5 MeV Proton irradiation effects on 200 GHz silicon–germanium heterojunction bipolar transistors

The total dose effects of 5?MeV proton and Co-60 gamma irradiation in the dose range from 1 to 100?Mrad on advanced 200?GHz Silicon–Germanium heterojunction bipolar transistors (SiGe HBTs) are investigated. The SRIM simulation study was conducted to understand the energy loss of 5?MeV proton ions in SiGe HBT structure. Pre- and post-radiation DC figure of merits such as forward- and inverse-mode Gummel characteristics, excess base current, DC current gain and output characteristics were used to quantify the radiation tolerance of the devices. The results show that the proton creates a significant amount of damages in the surface and bulk of the transistor when compared with gamma irradiation. The SiGe HBTs shows robust ionizing radiation tolerance even up to a total dose of 100?Mrad for both radiations.     

不同剂量率下锗硅异质结双极晶体管电离损伤效应研究

对于相同制作工艺的NPN锗硅异质结双极晶体管(SiGe HBT), 在不同辐照剂量率下进行⁶⁰Co γ射线的辐照效应与退火特性的研究. 测量结果表明, 两种辐照剂量率下, 随着辐照总剂量增加, 晶体管基极电流增大, 共发射极电流放大倍数降低, 且器件的辐照损伤、性能退化与辐照剂量率相关, 低剂量率下辐照损伤较高剂量率严重. 在经过与低剂量率辐照等时的退火后, 高剂量率下的辐照损伤仍较低剂量率下的损伤低, 即待测SiGeHBT具有明显的低剂量率损伤增强效应(ELDRS). 本文对相关的物理机理进行了探讨分析. 关键词： 锗硅异质结双极晶体管 低剂量率辐照损伤增强 辐照效应     

锗硅异质结晶体管单粒子效应激光微束模拟

对国产锗硅异质结双极晶体管(SiGe HBT)进行了单粒子效应激光微束辐照试验,观测SiGe HBT单粒子效应的敏感区域,测试不同外加电压和不同激光能量下SiGe HBT集电极瞬变电流和电荷收集情况,并结合器件结构对试验结果进行分析。试验结果表明:国产SiGe HBT位于集电极/衬底结内的区域对单粒子效应敏感,波长为1064 nm的激光在能量约为1.5 nJ时诱发SiGe HBT单粒子效应,引起电流瞬变。入射激光能量增强,电流脉冲增大,电荷收集量增加;外加电压增大,电流脉冲的波峰增大;SiGe HBT的单粒子效应与外加电压大小和入射激光能量都相关,电压主要影响瞬变电流的峰值,而电荷收集量主要依赖于入射激光能量。     

Comprehensive studies of InGaP/GaAs heterojunction bipolar transistors with different thickness of setback layers

The performances of InGaP/GaAs heterostructure bipolar transistors (HBTs) with different thickness of setback layers are theoretically studied. The appropriate thickness of the setback layer is an important factor in high-speed HBTs. In this work, it is found that the HBT device with a 60–90 Å setback layer has better DC and RF characteristics due to the absence of potential spike and reduced transit time. In addition, the studied devices with appropriate setback layer thickness have lower offset voltage, reverse saturation voltage, and base and collector current ideality factor.     

An investigation of ionizing radiation damage in different SiGe processes

Different SiGe processes and device designs are the critical influences of ionizing radiation damage. Based on the different ionizing radiation damage in SiGe HBTs fabricated by Huajie and an IBM SiGe process, quantitatively numerical simulation of ionizing radiation damage was carried out to explicate the distribution of radiation-induced charges buildup in KT9041 and IBM SiGe HBTs. The sensitive areas of the EB-spacer and isolation oxide of KT9041 are much larger than those of the IBM SiGe HBT, and the distribution of charge buildup in KT9041 is several orders of magnitude greater than that of the IBM SiGe HBT. The result suggests that the simulations are consistent with the experiment, and indicates that the geometry of the EB-spacer, the area of the Si/SiO_2 interface and the isolation structure could be contributing to the different ionizing radiation damage.     

