Epitaxial lateral overgrowth of non-polar GaN(1 1̄ 0 0) on Si(1 1 2) patterned substrates by MOCVD

m-Plane GaN was grown selectively by metal–organic chemical vapor deposition (MOCVD) on patterned Si(1 1 2) substrates, where grooves aligned parallel to the Si〈1 1 0〉 direction were formed by anisotropic wet etching to expose the vertical Si{1 1 1} facets for growth initiation. The effect of growth conditions (substrate temperature, chamber pressure, and ammonia and trimethylgallium flow rates) on the growth habits of GaN was studied with the aim of achieving coalesced m-plane GaN films. The epitaxial relationship was found to be GaN(1 1? 0 0) || Si(1 1 2), GaN[0 0 0 1] || Si[1 1 –1], GaN[1? 1? 2 0] || Si[1 1? 0]. Among all growth parameters, the ammonia flow rate was revealed to be the critical factor determining the growth habits of GaN. The distribution of extended defects, such as stacking faults and dislocations, in the selectively grown GaN were studied by transmission electron microscopy in combination with spatially resolved cathodoluminescence and scanning electron microscopy. Basal-plane stacking faults were found in the nitrogen-wing regions of the laterally overgrown GaN, while gallium-wings were almost free of extended defects, except for the regions near the GaN/Si{1 1 1} vertical sidewall interface, where high dislocation density was observed.     

InAs nanowire growth on oxide-masked 〈111〉 silicon

Here we investigate the growth of InAs nanowires on 〈111〉 Si substrates masked by SiO_x using metal–organic chemical vapor deposition. We study 〈111〉 (axial) and 〈1?10〉 (radial) growth of InAs NWs by varying growth duration, temperature, group-III molar flows, V/III ratio, mask material, mask opening size, and inter-wire distance. We find that growth takes place without an In droplet and the process evolves through three successive phases: nucleation of an InAs cluster, followed by two distinct nanowire growth phases. These two growth phases have different axial and radial growth rates, which originate in a transition from having In supply dominated by the open Si area in the first phase towards an In supply from the vapor/oxide mask in the second growth phase. The linear relation found between nanowire length and diameter vs. time in the last growth phase indicates that 〈111〉 growth is not surface diffusion limited as is usually the case for catalyzed growth. A high yield of vertical nanowires is obtained if group-III flow is above and V/III ratio below threshold values, in addition to having an arsenic-terminated Si surface. Furthermore, we observe that 〈111〉 and 〈1?10〉 growth is surface kinetically limited below 520 °C and 540 °C, respectively, with activation energies of 20 and 6.5 kcal/mol. This difference in activation energies limits the selectivity of the 〈111〉 to 〈1?10〉 growth to 25:1 under optimized conditions, which must be considered when fabricating axially modulated structures. However, we find that by placing wires in large arrays it is possible to completely stop the 〈1?10〉 growth rate in favor of the 〈111〉 growth rate.     

Formation of microtwins in TmP/GaAs heterostructures

Microtwins in semi-metal thulium phosphide (TmP) epilayers grown on (0 0 1) GaAs substrates by molecular beam epitaxy have been studied by transmission electron microscopy. Selected area diffraction patterns show extra spots along 〈1 1 1〉 and 〈2 2 4〉 corresponding to three times the normal rock-salt periodicity. Only one or two twin variants are found in the crystal. The occurrence of the observed microtwins in the TmP-GaAs heterostructure can be accounted for by the growth-accident mechanism, i.e., the formation of microtwins is via growth accidents in the stacking sequence on {1 1 1} and {1 1 2} planes. The growth accidents appear to occur due to rapid growth rates and/or contamination.     

High quality InAlN/GaN heterostructures grown on sapphire by pulsed metal organic chemical vapor deposition

High quality InAlN/GaN heterostructures are successfully grown on the (0 0 0 1) sapphire substrate by pulsed metal organic chemical vapor deposition. The InAlN barrier layer with an indium composition of 17% is observed to be nearly lattice matched to GaN layer, and a smooth surface morphology can be obtained with root mean square roughness of 0.3 nm and without indium droplets and phase separation. The 50 mm InAlN/GaN heterostructure wafer exhibits a mobility of 1402 cm²/V s with a sheet carrier density of 2.01×10¹³  cm^?2, and a low average sheet resistance of 234 Ω/cm² with a sheet resistance nonuniformity of 1.22%. Compared with the conventional continual growth method, PMOCVD reduces the growth temperature of the InAlN layer and the Al related prereaction in the gas phase, and consequently enhances the surface migration, and improves the crystallization quality. Furthermore, indium concentration of InAlN layer can be controlled by adjusting the pulse time ratio of TMIn to TMAl in a unit cycle, the growth temperature and pressure, as well as the InAlN layer thickness by the number of unit cycle repeats.     

