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1.
A novel fluorinated diamine monomer based on 4,4′‐biphenol was synthesized via a straightforward, high‐yielding two‐step procedure. 4,4′‐Biphenol was reacted with 2‐chloro‐5‐nitrobenzotrifluoride in the presence of potassium carbonate to yield the intermediate dinitro compound, which was subsequently reduced to afford the fluorinated diamine, 4,4′‐bis(4‐amino‐3‐trifluoromethylphenoxy)biphenyl. A series of organosoluble fluorinated polyimides were prepared from the diamine with various aromatic dianhydrides via a conventional two‐step thermal imidization method. All polyimides were soluble in strong dipolar solvents such as N‐methyl‐2‐pyrrolidone and N,N‐dimethylacetamide. The polyimides showed excellent thermal and thermooxidative stability and good mechanical properties. No significant weight loss was observed below a temperature of 520 °C in nitrogen or in air, and the glass‐transition temperatures ranged from 247 to 313 °C. Low dielectric constants (2.57–3.65 at 10 kHz), low moisture absorption (0.1–0.7 wt %), and low color intensity were also observed. © 2002 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 40: 524–534, 2002; DOI 10.1002/pola.10113  相似文献   

2.
A novel, trifluoromethyl‐substituted, bis(ether amine) monomer, 1,4‐bis(4‐amino‐2‐trifluoromethylphenoxy)naphthalene, was synthesized through the nucleophilic displacement of 2‐chloro‐5‐nitrobenzotrifluoride with 1,4‐dihydroxynaphthalene in the presence of potassium carbonate in dimethyl sulfoxide, followed by catalytic reduction with hydrazine and Pd/C in ethanol. A series of new fluorine‐containing polyimides with inherent viscosities of 0.57–0.91 dL/g were prepared by reacting the diamine with six commercially available aromatic dianhydrides via a conventional, two‐step thermal or chemical imidization method. Most of the resulting polyimides were soluble in strong polar solvents such as N‐methylpyrrolidone and N,N‐dimethylacetamide (DMAc). All the polyimides afforded transparent, flexible, and strong films with good tensile properties. These polyimides exhibited glass‐transition temperatures (Tg's) (by DSC) and softening temperatures (by thermomechanical analysis) in the ranges of 252–315 and 254–301 °C, respectively. Decomposition temperatures for 5% weight loss all occurred above 500 °C in both air and nitrogen atmospheres. The dielectric constants of these polyimides ranged from 3.03 to 3.71 at 1 MHz. In addition, a series of new, fluorinated polyamides with inherent viscosities of 0.32–0.62 dL/g were prepared by the direct polycondensation reaction the diamine with various aromatic dicarboxylic acids by means of triphenyl phosphite and pyridine. All the polyamides were soluble in polar solvents such as DMAc and could be solution‐cast into tough and flexible films. These polyamides had Tg's between 228 and 256 °C and 10% weight‐loss temperatures above 400 °C in nitrogen or air. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 2377–2394, 2004  相似文献   

3.
Two series of fluorinated polyimides were prepared from 2,2′‐bis(4‐amino‐2‐trifluoromethylphenoxy)biphenyl ( 2 ) and 2,2′‐bis(4‐amino‐2‐trifluoromethylphenoxy)‐1,1′‐binaphthyl ( 4 ) with various aromatic dianhydrides via a conventional, two‐step procedure that included a ring‐opening polyaddition to give poly(amic acid)s, followed by chemical or thermal cyclodehydration. The inherent viscosities of the polyimides ranged from 0.54 to 0.73 and 0.19 to 0.36 dL/g, respectively. All the fluorinated polyimides were soluble in many polar organic solvents, such as N,N‐dimethylacetamide and N‐methylpyrrolidone, and afforded transparent and light‐colored films via solution‐casting. These polyimides showed glass‐transition temperatures in the ranges of 222–280 and 257–351 °C by DSC, softening temperatures in the range of 264–301 °C by thermomechanical analysis, and a decomposition temperature for 10% weight loss above 520 °C both in nitrogen and air atmospheres. The polyimides had low moisture absorptions of 0.23–0.58%, low dielectric constants of 2.84–3.61 at 10 kHz, and an ultraviolet–visible absorption cutoff wavelength at 351–434 nm. Copolyimides derived from the same dianhydrides with an equimolar mixture of 4,4′‐oxydianiline and diamine 2 or 4 were also prepared and characterized. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 2416–2431, 2004  相似文献   

