Synthesis, cure kinetics, and thermal properties of a novel boron–silicon hybrid polymer

A novel boron–silicon hybrid polymer (PASB) was synthesized from polycondensation between phenylboron dichloride and dichloromethylsilane with Grignard reagent. The structure of PASB was characterized using fourier transform infrared spectra, ¹H-NMR, ¹³C-NMR, and gel permeation chromatography. The curing behavior of PASB was investigated by means of non-isothermal differential scanning calorimetry and the kinetic parameters were determined by the Kissinger’s and Ozawa’s methods, respectively. The results showed that both the methods for calculating the activation energy value gave fairly close results of 104.4 and 107.7 kJ mol^?1, respectively. A reasonable curing cycle for the resin system was also established, which suggested that it was reasonable to choose a curing temperature between T _i0 (452.0 K) and T _f0 (554.0 K). These results can provide theoretical guidance reference for determining the curing of the resin system. The thermal stability of cured PASB resin was studied by means of thermogravimetric analysis under nitrogen atmosphere and the temperature of 5 % mass loss (Td₅) was 610.1 °C, the residue at 1,000 °C was 87.8 %, which showed that the cured PASB resin exhibited excellent thermal properties and made it potentially useful as high performance matrix resin and precursor for ceramics.     

Synthesis and characterization of oligosalicylaldehyde-based epoxy resins

The synthesis of a new epoxy resin of oligosalicylaldehyde by the reaction with epichlorohydrin is reported. New resin’s epoxy value and chlorine content were determined and found to be 25% and 1%, respectively. The characterization of the new resin was instrumented by FTIR, ¹H NMR, scanning electron microscopy, and thermal gravimetric analyses. TGA results showed that the cured epoxy resin has a good resistance to thermal decomposition. The mass losses of cured epoxy resin were found to be 5%, 10%, 50% at 175°C, 240°C, and 400°C, respectively. On the curing procedure the resin was cured with polyethylenepolyamine at 25 °C for 8 h and 100°C for 1.5 h. The FTIR spectrum of new epoxy resin gave the peak of oxirane ring at ṽ = 918 cm⁻¹. In memory of Professor Dr. Adalet R. Vilayetoğlu     

Calcination temperature-dependent morphology of photocatalytic ZnO nanoparticles prepared by an electrochemical–thermal method

ZnO nanoparticles (NPs) with tunable morphologies were synthesized by a hybrid electrochemical–thermal method at different calcination temperatures without the use of any surfactant or template. The NPs were characterized by Fourier transform infrared (FT-IR) spectroscopy, X-ray diffraction, dynamic light scattering, thermogravimetry–differential thermal analysis, scanning electron microscope and N₂ gas adsorption–desorption studies. The FT-IR spectra of ZnO NPs showed a band at 450 cm^?1, a characteristic of ZnO, which remained fairly unchanged at calcination temperatures even above 300 °C, indicating complete conversion of the precursor to ZnO. The products were thermally stable above 300 °C. The ZnO NPs were present in a hexagonal wurtzite phase and the crystallinity of ZnO increased with an increasing calcination temperature. The ZnO NPs calcined at lower temperature were mesoporous in nature. The surface areas of ZnO NPs calcined at 300 and 400 °C were 51.10 and 40.60 m² g^?1, respectively, which are significantly larger than commercial ZnO nanopowder. Surface diffusion has been found to be the key mechanism of sintering during heating from 300 to 700 °C with the activation energy of sintering as 8.33 kJ mol^?1. The photocatalytic activity of ZnO NPs calcined at different temperatures evaluated by photocatalytic degradation of methylene blue under sunlight showed strong dependence on the surface area of ZnO NPs. The ZnO NPs with high surface area showed enhanced photocatalytic activity.     

Dynamic mechanical properties of epoxy‐phenolic mixtures

The dynamic‐mechanical properties of different mixtures formed by an epoxy resin (DGEBA type) and a phenolic resin (resole type) cured by trietylenetetramine and/or p‐toluensulphonic acid at different concentrations have been studied by means of dynamic mechanical thermal analysis (DMTA). All samples were cured by pressing at 90 °C during 6 h. The mechanical studies were performed between ?100 to 300 °C at a heating rate of 2 °C/min. This study was also carried out for the epoxy‐TETA and phenolic‐p‐toluensulphonic acid systems. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 1548–1555, 2005     

