Annealing and measurement temperature dependence of W2B5-based rectifying contacts to n-GaN

The thermal stability and measurement temperature dependence of Schottky contact characteristics on n-GaN using a W₂B₅/Ti/Au metallization scheme was studied using current-voltage (I-V), scanning electron microscopy (SEM) and Auger electron spectroscopy (AES) measurements. The elemental profile obtained from samples annealed at 350 °C showed some titanium diffusion into the gold layer but little other difference from the as-deposited wafer. Annealing at 700 °C produced significant diffusion of titanium. The Schottky barrier height increased with anneal temperature up to 200 °C, reaching a maximum value of 0.65 eV, but decreased at higher annealing temperatures. The reverse breakdown voltage from diodes fabricated using the W₂B₅-based contacts showed a similar dependence. The reverse current magnitude was larger than predicted by thermionic emission alone. The barrier height showed only minor changes with measurement temperature up to 150 °C.     

Current–voltage temperature characteristics of Au/n-Ge (1 0 0) Schottky diodes

The variation in electrical characteristics of Au/n-Ge (1 0 0) Schottky contacts have been systematically investigated as a function of temperature using current–voltage (I−V) measurements in the temperature range 140–300 K. The I–V characteristics of the diodes indicate very strong temperature dependence. While the ideality factor n decreases, the zero-bias Schottky barrier height (SBH) (Φ_B) increases with the increasing temperature. The I–V characteristics are analyzed using the thermionic emission (TE) model and the assumption of a Gaussian distribution of the barrier heights due to barrier inhomogeneities at the metal–semiconductor interface. The zero-bias barrier height Φ_B vs. 1/2 kT plot has been used to show the evidence of a Gaussian distribution of barrier heights and values of Φ_B=0.615 eV and standard deviation σ_s0=0.0858 eV for the mean barrier height and zero-bias standard deviation have been obtained from this plot, respectively. The Richardson constant and the mean barrier height from the modified Richardson plot were obtained as 1.37 A cm⁻² K⁻² and 0.639 eV, respectively. This Richardson constant is much smaller than the reported of 50 A cm⁻² K⁻². This may be due to greater inhomogeneities at the interface.     

Inhomogeneities in 130 MeV Au ion irradiated Au/n-Si (1 0 0) Schottky structure

The electrical characteristics of Au/n-Si (1 0 0) Schottky rectifier have been studied in a wide irradiation fluence range using conventional current-voltage (I-V) and capacitance-voltage (C-V) measurements. The I-V characteristics showed an abnormal increase in forward current at low voltage. The device shows a bend in forward I-V and reverses bias C-V characteristics due to extra current, suggesting that there are two independent contributions to thermionic current, corresponding to two levels of the Schottky barrier. It is shown that the excess current at low voltage can be explained by taking into account the role of heavy ion irradiation induced defects at the metal semiconductor interface.     

Current-conduction mechanisms in Au/n-CdTe Schottky solar cells in the wide temperature range

The current-conduction mechanisms in Au/n-CdTe Schottky solar cells have been investigated by considering the series resistance (R_s) effect in the temperature range 120–380 K. The obtained values of main electrical parameters such as zero-bias barrier height (Φ_bo), ideality factor (n) and R_s were found strongly function of temperature. While the Φ_bo increases, the n decreases with the increasing temperature. Such behavior can be explained on the basis of the thermionic emission (TE) theory with the Gaussian distribution (GD) of the barrier height (BH) being related to inhomogeneities at the metal/semiconductor (M/S) interface. The results show that the conduction mechanism in Au/n-CdTe Schottky solar cells can be successfully explained on the basis of the TE mechanism with a GD of the BHs. In addition, the capacitance–voltage (C–V) characteristics of Au/n-CdTe solar cells have been investigated at room temperature and 1 MHz.     

Simulation studies of current transport in metal–insulator–semiconductor Schottky barrier diodes

The current–voltage characteristics of Schottky diodes with an interfacial insulator layer are analysed by numerical simulation. The current–voltage data of the metal–insulator–semiconductor Schottky diode are simulated using thermionic emission diffusion (TED) equation taking into account an interfacial layer parameter. The calculated current–voltage data are fitted into ideal TED equation to see the apparent effect of interfacial layer parameters on current transport. Results obtained from the simulation studies shows that with mere presence of an interfacial layer at the metal–semiconductor interface the Schottky contact behave as an ideal diode of apparently high barrier height (BH), but with same ideality factor and series resistance as considered for a pure Schottky contact without an interfacial layer. This apparent BH decreases linearly with decreasing temperature. The effects giving rise to high ideality factor in metal–insulator–semiconductor diode are analysed. Reasons for observed temperature dependence of ideality factor in experimentally fabricated metal–insulator–semiconductor diodes are analysed and possible mechanisms are discussed.     