4.
A novel, fluorinated diamine monomer with the ether–ketone group, 4,4′‐bis(4‐amino‐2‐trifluoromethylphenoxy)benzophenone ( 2 ), was prepared through the nucleophilic substitution reaction of 2‐chloro‐5‐nitrobenzotrifluoride and 4,4′‐dihydroxybenzophenone in the presence of potassium carbonate, followed by catalytic reduction with hydrazine and Pd/C. Flourinated polyimides (PIs) 5a – f and copolyimides (co‐PIs) 5c / a – f were synthesized from 2 and various commercial aromatic dianhydrides via thermal or chemical imidization. PIs 5a – f had inherent viscosities ranging from 0.72 to 1.22 dL/g. Besides the chemical imidization of 5c ( C ), the 5 ( C ) series were soluble in amide‐type solvents and even in less polar solvents, but PIs 5a – f prepared via thermal imidization were insoluble. PI films 5a – f exhibited tensile strengths ranging from 92 to 112 MPa, elongations at break from 8 to 15%, and initial moduli from 2.0 to 2.1 GPa. The glass‐transition temperatures of the 5 series were in the range of 232–278 °C, and the 10% weight‐loss temperatures were above 535 °C, with more than a 50% char yield at 800 °C in nitrogen. In comparison of the PI 5 series with the analogous non‐fluorinated PIs 6 series based on 4,4′‐bis(4‐aminophenoxy)benzophenone, the 5 series revealed better solubility, lower color intensity, dielectric constant, and moisture absorption. Their PI films had cutoff wavelengths between 370 and 410 nm, b* values ranging from 9.6 to 58.3, dielectric constants of 3.05–3.64 (1 MHz), with moisture absorption in the range of 0.08–0.38 wt %. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 222–236, 2004  相似文献   

5.
Three isomeric bis(thioether anhydride) monomers, 4,4′‐bis(2,3‐dicarboxyphenylthio) diphenyl ketone dianhydride (3,3′‐PTPKDA), 4,4′‐bis(3,4‐dicarboxyphenylthio) diphenyl ketone dianhydride (4,4′‐PTPKDA), and 4‐(2,3‐dicarboxyphenylthio)‐4′‐(3,4‐dicarboxyphenylthio) diphenyl ketone dianhydride (3,4′‐PTPKDA), were prepared through multistep reactions. Their structures were determined via Fourier transform infrared, NMR, and elemental analysis. Three series of polyimides (PIs) were prepared from the obtained isomeric dianhydrides and aromatic diamines in N‐methyl‐2‐pyrrolidone (NMP) via the conventional two‐step method. The PIs showed excellent solubility in common organic solvents such as chloroform, N,N‐dimethylacetamide, and NMP. Their glass‐transition temperatures decreased according to the order of PIs on the basis of 3,3′‐PTPKDA, 3,4′‐PTPKDA, and 4,4′‐PTPKDA. The 5% weight loss temperatures (T5%) of all PIs in nitrogen were observed at 504–519 °C. The rheological properties of isomeric PI resins based on 3,3′‐PTPKDA/4,4′‐oxydianiline/phthalic anhydride showed lower complex viscosity and better melt stability compared with the corresponding isomers from 4,4′‐ and 3,4′‐PTPKDA. In addition, the PI films based on three isomeric dianhydrides and 2,2′‐bis(trifluoromethyl)benzidine had a low moisture absorption of 0.27–0.35%. © 2011 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2011  相似文献   

