Fabrication and electrical characterization of p-Sb2S3/n-Si heterojunctions for solar cells application

Antimony trisulphide (Sb₂S₃) films were prepared by thermal evaporation technique on n-type single crystal Si substrates to fabricate p-Sb₂S₃/n-Si heterojunctions. The electrical transport properties of the p–Sb₂S₃/n-Si heterojunctions were investigated by current–voltage (I–V) and capacitance–voltage (C–V) measurements. The temperature-dependent I–V characteristics revealed that the forward conduction was determined by multi-step tunnelling current and the activation energy of saturation current was about 0.54 eV. The 1/C²–V plots indicated the junction was abrupt and the junction built-in potential was 0.6 V at room temperature and decreased with increasing temperature. The solar cell parameters have been calculated for the fabricated cell as V_oc = 0.50 V, J_sc = 14.53 mA cm⁻², FF = 0.32 and η = 4.65% under an illumination of 50 mW cm⁻².     

Improved GaSb surfaces using a (NH4)2S/(NH4)2S04 solution

Bulk (1 0 0) n-GaSb surfaces have been treated with a sulphur based solution ((NH₄)₂S/(NH₄)₂SO₄) to which sulphur has been added, not previously reported for the passivation of GaSb surfaces. Au/n-GaSb Schottky barrier diodes (SBDs) fabricated on the treated material show significant improvement compared to that of the similar SBDs on the as-received material as evidenced by the lower ideality factor (n), higher barrier height (?_b) and lower contact resistance obtained. Additionally, the reverse leakage current, although not saturating, has been reduced by almost an order of magnitude at −0.2 V. The sample surfaces were studied by scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). The native oxide, Sb–O, present on the as-received material is effectively removed on treating with ([(NH₄)₂S/(NH₄)₂SO₄]+S) and (NH₄)₂S. Analysis of the as-received surface by XPS, prior to and after argon sputtering, suggests that the native oxide layer is ≤8.5 nm.     

Comparison of electrical parameters of Zn/p-Si and Sn/p-Si Schottky barrier diodes

In this study, current-voltage (I-V) and capacitance-voltage (C-V) characteristics of metal-semiconductor (MS) Zn/p-Si and Sn/p-Si Schottky diodes, with high resistivity silicon structures, are investigated. The parameters of series resistance (R_S), the ideality factor (n) and the barrier height (Φ_b) are determined by performing different plots from the forward bias current-voltage (I-V) and reverse bias capacitance-voltage (C-V) characteristics. Thus, the barrier heights (Φ_b) for the Si Schottky diodes obtained between 0.725 and 1.051 eV, the ideality factor (n) between 1.043 and 1.309, and the series resistance (R_S) between 12.594 and 12.950 kΩ. The energy distribution of interface states density was determined from the forward bias I-V characteristics by taking into account the bias dependence of the effective barrier height. It was concluded that the density of interface states in the considered energy range are in close agreement with each other values obtained for Zn/p-Si and Sn/p-Si Schottky diodes.     

Asymmetric electrical properties in Pt/Ba0.5Sr0.5Ti0.99Co0.01O3/Nb-doped SrTiO3 capacitors

Ba_0.5Sr_0.5Ti_0.99Co_0.01O₃ (BSTC) thin films have been fabricated with pulsed laser deposition on Nb-doped SrTiO₃ (STN) substrate. In Pt/BSTC/STN capacitor, we systematically investigated the capacitance, leakage current and polarization versus bias voltage characteristics, and found that curves of capacitance versus voltage and leakage current versus voltage were not symmetric, and polarization hysteresis loop exhibited large relaxation of the remnant polarization at negatively poled state. A detailed analysis of capacitance data demonstrated a difference of the built-in voltage between top Pt/BSTC interface (V_b,t=2.5 V) and bottom BSTC/STN interface (V_b,b=1.1 V). Such different built-in voltages lead to the presence of an internal electric field, which results in asymmetric electric characteristics in Pt/BSTC/STN capacitor.     