Comparative study of InGaP/GaAs heterojunction bipolar transistors (HBTs) with different base surface treatments

The interesting InGaP/GaAs heterojunction bipolar transistors (HBTs) with different surface passivations on the base surface are fabricated and studied. Experimentally, the HBT device with sulfur treatment passivation displays the lowest offset voltage. However, the device with a 0.02 μm-thick emitter ledge structure reveals better transistor behaviors such as higher current gain and lower base surface recombination current. In addition, it also exhibits improved thermal stability. For the reliability test, the device with a 0.02 μm-thick emitter ledge structure shows the best performance. Therefore, from experimental results, the HBT device performance could be improved by appropriate base surface treatments, e.g., sulfur passivation and emitter ledge structure.     

锗硅异质结双极晶体管单粒子效应加固设计与仿真

本文设计了一种通过在版图布局中引入伪集电极的方法来提高锗硅异质结双极晶体管(SiGe HBT)抗单粒子性能的方法. 利用半导体器件模拟工具, 针对加固前后的SiGe HBT开展了单粒子效应仿真模拟, 分析了伪集电极对SiGe HBT电荷收集机理的影响. 结果表明, 引入的伪集电极形成的新的集电极-衬底结具有较大的反偏能力, 加固后SiGe HBT伪集电极通过扩散机理, 大量收集单粒子效应产生的电荷, 有效地减少了实际集电极的电荷收集量, 发射极、基极电荷收集量也有不同程度的降低, 加固设计后SiGe HBT 的单粒子效应敏感区域缩小, 有效的提高了SiGe HBT 器件抗单粒子效应辐射性能. 此项工作的开展为SiGe HBT电路级单粒子效应抗辐射加固设计打下良好的基础.     

基区Ge组分分布对SiGe HBTs热学特性的影响

基区Ge组分的加入可以改善SiGe HBT的直流特性、 频率特性和噪声特性, 但Ge组分及其分布对HBT热学特性的影响报道还很少. 本文利用SILVACO半导体器件仿真工具, 建立了多指SiGe HBT模型, 对基区具有不同Ge组分梯度结构的SiGe HBTs的热学特性和电学特性的热稳定性进行了研究. 研究发现, 在Ge组分总量一定的条件下, 随着Ge组分梯度的增大, 器件的特征频率明显提高, 增益β和特征频率f_T随温度变化变弱, 器件温度分布的均匀性变好, 但增益变小; 而基区均匀Ge组分(Ge组分梯度为零) 的HBT的增益较大, 但随温度的变化较大, 器件温度分布的均匀性也较差. 在此基础上, 将基区Ge组分均匀分布和Ge组分缓变分布相结合, 提出了兼顾器件热学特性、 增益特性和频率特性的新型基区Ge组分分布- 分段分布结构. 结果表明, 相比于基区Ge组分均匀分布的器件, 新器件温度明显降低; β和f_T保持了较高的值, 且随温度的变化也较小, 显示了新结构器件的优越性. 这些结果对HBT的热学设计具有重要的参考意义, 是对SiGe HBT性能研究的一个补充.     

Photoreflectance study at the micrometer scale

Photoreflectance (PR) spectroscopy has proven to be a very efficient non-destructive tool to get information on various semiconducting epitaxial structures as it is very sensitive to every direct optical transitions in semiconducting quantum structures and allows as well to optically measure internal electric fields in space charge layers, through Franz-Keldysh oscillation (FKO) analysis. We have developed an experimental setup to get micro-PR spectra on epitaxial structures or devices on a few micrometer size spots. Due to very low signal intensity, experimental conditions have to be very carefully controlled: the signal/noise ratio strongly depends on the pump-probe power ratio.We give experimental micro-PR results recorded on antimonide-based heterojunction bipolar transistors (HBTs), which give the local electric field at the emitter-base junction under different biasing conditions. A second part of the paper is devoted to micro-PR analysis performed on tuneable vertical cavity surface emitting layers (VCSELs) with InP/air Bragg mirrors. In such VCSELs, both the cavity Fabry-Perot peak and the active region quantum well ground state are giving transitions in the micro-PR spectrum. This is very useful in the case of a tuneable structure. Feasibility of micro-PR analysis at the device scale is demonstrated.     

