根据 Pd 和 Ag 的化学镀沉积规律, 通过调节镀液中金属离子的含量能够预先设计和精确控制超薄 Pd/Ag 膜的膜厚和组成.