Micro-structural and temperature dependent electrical characterization of Ni/GaN Schottky barrier diodes

Micro-structural investigation of Ni/GaN Schottky barrier diodes has been carried out using high-resolution transmission electron microscopy and electron diffraction spectrum in order to emphasize the role of Ni/GaN interface in controlling the Schottky diode behavior. Variable temperature Hall effect measurement of GaN samples along with the current–voltage (I–V) characteristics of Ni/n-GaN Schottky barrier diodes have been measured in 100–380 K temperature range. Results are analyzed in terms of thermionic emission theory by incorporating the concept of barrier inhomogeneity at the metal/semiconductor interface. The observed anomaly of temperature dependence of Schottky barrier height and ideality factor are explained by invoking two sets of Gaussian distribution of SBH in the temperature ranges of 100–180 K and 220–380 K, respectively. The value of A** (effective Richardson constant) as determined from the modified Richardson plot is 29.2 A/(cm² K²), which shows an excellent agreement with the theoretical value (26.4 A/(cm² K²)) in the temperature range of 220–380 K.     

Analysis of electrical characteristics of Er/p-InP Schottky diode at high temperature range

We report on the temperature-dependent electrical characteristics of Er/p-InP Schottky barrier diodes. The current–voltage (I–V) and capacitance–voltage (C–V) measurements have been carried out in the temperature range of 300–400 K. Using thermionic emission (TE) theory, the zero-bias barrier height (Φ_bo) and ideality factor (n) are estimated from I–V characteristics. It is observed that there is a decrease in n and an increase in the Φ_bo with an increase in temperature. The barrier height inhomogenity at the metal/semiconductor (MS) interface resulted in Gaussian distribution of Φ_bo and n. The laterally homogeneous Schottky barrier height value of approximately 1.008 eV for the Er/p-InP Schottky barrier diodes is extracted from the linear relationship between the experimental zero-bias barrier heights and ideality factors. The series resistance (R_s) is calculated by Chenug's method and it is found that it increases with the decrease in temperature. The reverse-bias leakage current mechanism of Er/p-InP Schottky diode is investigated. Both Poole–Frenkel and Schottky emissions are described and discussed. Furthermore, capacitance–voltage (C–V) measurements of the Er/p-InP Schottky contacts are also carried out at room temperature in dark at different frequencies of 10, 100 and 1000 kHz. Using Terman's method, the interface state density is calculated for Er/p-InP Schottky diode at different temperatures.     

Intersecting behaviour of nanoscale Schottky diodes I-V curves

We describe a new feature connected with Schottky barriers with nanosize dimensions. We found out by theoretical analysis that the I-V curves of such small diodes measured at different temperatures should intersect and consecutively at higher voltages larger current flows through the diode at lower temperatures. This effect which is at first glance in contradiction with the thermionic theory is caused by the series resistance influence. We show that the presence of the series resistance is a necessary condition of its observation. However, the intersection voltage—minimum voltage at which the intersection may occur—increases with the value of the series resistance and the diode dimensions for which the effect could be observable in Si diodes and the common series resistance values must be in submicrometer range. Diodes with several hundreds nanometers dimension have the intersection voltage ∼1 V. Analytical expression for the intersection voltage values was also derived.     

Electronic and interface state density distribution properties of Ag/p-Si Schottky diode

Electronic and interface state distribution properties of Ag/p-Si Schottky diode have been investigated. The diode indicates non-ideal current-voltage behavior with an ideality factor greater than unity. The capacitance-voltage (C-V) characteristic is linear in reverse bias indicating rectification behavior and charge density within depletion layer is uniform. From I-V and C-V characteristics, junction parameters such as diode ideality factor and barrier height were found as 1.66 and ?_B(I-V) = 0.84 eV (?_B(C-V) = 0.90 eV), respectively. The interface state density N_ss and relaxation time τ of the Schottky diode were determined by means of Schottky capacitance spectroscopy method. The results show the presence of thin interfacial layer between the metal and semiconductor.     

Investigation of electrical and ammonia sensing characteristics of Schottky barrier diode based on a single ultra-long ZnO nanorod

Novel ultra-long ZnO nanorods, with lengths about 0.5-1.5 mm and diameters ranging from 100 to 1000 nm, in mass production have been synthesized via the vapor-phase transport method with CuO catalyst at 900 °C. Rectifying Schottky barrier diodes have been fabricated by aligning a single ultra-long ZnO nanorod across paired Ag electrodes. The resulting current-voltage (I-V) characteristics of the SBD exhibit a clear rectifying behavior. The ideality factor of the diode is about 4.6, and the threshold voltage is about 0.54 V at room temperature (300 K). At the same time the detailed I-V characteristics have been investigated in the temperature range 423-523 K. In addition, after exposure of the Schottky diodes to NH₃, the forward and reverse currents increase rapidly, indicating a high sensitivity to NH₃ gas.     