Low temperature epitaxial growth of Ge on CaF2 buffered cube-textured Ni

Quasi-single crystal Ge films were grown on cube textured Ni substrate at a temperature of 350 °C using an insulating buffer layer of CaF₂. A direct deposition of Ge on Ni at 350 °C was shown to alloy with Ni. From x-ray pole figure analysis, it was shown that Ge grew epitaxially with the same orientation as CaF₂ and the dispersions in the out-of-plane and in-plane directions were found to be 1.7±0.1° and 6±1°, respectively. In the out-of-plane direction, Ge[111]6CaF₂[111]6Ni[001]. In addition, the Ge consisted of four equivalent in-plane oriented domains such that two mutually orthogonal directions: Ge〈2?11〉 and Ge〈01?1〉 are parallel to mutually orthogonal directions: Ni〈1?10〉 and Ni〈1?1?0〉, respectively, of the Ni(001) surface. This was shown to originate from the four equivalent in-plane oriented domains of CaF₂ created to minimize the mismatch strain between CaF₂ and Ni in those directions.     

Growth chemistry of nanocrystalline silicon and germanium films

We report on the growth of nanocrystalline Si:H and Ge:H films. The films were grown using plasma deposition and hot wire chemical growth techniques. Conditions such as pressure, temperature and hydrogen dilution were systematically varied. It is shown that excessive hydrogen dilution during growth leads to smaller grains in nanocrystalline Si and Ge. Films with very large grains (56 nm) could be obtained using hot wire growth techniques under appropriate conditions of growth. From the data, it is concluded that the natural growth direction for the films is 〈2 2 0〉, and that excessive bonded hydrogen leads to smaller grains.     

Growth temperature induced effects in non-polar a-plane GaN on r-plane sapphire substrate by RF-MBE

Non-polar a-plane GaN films were grown on an r-plane sapphire substrate by plasma assisted molecular beam epitaxy (PAMBE). The effect of growth temperature on structural, morphological and optical properties has been studied. The growth of non-polar a-plane (1 1 ?2 0) orientation of the GaN epilayers were confirmed by high resolution X-ray diffraction (HRXRD) study. The X-ray rocking curve (XRC) full width at half maximum of the (1 1 ?2 0) reflection shows in-plane anisotropic behavior and found to decrease with increase in growth temperature. The atomic force micrograph (AFM) shows island-like growth for the film grown at a lower temperature. Surface roughness has been decreased with increase in growth temperature. Room temperature photoluminescence shows near band edge emission at 3.434–3.442 eV. The film grown at 800 °C shows emission at 2.2 eV, which is attributed to yellow luminescence along with near band edge emission.     

Silicon light emissions from boron implant-induced defect engineering

We studied the electroluminescence of boron-implanted p–n junction silicon light emitting-diodes (Si LEDs) engineered with the implant-induced extended defects of different types. By varying the post implant annealing conditions to tune the extended defects and by using plan-view transmission electron microscopy to identify them, we found that {1 1 3} defects along Si〈1 1 0〉 are the ones that result in strong silicon light emission of the p–n junction Si LEDs other than {1 1 1} perfect prismatic and {1 1 1} faulted Frank dislocation loops. The electroluminescence peak intensity at about 1.1 eV of {1 1 3} defect-engineered Si LEDs is about twenty-five times higher than that of dislocation defect-engineered Si LEDs.     