High‐performance aromatic thermosetting resins with hydroxyl and ethynyl groups

A novel hydroxyl‐ethynyl‐arene (HEA) resin was synthesized via Aldol condensation and Sonogashira reaction. The structure of the obtained resin was confirmed by the techniques of mass spectroscopy (MS), gel permeation chromatography (GPC), proton nuclear magnetic resonance spectroscopy (¹H‐NMR), Fourier transform infrared spectroscopy, (FT‐IR) and elemental analysis (EA). Differential scanning calorimetry (DSC) results showed an exotherm at the temperature range of 187°C–245°C, attributable to crosslinking reaction of the acetylene groups. After thermal cure, the obtained cured resin possessed excellent thermal stability. Thermal gravimetric analysis (TGA) in nitrogen showed the Td₅ (temperature of 5% weight loss) was about 400°C, and the char yield in nitrogen was about 78% at 900°C. The laminate composite of HEA resin was prepared and its mechanical and thermal properties were determined. The usefulness of the HEA resin as matrix for ablative composite was evaluated. Copyright © 2010 John Wiley & Sons, Ltd.     

Preparation and Properties of Novel Cyclophosphazenes Containing Cyanato Groups

Abstract

Novel cyclotriphosphazenes containing cyanato group (PZCN) derivatives were synthesized by a substitution reaction of 4-hydroxyphenoxycyclotriphosphazenes and cyanogen bromide (BrCN) in the presence of triethylamine (TEA). The PZCNs were characterized by FT-IR, liquid chromatography–mass spectrometry (LC-MS), ¹H NMR, ¹³C NMR, and ³¹P NMR spectroscopy. Curing reactions of the PZCNs were evaluated by FT-IR spectroscopy, thermogravimetry/differential thermal analysis (TG/DTA), and differential scanning, calorimetry (DSC). The PZCNs exhibited an exothermic peak due to curing within the temperature range of 140–300°C by DSC. The PZCNs were completely cured at 220°C. The cured PZCNs exhibited high thermal stability up to 350°C, a high char-forming capability, and electrical properties, such as dielectric constants (Dks) between 2.68 and 2.87, and dissipation factors (Dfs) between 0.008 and 0.013 at 1 MHz.

Supplemental materials are available for this article. Go to the publisher's online edition of Phosphorus, Sulfur, and Silicon and the Related Elements to view the free supplemental file.     

Thermal and mechanical properties of epoxy resin toughened with epoxidized soybean oil

A series of new modified epoxy resin (EP) cured products were prepared from epoxidized soybean oil and commercial epoxy resin, with methyl nadic anhydride as curing agent and 1-methylimidazole as promoting agent. The thermal properties of the resins were characterized by DMA and TG; DSC was used to determine the curing process. Fourier transform infrared spectroscopy was utilized to investigate their molecular structures and scanning electron microscopy was used to observe the micro morphology of their impact fracture surfaces. Tensile and impact testing was employed to characterize the mechanical properties of the cured products. The combination of commercial EP with 20 wt% ESO resulted in a bioresin with the optimum set of properties: 130.5 °C T _g, 396.9 °C T _50 %, 74.89 MPa tensile strength, and 48.86 kJ m^?2 impact resistance.     

Curing and thermal behaviour of a flame retardant cycloaliphatic epoxy resin based on phosphorus containing poly(amide–imide)s

The curing behaviour of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexane carboxylate was investigated by the dynamic differential scanning calorimetry (DSC) using phosphorus-containing poly(amide–imide)s (PAIs) having free amine groups, 4,4′-diaminodiphenylmethane (PM) and p-phenylenediamine (PA), in the ratio of 1:1. The PAIs were prepared by co-polymerization of diimide–diacid (DIDA) and phosphorus-containing triamines having phenylene moiety. l-Tryptophan and pyromellitic anhydride were used to synthesize DIDA. Triamines used in the synthesis PAIs were tris(3-aminophenyl) phosphine (TAP), tris(3-aminophenyl) phosphine oxide (TAPO) and bis(3-aminophenyl) aminotolyl phosphine (BAP). TAP-, TAPO- and BAP-containing PAIs were designated as PTAP, PTAPO and PBAP, respectively. These PAIs with free amine groups were characterized by FTIR, ¹H NMR, ¹³C NMR spectroscopic techniques and elemental analysis. The mixture of PAIs and PM or/and PA in the ratios of 0:1, 1:0 and 0.5:0.5 was used for investigation. DSC was used to study the curing of epoxy by recording the DSC scans at heating rates of 10 °C min^?1. Thermal stability of epoxy resin cured isothermally was evaluated by recording thermo gravimetric traces in nitrogen atmosphere at the heating rate of 20 °C min^?1. All samples are highly stable, and the 10 % mass loss found was in the range of 335–520 °C. The percent char yield was highest in case of resin sample E/PM/PTAPO. The flame-retardant properties of cured epoxy resins were investigated by the limiting oxygen index test (LOI) and UL94 test. When phosphorus was incorporated in epoxy resin, the epoxy resin system met the UL94 V-0 classification and the LOI reached at 37.8, because of nitrogen–phosphorus synergistic effect.     