6.
New fluorinated aromatic polyimides were prepared from 1,4‐(4′‐aminophenoxy)‐2‐(3′‐trifluoromethylphenyl)benzene and aromatic dianhydrides via the polycondensation of one‐step high‐temperature and two‐step thermal or chemical imidization methods. Experimental results indicated that some of the polyimides were soluble both in strong dipolar solvents (N‐methyl‐2‐pyrrolidone or N,N‐dimethylacetamide) and in common organic solvents such as tetrahydrofuran, CHCl3, and acetone. The polyimides showed exceptional thermal and thermooxidative stability and good mechanical properties. No weight loss was detected before a temperature of 520 °C in nitrogen, and the glass‐transition temperatures ranged from 208 to 251 °C. Low dielectric constants (2.55–2.71 at 1 MHz), low refractive indices, and low water absorption were also observed. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 39: 2404–2413, 2001  相似文献   

7.
A new trifluoromethyl‐substituted bis(ether amine) monomer, 2,7‐bis(4‐amino‐2‐trifluoromethylphenoxy)naphthalene, was synthesized. It led to a series of novel fluorinated polyimides by thermal and chemical imidization routes when reacted with various commercially available aromatic tetracarboxylic dianhydrides. Most of the polyimides obtained from both routes were soluble in many organic solvents, such as N,N‐dimethylacetamide. All the polyimides could afford transparent, flexible, and strong films with low moisture absorptions of 0.3–0.6%, low dielectric constants of 2.52–3.27 at 10 kHz, and an ultraviolet–visible absorption cutoff wavelength at 377–436 nm. The glass‐transition temperatures of the polyimides were in the range of 244–297 °C, and the 5% weight‐loss temperatures were higher than 550 °C. For a comparative study, a series of analogous polyimides based on 2,7‐bis(4‐aminophenoxy)naphthalene were also prepared and characterized. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2001–2018, 2003  相似文献   

8.
A novel structurally asymmetric bis(ether amine) monomer containing trifluoromethyl groups, 1,7‐bis(4‐amino‐2‐trifluoromethylphenoxy)naphthalene, was prepared through the nucleophilic substitution reaction of 2‐chloro‐5‐nitrobenzotrifluoride and 1,7‐dihydroxynaphthalene in the presence of potassium carbonate in N‐methyl‐2‐pyrrolidone (NMP), followed by catalytic reduction with hydrazine and Pd/C in ethanol. A series of new fluorine‐containing polyimides were synthesized from the diamine with various commercially available aromatic tetracarboxylic dianhydrides using a two‐stage process with thermal or chemical imidization method. The intermediate poly(amic acid)s had inherent viscosities between 0.93 and 1.93 dL/g. Most of the polyimides obtained from both routes were readily soluble in many organic solvents such as NMP and N,N‐dimethylacetamide (DMAc). All the polyimides could afford transparent, flexible, and strong films with low moisture absorptions of 0.29–0.69%, low dielectric constants of 2.81–3.23 at 10 kHz, and an ultraviolet‐visible absorption cutoff wavelength at 358–423 nm. The glass‐transition temperatures (Tgs) (by DSC) and softening temperatures (by thermomechanical analysis) of the polyimides were recorded in the range of 222–271 °C and 210–266 °C, respectively. Decomposition temperatures for 10% weight loss all occurred above 500 °C in both nitrogen and air atmospheres. For a comparative study, some properties of the present polyimides will be compared with those of structurally related ones derived from 1,7‐bis(4‐aminophenoxy)naphthalene and 1,5‐bis(4‐amino‐2‐trifluoromethylphenoxy)naphthalene. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 1756–1770, 2009  相似文献   

