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1.
Previous molecular dynamics (MD) simulations of ultraviolet (UV) laser ablation demonstrate the distinct dependence of material ejection on laser fluence and laser pulse duration. In this paper, we examine the pulse width dependence when the laser pulse widths are appropriate for the thermal confinement regime. We perform MD simulations of laser ablation with a laser pulse duration of 1 ns and compare with a pulse width of 150 ps as in previous simulations. The simulations confirm that the pulse width in thermal confinement regime does not dramatically influence the molecular ejection mechanism. The simulations reveal differentiations, however, in plume composition and the ablation threshold value. PACS 02.70.Ns; 61.80.Az; 79.20.Ap  相似文献   

2.
Dynamics of the ejected material in ultra-short laser ablation of metals   总被引:1,自引:0,他引:1  
A molecular dynamics model is applied to study the formation and the early stages of ejection of material in ultra-short laser ablation of metals in vacuum. Simulations of the ablation process for iron at a pulse duration of 0.1 ps and at different laser fluences are performed. Different features of the ejection mechanism are observed below, near, and above the ablation threshold. The last is estimated as approximately 0.1 J/cm2. The structure of the ablated material is found to depend on the applied laser fluence. The expanded plume consists mainly of large clusters at fluences near to the threshold. With the increase of the laser fluence the presence of the large clusters decreases. Clear spatial segregation of species with different sizes is observed in the direction normal to the surface several tens of picoseconds after the laser pulse onset. The angular distribution of the ejected material is estimated for different regimes of material removal. Above the ablation threshold the distribution is forward peaking. PACS 79.20.Ds; 52.38.Mf; 02.70.Ns; 81.05.Bx  相似文献   

3.
The time-dependent intensity profile of pulsed KrF excimer laser radiation reflected from polyimide is determined over a range of laser fluences, from well below to above the ablation threshold. The reflected laser beam is truncated once the incident laser radiation exceeds a threshold fluence, i.e., truncation depends on the energy per unit area and not on the intensity, analogous to results for the ablation threshold and the etch depth per pulse. The threshold fluence for pulse truncation corresponds to the onset of ablation. The results indicate that the truncation is not due to laser plasma interactions at these fluences. A general mechanism is discussed involving a time dependent index of refraction.  相似文献   

4.
We have developed a non-thermal laser ablation model which may reduce thermal damage to neighboring structures. Based on this model, the three critical parameters for a well controlled non-thermal microsurgery are (1) the laser wavelength with its photon energy matching closely the bond dissociation energy, (2) the energy fluence must be above threshold to avoid thermal process due to non-radiative relaxation from the excited electronic states to vibrational, (3) ultra short laser pulses (few fs) to completely eliminate thermal and direct biomolecular reactions. In this model the UV laser photon dissociates the molecular bonds which leads to the splitting of longer polymer chains into small fragments. The excess energy if any may appear as kinetic energy in the polymer-fragments. The extreme rapidity of the bond breaking process reduces heat conduction. The model establishes a relationship between ablation depth per pulse, the absorption coefficient, the incident laser energy fluence, and the threshold energy fluence. The ablation depths per pulse were calculated for the polymers Polymethyl methacrylate (PMMA) and polyimide for various commercially available UV lasers. It has been found that the minimum ablations depth occurs at 193 nm for both PMMA and polyimide. This assures a well defined incision with minimal thermal damage to the surrounding structures at this wavelength. There exists a definite threshold energy fluence for non-thermal ablation for any given biomolecule and below the threshold the non-radiative relaxation process may cause thermal ablation. New ultra fast lasers (few femtoseconds) (fs) will completely eliminate thermal diffusion as well as direct biomolecular reactions.  相似文献   

