GaN HEMT欧姆接触模式对电学特性的影响

本文制备了AlGaN/GaN HEMT器件中常规结构与带有纵向接触孔结构的两种接触电极,研究了该两种源欧姆接触模式对器件电学特性的影响.在相同条件下进行快速退火,发现在750?C下退火30 s后,常规结构还没有形成欧姆接触,而带有纵向欧姆接触孔的接触电极与外延片已经形成了良好的欧姆接触.同时,比较了Ti/Al/Ti/Au和Ti/Al/Ni/Au电极退火后表面形态,Ti/Al/Ni/Au具有更好的表面形貌.通过测试两种结构的HEMT器件后,发现采用纵向欧姆接触孔结构器件具有更高的跨导和饱和电流,但是也会在栅极电压为0.5—2 V之间产生严重的电流崩塌现象.     

MOVPE生长GaN的表面反应机理

利用量子化学的 DFT 理论,对 MOVPE 生长 GaN 薄膜的表面初始反应机理进行研究。通过计算GaCH3和NH3在GaN(0001)-Ga面的4种吸附位的能量曲线发现,GaCH3在各吸附位的吸附能差值不大,因此容易在表面迁移;而NH3在各吸附位的吸附能差值较大,最稳定吸附位为Top位,迁移到其他位置需要克服较大能垒。在此基础上,提出了以NH3和 GaCH3为表面生长基元,在GaN(0001)-Ga面连续生长,最终形成环状核心的二维生长机理：在环状核心形成过程中,第1个GaN核生长需要3个NH3和1个GaCH3,可表示为Ga( NH2)3。第2个GaN核生长可利用已有的1个N作为配位原子,故只需2个NH3和1个GaCH3。2个GaN核可表示为( NH2)2 Ga-NH-Ga( NH2)2。第3个GaN核生长可利用已有的2个N作为配位原子,故只需要1个NH3和1个GaCH3。3个GaN核构成环状核心,可表示为Ga3( NH)3( NH2)3。后续的生长将重复第2个核和第3个核的生长过程,从而实现GaN薄膜的连续台阶生长。     

晶格匹配InAlN/GaN和InAlN/AlN/GaN材料二维电子气输运特性研究

文章研究了InAlN/GaN和引入AlN界面插入层形成的InAlN/AlN/GaN材料的输运性质. 样品均在蓝宝石上以脉冲金属有机物化学气相淀积法生长,霍尔迁移率变温特性具有典型的二维电子气(2DEG)特征. 综合各种散射机理包括声学形变势散射、压电散射、极性光学声子散射、位错散射、合金无序散射和界面粗糙度散射,理论分析了温度对迁移率的影响,发现室温下两种材料中2DEG支配性的散射机理都是极性光学波散射和界面粗糙度散射;AlN插入层对InAlN/GaN材料迁移率的改善作用一方面是免除2DEG的合金无序散射,另外还显著改善异质界面,抑制了界面粗糙度散射. 考虑到2DEG密度也是影响其迁移率的重要因素,结合实验数据给出了晶格匹配InAlN/GaN和InAlN/AlN/GaN材料的2DEG迁移率随电子密度变化的理论上限. 关键词： InAlN/GaN 二维电子气 迁移率     

使用AlN/GaN超晶格势垒层生长高Al组分AlGaN/GaN HEMT结构

在蓝宝石衬底上生长了以AlN/GaN超晶格准AlGaN合金作为势垒的HEMT结构材料,并与传统AlGaN合金势垒样品进行了对比.在高Al组分(≥40%)情况下,超晶格势垒样品的表面形貌明显改进,电学性能特别是2DEG面电子浓度也有所改进.对超晶格势垒生长参数进行了初步优化,使得HEMT结构薄层电阻进一步降低,最后获得了251 Ω/□的薄层电阻. 关键词： AlGaN/GaN 结构 AlN/GaN超晶格 二维电子气 高电子迁移率晶体管     

用MOVPE和RF-MBE方法极性控制生长GaN

本文报道了用低压MOVPE和RF-分子束外延法在蓝宝石衬底上作极性控制的GaN生长.以“双Al单层”模型讨论了用MOVPE和MBE法在蓝宝石衬底上生长GaN的极性选择的机理,并对AlN在极性转换过程中的作用给出了适当的解释.通过极性控制的生长,使MBE法生长的GaN的表面形貌和电学特性都得到了改善;并对LP-MOVPE生长开发出了一种“三步生长法”,这样就可以用更多的外延方式在蓝宝石衬底上生长出高质量的GaN膜.     

