Effect of additive triblock copolymer PEP-3100 on bottom-up filling in electroless copper plating

Bottom-up copper filling for different sub-micrometer trenches was investigated by electroless deposition technique using a PO-EO-PO triblock copolymer termed PEP-3100 as an additive. It was found that PEP-3100 (molecular weight 3100) had a strong inhibition for the electroless copper deposition. The bottom-up filling behavior of electroless copper bath for different trenches was investigated in a plating bath containing 1.0 mg l⁻¹ PEP-3100. The cross-section SEM observation indicated the trenches with different widths ranging from 100 to 380 nm were all filled completely by electroless copper.     

Bottom-up filling in electroless plating with an addition of JGB-RPE

Bottom-up filling of copper for different sub-micrometer trenches was investigated by electroless deposition technique using Janus Green B (JGB) and Triblock copolymers RPE-2520. The bottom-up copper filling usually achieves a relative high deposition rate of copper in the bottom of trenches through inhibiting the surface deposition or accelerating the bottom deposition of copper. The bottom-up filling behavior of electroless copper deposition for different trenches was investigated in a plating bath containing 0.3 mg/L JGB and 1.0 mg/L RPE-2520. The cross-section image with SEM indicated that the trenches with different widths ranging from 110 to 520 nm were completely filled with electroless copper and that no void was found.     

超级化学镀铜填充微道沟的研究

超级化学铜填充技术不仅可以应用于半导体超大集成电路铜互连线, 而且可以应用于三维封装. 研究了不同浓
度、不同分子量的PEG 对以甲醛为还原剂的化学镀铜溶液中铜的沉积速率的影响. 随着添加剂PEG 浓度和分子量的
增大, 化学铜的沉积速率明显降低. 电化学研究结果表明PEG 通过抑制甲醛的氧化反应降低化学铜的沉积速率, PEG
分子量越大, 对化学铜的抑制作用越强. 利用PEG-6000 对化学铜的抑制作用和在溶液中低的扩散系数, 采用添加
PEG-6000 的化学镀铜溶液, 成功地实现了宽度在0.2 μm 以下微道沟的超级化学填充. 就PEG 的分子量、微道沟的深
径比等因素对超级化学铜填充的影响也做了研究.     

Additive influence on Cu nanotube electrodeposition in anodised aluminium oxide templates

Anodised aluminium oxide (AAO) templates have been utilised to investigate Cu deposition from a typical sulphate plating bath. The influence of the common additives poly ethylene glycol (PEG), chloride ion (Cl^?) and Bis-(sodium sulphopropyl)-disulphide (SPS) on the deposition process has been analysed. The growth of Cu wires or nanotubes (with tube walls of 40–70 nm) is significantly influenced by the action of the additives. In the presence of either Cl^? or SPS solid wire growth is observed, however, when PEG is added with Cl^? the growth of ordered Cu nanotubes is observed. SPS added to a bath containing Cl^? and PEG restores the growth of wires.     

化学镀钴和超级化学镀填充的研究进展

随着半导体集成度的不断提高,铜互连线的电阻率迅速提高。当互连线宽度接近7 nm时,铜互连线的电阻率与钴接近。IBM和美国半导体公司（ASE）已经使用金属钴取代铜作为下一代互连线材料。然而,钴种子层的形成和超级电镀钴填充7 nm微孔的技术工艺仍是一个很大的挑战。化学镀是在绝缘体表面形成金属种子层的一种非常简单的方法, 通过超级化学镀填充方式, 直径为几纳米的盲孔可以无空洞和无缝隙的方式完全填充。本文综述了化学镀钴的研究进展,并分析了还原剂种类对化学镀钴沉积速率和镀膜质量的影响。同时, 在长期从事超级化学填充研究的基础上, 作者提出了通过超级化学镀钴技术填充7 nm以及一下微盲孔的钴互连线工艺。     