9.
A new aromatic, unsymmetrical ether diamine with a trifluoromethyl pendent group, 1,4‐(2′‐trifluoromethyl‐4′,4″‐diaminodiphenoxy)benzene, was successfully synthesized in three steps with hydroquinone as a starting material and polymerized with various aromatic tetracarboxylic acid dianhydrides, including 4,4′‐oxydiphthalic anhydride, 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride, 2,2′‐bis(3,4‐dicarboxyphenyl)‐hexafluoropropane dianhydride, and pyromellitic dianhydride, via a conventional two‐step thermal or chemical imidization method to produce a series of fluorinated polyimides. The polyimides were characterized with solubility tests, viscosity measurements, IR, 1H NMR, and 13C NMR spectroscopy, X‐ray diffraction studies, and thermogravimetric analysis. The polyimides had inherent viscosities of 0.56–0.77 dL/g and were easily dissolved in both polar, aprotic solvents and common, low‐boiling‐point solvents. The resulting strong and flexible polyimide films exhibited excellent thermal stability, with decomposition temperatures (at 5% weight loss) above 522 °C and glass‐transition temperatures in the range of 232–272 °C. Moreover, the polymer films showed outstanding mechanical properties, with tensile strengths of 74.5–121.7 MPa, elongations at break of 6–13%, and initial moduli of 1.46–1.95 GPa, and good dielectric properties, with low dielectric constants of 1.82–2.53 at 10 MHz. Wide‐angle X‐ray diffraction measurements revealed that these polyimides were predominantly amorphous. These outstanding combined features ensure that the polymers are desirable candidate materials for advanced microelectronic applications. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 6836–6846, 2006  相似文献   

10.
The synthesis and properties of a class of soluble fluorine‐containing aromatic polyimides are described. Substituents of trifluoromethyl groups on the aromatic rings of paralinked aromatic ether diamine conferred the polymer prepared thereof with enhanced solubility, low‐moisture absorption, and low dielectric constants. The polyimides also exhibited exceptional thermal stability, good mechanical properties, and excellent hygrothermal resistance. These outstanding combined features ensure the polymers are desirable candidate materials for advanced microelectronics applications. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 39: 2581–2590, 2001  相似文献   

11.
To prepare novel polyimides with enhanced thermal stability and high solubility in common organic solvents, diamine monomers, 4‐aryl‐2,6 bis‐(4‐amino phenyl)pyridine, were introduced. The diamines were reacted with three different conventional aromatic dianhydrides including pyromellitic dianhydride, benzophenone tetracarboxylic dianhydride, and hexafluoroisopropylidene‐2,2‐bis(phthalic‐dianhydride) (6FDA) in dimethylacetamide solvent to obtain the corresponding polyimides via the polyamic acid precursors and chemical imidization. The monomers and polymers were characterized by Fourier transform infrared spectroscopy, 1H NMR, mass spectroscopy, and elemental analysis; and the best condition of polymerization and imidization were obtained via the study of model compound. The polyimides showed little or no weight loss by thermogravimetric analysis up to 500 °C, and those derived from 6FDA exhibited good solubility in various polar solvents. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 39: 3826–3831, 2001  相似文献   

12.
A series of new polyimides were prepared via the polycondensation of (3‐amino‐2,4,6‐trimethylphenyl)‐(3′‐aminophenyl)methanone and aromatic dianhydrides, that is, 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), 4,4′‐oxydiphthalic anhydride, 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride, and 2,2′‐bis(3,4‐dicarboxyphenyl) hexafluoropropane dianhydride. The structures of the polyimides were characterized by Fourier transform infrared and NMR measurements. The properties were evaluated by solubility tests, ultraviolet–visible analysis, differential scanning calorimetry, and thermogravimetric analysis. The two different meta‐position‐located amino groups with respect to the carbonyl bridge in the diamine monomer provided it with an unsymmetrical structure. This led to a restriction on the close packing of the resulting polymer chains and reduced interchain interactions, which contributed to the solubility increase. All the polyimides except that derived from BPDA had good solubility in strong aprotic solvents, such as N‐methyl‐2‐pyrrolidinone, N,N′‐dimethylacetamide, N,N‐dimethylformamide, and dimethyl sulfone, and in common organic solvents, such as cyclohexanone and chloroform. In addition, these polyimides exhibited high glass‐transition values and excellent thermal properties, with an initial thermal decomposition temperature above 470 °C and glass‐transition temperatures in the range of 280–320 °C. The polyimide films also exhibited good transparency in the visible‐light region, with transmittance higher than 80% at 450 nm and a cutoff wavelength lower than 370 nm. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 1291–1298, 2006  相似文献   