Improved high-frequency equivalent circuit model based on distributed effects for SiGe HBTs with CBE layout

In this paper, we present an improved high-frequency equivalent circuit for SiGe heterojunction bipolar transistors(HBTs) with a CBE layout, where we consider the distributed effects along the base region. The actual device structure is divided into three parts: a link base region under a spacer oxide, an intrinsic transistor region under the emitter window,and an extrinsic base region. Each region is considered as a two-port network, and is composed of a distributed resistance and capacitance. We solve the admittance parameters by solving the transmission-line equation. Then, we obtain the smallsignal equivalent circuit depending on the reasonable approximations. Unlike previous compact models, in our proposed model, we introduce an additional internal base node, and the intrinsic base resistance is shifted into this internal base node,which can theoretically explain the anomalous change in the intrinsic bias-dependent collector resistance in the conventional compact model.     

Magnetotransport characterization of THz detectors based on plasma oscillations in submicron field-effect transistors

Magnetotransport characterization of field-effect transistors in view of their application as resonant detectors of THz radiation is presented. Three groups of different transistors based on GaAs/GaAlAs or GaInAs/AlGaAs heterostructures are investigated at liquid-helium temperatures and for magnetic fields of up to 14 T. The magnetic-field dependence of the transistor resistance is used for evaluation of the electron density and mobility in the transistor channel. The electron mobility and concentration determined from magnetotransport measurements are used for the interpretation of recently observed resonant detection of terahertz radiation in 0.15 μm gate length GaAs transistors and for the determination of the parameters of other field-effect transistors processed for resonant and voltage tunable detection of THz radiation. From Fizika Tverdogo Tela, Vol. 46, No. 1, 2004, pp. 138–145. Original English Text Copyright ? 2004 by Lusakowski, Knap, Dyakonova, Kaminska, Piotrowska, Golaszewska, Shur, Smirnov, Gavrilenko, Antonov, Morozov. This article was submitted by the authors in English.     

Noise sensitivity to gamma radiation in Si-jfet devices

The result of noise measurements for a Charge Sensitive Preamplifier based on Si-Field Effect Transistor exposed to a total Gamma ray dose of 30 v Mrad have been reported. The radiation effect on the DC parameters of single transistors was also tested. Our study has shown that, there are no changes on the DC parameters. Meanwhile the noise level, which was evaluated by the total equivalent noise charge, was clearly increased. The results of noise measurements were analyzed and compared with theoretical predictions. The temperature and time-dependent effects on the noise had also been reported after irradiation. All measurements were performed for biased and unbiased irradiated transistors.     

Total ionizing dose effects of domestic Si Ge HBTs under different dose rates

The total ionizing radiation(TID) response of commercial NPN silicon germanium hetero-junction bipolar transistors(Si Ge HBTs) produced domestically are investigated under dose rates of 800 m Gy(Si)/s and 1.3 m Gy(Si)/s with a Co-60 gamma irradiation source. The changes of transistor parameters such as Gummel characteristics, and excess base current before and after irradiation, are examined. The results of the experiments show that for the KT1151, the radiation damage is slightly different under the different dose rates after prolonged annealing, and shows a time dependent effect(TDE). For the KT9041, however, the degradations of low dose rate irradiation is higher than for the high dose rate, demonstrating that there is a potential enhanced low dose rate sensitivity(ELDRS) effect for the KT9041. The possible underlying physical mechanisms of the different dose rates responses induced by the gamma rays are discussed.     