5.
Femtosecond laser (180 fs, 775 nm, 1 kHz) ablation characteristics of the nickel-based superalloy C263 are investigated. The single pulse ablation threshold is measured to be 0.26±0.03 J/cm2 and the incubation parameter ξ=0.72±0.03 by also measuring the dependence of ablation threshold on the number of laser pulses. The ablation rate exhibits two logarithmic dependencies on fluence corresponding to ablation determined by the optical penetration depth at fluences below ∼5 J/cm2 (for single pulse) and by the electron thermal diffusion length above that fluence. The central surface morphology of ablated craters (dimples) with laser fluence and number of laser pulses shows the development of several kinds of periodic structures (ripples) with different periodicities as well as the formation of resolidified material and holes at the centre of the ablated crater at high fluences. The debris produced during ablation consists of crystalline C263 oxidized nanoparticles with diameters of ∼2–20 nm (for F=9.6 J/cm2). The mechanisms involved in femtosecond laser microprocessing of the superalloy C263 as well as in the synthesis of C263 nanoparticles are elucidated and discussed in terms of the properties of the material.  相似文献   

6.
The ablation rate when drilling fine holes having large aspect ratios in silicon substrates with femtosecond laser pulses was estimated from mechanically ground cross sections of the ablated holes. The ablation rate shows a dramatic change at the depth at which the laser pulse reaches a certain fluence, which is nearly constant when the initial laser fluence was varied from 14.5 to 59.4 J/cm2. The ablation rate, threshold fluence, in three fluence domains, and the transition fluences at which the ablation rate shows a dramatic change, were derived. However, when a pulse energy of 200 μJ was used a much greater ablation rate was obtained, suggesting that another fluence domain for larger ablation rates exists. The experimentally obtained hole depths as a function of shot numbers were reproduced by a theoretical model, which incorporates laser pulse attenuation in the holes that is the same as that in waveguides for some attenuation coefficient and ablation rates for three fluence domains. PACS 42.62.-b; 42.65.Re; 78.40.Fy; 78.47.+p; 81.20.Wk  相似文献   

7.
研究了800nm飞秒激光照射下45°高反膜ZrO2-Si O2的破坏及其超快动力学过程。利用原子力显微镜和扫描电镜观察了材料的烧蚀形貌,测量了破坏阈值与脉冲宽度、烧蚀深度与脉冲能量的依赖关系。随着脉冲宽度从50fs增加到900fs,其烧蚀阈值从0.35J/cm2增加到1.78J/cm2。烧蚀深度与激光能流密度近似成对数关系。当激光强度略高于烧蚀阈值时,材料很快被烧蚀到几百纳米,烧蚀深度表现出明显的层状特性。同时,利用建立的抽运探针实验系统,测量了高强度抽运脉冲作用下材料对探针光的反射率随延迟时间的变化,揭示了薄膜烧蚀的超快动力学过程。实验结果表明高反膜表层的材料对烧蚀特性有重要影响。  相似文献   

8.
Debris control and surface quality are potential major benefits of sample liquid immersion when laser micromachining; however, the use of an immersion technique potentially modifies the ablation mechanism when compared to an ambient air interaction. To investigate the machining characteristics, bisphenol A polycarbonate has been laser machined in air and under a controllable open liquid film. To provide quantitative analysis, ablation threshold, ablation rate and the attenuation coefficient of the immersing de-ionized (DI) water fluid were measured. In ambient air the threshold fluence was measured to be 37 mJ cm−2. Thin film immersion displayed two trends: threshold fluences of 58.6 and 83.9 mJ cm−2. The attenuation of DI water was found to be negligible; thus, the change in ablation rate resulted from increased confinement of the vapour plume by the liquid medium, generating higher Bremsstrahlung attenuation of the beam, lowering the laser etch rate. Simultaneously, splashing motivated by the confined ablation plume allowed release of plume pressure before plume etching commenced. This contributed to the loss of total etching efficiency. Two interaction scenarios were obsereved as a result of splashing: (i) intermediate threshold fluence, where splashing occured after every pulse in a mode that interrupted the flow entirely, leaving an ambient air interaction for the following pulse; (ii) high threshold fluence, where splashing occured for every pulse in a mode that allowed the flow to recommence over the image before the next pulse causing every pulse to experience Bremsstrahlung attenuation. Since attenuation of the immersion liquid was negligible, it is the action of the constrained ablation plume within a thin flowing immersion liquid, the resultant Bremsstrahlung attenuation and splashing events that are the critical mechanisms that modify the primary ablation characteristics.  相似文献   