13.
A novel fluorinated aromatic dianhydride, 4,4′‐[2,2,2‐trifluoro‐1‐(3‐trifluoromethyl‐phenyl)ethylidene]diphthalic anhydride (TFDA) was synthesized by coupling of 3′‐trifluoromethyl‐2,2,2‐trifluoroacetophenone with o‐xylene under the catalysis of trifluoromethanesulfonic acid, followed by oxidation of KMnO4 and dehydration. A series of fluorinated aromatic polyimides derived from the novel fluorinated aromatic dianhydride TFDA with various aromatic diamines, such as p‐phenylenediamine (p‐PDA), 4,4′‐oxydianiline (ODA), 1,4‐bis(4‐aminophenoxy)benzene (p‐APB), 1,3‐bis(4‐amino‐phenoxy)benzene (m‐APB), 4‐(4‐aminophenoxy)‐3‐trifluoromethylphenylamine (3FODA) and 1,4‐bis(4‐amino‐2‐trifluoromethylphenoxy)benzene (6FAPB), were prepared by polycondensation procedure. All the fluorinated polyimides were soluble in many polar organic solvents such as NMP, DMAc, DMF, and m‐cresol, as well as some of low boiling point organic solvents such as CHCl3, THF, and acetone. Homogeneous and stable polyimide solutions with solid content as high as 35–40 wt % could be achieved, which were prepared by strong and flexible polyimide films or coatings. The polymer films have good thermal stability with the glass transition temperature of 232–322 °C, the temperature at 5% weight loss of 500–530 °C in nitrogen, and have outstanding mechanical properties with the tensile strengths of 80.5–133.2 MPa as well as elongations at breakage of 7.1–12.6%. It was also found that the polyimide films derived from TFDA and fluorinated aromatic diamines possess low dielectric constants of 2.75–3.02, a low dissipation factor in the range of 1.27–4.50 × 10?3, and low moisture absorptions <1.3%. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 4143–4152, 2004  相似文献   

14.
A novel fluorinated diamine monomer, 1,4‐bis(4‐amino‐2‐trifluoromethylphenoxy)‐2,5‐di‐tert‐butylbenzene ( 2 ), was prepared through the nucleophilic substitution reaction of 2‐chloro‐5‐nitrobenzotrifluoride and 2,5‐di‐tert‐butylhydroquinone in the presence of potassium carbonate, followed by catalytic reduction with hydrazine and Pd/C. Fluorinated polyimides ( 5a – 5f ) were synthesized from diamine 2 and various aromatic dianhydrides ( 3a – 3f ) via thermal or chemical imidization. These polymers had inherent viscosities of 0.77–1.01 dL/g. The 5 series polyimides were soluble in N‐methyl‐2‐pyrrolidone, N,N‐dimethylacetamide, and N,N‐dimethylformamide and were even soluble in dioxane, tetrahydrofuran, and dichloromethane. 5 (C) showed cutoff wavelengths between 363 and 404 nm and yellowness index (b*) values of 6.5–40.2. The polyimide films had tensile strengths of 93–114 MPa, elongations to break of 9–12%, and initial moduli of 1.7–2.1 GPa. The glass‐transition temperatures were 255–288 °C. The temperatures of 10% weight loss were all above 460 °C in air or nitrogen atmospheres. In comparison with a nonfluorinated polyimide series based on 1,4‐bis(4‐aminophenoxy)‐2,5‐di‐tert‐butylbenzene, the 5 series showed better solubility and lower color intensity, dielectric constants, and moisture absorption. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 2272–2284, 2004  相似文献   