偏置条件对NPN及PNP双极晶体管电离辐射损伤的影响研究

本文采用低能电子辐照源对NPN及PNP晶体管进行辐照试验. 在辐照试验过程中, 针对NPN及PNP晶体管发射结施加不同的偏置条件, 研究偏置条件对NPN及PNP晶体管辐射损伤的影响. 使用Keithley 4200-SCS半导体特性测试仪在原位条件下测试了双极晶体管电性能参数随低能电子辐照注量的变化关系. 测试结果表明, 在相同的辐照注量条件下, 发射结反向偏置时双极晶体管的辐照损伤程度最大; 发射结正向偏置时双极晶体管的辐照损伤程度最小; 发射结零偏时双极晶体管的辐照损伤程度居于上述情况之间. 关键词： 双极晶体管 低能电子 电离辐射     

Non-equilibrium point defect phenomena influencing beryllium and zinc diffusion in GaAs and related compounds

Beryllium and zinc are the main p-type dopants used for the fabrication of devices based on GaAs or related III-V materials. Both elements are substitutionally dissolved on the group III sublattice and diffuse via the kick-out mechanism which involves group III self-interstitials. Non-equilibrium concentrations of these self-interstitials have a strong influence on the diffusivities of Be and Zn with often drastic consequences on device behavior especially if Be or Zn is used to realize narrow base regions in heterojunction bipolar transistors (HBTs). Various situations in which non-equilibrium point defects play a role for Be and Zn diffusion are discussed such as: in-diffusion of these dopants from an outside source, diffusion of grown-in dopants, self-interstitial generation by Fermi level surface pinning of highly n ⁺-doped emitter cap or subcollector layers in HBTs, or recom bination-enhanced beryllium diffusion during device operation. Finally, we will comment on the diffusion behavior of carbon, which is dissolved on the group V sublattice in GaAs, is much less sensitive to non-equilibrium point defect, and, therefore, is increasingly used to replace Be and Zn as p-type dopants.On sabbatical leave from Duke University, School of Engineering, Durham, NC 27706, USA     

Total ionizing dose effect in an input/output device for flash memory

Input/output devices for flash memory are exposed to gamma ray irradiation. Total ionizing dose has been shown great influence on characteristic degradation of transistors with different sizes. In this paper, we observed a larger increase of off-state leakage in the short channel device than in long one. However, a larger threshold voltage shift is observed for the narrow width device than for the wide one, which is well known as the radiation induced narrow channel effect. The radiation induced charge in the shallow trench isolation oxide influences the electric field of the narrow channel device. Also, the drain bias dependence of the off-state leakage after irradiation is observed, which is called the radiation enhanced drain induced barrier lowing effect. Finally, we found that substrate bias voltage can suppress the off-state leakage, while leading to more obvious hump effect.     

Solution-deposited carbon nanotube layers for flexible display applications

We have investigated two possible fields of application for carbon nanotube (CNT) networks in flexible displays. Transparent and conductive layers of CNTs were spray coated onto glass and plastic substrates. The spectral transmission of the produced layers is almost even for all wavelengths in the visible regime. A sheet resistance of 400 Ω/□ at a transmittance of 80% was achieved.Thin-film transistors (TFT) were created on silicon wafers and glass substrates using low-density CNT networks as a semiconducting layer. The process used for device fabrication on glass substrates is fully compatible to application on plastic foils. The transistors reach on/off ratios of more than five orders of magnitude and show device charge carrier mobilities in the order of 1 cm²/Vs. These values promise an application in active matrix liquid crystal displays (AMLCD). Issues that need to be addressed are the homogeneity and reproducibility of the device properties.     