Effects of chemical treatment on barrier height and ideality factors of Au/GaN Schottky diodes

We have studied Au/n-GaN Schottky barrier diodes. GaN surfaces have been prepared by cleaning in HCl and (NH₄)₂S prior to metal deposition. The zero-biased barrier heights and ideality factors obtained from the current-voltage characteristics differ from diode to diode, although all the samples were prepared identically. The statistical analysis for the reverse bias C-V data yielded mean value of (1.35±0.04) eV for Schottky barrier height of HCl treated sample and (1.20±0.03) eV for (NH₄)₂S sample, where 9 dots were considered from each cleaning method. It was found that the barrier height values obtained from the C⁻²-V (1.43 eV) and I-V characteristics (0.89 eV) are different from each other by 0.54 eV. The inhomogeneous barrier heights were found to be related to the effect of the high series resistance on diode parameters (Akkiliç et al., 2004) [1].     

Barrier height enhancement and temperature dependence of the electrical characteristics of Al Schottky contacts on p-GaAs with organic Rhodamine B interfacial layer

In this work, two types of Schottky barrier diodes (SBDs) with and without Rhodamine B interfacial layer, were fabricated and measured at room temperature in order to investigate the effects of the Rhodamine B interfacial layer on the main electrical parameters. It was seen that the barrier height (BH) value of 0.78 eV calculated for the Al/Rhodamine B/p-GaAs device was higher than the value of 0.63 eV of the conventional Al/p-GaAs Schottky diodes. It has been observed that the Rhodamine B film increases the effective BH by influencing the space charge region of GaAs. The main diode parameters such as the ideality factor (n) and zero-bias BH of SBD with Rhodamine B interfacial layer were found to be strongly temperature dependent and while the BH decreases, the ideality factor increases with decreasing temperature. It has been concluded that the temperature dependent characteristic parameters for Al/Rhodamine B/p-GaAs SBDs can be successfully explained on the basis of thermionic emission (TE) mechanism with Gaussian distribution of the barrier heights.     

Effect of ambient temperature on electrical properties of nanostructure n-ZnO/p-Si heterojunction diode

The nanostructure n-ZnO/p-Si heterojunction diode was fabricated by sol–gel method. The structural and morphological properties of the nanostructure ZnO film have been investigated. The X-ray diffraction spectra indicated that the films are of polycrystalline nature. The scanning electron microscopy images indicate that the surface morphology of ZnO film is almost homogeneous and the ZnO film is consisted of the circular formed with coming together of the nanoparticles. The electrical characterization of nanostructure n-ZnO/p-Si heterojunction diode has been investigated by current–voltage characteristics. The ideality factor (n) of the diode was found for different ambient temperatures and the obtained 6.40 value for 296 K is higher than unity due to the interface states between the two semiconductor materials and series resistance. The values of n increased with decreasing ambient temperature. The reverse current of the diode increased with illumination intensity of 100 mW cm⁻² and the diode gave a maximum open circuit voltage V_oc of 0.19 V and short-circuits current I_sc of 8.03 × 10⁻⁸ A.     

Electrical and structural properties of a stacked metal layer contact to n-InP

In this study, we found that the double metal contact structure in Pt/Al/n-InP diodes provides better rectification characteristics than conventional single-metal/n-InP Schottky diodes. The effective barrier height was measured to be 0.67 eV for a 400 °C-annealed Pt/Al/n-InP diode sample. The increase in the barrier height is attributed to the formation of Al₂O₃ at the metal/n-InP contact interface during thermal annealing. The formation of the phase Al₂O₃ phase was monitored by X-ray diffraction (XRD) analysis. The corresponding element profiles of Al and O were also confirmed at the metal/n-InP contact interface using secondary ion mass spectrum (SIMS) analysis. The lowering of the Schottky barrier height due to the inhomogeneity at the metal/n-InP junction is also discussed on the basis of the TE theory. The distribution of local effective Schottky barrier heights was explained by a model incorporating the existence of double Gaussian barrier heights, which represent the high barrier and low barrier of the full distribution in the temperature ranges of 83-198 and 198-300 K.     