I–V characteristics of ZnO/Cu2O thin film n–i–p heterojunction

ZnO/Cu₂O thin film n–i–p heterojunctions were fabricated by magnetron sputtering. The microstructure, optical, and electrical properties of n-type (n‐) ZnO, insulating (i‐) ZnO, and p-type (p‐) Cu₂O films deposited on glass substrates were characterized by X-Ray diffraction (XRD), spectrophotometer, and the van der Pauw method, respectively. XRD results show that the mean grain size of i-ZnO film is much larger than that of n-ZnO film. The optical band gap energies of n-ZnO, i-ZnO, and p-Cu₂O film are 3.27, 3.47, and 2.00 eV, respectively. The carrier concentration of n-ZnO film is two orders of magnitude larger than that of p-Cu₂O film. The current–voltage (I–V) characteristics of ZnO/Cu₂O thin film n–i–p heterojunctions with different i-ZnO film thicknesses were investigated. Results show that ZnO/Cu₂O n–i–p heterojunctions have well-defined rectifying behavior. All ideality factors of these n–i–p heterojunctions are larger than 2.0. The forward bias threshold voltage and ideality factor increase when i-ZnO layer thickness increases from 100 to 200 nm. An energy band diagram was proposed to analyze the I–V characteristics of these n–i–p heterojunctions.     

Investigation of temperature-dependent electrical properties of p-VOPc/n-si heterojunction under dark conditions

An organic/inorganic heterojunction p-VOPc/n-Si was fabricated and its electrical properties were investigated. Temperature-dependent dark current–voltage (I–V) characteristics of the heterojunction exhibited rectification behaviour with a rectification ratio of 405 at ±1 V and room temperature. The current–voltage characteristics of the cell showed ohmic conduction at low voltages followed by a space charge-limited current (SCLC) conduction dominated by an exponential trap distribution at higher voltages. At room temperature, the series and shunt resistances were found to be approximately 1.4 and 100 kΩ, respectively. Diode ideality factor n was found to be 3.2 at room temperature and dropped to 1.9 at 363 K. Room temperature mobility of vanadyl phthalocyanine (VOPc) was extracted from the I–V characteristics in the SCLC region and was found approximately 15.5 × 10⁻³ cm² V⁻¹ s⁻¹. The effective barrier height, Ф_B, was estimated as 0.77 eV. The effect of temperature, on various heterojunction parameters was recorded under dark conditions and at temperatures ranging from 300 to 363 K.     

Current transport through InP/InSb heterojunction: Effect of lattice mismatch

Semiconductor heterojunctions of MOCVD grown InP were fabricated on n-InSb to study some features of a current transport in strained heterojunctions. The MOCVD grown undoped InP samples on InP substrates were characterized by XRD and Hall measurements whereas the InP/InSb heterojunction was characterized by XRD, TEM and I-V measurements in the temperature range 160-305 K. On increasing the voltage, first the current through the heterojunction is found to increase linearly and then it gets saturate due to surface states saturation. When the misfit dislocation density was increased, overlapping in the depletion regions gave rise to a barrier to the current flow there by saturating the current.     

Electrical and photovoltaic properties of Cd1? x Zn x S/ p -GaAs heterojunctions

Cd_1−x Zn _x S/p-GaAs heterojunctions for solar cell applications have been prepared by growing single crystal Cd_1−x Zn _x S epitaxial layers on (111)GaAs substrates through a vapour phase chemical transport method using the close-spaced geometry and H₂ as a transport agent. Electrical and photovoltaic properties of the heterojunctions have been investigated and discussed in connection with the main features of the growth technique. AM1 power conversion efficiencies up to 6.2% have been measured and possible improvements have been examined.     

Electrical and photovoltaic characteristics of sodium copper chlorophyllin/n-type silicon heterojunctions

Heterojunctions of p-type sodium copper chlorophyllin (p-SCC)/n-type silicon (n-Si) were prepared by deposition of p-SCC film on n-Si wafers using spray-pyrolysis technique. Current-voltage and capacitance-voltage measurements of Au/p-SCC/n-Si/In heterojunctions were performed to discuss the electrical properties of these heterostructures. Rectifying characteristics were observed, which are definitely of the diode type. The current-voltage measurements suggest that the forward current in these junctions involves tunnelling and the results showed that the forward current can be explained by a multi-tunnelling capture-emission model in which the electron emission process dominates the carrier transport mechanism. On the other hand, the reverse current is probably limited by the same conduction process. The capacitance-voltage behavior indicates an abrupt heterojunction model is valid for Au/p-SCC/n-Si/In heterojunctions and the junction parameters such as, built-in potential, V_D, carrier concentration, N, the width of depletion layer, W, were obtained. The temperature and frequency dependence of the measured capacitance were also studied. The loaded I-V characteristics under white illumination provided by tungsten lamp (80 mW/cm²) give values of 400 mV, 0.9 mA, 0.38 and 1.7% for the open-circuit voltage, V_oc, the short-circuit current, I_sc, the fill factor, FF, and conversion efficiency, η, respectively.     