FPGA配置片反熔丝PROMs加速器地面单粒子效应特性研究

针对0.13 μm CMOS（Complementary Metal-Oxide-Semiconductor）体硅外延工艺下FPGA（Field Programmable Gate Arrays）配置片反熔丝PROM（Programmable-Read-Only-Memory）进行了单粒子效应（Single Event Effects SEEs）的加速器地面模拟试验研究。以PROM的存储容量、数据类型和工艺差异性为研究变量,考核与验证其在不同种类和能量粒子入射的系列性加速器地面SEEs模拟试验。研究结果表明,相对于8 Mbits PROM而言,空片16 Mbits PROM抗辐射性能最优,且从翻转饱和截面上说,16 Mbits的PROM具备更高的可靠性,优于国外同系列的芯片类型,试验用PROM芯片的单粒子锁定阈值>99.0 MeV·cm2/mg。另一方面,研究0.13 μm CMOS普通与深阱工艺技术下PROM芯片单粒子翻转效应异同性的实验数据表明,在高LET（Linear Energy Transfer）处的两者抗辐射性能并无明显变化,但是低LET处（LET翻转阈值）的加固效果较为明显,即抗辐射技术能力主要体现在LET翻转阈值的提升而非翻转截面的减小。Single event effects (SEEs) have been characterized and investigated on one-time configured devices for field-programmable-gate-arrays (FPGA) of programmable-read-only-memory (PROM) in 0.13 μm Complementary Metal-Oxide-Semiconductor (CMOS) technology.The variables of their memory size,written data and technology have been taken into consideration as the key parameters affecting the SEEs sensitivity when testing and verifying the reliability/radiation tolerance on self-made PROMs by heavy ions.The results show that,16 Mbits PROM within blanked data has been studied that it has better performance to radiation tolerance as compared with the 8 Mbits PROMs.Additionally,16 Mbits PROMs have the higher reliability,if based on the viewpoint of the saturated single event upset cross-section.To the single event latchup,16 Mbits PROMs were exposed to a total fluence of 107 ions/cm2 at the linear energy transfer (LET) of 99.0 MeV·cm2/mg and no obvious fluctuation of current has been observed.Additionally,as comparing the zone of high LET value,0.13 μm CMOS transistors with deep-well technology present a better radiation hardened approach than normal technology,especially in improving the threshold of LET at the zone of low LET value.     

Ge组分分布对基区杂质非均匀分布的SiGe HBT温度特性的影响

众所周知, 双极型晶体管的设计主要是基区的设计. 一般而言, 基区的杂质分布是非均匀的. 本文首先研究了非均匀的杂质高斯分布对器件温度分布、增益和截止频率的温度特性的影响, 发现增益和截止频率具有正温度系数, 体内温度较高. 随后研究了基区Ge组分分布对这些器件参数的影响. 均匀Ge组分分布和梯形Ge组分分布的SiGe 异质结双极型晶体管增益和截止频率具有负温度系数, 具有较好的体内温度分布. 进一步的研究表明, 具有梯形Ge组分分布的SiGe 异质结双极型晶体管, 由于Ge组分缓变引入了少子加速电场, 不但使它的增益和截止频率具有较高的值, 而且保持了较弱的温度敏感性, 在增益、特征频率大小及其温度敏感性、体内温度分布达到了很好的折中.     

基于环形栅和半环形栅N沟道金属氧化物半导体晶体管的总剂量辐射效应研究

在商用0.35 μm互补金属氧化物半导体工艺上制备了两种栅氧化层厚度(t_ox)的条形栅、环形栅和半环形栅N沟道金属氧化物半导体 (n-channel metal oxide semiconductor, 简记为NMOS) 晶体管, 并进行了2000 Gy(Si)的总剂量辐射效应实验. 实验结果显示, 栅氧厚度对阈值电压漂移的影响大于栅氧厚度的3次方. 对于t_ox为11 nm的低压NMOS晶体管, 通过环形栅或半环形栅的加固方式能将其抗总剂量辐射能力从300 Gy(Si)提高到2000 Gy(Si)以上; 而对于t_ox为26 nm的高压NMOS晶体管, 通过环栅或半环栅的加固方式, 则只能在低于1000 Gy(Si)的总剂量下, 一定程度地抑制截止漏电流的增加. 作为两种不同的版图加固方式, 环形栅和半环形栅对同一t_ox的NMOS器件加固效果类似, 环形栅的加固效果略优于半环形栅. 对于上述实验结果, 进行了理论分析并阐释了产生这些现象的原因. 关键词： 环形栅 半环形栅 总剂量 辐射效应