Investigation of diode parameters using I-V and C-V characteristics of In/SiO2/p-Si (MIS) Schottky diodes

A study on interface states density distribution and characteristic parameters of the In/SiO₂/p-Si (MIS) capacitor has been made. The thickness of the SiO₂ film obtained from the measurement of the corrected capacitance in the strong accumulation region for MIS Schottky diodes was 220 Å. The diode parameters from the forward bias I-V characteristics such as ideality factor, series resistance and barrier heights were found to be 1.75, 106-112 Ω and 0.592 eV, respectively. The energy distribution of the interface state density D_it was determined from the forward bias I-V characteristics by taking into account the bias dependence of the effective barrier height. The interface state density obtained using the I-V characteristics had an exponential growth, with bias towards the top of the valance band, from 9.44×10¹³ eV⁻¹ cm⁻² in 0.329-E_v eV to 1.11×10¹³ eV⁻¹ cm⁻² in 0.527-E_v eV at room temperature. Furthermore, the values of interface state density D_it obtained by the Hill-Coleman method from the C-V characteristics range from 52.9×10¹³ to 1.11×10¹³ eV⁻¹ cm⁻² at a frequency range of 30kHz-1 MHz. These values of D_it and R_s were responsible for the non-ideal behaviour of I-V and C-V characteristics.     

Electronic properties of the metal/organic interlayer/inorganic semiconductor sandwich device

In this study, we prepared a Metal(Al)/Organic Interlayer(Congo Red=CR)/Inorganic Semiconductor (p-Si) (MIS) Schottky device formed by coating of an organic film on p-Si semiconductor wafer. The Al/CR/p-Si MIS device had a good rectifying behavior. By using the forward bias I-V characteristics, the values of ideality factor (n) and barrier height (Φ_b) for the Al/CR/p-Si MIS device were obtained as 1.68 and 0.77 eV, respectively. It was seen that the Φ_b value of 0.77 eV calculated for the Al/CR/p-Si MIS device was significantly higher than value of 0.50 eV of the conventional Al/p-Si Schottky diodes. Modification of the interfacial potential barrier of the Al/p-Si diode was achieved by using a thin interlayer of the CR organic material. This was attributed to the fact that the CR organic interlayer increased the effective barrier height by influencing the space charge region of Si. The interface-state density of the MIS diode was found to vary from 1.24×10¹³ to 2.44×10¹² eV⁻¹ cm⁻².     

Determination of the laterally homogeneous barrier height of thermally annealed and unannealed Au/p-InP/Zn-Au Schottky barrier diodes

We have identically prepared Au/p-InP Schottky barrier diodes (SBDs). The diodes were annealed up to 400 °C thermally. The barrier height (BH) for the as-deposited Au/p-InP/Zn-Au SBDs from the current-voltage characteristics have varied from 0.58 to 0.72 eV, and ideality factor n from 1.14 to 1.47. The BH for the annealed SBDs from the current-voltage characteristics have varied from 0.76 to 0.82 eV, and ideality factor n from 1.17 to 1.39. As a result of the thermal annealing, it has been seen that the BH values of the annealed SBDs are larger than those of the as-deposited SBDs. We have determined a lateral homogeneous BH value of 0.72 eV for the as-deposited Au/p-InP SBD from the experimental linear relationship between barrier heights and ideality factors, and a value of 0.85 eV for the annealed Au/p-InP SBD. The increase of 0.13 eV in the BH value by means of 400 °C annealing has been ascribed to the formation of the excess charges that electrically actives on the semiconductor surface.     

Calculation of on-state I–V characteristics of LDMOSFETs based on an accurate LDD resistance modeling

In this paper, we present an I–V model for LDMOSFETs. It is based on modeling the Lightly-Doped Drain (LDD) region of the device as voltage-controlled resistors where velocity saturation effect is also taken into account. Using the LDD region model along with a model for the channel region of the device, the on-state I–V characteristic of the transistor is accurately calculated. The models for the LDD region resistors can be incorporated into a circuit simulator such as HSPICE which has an accurate model for the channel region of the transistor. The accuracy of the models is verified by comparing its results with those of a device simulator. The results show a maximum error of 1% for a wide range of voltages and overlapped LDD region lengths.     

The dependence of barrier height on temperature for Pd Schottky contacts on ZnO

Temperature dependent current-voltage (I-V) and capacitance-voltage (C-V) measurements have been performed on Pd/ZnO Schottky barrier diodes in the range 60-300 K. The room temperature values for the zero bias barrier height from the I-V measurements (Φ_I-V) was found to be 0.52 eV and from the C-V measurements (Φ_C-V) as 3.83 eV. From the temperature dependence of forward bias I-V, the barrier height was observed to increase with temperature, a trend that disagrees with the negative temperature coefficient for semiconductor material. The C-V barrier height decreases with temperature, a trend that is in agreement with the negative temperature coefficient of semiconductor material. This has enabled us to fit two curves in two regions (60-120 K and 140-300 K). We have attributed this behaviour to a defect observed by DLTS with energy level 0.31 eV below the conduction band and defect concentration of between 4×10¹⁶ and 6×10¹⁶ cm⁻³ that traps carriers, influencing the determination of the barrier height.