Residual Stress Measurement Using Hole Drilling and Integrated Digital Image Correlation Techniques

The effectiveness of optical (mostly interferometric) methods for the measurement of residual stresses is largely demonstrated in literature. Nevertheless, these techniques are still confined to optical laboratories due to their high sensitivity to vibrations which makes it very difficult to perform the measurement in an industrial environment. Digital Image Correlation (DIC) has recently been proposed as a possible solution to this problem: this non-interferometric technique is much less affected by vibrations, but its sensitivity is relatively low, thus negatively affecting the accuracy of results. This work proposes to use a variant of Digital Image Correlation, known as Integrated DIC (iDIC), in combination with the hole drilling technique. Since iDIC directly incorporates in its formulation the displacement field related to hole drilling, it overcomes most of the problems of standard DIC; in this way it is possible to obtain accurate results without using interferometric techniques.     

On the Implementation of the Integral Method for Residual Stress Measurement by Integrated Digital Image Correlation

Experimental Mechanics - The Integrated Digital Image Correlation method (iDIC) is a simple and effective approach for residual stress measurement. iDIC differs from Digital Image Correlation...     

Residual Stress Determination Using Hole Drilling and 3D Image Correlation

In recent years, the hole drilling method for determining residual stresses has been implemented with optical methods such as holographic interferometry and ESPI to overcome certain limitations of the strain rosette version of hole drilling. Although offering advantages, the interferometric methods require vibration isolation, a significant drawback to their use outside of the laboratory. In this study, a 3D image correlation approach was used to measure micron-sized surface displacements caused by the localized stress relief associated with hole drilling. Residual stresses were then found from the displacements using non-dimensional relations previously derived by finite element analysis. A major advantage of image correlation is that it does not require interferometric vibration isolation. Experiments were performed to check the ability of this new approach for uniaxial and equi-biaxial states of stress. Stresses determined by the approach were in good agreement with computed values and those determined by hole drilling using holographic interferometry.     

Residual Stress Analysis of Orthotropic Materials Using Integrated Digital Image Correlation

Measuring residual stress in an orthotropic material is a difficult task due to the complex behavior of the material. Recently, two different approaches based on Smith’s simplified real value formulation and the general solution developed by Lekhnitskii have been proposed. Both solutions assume the measurement of the displacement field via interferometric optical methods and estimate stress values through solving an inverse problem. However, the high sensitivity to vibrations of interferometric techniques makes their use difficult outside optical laboratories; standard Digital Image Correlation could be used, but its low sensitivity and relatively high standard deviation of displacements severely affect the reliability of estimates. In this work we propose to integrate the residual stress displacement functions related to orthotropic materials into the shape functions of Digital Image Correlation. This makes it possible overcome most of the problems related to low sensitivity and large standard deviation because a single large patch can be used for the measurement, thus providing an accurate and reliable algoritm for the measurement of residual stress.     

Improvements in Residual Stress Measurement by the Incremental Centre Hole Drilling Technique

This paper presents results which advance and improve the usefulness, accuracy and efficiency of incremental centre hole drilling as a method of measuring near surface residual stress fields. Particular emphasis is placed on providing optimal values for the number of drilling step increments to be used and their corresponding size. Guidelines on the optimal values for the number and size of steps to use during measurements are presented for various ratios of hole radius to strain gauge rosette radius in the form of tabulated data. These guidelines are subsequently incorporated into a new data analysis program which permits very near surface residual stress fields to be accurately determined in real components. The benefits of the new approach are highlighted by reporting the results of measurements made on three industrial components, each of which has been subjected to a well-known engineering process. These components are a shot-peened spring-steel, a friction stir welded aluminium alloy, and a titanium alloy subjected to three different machining processes. The results reveal that the improvements to the incremental centre hole drilling technique can provide measured residual stresses from depths ranging from about 10 m to 1 mm.     

Overview of High-temperature Deformation Measurement Using Digital Image Correlation

Background

Developments in digital image correlation (DIC) in the last decade have made it a practical and effective optical technique for displacement and strain measurement at high temperatures.

Objective

This overview aims to review the research progress, summarize the experience and provide valuable references for the high-temperature deformation measurement using DIC.

Methods

We comprehensively summarize challenges and recent advances in high-temperature DIC techniques.

Results

Fundamental principles of high-temperature DIC and various approaches to generate thermal environment or apply thermal loading are briefly introduced first. Then, the three primary challenges presented in performing high-temperature DIC measurements, i.e., 1). image saturation caused by intensified thermal radiation of heated sample and surrounding heating elements, 2) image contrast reduction due to surface oxidation of the heated sample and speckle pattern debonding, and 3) image distortion due to heat haze between the sample and the heating source, and corresponding countermeasures (i.e., the suppression of thermal radiation, fabrication of high-temperature speckle pattern and mitigation of heat haze) are discussed in detail. Next, typical applications of high-temperature DIC at various spatial scales are briefly described. Finally, remaining unsolved problems and future goals in high-temperature deformation measurements using DIC are also provided. 