Self-limiting nature in atomic-layer epitaxy of rutile thin films from TiCl4 and H2O on sapphire (0 0 1) substrates

The atomic-layer epitaxy of rutile thin films on sapphire (0 0 1) substrates was studied in the controlled growth of titanium oxide films by sequential surface chemical reactions using sequentially fast pressurized titanium tetrachloride (TiCl₄) and water (H₂O) vapor pulses. Optical constants and thicknesses of these rutile films were investigated in terms of vapor pressure using a variable-angle spectroscopic ellipsometer. As a result, the self-limiting nature in the atomic-layer epitaxy of rutile thin films was demonstrated clearly under various conditions of dosing reactant vapors, where growth rates were almost constant at approximately 0.077 nm/cycle (0.77 nm/min) and refractive indices were also constant at 2.59.     

Desymmetrization of the polyhedral crystal shape of tetragonal lysozyme due to face-growth rate fluctuations

We have studied the desymmetrization of the polyhedral crystalline shape of tetragonal lysozyme crystals due to the growth rate differences of the equivalent {1 0 1} planes. Using atomic force microscopy, we have observed the evolution of the multifaceted structures composed of four equivalent {1 0 1} faces during growth. In our growth condition, lateral step flow, where a large density of dislocations acts as a source of steps, is the dominant growth mechanism. The measured step flow velocities are almost independent of the separation between the neighboring steps, revealing that the local face normal growth rate is determined by the local step density. By tracing the motion of the vertex surrounded by the {1 0 1} faces, we have found that the desymmetrization of the crystalline shape is due to the large fluctuation of the local face normal growth rate, which is comparable in magnitude to the average growth rate.     

Contribution of floppy modes to configurational and excess entropy in chalcogenide glasses

In this work, following Naumis’ ideas [G.G. Naumis, Phys. Rev. B 61 (2000) R9205], we include the floppy modes as a free energy in order to obtain the configurational and excess entropy as well as the jump of the heat capacity of the chalcogenide glasses as function of the coordination number 〈r〉. Theoretically, we find that S_ex/S_c ranges from 1.5 for strong liquids (〈r〉 = 2) to 2 for fragile ones (〈r〉 = 2.4). These results are consistent with the values reported by Angell and Borick [C.A. Angell, S. Borick, J. Non-Cryst. Solids 307&310 (2002) 393], who find experimentally for selenium, 〈r〉 = 2, S_ex/S_c = 1.47. The proportionality between the configurational and total excess entropies supports the non-existence of the Adam–Gibbs equation paradox. Finally, using S_c in the Adam–Gibbs equation we obtain a VFT-like equation as function of 〈r〉, predicting that when 〈r〉 increases, D decreases as well, as it has been seen in previous work.     

Growth of thick,continuous GaN layers on 4-in. Si substrates by metalorganic chemical vapor deposition

We report on the growth of thick GaN epilayers on 4-in. Si(1 1 1) substrates by metalorganic chemical vapor deposition. Using intercalated AlN layers that contribute to counterbalance the tensile strain induced by the thermal mismatch between gallium nitride and the silicon substrate, up to 6.7 μm thick crack-free group III-nitride layers have been grown. Root mean-squares surface roughness of 0.5 nm, threading dislocation densities of 1.1×10⁹ cm^?2, as well as X-ray diffraction (XRD) full widths at half-maximum (FWHM) of 406 arcsec for the GaN(0 0 2) and of 1148 arcsec for the GaN(3 0 2) reflection have been measured. The donor bound exciton has a low-temperature photoluminescence line width of 12 meV. The correlation between the threading dislocation density and XRD FWHM, as well as the correlation between the wafer curvature and the GaN in-plane stress is discussed. An increase of the tensile stress is observed upon n-type doping of GaN by silicon.     

Crystallization of bismuth titanate and bismuth silicate grown as thin films by atomic layer deposition

Bismuth silicate and bismuth titanate thin films were deposited by atomic layer deposition (ALD). A novel approach with pulsing of two Bi-precursors was studied to control the Si/Bi atomic ratio in bismuth silicate thin films. The crystallization of compounds formed in the Bi₂O₃–SiO₂ and Bi₂O₃–TiO₂ systems was investigated. Control of the stoichiometry of Bi–Si–O thin films was studied when deposited on Si(1 0 0) and crystallization was studied for films on sapphire and MgO-, ZrO₂- and YSZ-buffered Si(1 0 0). The Bi–Ti–O thin films were deposited on Si(1 0 0) substrate. Both Bi–Si–O and Bi–Ti–O thin films were amorphous after deposition. Highly a-axis oriented Bi₂SiO₅ thin films were obtained when the Bi–Si–O thin films deposited on MgO-buffered Si(1 0 0) were annealed at 800 °C in nitrogen. The full-width half-maximum values for 200 peak were also studied. An excess of bismuth was found to improve the crystallization of Bi–Ti–O thin films and the best crystallinity was observed with Ti/Bi atomic ratio of 0.28 for films annealed at nitrogen at 1000 °C. Roughness of the thin films as well as the concentration depth distribution were also examined.     