9.
A comparative study of residual thermal effects in aluminum following ns- and fs-laser ablation shows a surprisingly similar trend in their behavior, despite many differences between ns and fs laser-matter interactions. At laser fluences above the ablation threshold where plasmas are produced and at a sufficiently high ambient gas pressure, an enhanced coupling of pulsed laser energy to the sample occurs. This effect appears to be a universal phenomenon for both ns- and fs-laser ablation in gas media. Furthermore, in contrast to the common belief that residual thermal energy is negligible in fs-laser ablation, our study shows that up to 70% of the incident pulse energy can be retained in the sample following single-pulse fs-laserablation in 1-atm air. In both ns- and fs-laser ablation, the major factors governing thermal energy coupling to the sample are the laser fluence and ambient gas pressure. Residual thermal energy deposition decreases with reducing ambient gas pressure. PACS 78.20; 81.05.Bx  相似文献   

10.
Films of polyethylene terephthalate (PET) can be successfully etched with 9 m radiation from a pulsed TEA CO2 laser. The relationship between etch depth and fluence is broadly similar to that observed for excimer laser etching but with a less well-defined threshold. Time-resolved photoacoustic measurements of stress waves generated in the interaction show that at a fluence of 1.8 J cm–2 ablation occurs 100–200 ns after the start of the laser pulse, a time which is consistent with the rate of thermal decomposition of PET. The volatile products of ablation are carbon monoxide, carbon dioxide, methane, ethyne, ethene, benzene, ethanal, and small quantities of other products. For fluences close to and appreciably above the threshold the ablated material consists predominantly of involatile species of relatively high molecular weight, whereas at higher fluences substantial fragmentation of the polymer to small molecules occurs.School of Chemistry  相似文献   

11.
Picosecond laser (10.4 ps, 1064 nm) ablation of the nickel-based superalloy C263 is investigated at different pulse repetition rates (5, 10, 20, and 50 kHz). The two ablation regimes corresponding to ablation dominated by the optical penetration depth at low fluences and of the electron thermal diffusion length at high fluences are clearly identified from the change of the surface morphology of single pulse ablated craters (dimples) with fluence. The two corresponding thresholds were measured as F th(D1)1=0.68±0.02 J/cm2 and F th(D2)1=2.64±0.27 J/cm2 from data of the crater diameters D 1,2 versus peak fluence. The surface morphology of macroscopic areas processed with a scanning laser beam at different fluences is characterised by ripples at low fluences. As the fluence increases, randomly distributed areas among the ripples are formed which appear featureless due to melting and joining of the ripples while at high fluences the whole irradiated surface becomes grainy due to melting, splashing of the melt and subsequent resolidification. The throughput of ablation becomes maximal when machining at high pulse repetition rates and with a relatively low fluence, while at the same time the surface roughness is kept low.  相似文献   

12.
The backside ablation of a absorbing carbon layer onto fused silica is studied in air and water confinement in comparison. The confinement influences the etch rate and the laser fluence dependence of the etch rate significantly while the threshold fluence is almost the same. The different confinement of the laser induced plasma results in the observed rate saturation in the case of air and in a linear growing rate in the case of water confinement at medium laser fluences. The less dense air confinement permits a faster plasma expansion of the laser plume than in the case of water confinement and effects consequently the interaction time and interaction strength of the laser plume with the fused silica surface. The differences in the laser-plasma-substrate interaction cause the observed rate saturation at weak interaction (air) and the growing etch rate at strong interaction (water). Thus, the confinement situation controls the interaction process in the case of backside ablation and should be considered in indirect material processing methods such as LIBWE and LESAL, too. PACS 81.65.C; 81.05.K; 79.20.D; 61.80.B; 42.55.L; 68.45.D  相似文献   