不同分子量PEG的铜电镀液对电化学沉积铜行为的研究

研究了在酸性镀铜溶液中添加不同分子量的PEG对直径为50微米、深径比为1的镀层盲孔填充效果的影响.结果表明,随着PEG分子量的增加,电镀铜溶液的微孔填充力明显提高.电流密度为2 A/dm2,添加剂PEG分子量(u)超过6000时,镀液可以完全填充盲孔,镀层不出现任何空洞和缝隙.这是由于添加剂PEG能明显加强电镀铜镀液阴极极化,抑制了电镀铜的沉积.同时,PEG于镀液中的扩散系数还随其分子量的增加而降低,从而增加了SPS在微孔底部的吸附力,加速了电镀铜在微孔底部的沉积.进一步,增大PEG分子量,沉积铜膜的表面粗糙度、铜膜结晶度和电阻率均有所降低.     

氢气泡模板法电沉积制备三维多孔铜薄膜

应用阴极析氢气泡模板法电沉积制备三维多孔铜薄膜,基础电解液组成为0.2 mol.dm-3CuSO4和1.5 mol.dm-3H2SO4.研究了电流密度(0.5~8.0 A.cm-2)、温度(20~70℃)、支持电解质(Na2SO4)以及添加剂HC l和聚乙二醇(PEG)等对薄膜的孔径大小和孔壁结构的影响.扫描电子显微镜(SEM)分析表明,降低镀液温度和添加Na2SO4、PEG都可降低孔径的大小,但对孔壁结构无影响.加入微量的氯离子可显著改变薄膜的孔壁结构,得到孔壁结构较为致密的三维多孔铜电极.循环伏安(CV)测试结果显示三维多孔铜薄膜电极在碱性条件下电氧化甲醇的电流密度比光滑铜电极提高了近20倍.     

铜电化学沉积在微孔金属化中的应用

以分布有微孔的印刷线路板(PCB)作为模板,按照PCB孔金属化工艺路线,研究乙醛酸化学镀铜和柠檬酸盐体系铜电沉积工艺在PCB微孔金属化中的应用.结果表明,乙醛酸化学镀铜和柠檬酸盐体系电沉积铜可以成功地应用于PCB微孔金属化加工工艺中.微孔化学镀铜金属化导电处理后,铜附着于微孔内壁,颗粒细小,但排列疏松且局部区域发生漏镀现象.微孔一经电镀铜加厚,镀层电阻显著下降;孔壁内外的铜沉积速率达到0.8:1.0;铜颗粒具有一定的侧向生长能力,能够完全覆盖化学镀铜时产生的微小漏镀区域;微孔内壁铜镀层连续、结构致密并紧密附着于内壁,大大增强了PCB上下层互连的导电性能.     

化学镀技术在超大规模集成电路互连线制造过程的应用

总结自大马士革铜工艺建立以来,电化学工作者利用化学镀技术围绕该工艺而开展的一系列相关研究,介绍了应用化学镀沉积镍三元合金防扩散层和化学镀铜种子层的研究以及离子束沉积法(Ion ized C lus-ter Beam,ICB)形成Pd催化层后的化学镀铜技术和超级化学镀铜方法.简要叙述化学镀铜技术在超大规模集成电路中的应用,总结化学镀铜技术的研究进展,并指出了今后的发展方向.     

陶瓷表面无敏化活化法微细化学镀铜

本文提出一种新的化学镀铜工艺,与激光微细刻蚀技术相结合可在Al2O3基底上实现无敏化活化化学镀铜,获得光亮致密、分辨率较高(40μm),导电性良好的化学镀层.     

高密度互连印制电路板孔金属化研究和进展

孔金属化互连是印制电路板(PCB)高密度集成的核心制程之一,化学镀铜和电子电镀铜是实现孔金属化的关键技术.本文介绍HDI-PCB的概念和制作流程;综述化学镀铜和电子电镀铜孔金属化互连的研究和进展,包括溶液组成和操作条件的影响,添加剂及其相互作用机理,以及盲孔填充和通孔孔壁加厚机制;展望高密度互连印制电路板电子电镀基础研...     