Preparation and characterization of CdGeAs2 crystal by modified vertical Bridgman method

A large, crack-free CdGeAs₂ single crystal measuring 15 mm in diameter and 45 mm in length was grown in a vertical three-zone tubular furnace by a modified vertical Bridgman method, i.e. quasi-seed technique with small temperature gradient and descending quartz ampoule. High-purity, single phase CdGeAs₂ polycrystallite for crystal growth was synthesized using a rocking furnace with temperature oscillation techniques. Various measuring means, including X-ray diffractometer(XRD), Fourier transform infrared spectroscopy(FTIR), and Field emission scanning electron microscope(FE-SEM) were adopted to characterize the as-grown crystal. It is found that the cleavage plane of the as-grown crystal is {1 0 1} face; the crystal is integrated in structure and crystallized well; etch pits in the shape of pentagon on (1 1 2) face have been observed for the first time using the new preferential etchant we prepared. All these results encouragingly indicate that the modified vertical Bridgman method is a convenient and effective way for high quality CdGeAs₂ crystal growth.     

Effects of vicinal angles from (0 0 1) surface on the Boron-doping features of high-quality homoepitaxial diamond films grown by the high-power microwave plasma chemical-vapor-deposition method

Vicinal surface effects on homoepitaxial growth and boron-doping processes have been studied in case of single-crystalline diamond (0 0 1) surfaces grown using the high-power microwave plasma chemical-vapor-deposition (MWPCVD) method. The off-angles inclined from the on-orientation (0 0 1) surfaces ranged to 5° along the [1 1 0] or [1 0 0] direction, while the concentration of doping B(CH₃)₃ gas was kept constant with a B/C ratio of 50 ppm. Although a number of square-like growth hillocks often appeared, depending substantially on the crystalline quality of the high-pressure/high-temperature-synthesized (HPHT) Ib diamond substrates employed, the number and shape of the hillocks changed significantly with the increasing off-angle. For the vicinal surfaces with off-angles of ≈3° inclined along the [1 1 0] direction, macroscopically flat surfaces were obtained, compared with the other off-angle cases examined. Furthermore, the growth rate and acceptor density of substitutional boron atoms in the homoepitaxial layers were found to substantially increase with the increasing off-angle. These indicate that the step density can play important roles not only in the homoepitaxial growth but also in the boron-incorporation process during the high-power MWPCVD growth.     

The preferential orientation of the directionally solidified Si–TaSi2 eutectic in situ composite

The Si–TaSi₂ eutectic in situ composite is a favorable field emission material due to relatively low work function, good electron conductivity, and three-dimensional array of Schottky junctions grown in the composite spontaneously. The preferential orientation during directional solidification is determined by the growth anisotropy. In order to obtain the preferential direction of the steady-state crystal growth, the transmission electron microscopy (TEM) is used for analysis. It is found that the preferential orientation of the Si-TaSi₂ eutectic in situ composite prepared by Czochralski (CZ) technique is [3 3¯ 2¯] Si∥[0 0 0 1] TaSi₂, (2 2 0)Si∥(2 2¯ 0 0) TaSi₂. Whereas the preferential orientation of the Si–TaSi₂ eutectic in situ composite prepared by electron beam floating zone melting (EBFZM) technique is [0 1¯ 1¯ ]] Si∥[0 0 0 1] TaSi₂,(0 1¯ 1) Si∥(0 1¯ 1 1)TaSi₂. The preferential directions of the Si-TaSi₂ eutectic in situ composites prepared by two kinds of crystal growth techniques are distinctly different from each other, which results from different solid–liquid interface temperatures on account of the different crystal growth conditions, e.g. different solidification rate, different temperature gradient, different solid–liquid interface curvature and different kinetic undercooling.     