Synthesis and characterization of a novel polytriazole resin with low‐temperature curing character

A novel low‐temperature curing polytriazole resin was prepared from a triazide and a tetraalkyne and characterized. The resin can be cured at 70°C. The glass transition temperature T_g and thermal decomposition temperature T_d5 of the cured resin with the molar ratio of azide to alkyne group [A]/[B] = 1.0:1.0 reached 324 and 355°C, respectively. The study on the curing kinetics of the resin shows that the apparent activation energy of the curing reaction is 93 kJ mol^?1. The flexural strength of the cured resin reached 137.6 MPa at room temperature and 102.6 MPa at 185°C. Copyright © 2007 John Wiley & Sons, Ltd.     

Preparation and properties of novel benzoxazine and polybenzoxazine with maleimide groups

A benzoxazine compound with a maleimide group, 3‐phenyl‐3,4‐dihydro‐2H‐6‐(N‐maleimido)‐1,3‐benzoxazine (HPM‐Ba), was prepared from N‐(4‐hydroxyphenyl)maleimide, formaldehyde, and aniline. The chemical structure of HBM‐Ba was identified by FT‐IR, ¹H‐NMR, and elemental analysis. HPM‐Ba showed a melting point of 52–55 °C and good solubility in common organic solvents. HPM‐Ba showed a two‐stage process of thermal polymerization. The first stage arose from the polymerization of maleimide groups, and the second one was the ring‐opening reaction of benzoxazine groups. Fusible polymaleimides with a Tg of around 100 °C could be obtained by thermally polymerizing HPM‐Ba at 130 °C. Further polymerizing the polymaleimides at 240 °C resulted in a completely cured resin showing a Tg at 204 °C. Good thermal stability and self‐extinguishing behavior was observed with the cured polybenzoxazine resins. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 5954–5963, 2004     

Nonaqueous synthesis of nanosilica in epoxy resin matrix and thermal properties of their cured nanocomposites

Nonaqueous synthesis of nanosilica in diglycidyl ether of bisphenol‐A epoxy (DGEBA) resin has been successfully achieved in this study by reacting tetraethoxysilane (TEOS) directly with DGEBA epoxy matrix, at 80 °C for 4 h under the catalysis of boron trifluoride monoethylamine (BF₃MEA). BF₃MEA was proved to be an effective catalyst for the formation of nanosilica in DGEBA epoxy under thermal heating process. FTIR and ²⁹Si NMR spectra have been used to characterize the structures of nanosilica obtained from this direct thermal synthetic process. The morphology of the nanosilica synthesized in epoxy matrix has also been analyzed by TEM and SEM studies. The effects of both the concentration of BF₃MEA catalyst and amount of TEOS on the diameters of nanosilica in the DGEBA epoxy resin have been discussed in this study. From the DSC analysis, it was found that the nanosilica containing epoxy exhibited the same curing profile as pure epoxy resin, during the curing reaction with 4,4′‐diaminodiphenysulfone (DDS). The thermal‐cured epoxy–nanosilica composites from 40% of TEOS exhibited high glass transition temperature of 221 °C, which was almost 50 °C higher than that of pure DGEBA–DDS–BF₃MEA‐cured resin network. Almost 60 °C increase in thermal degradation temperature has been observed during the TGA of the DDS‐cured epoxy–nanosilica composites containing 40% of TEOS. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 757–768, 2006     

Synthesis and thermal behavior of gem-dinitro valerylated polystyrene

Commercial polystyrene has been chemically modified with 4,4-dinitro valeryl chloride by use of Friedel–Crafts acylation reaction in the presence of anhydrous aluminum chloride in a mixture of 1,2-dichloroethane and nitrobenzene. The modified polystyrene containing –COCH₂CH₂C(NO₂)₂CH₃ fragments in side phenyl rings, named gem-dinitro valerylated polystyrene (GDN-PS), was characterized by an Ubbelohde’s viscometer, FTIR, and ¹H NMR spectroscopy. Simultaneous thermogravimetry–differential thermal analysis and differential scanning calorimetry (DSC) have been used to study thermal behavior of the polymer. The results of TG analysis revealed that the main thermal degradation for the GDN-PS occurs during two temperature ranges of 200–300 and 300–430 °C. The DTA curve of GDN-PS is showing a visible exothermic peak at 253.8 °C corresponding to the decomposition of gem-dinitro valeryl groups. The decomposition kinetic of the gem-dinitro groups for GDN-PS with degree of substitution (DS) 11 % was studied by non-isothermal DSC under various heating rates. Kinetic parameters such as activation energy and frequency factor for thermal decomposition of GDN-PS with DS 11 % were evaluated via the ASTM E698 and two isoconversional methods.     