乙二胺在化学沉积Ni-B合金中的机理

研究乙二胺稳定剂对化学镀N i-B合金沉积速率和镀液稳定性的影响.实验表明,少量乙二胺可改善镀液的稳定性.镀液的电化学测试发现,乙二胺对体系的阳极过程和阴极过程均有影响,还原剂的氧化电流和合金的还原电流均随乙二胺加入量的增加而减少.红外光谱显示乙二胺附在镍基体表面发生化学吸附,从而抑制了还原剂的氧化,降低N i-B化学沉积速率(稳定了镀液).     

The influence of electrospray deposition in matrix-assisted laser desorption/ionization mass spectrometry sample preparation for synthetic polymers

Although electrospray sample deposition in matrix-assisted laser desorption/ionization (MALDI) mass spectrometry (MS) sample preparation increases the repeatability of both the MALDI signal intensity and the measured molecular mass distribution (MMD), the electrospray sample deposition method may influence the apparent MMD of a synthetic polymer. The MMDs of three polymers of differing thermal stability, polystyrene (PS), poly(ethylene glycol) (PEG), and poly(propylene glycol) (PPG), were studied by MALDI time-of-flight (TOF) MS as the electrospray deposition voltage was varied. The MMDs obtained using the electrospray deposition method were compared with those obtained for hand-spotted samples. No change was observed in the measured polymer MMD when the electrospray deposition voltage was varied in the analysis of PS, but those of PEG and PPG changed at higher electrospray voltages due to increased ion fragmentation. It was also shown that the fragmentation in the hand-spotted samples is dependent on the matrix used in sample preparation.     

Regeneration of a Solution for Electroless Copper Plating

The possibility of electrochemical regeneration of a solution for electroless copper plating by membrane electrolysis was studied. The conditions of anodic dissolution of copper in a spent solution for electroless copper plating, under which the concentration of copper ions increases at a rate exceeding by an order of magnitude that of their deposition in the course of electroless copper plating, were examined. A scheme for regeneration of spent solutions for electroless copper plating was suggested.__________Translated from Zhurnal Prikladnoi Khimii, Vol. 78, No. 4, 2005, pp. 586–590.Original Russian Text Copyright © 2005 by Turaev, Kruglikov.     

酸性化学镀镍磷合金的动力学机理

通过极化曲线研究了3种不同溶液（阴极液、阳极液和完整镀液）的电化学行为,测定了主盐、还原剂浓度以及镀液pH和体系温度对化学镀镍沉积速率的影响. 与直接在镁合金上化学镀镍并使用重量分析法得到的沉积速率相比较发现,完整镀液体系的极化曲线才能真实地反映化学镀镍的沉积过程,其过程不能简单视为由彼此完全独立毫无关联的阴阳极半反应构成. 根据Butler-Volmer公式,本化学镀液体系的化学镀镍过程属混合控制,其表观反应活化能为42.89 kJ·mol^-1.     

5,5-二甲基乙内酰脲在化学镀铜中的作用

在以酒石酸钾钠和乙二胺四乙酸二钠为双配位剂、 甲醛为还原剂的化学镀铜液中, 研究了5,5-二甲基乙内酰脲(DMH)在化学镀铜中的作用. 化学镀铜实验结果表明, DMH提高了镀液的稳定性; 扫描电子显微镜(SEM)结果表明, DMH使镀层颗粒尺寸减小, 镀层光亮致密; 紫外-可见光谱结果表明, DMH在镀液中与Cu(II)不发生强配位作用; 线性伏安扫描结果表明, DMH在化学镀铜过程中能抑制Cu⁺的产生或促进Cu⁺快速还原, 降低甲醛的氧化速率; X射线衍射(XRD)结果表明, 在含和不含DMH化学镀铜液中, 得到的铜镀层均呈现面心立方混晶结构的特征, 且未出现Cu₂O夹杂衍射峰.     