13.
超短脉冲激光照射下氧化铝的烧蚀机理   总被引:1,自引:0,他引:1       下载免费PDF全文
利用烧蚀面积与激光脉冲能量的线性关系,确定了氧化铝的破坏阈值,同时采用散射光探测法,研究了800和400nm超短脉冲激光作用下氧化铝的破坏阈值对激光脉宽的依赖关系,并探讨了氧化铝的烧蚀规律. 利用雪崩击穿模型,解释了实验结果,并讨论了导带电子光吸收机理. 关键词: 飞秒激光 氧化铝 破坏阈值 雪崩模型  相似文献   

14.
Experimental results on picosecond laser processing of aluminum, nickel, stainless steel, molybdenum, and tungsten are described. Hole drilling is employed for comparative analysis of processing rates in an air environment. Drilling rates are measured over a wide range of laser fluences (0.05–20?J/cm2). Experiments with picosecond pulses at 355?nm are carried out for all five metals and in addition at 532?nm, and 1064?nm for nickel. A comparison of drilling rate with 6-ps and 6-ns pulses at 355?nm is performed. The dependence of drilling rate on laser fluence measured with picosecond pulses demonstrates two logarithmic regimes for all five metals. To determine the transition from one regime to another, a critical fluence is measured and correlated with the thermal properties of the metals. The logarithmic regime at high-fluence range with UV picosecond pulses is reported for the first time. The energy efficiency of material removal for the different regimes is evaluated. The results demonstrate that UV picosecond pulses can provide comparable quality and higher processing rate compared with literature data on ablation with near-IR femtosecond lasers. A significant contribution of two-photon absorption to the ablation process is suggested to explain high processing rate with powerful UV picosecond pulses.  相似文献   

15.
Material removal during ArF excimer laser ablation of graphite at atmospheric pressure was investigated by two independent methods; 1) by observation of the propagating properties of the shock wave generated by the carbonaceous ejecta and 2) by in situ measurement of the size distribution of carbon nanoparticles condensing in the ablation plume. This latter was carried out by a scanning mobility particle sizer system based on a differential mobility analyser. The performed measurements indicate that the material removal during ArF laser ablation consists of two steps at fluences above the threshold fluence. First, a thin layer of carbon (of the order of 1 nm) is removed by a quick desorption process, leading to shockwave formation. This process takes place in a ns time scale, and desorption rate estimations reveal that this can not be explained by thermal surface evaporation. Since to our knowledge there is no thermal process that could account for the estimated desorption rate, it is argued that this is a fast photochemical (i.e. non-thermal) process. The size distribution of the condensed nanoparticles related to this step shows a rising edge at diameters below 10 nm. At fluences above the ablation threshold, the majority of the material is ejected in the second phase, resulting in condensation of carbon nanoparticles, peaking at 50 nm diameters in the size spectrum. Both shockwave formation and material removal are also detected well below the ablation threshold fluence, which is attributed to the photochemical process. PACS 61.46.+w; 81.16.Mk  相似文献   

16.
Ultrashort pulse laser ablation of metallic targets is investigated theoretically through establishing a modified two-temperature model that takes into account both the temperature dependent electron–lattice coupling and the electron–electron-collision dominated electron diffusion processes for higher electron temperature regime. The electron–lattice energy coupling rate is found to reduce only slowly with increasing pulse duration, but grow rapidly with laser fluence, implying that the melting time of metallic materials decreases as the laser intensity increases. By taking phase explosion as the primary ablation mechanism, the predicted dependences of ablation rates on laser energy fluences for different laser pulse widths match very well with the experimental data. It is also found that during phase explosion the ablation rate is almost independent of the pulse width, whereas the ablation threshold fluence increases with the pulse duration even for femtosecond pulses. These theoretical results should be useful in having proper understanding of the ablation physics of ultrafast micromachining of metal targets. PACS 52.50.Jm; 61.80.Az; 72.15.Cz; 79.20.Ap; 79.20.Ds  相似文献   