Growth mechanisms and defect structures of B12As2 epilayers grown on 4 H-SiC substrates

Epitaxial growth of icosahedral B₁₂As₂ on c-plane 4 H-SiC substrates has been analyzed. On on-axis c-plane 4 H-SiC substrates, Synchrotron white beam x-ray topography (SWBXT) revealed the presence of a homogenous solid solution of twin and matrix B₁₂As₂ epilayer domains. High resolution transmission electron microscopy (HRTEM) and scanning transmission electron microscopy (STEM) both revealed the presence of an ～20 nm thick, disordered transition layer at the interface. (0003) twin boundaries are shown to possess fault vectors such as 1/3[1–100]_B12As2, which originate from the mutual shift between the nucleation sites. On the contrary, B₁₂As₂ epilayers grown on c-plane 4 H-SiC substrates intentionally misoriented from (0001) towards [1–100] is shown to be free of rotational twinning. SWBXT, HRTEM and STEM all confirmed the single crystalline nature and much higher quality of the films. In addition, no intermediate layer between the epilayer and the substrate was observed. It is proposed that the vicinal steps formed by hydrogen etching on the off-axis 4 H-SiC substrate surface before deposition cause the film to adopt a single orientation during nucleation process. This work also demonstrates that c-plane 4 H-SiC with offcut toward [1–100] is potentially a good substrate choice for the growth of high-quality, single crystalline B₁₂As₂ epilayers for future device applications.     

Epitaxial growth of the metastable phase ytterbium monoxide on gallium nitride surfaces

Molecular beam deposition systems allow for unparalleled control of film composition and structure. This article addresses the capacity for controlling metal and oxidant fluxes in the Yb/O₂ system to access the metastable phase ytterbium monoxide (YbO). Experiments exploring the growth of polycrystalline YbO_x films by molecular beam deposition demonstrate that a 2:1 molar ratio of Yb:O₂ fluxes is necessary to achieve preferential growth of the divalent oxide. Applying similar deposition conditions to a (0 0 1) GaN surface leads to the growth of epitaxial (1 1 1) YbO films. Similar to other rocksalt oxides grown on GaN surfaces, YbO films display a 3D growth mechanism that leads to a grainy morphology with crystallites of 50 nm lateral dimensions. Rocking curves in ω and φ have full-width half-maximum values of 1.77° and 4.1°, respectively; further improvements in crystal quality appear to be limited by the thermal stability of the YbO phase.     

Defect-related emission characteristics of nonpolar m-plane GaN revealed by selective etching

A comprehensive study of the morphology and luminescence characteristics of nonpolar m-plane GaN etched in hot acids was presented. It was found that many four-sided pyramidal pits were distributed on the etched GaN surface with the long side perpendicular to the [1 1 2? 0] direction, corresponding to the threading dislocations. When compared to the as-grown GaN, DAP emission intensity and its LO-phonon coupling phenomenon in the etched GaN were greatly attenuated, whereas the intensity of BSF-related band almost kept constant due to its immunity to chemical etching. Especially, a new PSF-related emission at 3.32 eV emerged in CL spectra of etched GaN. Simultaneously, partial relaxation of compressive stress happened for the etched GaN epilayer according to the red shift of NBE emission in photoluminescence (PL) and E₂(high) phonon peak in the Raman spectra. Contrary, the DAP peak in etched GaN was blueshifted, likely due to the reduced impurity level fluctuation by etching. In addition, the different behaviors were discussed for NBE and defect-related transitions in the etched GaN, characterized by excitation power- and temperature-dependent PL.     

Micro-Raman mapping on layers for crystalline silicon thin-film solar cells

Micro-Raman mappings have been used for characterization of our layers system developed for thin-film silicon solar cells. For the cubic SiC barrier layer a preferential orientation of the grains in 〈1 1 1〉 direction normal to the substrate was revealed. A high density of stacking faults resulted in the splitting of transversal optical (TO)-phonon modes, usually only observed in several non-cubic SiC polytypes. Within the silicon layers, which were obtained by zone melting recrystallization (ZMR) and subsequent epitaxial growth, a high residual stress of about 625 MPa was measured near the boundary towards the SiC layer. Outside of this boundary no residual stress could be detected, in spite of commonly found twin boundaries. Thus the main origin of residual stress in the silicon layers is due to the different expansion coefficients of the respective layers, while grain boundaries have no dominant effect.