化学镀铜过程混合电位本质的研究

现场测量了铜基和陶瓷基化学镀铜过程混合电位－时间曲线(Emix－t)，成功地检测到了化学镀诱发过程.考察了添加剂和络合剂的浓度以及pH值对Emix－t曲线的影响，结合阴、阳极极化曲线及双电层理论对各种影响因素进行了讨论.新生铜活化的铜基化学镀铜的诱发过程是一个缓慢激活过程,所对应的Emix－t曲线是一个稍微倾斜的台阶，这不同于钯活化的基体的诱发过程.通过对不同活化工艺的Emix－t曲线的比较，发现较高的活化温度能明显减少活化时间，而且还可加速诱发过程，从而提高化学沉积铜的速度.     

Catalytic effect of Pd nanoparticles on electroless copper deposition

This study elucidates the application of Pd nanoparticles as catalysts of electroless copper deposition and their catalytic effect on the deposition kinetics and microstructure in an electroless copper bath. Quartz crystal microgravimetry (QCM) and high-resolution field emission scanning electron microscopy (FE-SEM) with energy dispersive X-ray spectroscopy (EDX) demonstrated that the kinetic changes associated with electroless copper deposition (ECD) comprised two stages—the incubation period and the acceleration period. In the incubation period, small copper particles were deposited. In the acceleration period, the ECD rate increased rapidly and continuously conducting films with large grains were formed. Leaner sweep voltammetry (LSV) and mixed potential theory (MPT) were applied to examine the catalytic powers of the prepared Pd nanoparticles and the related electrochemical kinetics in the ECD bath.     

Effect of soft segment component on moisture‐permeable polyurethane films

The effect of soft segment component and molecular weight combination on moisture‐permeable polyurethane films was studied. Moreover, water sorption phenomenon in films was observed with infrared analysis. As for soft segment components, PTMG/PEG and PTMG/PPG were used and molecular weight combinations were changed. Different tendency appeared in the experimental results corresponding to PEG system and PPG system. Moisture permeability P in PEG system increased with increasing PEG content, but P changed little in the case of PPG system. Both hydrogen‐bonded concentration by infrared measurement and the higher order term Δh of Mooney–Rivlin plot by stress–strain relationships indicate the existence of aggregate structure of hard segment. It is considered that ether group in PEG is more active than that in PPG. Therefore, small size of aggregate structure indicated as Δh appears in PEG system owing to inhibition of aggregate structure growth. Whereas, ether group in PPG system does not inhibit hydrogen bond in urethane group and large size of aggregate structure appears. From water affinity relationship analysis, hydrophilicity of samples with PTMG/PEG = 2000/2000 increased with increasing PEG content. Consequently, it is suggested that not only size but also hydrogen‐bonded concentration of urethane group in aggregate structure affects moisture permeability. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 573–583, 2006     

Electroless deposition of Ni-P-nano-ZrO2 composite coatings in the presence of various types of surfactants

Ni-P-nano-ZrO(2) coatings were produced using the electroless deposition technique. To prevent agglomeration of zirconia nanoparticles in the plating bath, various surfactant additives (anionic, cationic, and nonionic) were used. The most stable bath was obtained with the addition of dodecyltrimethylammonium bromide (DTAB). The impact of this surfactant on the deposition rate, coating composition, and topography, as well as ζ potential of particles, was examined. Surface morphology and composition of the Ni-P-nano-ZrO(2) composite coatings was analyzed by various techniques including scanning electron microscopy (SEM) equipped with in situ energy-dispersive X-ray (EDX) spectroscopy. Coatings with a clearly greater amount of zirconia (21.88-22.10 wt.%) were obtained from baths containing DTAB in concentrations equal to or above its critical micelle concentration (cmc). For these surfactant concentrations, the reduction of Ni and P content was observed.