Effect of thermal annealing on ohmic contacts properties of undoped and Si-doped AlxGa1−xN on Si (1 1 1) substrate grown by PA-MBE

In this work, we study the ohmic contact properties of titanium (Ti)/aluminum (Al) bi-layer contacts on undoped and n-type doped Al_xGa_1−xN grown on silicon (1 1 1) substrates by radio frequency nitrogen plasma-assisted molecular beam epitaxy (PA-MBE). The electrical stability of the contacts at various annealing temperatures of 400, 500, 600 and 700 °C were investigated. Specific contact resistivity was determined using transmission line method (TLM) and current–voltage (I–V) measurements. The results reveal that the bi-layer scheme was sensitive to the change of annealing temperatures and annealing time. The optimal value of specific contact resistivities was obtained at annealing temperature of 600 °C for both samples. However, the values of n-type doped sample exhibited better results compared with the undoped sample.     

Current conduction mechanism in Al/p-Si Schottky barrier diodes with native insulator layer at low temperatures

The forward bias current-voltage (I-V) characteristics of Al/p-Si (MS) Schottky diodes with native insulator layer were measured in the temperature range of 80-300 K. The obtained zero bias barrier height Φ_B0(I-V), ideality factor (n) and series resistance (R_s) determined by using thermionic emission (TE) mechanism show strong temperature dependence. There is a linear correlation between the Φ_B0(I-V) and n because of the inhomogeneties in the barrier heights (BHs). Calculated values from temperature dependent I-V data reveal an unusual behaviour such that the Φ_B0 decreases, as the n and R_s values are increasing with decreasing absolute temperature, and these changes are more pronounced especially at low temperatures. Such temperature dependence of BH is contradictory with the reported negative temperature coefficient of the barrier height. In order to explain this behaviour we have reported a modification in the expression reverse saturation current I_o including the n and the tunnelling factor (αΧ^1/2δ) estimated to be 15.5. Therefore, corrected effective barrier height Φ_bef.(I-V) versus temperature has a negative temperature coefficients (α = −2.66 × 10⁻⁴ eV/K) and it is in good agreement with negative temperature coefficients (α = −4.73 × 10⁻⁴ eV/K) of Si band gap. In addition, the temperature dependent energy distribution of interface states density N_ss profiles was obtained from the forward bias I-V measurements by taking into account the bias dependence of the Φ_e and n. The forward bias I-V characteristics confirm that the distribution of N_ss, R_s and interfacial insulator layer are important parameters that the current conduction mechanism of MS Schottky diodes.     

InGaAs/InP heterojunction-channel tunneling field-effect transistor for ultra-low operating and standby power application below supply voltage of 0.5 V

An In_0.53Ga_0.47As/InP heterojunction-channel tunneling field-effect transistor (TFET) with enhanced subthreshold swing (S) and on/off current ratio (I_on/I_off) is studied. The proposed TFET achieves remarkable characteristics including S of 16.5 mV/dec, on-state current (I_on) of 421 μA/μm, I_on/I_off of 1.2 × 10¹² by design optimization in doping type of In_0.53Ga_0.47As channel at low gate (V_GS) and drain voltages (V_DS) of 0.5 V. Comparable performances are maintained at V_DS below 0.5 V. Moreover, an extremely fast switching below 100 fs is accomplished by the device. It is confirmed that the proposed TFET has strong potentials for the ultra-low operating power and high-speed electron device.     

Hydrogen interaction with GaN metal–insulator–semiconductor diodes

Interaction mechanism of hydrogen with GaN metal–insulator–semiconductor (MIS) diodes is investigated, focusing on the metal/semiconductor interfaces. For MIS Pt-GaN diodes with a SiO₂ dielectric, the current–voltage (I–V) characteristics reveal that hydrogen changes the conduction mechanisms from Fowler–Nordheim tunneling to Poole–Frenkel emission. In sharp contrast, Pt-Si_xN_y-GaN diodes exhibit Poole–Frenkel emission in nitrogen and do not show any change in the conduction mechanism upon exposure to hydrogen. The capacitance–voltage (C–V) study suggests that the work function change of the Schottky metal is not responsible mechanism for the hydrogen sensitivity.     