15.
New phenolic hydroxyl‐pendant aromatic polyimides were synthesized with the N‐silylated diamine method in two steps: the ring‐opening polyaddition of tetrakis(trimethylsilyl)‐substituted 4,4′‐diamino‐3,3′‐dihydroxybiphenyl to various aromatic tetracarboxylic dianhydrides, giving trimethylsiloxy‐pendant poly(amic acid) trimethylsilyl esters, and thermal imidization. The hydroxyl‐bearing polyimides were amorphous but insoluble in organic solvents. They had glass‐transition temperatures greater than 370 °C and temperatures of 10% weight loss greater than 415 °C in nitrogen. The hydroxyl‐pendant polypyromellitimide film had a high tensile strength and a high modulus of 310 MPa and 10 GPa, respectively. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 1790–1795, 2002  相似文献   

16.
A novel fluorinated aromatic diamine, 1,1‐bis(4‐amino‐3,5‐dimethylphenyl)‐1‐(3,5‐ditrifluoromethylphenyl)‐2,2,2‐trifluoroethane (9FMA), was synthesized by the coupling reaction of 3′,5′‐ditrifluoromethyl‐2,2,2‐trifluoroacetophenone with 2,6‐dimethylaniline under the catalysis of 2,6‐dimethylaniline hydrochloride. A series of fluorinated aromatic polyimides were synthesized from 9FMA and various aromatic dianhydrides, including pyromellitic dianhydride, 3,3′4,4′‐biphenyl tetracarboxylic dianhydride, 4,4′‐oxydiphthalic anhydride, 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA), and 4,4′‐hexafluoroisopropylidene diphthalic anhydride, via a high‐temperature, one‐stage imidization process. The inherent viscosities of the polyimides ranged from 0.37 to 0.74 dL/g. All the polyimides were quickly soluble in many low‐boiling‐point organic solvents such as tetrahydrofuran, chloroform, and acetone as well as some polar organic solvents such as N‐methyl‐2‐pyrrolidinone, N,N′‐dimethylacetamide, and N,N′‐dimethylformamide. Freestanding fluorinated polyimide films could be prepared and exhibited good thermal stability with glass‐transition temperatures of 298–334 °C and outstanding mechanical properties with tensile strengths of 69–102 MPa and elongations at break of 3.3–9.9%. Moreover, the polyimide films possessed low dielectric constants of 2.70–3.09 and low moisture absorption (<0.58%). The films also exhibited good optical transparency with a cutoff wavelength of 303–351 nm. One polyimide (9FMA/BTDA) also exhibited an intrinsic negative photosensitivity, and a fine pattern could be obtained with a resolution of 5 μm after exposure at the i‐line (365‐nm) wavelength. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 2665–2674, 2006  相似文献   

17.
A novel bis(ether anhydride) monomer, 2′,5′‐bis(3,4‐dicarboxyphenoxy)‐p‐terphenyl dianhydride, was synthesized from the nitro displacement of 4‐nitrophthalonitrile by the phenoxide ion of 2′,5′‐dihydroxy‐p‐terphenyl, followed by alkaline hydrolysis of the intermediate bis(ether dinitrile) and cyclodehydration of the resulting bis(ether diacid). A series of new poly(ether imide)s bearing laterally attached p‐terphenyl groups were prepared from the bis(ether anhydride) with various aromatic diamines via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s followed by thermal or chemical imidization to the poly(ether imide)s. The inherent viscosities of the poly(amic acid) precursors were in the range of 0.62–1.26 dL/g. Most of the poly(ether imide)s obtained from both routes were soluble in polar organic solvents, such as N,N‐dimethylacetamide. All the poly(ether imide)s could afford transparent, flexible, and strong films with high tensile strengths. The glass‐transition temperatures of these poly(ether imide)s were recorded as between 214 and 276 °C by DSC. The softening temperatures of all the poly(ether imide) films stayed in the 207–265 °C range according to thermomechanical analysis. For all the polymers significant decomposition did not occur below 500 °C in nitrogen or air atmosphere. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 1008–1017, 2004  相似文献   