Conclusions

We expect this review can guide to build a suitable DIC system for kinematic field measurements at high temperatures and solve the challenging problems that may be encountered during real tests.

     

Assessment of Digital Image Correlation Measurement Errors: Methodology and Results

Optical full-field measurement methods such as Digital Image Correlation (DIC) are increasingly used in the field of experimental mechanics, but they still suffer from a lack of information about their metrological performances. To assess the performance of DIC techniques and give some practical rules for users, a collaborative work has been carried out by the Workgroup “Metrology” of the French CNRS research network 2519 “MCIMS (Mesures de Champs et Identification en Mécanique des Solides / Full-field measurement and identification in solid mechanics, http://www.ifma.fr/lami/gdr2519)”. A methodology is proposed to assess the metrological performances of the image processing algorithms that constitute their main component, the knowledge of which being required for a global assessment of the whole measurement system. The study is based on displacement error assessment from synthetic speckle images. Series of synthetic reference and deformed images with random patterns have been generated, assuming a sinusoidal displacement field with various frequencies and amplitudes. Displacements are evaluated by several DIC packages based on various formulations and used in the French community. Evaluated displacements are compared with the exact imposed values and errors are statistically analyzed. Results show general trends rather independent of the implementations but strongly correlated with the assumptions of the underlying algorithms. Various error regimes are identified, for which the dependence of the uncertainty with the parameters of the algorithms, such as subset size, gray level interpolation or shape functions, is discussed.     

Residual Stress Determination by Hole Drilling Combined with Optical Methods

An overview is provided of the use of eight different optical methods with hole drilling to determine residual stresses. The methods considered are: brittle and photoelastic coatings, Moire interferometry, holographic interferometry, electronic speckle pattern interferometry, interferometric strain rosette, digital image correlation and shearography. A number of applications are summarized, such as the use of hole drilling with holographic interferometry to investigate stresses in rock structures accessed by deep boreholes and to determine manufacturing-induced residual stresses in fillets of small radii.     

On the Use of NURBS Functions for Displacement Derivatives Measurement by Digital Image Correlation

In this paper, we propose to investigate the potential improvement of using Non-Uniform Rational B-Spline (NURBS) functions for displacement measurements by digital image correlation (DIC). The aim is at improving the performance of DIC to capture with low uncertainty and low noise levels not only the displacement field but also its derivatives. Indeed, when the displacement field is used to feed constitutive law identification procedures, displacement derivatives are required and thus may be measured with robustness. Two examples illustrate the potential of NURBS for DIC: a compressive test on a wood sample and a bending test on a steel beam. For the latter, beam kinematics are adopted and NURBS are used in order to capture the variation of the curvature (second derivative of the displacement) along the beam axis. For these two examples, an error study based on a decomposition of the error into the correlation error and the interpolation error, is carried out and shows the great potential of NURBS functions for DIC.     

Residual Stress Analysis of Orthotropic Materials by the Through-hole Drilling Method

The present study deals with the development and the application of the through-hole drilling method for the residual stress analysis in orthotropic materials. Through a systematic theoretical study of the stress field present on orthotropic plates with a circular hole, the relationships between the relaxed strains measured by a rectangular strain gauge rosette and the Cartesian components of the unknown residual stresses are obtained. The theoretical formulas of each influence coefficient allow the user an easy application of the method to the analysis of uniform-residual stresses on a generic homogeneous orthotropic material. Furthermore, to extend the method to the analysis of the residual stresses on orthotropic laminates, caused by initial in-plane loadings, an alternative formulation is implemented. The accuracy of the proposed method has been assessed through 3D numerical simulations and experimental tests carried out on unidirectional, cross-ply and angle-ply laminates.     

数字体图像相关方法中基于迭代最小二乘法的物体内部变形测量

本文提出一种基于迭代最小二乘法的亚体素位移测量算法.该算法模型结合了符合实际情况的线性灰度变化模型和线性位移映射函数,采用仅需变形后体图像一阶灰度梯度的迭代最小二乘法计算亚体素位移和位移梯度.由于该算法采用的模型符合实际情况,因而具有更高的位移测量精度和更广泛的适用性.此外,由于仅需变形后体图像的一阶灰度梯度,无需计算...     