The effect of interface states, excess capacitance and series resistance in the Al/SiO2/p-Si Schottky diodes

The current-voltage (I-V) characteristics of Al/SiO₂/p-Si metal-insulator-semiconductor (MIS) Schottky diodes were measured at room temperature. In addition the capacitance-voltage (C-V) and conductance-voltage (G-V) measurements are studied at frequency range of 10 kHz-1 MHz. The higher value of ideality factor of 3.25 was attributed to the presence of an interfacial insulator layer between metal and semiconductor and the high density of interface states localized at Si/SiO₂ interface. The density of interface states (N_ss) distribution profile as a function of (E_ss − E_v) was extracted from the forward bias I-V measurements by taking into account the bias dependence of the effective barrier height (Φ_e) at room temperature for the Schottky diode on the order of ≅4 × 10¹³ eV⁻¹ cm⁻²_. These high values of N_ss were responsible for the non-ideal behaviour of I-V and C-V characteristics. Frequency dispersion in C-V and G-V can be interpreted only in terms of interface states. The N_ss can follow the ac signal especially at low frequencies and yield an excess capacitance. Experimental results show that the I-V, C-V and G-V characteristics of SD are affected not only in N_ss but also in series resistance (R_s), and the location of N_ss and R_s has a significant on electrical characteristics of Schottky diodes.     

Fabrication and characterization of Cu–CdSe–Cu nanowire heterojunctions

The Cu–CdSe–Cu nanowire heterojunctions were fabricated by sequential electrochemical deposition of layers of Cu metal and CdSe semiconductor within the nano-pores of anodic alumina membrane templates. X-ray diffraction reveals the cubic phase for Cu and hexagonal phase for CdSe in the electrodeposited Cu–CdSe–Cu nanowire heterojunctions. The composition of the nanowire heterojunction segments is characterized by energy dispersive X-ray spectroscopy. The morphological study of nanowire heterojunctions has been made using scanning electron microscope and high resolution transmission microscopy. The nanowire heterojunctions grown in 100 and 300 nm nano-pore size templates have been found to have optical band gaps of 1.92 and 1.75 eV, respectively. The absorption spectra of 100 nm nanowire heterojunctions show a blue shift of 0.18 eV. The collective nonlinear current–voltage (I–V) characteristics of the 300 and 100 nm nanowire heterojunctions show their rectifying and asymmetric behaviour, respectively.     

Effect of ambient temperature on electrical properties of nanostructure n-ZnO/p-Si heterojunction diode

The nanostructure n-ZnO/p-Si heterojunction diode was fabricated by sol–gel method. The structural and morphological properties of the nanostructure ZnO film have been investigated. The X-ray diffraction spectra indicated that the films are of polycrystalline nature. The scanning electron microscopy images indicate that the surface morphology of ZnO film is almost homogeneous and the ZnO film is consisted of the circular formed with coming together of the nanoparticles. The electrical characterization of nanostructure n-ZnO/p-Si heterojunction diode has been investigated by current–voltage characteristics. The ideality factor (n) of the diode was found for different ambient temperatures and the obtained 6.40 value for 296 K is higher than unity due to the interface states between the two semiconductor materials and series resistance. The values of n increased with decreasing ambient temperature. The reverse current of the diode increased with illumination intensity of 100 mW cm⁻² and the diode gave a maximum open circuit voltage V_oc of 0.19 V and short-circuits current I_sc of 8.03 × 10⁻⁸ A.     