用MOVPE方法外延生长Si掺杂的立方相GaN

用MOVPE方法采取一种两步生长过程生长了未掺杂和Si掺杂的GaN.在生长了一个20nm厚的缓冲层后,外延生长了1μm厚的立方GaN外延层.利用二次离子质谱测定了掺杂的程度.并用X射线衍射和光致发光测量来表征了未掺杂和Si掺杂GaN的结构和光学质量.     

InP的MOVPE生长

我们利用自制的常压MOVPE设备和国产的三甲基钢以及进口的磷烷生长了InP外延材料,其77K迂移率为65300cm²/V·s,据我们所知这是国内迄今为止用各种方法获得的InP薄膜的最大低温迁移率值。     

用Mg离子注入提高p型GaN的空穴浓度

研究了离子注入对金属有机化学气相淀积法生长的Mg掺杂GaN性质的影响.样品在800℃退火1小时后,我们获得了空穴浓度达8.28×1017cm-3的p型GaN.这一结果可以用于GaN基器件的p型层的欧姆接触.     

MOVPE生长的InGaN/GaN单量子阱的光致发光和光吸收特性

研究了用金属有机物气相外延(MOVPE)法在蓝宝石衬底上生长的In组分浓度保持不变的InGaN/GaN单量子阱结构在室温下的发光特性和光吸收特性.实验结果表明,在InGaN厚度<3nm时,随着样品InGaN势阱层宽度的增加(1nm),光致发光(PL)谱的发光峰值波长出现明显的红移33nm现象,而且发光强度下降8%,谱线半峰全宽(FWHM)展宽,通过对样品的透射、反射光谱研究发现,量子阱层窄(1.5nm)的样品在波长接近红外区时出现无吸收的现象,即R+T达到了100%,而在阱层较宽的样品中没有发现这一现象,对引起这些现象的原因进行了讨论.这些结果有助于开发和优化三族氮化物半导体光电器件的进一步研究工作.     

GaN基HEMT器件的缺陷研究综述

GaN基高电子迁移率晶体管(HEMT)因具有高输出功率密度、高工作频率、高工作温度等优良特性,在高频大功率等领域具有广泛应用前景。目前,HEMT器件在材料生长和工艺制备方面都取得了巨大的进步。但是,由缺陷产生的陷阱效应一直是限制其发展的重要原因。本文首先论述了HEMT器件中的表面态、界面缺陷和体缺陷所在位置及其产生的原因。然后,阐述了由陷阱效应引起的器件电流崩塌、栅延迟、漏延迟、Kink效应等现象,从器件结构设计和工艺设计角度,总结提出了改善缺陷相关问题的主要措施,其中着重总结了器件盖帽层、表面处理、钝化层和场板结构4个方面的最新研究进展。最后,探索了GaN基HEMT器件在缺陷相关问题上的未来优化方向。     

EPR measurement on Er-doped InP grown by organometallic vapor phase epitaxy

We have performed X-band ESR measurements on InP:Er epitaxial layers grown by organometallic vapor phase epitaxy, which were grown at the substrate temperatures of 530°C (sample A) and 580°C (sample B). Sample A shows a slightly anisotropic resonance aroundg = 6 with hyperfine structure due to the¹⁶⁷Er (I = 7/2) isotope at 3 K. This result is similar to the result for Erdoped bulk InP and it indicates that Er³⁺ ions are located in In tetrahedral sites. On the other hand, we do not see such a resonance for sample B, suggesting that the local symmetry of Er in sample B is different from sample A. The difference between samples A and B is consistent with the fluorescence-detected extended X-ray absorption fine structure results that the coordination number of Er depends on the growth temperature.     

Porous AlN films grown on C-face SiC by hydride vapor phase epitaxy

We report the growth of porous AlN films on C-face SiC substrates by hydride vapor phase epitaxy (HVPE). The influences of growth condition on surface morphology, residual strain and crystalline quality of AlN films have been investigated. With the increase of the V/III ratio, the growth mode of AlN grown on C-face 6H-SiC substrates changes from step-flow to pit-hole morphology. Atomic force microscopy (AFM), scanning electron microscopy (SEM) and Raman analysis show that cracks appear due to tensile stress in the films with the lowest V/III ratio and the highest V/III ratio with a thickness of about 3 μm. In contrast, under the medium V/III ratio growth condition, the porous film can be obtained. Even when the thickness of the porous AlN film is further increased to 8 μm, the film remains porous and crack-free, and the crystal quality is improved.     