18.
A novel, fluorinated diamine monomer, 2,5‐bis(4‐amino‐2‐ trifluoromethylphenoxy)‐tert‐butylbenzene ( II ) was synthesized through the nucleophilic substitution reaction of tert‐butylhydroquinone (t‐BHQ) and 2‐chloro‐5‐nitrobenzotrifluoride in the presence of potassium carbonate to yield the intermediate dinitro compound I , followed by catalytic reduction with hydrazine and Pd/C to afford diamine II . A series of fluorinated polyimides V were prepared from II with various aromatic dianhydrides ( III a–f ) via the thermal imidization of poly(amic acid). Most of V a–f could be soluble in amide‐type solvents and even in less polar solvents. These polyimide films showed tensile strengths up to 106 MPa, elongation at break up to 21%, and initial modulus up to 2.1 GPa. The glass‐transition temperature of V was recorded at 245–304 °C, the 10% weight loss temperatures were above 488 °C, and left more than 41% residue even at 800 °C in nitrogen. Low dielectric constants, low moisture absorptions, and higher and light‐colored transmittances were also observed. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 5424–5438, 2004  相似文献   

19.
The synthesis of aromatic poly(ether imide)s containing spirobifluorene units in the polymer backbone is described. 2,2′‐Bis(3,4‐dicarboxyphenoxy)‐9,9′‐spirobifluorene dianhydride, which was used as a new monomer, was synthesized with 2,2′‐dihydroxy‐9,9′‐spirobifluorene as the starting material. In the spiro‐segment, the rings of the connected bifluorene were orthogonally arranged. This bis(ether anhydride) monomer was employed in reactions with a variety of aromatic diamines to furnish poly(ether imide)s, involving an initial ring‐opening polycondensation and subsequent chemically induced cyclodehydration. Excellent solubility in common organic solvents at room temperature, good optical transparency, and high thermal stability are the prominent characteristic features of these new polymers, which can be attributed to the presence of spiro‐fused orthogonal bifluorene segments along the polymer chain. The glass‐transition temperatures of the polyimides were 240–293 °C, and the 5% weight‐loss temperatures were greater than 500 °C. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 40: 262–268, 2002  相似文献   

20.
A series of fluorinated poly(amide imide)s were prepared from 1,4‐bis(2′‐trifluoromethyl‐4′‐trimellitimidophenoxy)benzene and various aromatic diamines [3,3′,5,5′‐tetramethyl‐4,4′‐diaminediphenylmethane, α,α‐bis(4‐amino‐3,5‐dimethyl phenyl)‐3′‐trifluoromethylphenylmethane, 1,4‐bis(4′‐amino‐2′‐trifluoromethylphenoxy)benzene, 4‐(3′‐trifluoromethylphenyl)‐2,6‐bis(3′‐aminophenyl)pyridine, and 1,1‐bis(4′‐aminophenyl)‐1‐(3′‐trifluoromethylphenyl)‐2,2,2‐trifluoroethane]. The fluorinated poly(amide imide)s, prepared by a one‐step polycondensation procedure, had good solubility both in strong aprotic solvents, such as N‐methyl‐2‐pyrrolidinone, dimethylacetamide, dimethylformamide, dimethyl sulfoxide, and cyclopentanone, and in common organic solvents, such as tetrahydrofuran and m‐cresol. Strong and flexible polymer films with tensile strengths of 84–99 MPa and ultimate elongation values of 6–9% were prepared by the casting of polymer solutions onto glass substrates, followed by thermal baking. The poly(amide imide) films exhibited high thermal stability, with glass‐transition temperatures of 257–266 °C and initial thermal decomposition temperatures of greater than 540 °C. The polymer films also had good dielectric properties, with dielectric constants of 3.26–3.52 and dissipation factors of 3.0–7.7 × 10?3, and acceptable electrical insulating properties. The balance of excellent solubility and thermal stability associated with good mechanical and electrical properties made the poly(amide imide)s potential candidates for practical applications in the microelectronics industry and other related fields. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 1831–1840, 2003  相似文献   

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