The effect of PVA (Bi2O3-doped) interfacial layer and series resistance on electrical characteristics of Au/n-Si (110) Schottky barrier diodes (SBDs)

Two types of Schottky Barrier Diodes (SBDs) with and without PVA (Bi₂O₃-doped) polymeric interfacial layer, were fabricated and measured at room temperature in order to investigate the effects of the PVA (Bi₂O₃-doped) interfacial layer on the main electrical parameters such as the ideality factor (n), zero-bias barrier height (Φ_B0), series resistance (R_s) and interface-state density (N_ss). Electrical parameters of these two diodes were calculated from the current-voltage (I-V) characteristics and compared with each other. The values of Φ_B0, n and R_s for SBDs without polymeric interfacial layer are 0.71 eV, 1.44 and 4775 Ω, respectively. The values of Φ_B0, n and R_s for SBDs with PVA (Bi₂O₃-doped) polymeric interfacial layer are 0.74 eV, 3.49 and 10,030 Ω, respectively. For two SBDs, the energy density distribution profiles of interface states (N_ss) were obtained from forward-bias I-V measurements by taking the bias dependence of R_s of these devices into account. The values of N_ss obtained for the SBD with PVA (Bi₂O₃-doped) polymeric interfacial layer are smaller than those of the SBD without polymeric interfacial layer.     

Current–voltage temperature characteristics of Au/n-Ge (1 0 0) Schottky diodes

The variation in electrical characteristics of Au/n-Ge (1 0 0) Schottky contacts have been systematically investigated as a function of temperature using current–voltage (I−V) measurements in the temperature range 140–300 K. The I–V characteristics of the diodes indicate very strong temperature dependence. While the ideality factor n decreases, the zero-bias Schottky barrier height (SBH) (Φ_B) increases with the increasing temperature. The I–V characteristics are analyzed using the thermionic emission (TE) model and the assumption of a Gaussian distribution of the barrier heights due to barrier inhomogeneities at the metal–semiconductor interface. The zero-bias barrier height Φ_B vs. 1/2 kT plot has been used to show the evidence of a Gaussian distribution of barrier heights and values of Φ_B=0.615 eV and standard deviation σ_s0=0.0858 eV for the mean barrier height and zero-bias standard deviation have been obtained from this plot, respectively. The Richardson constant and the mean barrier height from the modified Richardson plot were obtained as 1.37 A cm⁻² K⁻² and 0.639 eV, respectively. This Richardson constant is much smaller than the reported of 50 A cm⁻² K⁻². This may be due to greater inhomogeneities at the interface.     

Fabrication and electrical characterization of ZnO rod arrays/CuSCN heterojunctions

ZnO rod arrays/CuSCN heterojunctions are fabricated by depositing ZnO rod arrays films using two-step chemical bath deposition (CBD) and CuSCN thin films using successive ionic layer adsorption and reaction (SILAR) on ITO substrate successively. The structures and morphologies of ZnO films and CuSCN films, analyzed by X-ray diffraction (XRD) spectroscopy and metallurgical microscope, show that ZnO films are hexagonal wurtzite structure and consisted of vertical polycrystalline rods with diameter of 1 μm, CuSCN films are β-phase structure and consisted of elongated grains with length of 3 μm. Current–voltage (I–V) measurements of ZnO/CuSCN heterojunctions show good diode characteristics with rectification ratio about 48.3 at 3 V. The forward conduction is, respectively, determined by carrier recombination in the space charge region, defect-assisted tunneling and exponential distribution trap-assisted space charge limited current mechanism with the increase of forward voltage. Also, a band diagram of ZnO/CuSCN heterojunctions has been proposed to explain the transport mechanism.     

Forward and reverse bias current-voltage characteristics of Au/n-Si Schottky barrier diodes with and without SnO2 insulator layer

The effects of interfacial insulator layer, interface states (N_ss) and series resistance (R_s) on the electrical characteristics of Au/n-Si structures have been investigated using forward and reverse bias current-voltage (I-V) characteristics at room temperature. Therefore, Au/n-Si Schottky barrier diodes (SBDs) were fabricated as SBDs with and without insulator SnO₂ layer to explain the effect of insulator layer on main electrical parameters. The values of ideality factor (n), R_s and barrier height (Φ_Bo) were calculated from ln(I) vs. V plots and Cheung methods. The energy density distribution profile of the interface states was obtained from the forward bias I-V data by taking bias dependence of ideality factor, effective barrier height (Φ_e) and R_s into account for MS and MIS SBDs. It was found that N_ss values increase from at about mid-gap energy of Si to bottom of conductance band edge of both SBDs and the MIS SBD’s N_ss values are 5-10 times lower than those of MS SBD’s. An apparent exponential increase from the mid-gap towards the bottom of conductance band is observed for both SBDs’ (MS and MIS) interface states obtained without taking R_s into account.