17.
Ablation of organic polymers is described on the basis of photothermal bond breaking within the bulk material. Here, we assume a first-order chemical reaction, which can be described by an Arrhenius law. Ablation starts when the density of broken bonds at the surface reaches a certain critical value. In order to understand the ablation behavior near the threshold fluence, φth, non-stationary regimes must be considered. The present treatment reveals several qualitative differences with respect to models that treat ablation as a surface process: (i) Ablation starts sharply with a front velocity that has its maximum value just after the onset. (ii) The transition to the quasi-stationary ablation regime is faster. (iii) Near threshold, the ablated depth h has a square-root dependence on laser fluence, i.e., h∝(φ-φth)1/2. The ablation velocity is very high even near φth. (iv) With φ≈φth ablation starts well after the laser pulse. (v) The depletion of species is responsible for the Arrhenius tail observed with fluences φ≤φth. (vi) Residual modification of material has maximum near the threshold. (vii) Stationary regimes of ablation demonstrate change of effective activation energy with laser intensity. The model calculations are applied to Polyimide (KaptonTM H). Here, differences in single-pulse ablated depth determined from mass loss and profilometry should be about 10 nm. Received: 16 February 1999 / Accepted: 18 February 1999 / Published online: 28 April 1999  相似文献   

18.
We have investigated the all-optical generation of ions by photo-ionisation of atoms generated by pulsed laser ablation. A direct comparison between a resistively heated oven source and pulsed laser ablation is reported. Pulsed laser ablation with 10 ns Nd:YAG laser pulses is shown to produce large calcium flux, corresponding to atomic beams produced with oven temperatures greater than 650 K. For an equivalent atomic flux, pulsed laser ablation is shown to produce a thermal load more than one order of magnitude smaller than the oven source. The atomic beam distributions obey Maxwell–Boltzmann statistics with most probable speeds corresponding to temperatures greater than 2200 K. Below a threshold pulse fluence between 280 mJ/cm2 and 330 mJ/cm2, the atomic beam is composed exclusively of ground-state atoms. For higher fluences ions and excited atoms are generated.  相似文献   

19.
飞秒激光的波长对SiC材料烧蚀的影响   总被引:10,自引:0,他引:10  
利用10倍的显微物镜将近红外飞秒激光脉冲汇聚到宽带隙半导体材料6H SiC的前表面,研究样品的烧蚀及诱导微细结构。用扫描电镜(Scanning electron microscope,SEM)及光学显微镜测量烧蚀斑。利用烧蚀面积与激光脉冲能量的关系确定SiC的烧蚀阈值。给出了SiC样品的烧蚀阈值与飞秒激光波长的依赖关系。实验结果表明,可见光区随波长增加,烧蚀阈值从0.29J/cm2增加到0.67J/cm2;而在近红外区,SiC的烧蚀阈值为0.70J/cm2左右,基本上不随激光波长变化而改变。结合计算结果,可以认为在飞秒激光烧蚀SiC的过程中,在近红外区,光致电离和碰撞电离均起到了重要的作用;而在可见光区,光致电离的作用相对大一些。  相似文献   

20.
通过双温方程对飞秒单脉冲与双脉冲照射金薄膜进行了计算模拟分析,得到了金靶的电子温度和晶格温度随着时间空间的变化。在同样激光能量密度下,单脉冲与双脉冲使得金膜温度的变化表明双脉冲使得更多的激光能量渗透到靶材内部,这些能量可以使得烧蚀深度更深,有利于提高激光烧蚀靶材的效率。计算结果显示随着激光能量密度的增加熔化面深度逐渐增加,单脉冲与双脉冲熔化面深度的变化明显不同。在激光能量密度高于损伤阈值附近,单脉冲的烧蚀深度大于双脉冲的烧蚀深度,随着激光能量密度增加,双脉冲的烧蚀深度将大于单脉冲的烧蚀深度。  相似文献   

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