Bismaleimides chain-extended by imidized benzophenone tetracarboxylic dianhydride and their polymerization to high temperature matrix resins

Heat-resistant polymers were obtained by thermal polymerization of several bismaleimides or their substituted derivatives. The chain of the polymer precursors was extended by incorporation of imidized benzophenone tetracarboxylic dianhydride between the maleimide rings in order to impart a degree of flexibility in the polymers. The bismaleimides and their corresponding tetraamic acids were characterized by infrared (IR) and proton nuclear magnetic resonance (¹H-NMR) spectroscopy. The differential thermal analysis (DTA) thermograms of the monomers showed exotherms at 200–340°C attributed to the thermally induced polymerization reactions. The influence of different substituents in the maleic double bond on the curing temperature was investigated. The thermal stability of the cured resins was evaluated by thermogravimetric analysis (TGA) and isothermal gravimetric analysis (IGA). They were stable up to 367–433°C both in nitrogen and air atmosphere and afforded 57–68% char yield at 800°C under anaerobic conditions. The structure of the aromatic and aliphatic diamines utilized for imidization was correlated with the thermal stability of the cured resins. The bismaleimide derived from p-phenylenediamine gave the most heat-resistant resin because of its higher rigidity.     

Controlled site modification of inorganic networks in hybrid photocurable resins for high thermal crack resistance

For functional hybrid materials with desirable physical properties as well as chemical characteristics, controlled modification, i.e., site selective modification, of inorganic networks is one of the promising approaches. Here, we report a selective modification of less-condensed Si atoms in a siloxane-based UV-cured resin can drastically improve thermal crack resistance. The highly improved thermal crack resistance is attained by elimination of monomeric Si alkoxides using trimethylchlorosilane (TMCS) as a modifier. Liquid- and solid-state ²⁹Si NMR analyses were performed to evaluate the selectivity of reaction between TMCS and monomeric Si alkoxides included in photocurable precursory sols, whereas thermal mechanical analysis was to estimate coefficients of thermal expansion and deformation temperature of the UV-cured resins. The reaction between TMCS and the UV curable precursory sol occurs via a moisture-assisted process involving moderate hydrolysis reactions. As a result, the addition of TMCS increases a temperature at which crack forms from 150 up to 300 °C.     

Synthesis of aromatic amine curing agent containing non-coplanar rigid moieties and its curing kinetics with epoxy resin

A kind of aromatic diamine, 4′, 4″-(2, 2-diphenylethene-1, 1-diyl)dibiphenyl-4-amine (TPEDA), was successfully synthesized via Suzuki coupling reaction. The TPEDA containing nonplanar rigid moieties can be used as epoxy resins curing agent to improve the complex properties of cured composites. The curing kinetics during thermal processing of E51/TPEDA system was investigated by nonisothermal differential scanning calorimeter. The average activation energy (E _α), pre-exponential factor (lnA), and reaction order (n) calculated from the Kissinger, the Ozawa, the Friedman and the Flynn–Wall–Ozawa methods were 55.8 kJ mol^?1, 9.4 s^?1 and 1.1, respectively. By the aid of estimated kinetic parameters, the predicted heat generation vs temperature curves fit well with the experimental data, which supported the validity of the estimated parameters and the applicability of the analysis method used in this work. By the introduction of nonplanar rigid moieties, the cured epoxy resins with TPEDA exhibited a higher glass transition temperature (T _g = 258 °C), good thermal stability (≈395 °C at 10 % mass-loss), and high char yield (36.6 % at 700 °C under nitrogen) compared with conventional curing agents.     

Charcoal produced from cellulosic raw materials by microwave-assisted hydrothermal carbonization

In this work, cellulose-based renewable raw materials were hydrothermally carbonized in a microwave oven at 200 °C during 60, 120, and 240 min. The charcoals obtained were characterized by proximate analysis, gross calorific value, and thermogravimetric analysis on inert and oxidizing atmosphere. The values of fixed carbon were between 38 and 52 %. The mass loss between 300 and 470 °C was assigned to the thermal decomposition of cellulose, followed by the second stage between 470 and 740 °C, attributed to the thermal decomposition of lignin. The gross calorific values were between 22.60 and 27.12 MJ kg^?1, which are comparable to those of charcoals and coals.     