Leveraging Full-Field Measurement from 3D Digital Image Correlation for Structural Identification

Within the domain of structural health monitoring (SHM) measurement techniques have primarily relied on discrete sensing strategies using sensors physically attached to the structural system of interest. These sensors have proven effective in describing both global and local phenomena, but are limited to providing discrete response measurements of these systems. With the introduction of novel imaging tools and image analysis techniques, such as digital image correlation (DIC), the ability to measure the full-field response of these systems provides a novel approach to refining structural identification (St-ID) approaches used in SHM. This paper explores this proposed concept through a case study on a series of structural test specimens analyzed using 3D digital image correlation (3D-DIC) for St-ID. Finite element model updating (FEMU) was used as the technique for the structural identification. For the identification process, ABAQUS was interfaced with MATLAB to converge on the optimal unknown/uncertain system parameters of the experimental setup. 3D-DIC results provided a rich full-field dataset for the identification process, which was compared against measurements derived from traditional physical in-place sensors typically used in SHM. In this work a Hybrid Genetic Algorithm (HGA), which combines the genetic algorithm as a global optimization and a gradient-based method as a local optimization, was used for the FEMU based on 3D-DIC results of structural specimen subjected to variable loading. To minimize the error between the full field 3D-DIC measurements and FEA model updating results, an objective function was introduced that included the full-field contributions of strains and deformation response. The evolution of this objective function illustrated satisfactory convergence of the identified parameters and the excellent agreement of the experimental and numerical strain and displacement responses after the model updating process confirmed the success of the proposed approach. The results of this study highlight the advantage of this hybrid approach and provide the foundation for effective deployment of the proposed strategy for large-scale structural systems.     

Digital Image Correlation and Color Cameras

Digital Image Correlation (DIC) is a well-known experimental technique. It works by constructing a (surjective) mapping of pixel intensity from reference to target image, where the mapping parameters are identified using a Least Squares approach. Because it makes use of the luminance component of the image, Digital Image Correlation is usually implemented by assuming monochrome cameras. In this work, we will discuss its implementation when color cameras are used, focusing on pitfalls and potential advantages of this solution. Since most cameras implement color acquisition using a Color Filter Array (CFA), much of the article will focus on this technology. However, we will not limit ourselves to this aspect and will show that Three-CCD cameras can provide significant advantages over both CFA and monochrome cameras.     

Combining Image Compression with Digital Image Correlation

Experimental Mechanics - Digital image correlation (DIC) is a powerful experimental technique to determine displacement and strain fields. DIC methods usually require a large number of high...     

Micro- and Nanoscale Deformation Measurement of Surface and Internal Planes via Digital Image Correlation

The digital image correlation (DIC) technique is successfully applied across multiple length scales through the generation of a suitable speckle pattern at each size scale. For microscale measurements, a random speckle pattern of paint is created with a fine point airbrush. Nanoscale displacement resolution is achieved with a speckle pattern formed by solution deposition of fluorescent silica nanoparticles. When excited, the particles fluoresce and form a speckle pattern that can be imaged with an optical microscope. Displacements are measured on the surface and on an interior plane of transparent polymer samples with the different speckle patterns. Rigid body translation calibrations and uniaxial tension experiments establish a surface displacement resolution of 1 μm over a 5×6 mm scale field of view for the airbrushed samples and 17 nm over a 100×100 μm scale field of view for samples with the fluorescent nanoparticle speckle. To demonstrate the capabilities of the method, we characterize the internal deformation fields generated around silica microspheres embedded in an elastomer under tensile loading. The DIC technique enables measurement of complex deformation fields with nanoscale precision over relatively large areas, making it of particular relevance to materials that possess multiple length scales.     

Incremental Hole Drilling Residual Stress Measurement in Thin Aluminum Alloy Plates Subjected to Laser Shock Peening

Experimental Mechanics - The American standard ASTM E837 presents a standard procedure to determine residual stresses in isotropic materials using the incremental hole drilling technique (IHD). The...     

Augmented Lagrangian Digital Image Correlation

Experimental Mechanics - Digital image correlation (DIC) is a powerful experimental technique for measuring full-field displacement and strain. The basic idea of the method is to compare images of...     

Evaluation Using Digital Image Correlation of Stress Intensity Factors in an Aerospace Panel

The fracture behavior of a crack propagating in a large (4.8 m × 1.4 m) aircraft panel was investigated quantitatively by experiment for the first time using digital image correlation. Mixed mode (I+II) stress intensity factors were evaluated using a methodology, which combined digital image correlation with the multi-point over-deterministic method to fit displacement field equations to the experimental data from around a crack tip. More than 800 images were taken during a 10-minute time period as the fracture of the panel occurred under monotonic loading. It was observed that the crack propagated through the skin of the panel at a relatively low speed, with an average crack tip velocity of 0.014 mm/s, and changed its propagation direction at particular points due to the reinforcement of the structure. In the later stages of the test, substantial shear lips were observed indicating a state of plane stress as would be expected in a thin, wide panel and the size of the plastic zone increased substantially. The value of the mode I stress intensity factor obtained from the measured displacement fields initially increased linearly to around 50 MPa√m (K_Ic = 37 MPa√m) and afterwards non-linearly reaching 300 to 400 MPa√m for crack extensions of the order of 100 mm. It is proposed that these high values of stress intensity factor do not represent an unrealistically high material fracture toughness but rather are indicative of the high resistance to crack growth of the structural assemblage of ribs, stringers and hole reinforcements in the panel which allow the skin to sustain a strain level that would otherwise cause unstable crack growth. Digital image correlation is demonstrated to be particularly powerful in elucidating this structural behavior.