金属有机化学气相淀积技术制备GaMnN薄膜材料光学性质研究

研究由MOCVD 技术制备的 GaMnN 外延薄膜光吸收谱.实验发现Mn掺杂后较未掺杂GaN吸收系数在近紫外区增加,在吸收谱低能区144 eV附近观察到吸收峰,吸收系数随Mn浓度的增加而增大.实验结果与基于密度泛函理论的第一性原理计算结果一致,结合理论计算分析认为144 eV附近的吸收峰源于Mn³⁺离子e态与t₂态间的带内跃迁⁵T₂→⁵E. 关键词： GaMnN MOCVD 密度泛函理论 光学性质     

Structural and optical properties of vertically aligned InP nanowires grown by metal organic vapor phase epitaxy

Vertically aligned InP nanowires were successfully grown by metalorganic vapor phase epitaxy under metal-catalyzed vapor–liquid–solid growth processes. Au nanoparticles with a nominal diameter of 20 nm were used as the seed to control the diameter of the nanowires. Scanning and transmission electron microscopic studies showed highly dense nanowires with uniform diameters along the length direction, and the zinc-blende structure of the nanowires with 1 1 1 growth direction, respectively. Cathodeluminescence measurements showed a significant blueshift in the spectral peak position compared to bulk InP due to the quantum confinement of the carriers in the nanowires.     

离子束刻蚀碲镉汞晶体的电学特性研究

本文利用迁移率谱分析了离子束刻蚀后的碲镉汞晶体, 发现180 μm的p型碲镉汞晶体在刻蚀后完全转为n型, 且由两个不同电学特性的电子层组成:低迁移率的表面电子层和高迁移率的体电子层. 通过分析不同温度下的迁移率谱, 表明表面电子层的迁移率不随温度而变化, 而体电子层的迁移率随温度的变化与传统的n型碲镉汞材料一致. 不同厚度下的霍尔参数表明体电子层的电学性质均匀. 另外, 通过计算得到表面电子层的浓度要比体电子层高2-3个数量级.     

Structural properties of TiN films grown on stainless steel substrates by a reactive radio-frequency sputtering technique at low temperature

TiN thin films were grown on stainless steel substrates by using the reactive radio-frequency magnetron-sputtering technique at relatively low temperature (200°C) using Ti and N₂. The deposition rate of the TiN film increased linearly with increasing applied radio-frequency power, and it decreased with increasing partial-pressure ratio of the N₂ gas to the Ar gas. Scanning electron microscopy (SEM) showed that the surfaces of the TiN films had very smooth morphologies. The TiN thin film had good stoichiometry for a partial-pressure ratio of 0.05. The stoichiometry of the TiN films and the interface qualities of the TiN/stainless steel heterostructures were investigated by Auger electron spectroscopy (AES) measurements. Auger depth profiles indicated that the compositions of the as-grown films consisted of titanium and nitrogen uniformly distributed throughout the films and that the films exhibited smooth interfaces. The interface quality of the TiN films to the stainless steel substrates were improved by annealing. These results indicate that annealed TiN thin films grown on stainless steel substrates hold promise for potential applications in advanced ceramic devices.     

Free-standing and vertically aligned InP nanowires grown by metalorganic vapor phase epitaxy

Metalorganic vapor phase epitaxial technique has been used to grow surface mounted vertical and uniform cross-sectional InP nanowires on a wafer scale basis. The growth was carried out under the vapor–liquid–solid mechanism using Au colloidal nanoparticles of nominal diameters of 10 and 20 nm, and their properties were compared. The effect of the pre-growth anneals and growth temperatures on the stability of the nanowires were studied in detail. Scanning electron microscopy and transmission electron microscopic studies showed average diameter of the nanowires in the range of 20–35 nm, and of length 700 nm with growth direction of 1 1 1. Room temperature photoluminescence measurements of the nanowires grown on 10 and 20 nm Au particles showed strong peaks, which were blue shifted by 25 and 32 meV, respectively, compared to bulk InP.     

Surface morphology of GaN nanorods grown by catalyst-free hydride vapor phase epitaxy

GaN nanorods were grown on c-plane sapphire substrates by using catalyst-free hydride vapor phase epitaxy (HVPE). The effects of substrate temperature, Ga boat temperature, and Ga pretreatment on the surface morphology of GaN nanorods were investigated. From the dependence of a radial and axial growth rate on the substrate temperature, the kinetically limited process was found to be a rate determining step in the growth of GaN nanorods in HVPE. In addition, the activation energy of the growth along the both axial and radial directions were estimated. The dependence of a Ga boat temperature and the Ga pretreatment effect revealed that the density of nanorods were dependent on the flux of Ga species on the substrate.     

Effects of low temperature annealing on the electrical properties of plasma grown oxides

The effects of low temperature annealing on the electrical properties of plasma grown oxides have been investigated. In conjunction with a trichloroethylene/oxygen plasma it is found that plasma oxides with good electrical properties can be obtained at annealing temperatures below 600°C.