Thermal and water absorption properties of cyanate ester resins modified by fluoride‐containing and silicone‐containing components

In order to enhance the moisture resistance of cyanate ester resins, modifiers containing silicon or fluorine moieties were introduced. The curing behaviors of the obtained resins, as well as thermal, water absorption, and dielectric properties of all cured polymers, were investigated in detail. Results show that properties of fillers in polymer have great influence on the thermal property and of polymer. In all cases, modifier exhibited percolation threshold at 5 wt%. Compared with pristine cyanate ester resins (CE), when the methyl phenyl silicone resin B filler was added, the cured polymer exhibited water absorption as low as 0.39% and excellent thermal oxygen stability at 300°C. The introduction of silicon H improved thermal oxidative stability at 400°C without significant compromise in processability or mechanical properties.     

Dynamic electrical thermal analysis on zinc oxide/epoxy resin nanodielectrics

The dielectric response of ZnO/epoxy resin nanocomposites was studied by means of dynamic electrical thermal analysis in the frequency range of 10^?1 to 10⁷ Hz, and over the temperature range of 30–160 °C, varying the content of the reinforcing phase. Scanning electron microscopy pictures were used for assessing the composites morphology and for examining the particles’ dispersion. The thermal properties of nanocomposites were examined by differential scanning calorimetry in the temperature range of 0–170 °C. Dielectric data were analyzed via dielectric permittivity and electric modulus formalisms. Recorded relaxation phenomena include contributions from both the polymeric matrix and the presence of the reinforcing phase. Processes related to the polymer matrix are attributed to the glass to rubber transition (α-relaxation) of the epoxy resin and local motions of polar side groups of the main polymer chain (β-relaxation). Finally, the slower process appearing at low frequencies and high temperatures, originates from interfacial phenomena due to the accumulation of unbounded charges at the system’s interface.     

Hybrid-coatings derived from pyromellitic acid bridged alkoxy-silylalkyl precursors

To achieve high temperature stable insulation materials for the electrical insulation of fine copper wires two different bis(alkoxysilylalkyl)pyromellitamide acids 1 and 2 were prepared. These organic–inorganic sol–gel hybrid precursors were obtained via reactions of pyromellitic dianhydride and alkoxysilylalkylamines. The molecular single-source precursors 1 and 2 were comprehensively studied using FT-IR, ¹H, ¹³C and ²⁹Si NMR spectroscopy as well as elemental analyses. Besides, the hydrolysis and condensation processes of the different precursors were examined with solution ²⁹Si NMR spectroscopy. The imidization process was investigated using ¹³C NMR spectroscopy, FT-IR spectroscopy as well as thermal analysis methods. The different precursors were applied to coat fine copper wires using an industrial coating device. The obtained coatings were cured at temperatures between 380 and 425 °C, and tested regarding thicknesses, number of pinholes, electrical breakdown voltage and elongation. FT-IR spectroscopy was used to determine the chemical structure and scanning electron microscopy to investigate the morphology of the coating materials. The obtained coatings showed very promising mechanical, thermal and electrical properties, i.e. highest breakdown voltage values well above 200 V/µm. They possess high flexibility without cracking and no pinholes or other defects were detected.     

Synthesis of methacrylic copolymers with nona‐1‐butoxy trititanosiloxane as side groups and its application as a thermosetting resin

Methacrylic copolymers with a hydroxyl group on one end of the main chain and nona‐1‐butoxytrititanosiloxane as side groups (called methacrylic hybrid copolymers) were synthesized for use as baked‐finish‐type coating resins. The chemical structures of the side groups in the methacrylic hybrid copolymers were confirmed with the ash weight of the copolymers after combustion, the elemental ratio analysis of Si and Ti in the ash determined by inductively coupled plasma emission spectrometry, and the characteristic absorption band determined by Fourier transform infrared spectrophotometry. The methacrylic hybrid copolymers were cured at temperatures less than 150 °C in the absence of a curing accelerator. The cured copolymers exhibited a high thermal stability. The curing temperature of the copolymers was determined by the change in the absorption peak strength (peak area) of the 1655 cm⁻¹ band in the IR difference spectrum. The thermal stability of the copolymers was evaluated as the thermal‐degradation temperature measured by thermogravimetric analysis. The methacrylic hybrid copolymers were then be used as effective curing resins. The mixture, consisting of thermoplastic methacrylic terpolymer with hydroxyl and carboxyl groups and the methacrylic hybrid copolymers, were cured at less than 150 °C in the absence of a curing accelerator and exhibited a higher thermal‐degradation temperature than the copolymers. © 2001 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 1090–1098, 2001