动态固化聚丙烯/环氧树脂共混物的研究

将动态硫化技术应用于热塑性树脂 热固性树脂体系 ,制备了动态固化聚丙烯 (PP) 环氧树脂共混物 .研究了动态固化PP 环氧树脂共混物中两组分的相容性、力学性能、热性能和动态力学性能 .实验结果表明 ,马来酸酐接枝的聚丙烯 (PP g MAH)作为PP和环氧树脂体系的增容剂 ,使分散相环氧树脂颗粒变细 ,增加了两组分的界面作用力 ,改善了共混物的力学性能 .与PP相比 ,动态固化PP 环氧树脂共混物具有较高的强度和模量 ,含 5 %环氧树脂的共混物拉伸强度和弯曲模量分别提高了 30 %和 5 0 % ,冲击强度增加了 15 % ,但断裂伸长率却明显降低 .继续增加环氧树脂的含量 ,共混物的拉伸强度和弯曲模量增加缓慢 ,冲击强度无明显变化 ,断裂伸长率进一步降低 .动态力学性能分析 (DMTA)表明动态固化PP 环氧树脂共混物是两相结构 ,具有较高的储能模量 (E′)     

Effect of internal mold release agent on flexural and inter laminar shear properties of carbon and glass fabric reinforced thermoset composites

The study is focused on thermoset composites reinforced with carbon and glass woven fabrics. Two types of thermoset resins, for example, epoxy and vinyl ester were used as the matrix. Varying concentrations of internal mold releasing (IMR) agent was used in the resin. The composites were cured both at room temperature and at 80°C. The flexural properties were studied using 3‐point bending test method. Further theinter‐laminar shear strength (ILSS) was investigated using the short beam shear strength test based on 3‐point bending. The flexural modulus of room temperature cured epoxy resin is higher than that of high temperature cured epoxy resin and cured vinyl ester resin. The flexural modulus is lowest for 1% IMR sample in epoxy system and the modulus for 0% and 2% epoxy are not significantly different. Lowest flexural strength and modulus can be observed for the combination of reinforcement and curing conditions for samples containing 1% IMR for the epoxy systems. Carbon fiber is found to be less compatible with the vinyl ester resin system and the addition of IMR to the resin degraded the properties further. Inter‐laminar shear strength for epoxy‐based composites is not much affected by presence of IMR, but in case of vinyl ester based composites there is a decrease in ILSS on addition of IMR agent. The study explains variation in flexural properties on addition of IMR and change of curing conditions. These results can be used for ascertaining variation in mechanical properties in real use.     

Preparation and characterization of bismaleimide/1,3-dicyanatobenzene modified epoxy intercrosslinked matrices

An intercrosslinked network of cyanate ester (CE)-bismaleimide (BMI) modified epoxy matrix system was made by using epoxy resin, 1,3-dicyanatobenzene and bismaleimide (N,N^′-bismaleimido-4,4^′-diphenyl methane) with diaminodiphenylmethane as curing agent. BMI-CE-epoxy matrices were characterised using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and heat deflection temperature (HDT) analysis. The matrices, in the form of castings, were characterised for their mechanical properties such as tensile strength, flexural strength and unnotched Izod impact test as per ASTM methods. Mechanical studies indicated that the introduction of cyanate ester into epoxy resin improves the toughness and flexural strength with reduction in tensile strength and glass transition temperature, whereas the incorporation of bismaleimide into epoxy resin influences the mechanical and thermal properties according to its percentage content. DSC thermograms of cyanate ester as well as BMI modified epoxy resin show an unimodal reaction exotherm. Electrical properties were studied as per ASTM method and the morphology of the BMI modified epoxy and CE-epoxy systems were studied by scanning electron microscope.     

Synthesis and thermal characterization of phosphorus containing siliconized epoxy resins

Siliconized epoxy matrix resin was developed by reacting diglycidyl ethers of bisphenol A (DGEBA) type epoxy resin with hydroxyl terminated polydimethylsiloxane (silicone) modifier, using γ-aminopropyltriethoxysilane crosslinker and dibutyltindilaurate catalyst. The siliconized epoxy resin was cured with 4, 4-diaminodiphenylmethane (DDM), 1,6-hexanediamine (HDA), and bis (4-aminophenyl) phenylphosphate (BAPP). The BAPP cured epoxy and siliconized epoxy resins exhibit better flame-retardant behaviour than DDM and HDA cured resins. The thermal stability and flame-retardant property of the cured epoxy resins were studied by thermal gravimetric analysis (TGA) and limiting oxygen index (LOI). The glass transition temperatures (T_g) were measured by differential scanning calorimetry (DSC) and the surface morphology was studied by scanning electron microscopy (SEM). The heat deflection temperature (HDT) and moisture absorption studies were carried out as per standard testing procedure. The thermal stability and flame-retardant properties of the cured epoxy resins were improved by the incorporation of both silicone and phosphorus moieties. The synergistic effect of silicone and phosphorus enhanced the limiting oxygen index values, which was observed for siliconized epoxy resins cured with phosphorus containing diamine compound.     

非离子型活性乳化剂及其水性环氧树脂的制备和性能

以α-甲氧基-ω-N-异丙醇基-对苯甲胺基聚乙二醇和酚醛环氧树脂F51为原料合成了非离子型活性乳化剂(PEGF51),并与F51混合,通过相反转法制备了分散相粒径为纳米级的PEGF51/F51水乳液.通过红外光谱和凝胶渗透色谱(GPC)分析了PEGF51的结构,研究了PEGF51浓度对PEGF51/F51水乳液分散相粒子粒径和D230-PEGF51/F51固化产物的力学性能、断面形貌和耐水性能的影响规律.结果表明:在环氧树脂分子结构中引入化学连接的PEG链段有利于提高环氧树脂链段的亲水性和应变松弛速率.增加PEGF51浓度,制备的PEGF51/F51水乳液分散相粒子粒径减小,粒度分布变窄;D230-PEGF51/F51固化产物的玻璃化转变温度和室温下的刚度和拉伸强度降低,冲击强度、断裂应变和吸水率增加.PEGF51与F51物质的量的比为1∶3时可制备出同时具有优异的拉伸强度、模量、断裂应变、冲击性能和低吸水率的D230-PEGF51/F51环氧树脂.     

Studies on thermal and morphological properties of 1,1-bis(3-methyl-4-cyanatophenyl)cyclohexane-epoxy-bismaleimide matrices

A new cyanate ester monomer, 1,1-bis(3-methyl-4-cyanatophenyl)cyclohexane has been synthesized and characterized. Epoxy modified with 4, 8 and 12% (by weight) of cyanate ester were made using epoxy resin and 1,1-bis(3-methyl-4-cyanatophenyl)cyclohexane and cured by using diaminodiphenylmethane. The cyanate ester modified epoxy matrix systems were further modified with 4, 8 and 12% (by weight) of bismaleimide (N,N′-bismaleimido-4,4′-diphenylmethane). The formation of oxazolidinone and isocyanurate during cure reaction of epoxy and cyanate ester blend was confirmed by IR spectral studies. Bismaleimide-cyanate ester-epoxy matrices were characterized using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and heat deflection temperature (HDT) analysis. Thermal studies indicate that the introduction of cyanate ester into epoxy resin improves the thermal degradation studies at the expense of glass transition temperature. Whereas the incorporation of bismaleimide into epoxy resin enhances the thermal properties according to its percentage content. However, the introduction of both cyanate ester and bismaleimide influences the thermal properties according to their percentage content. DSC thermogram of cyanate ester modified epoxy and bismaleimide modified epoxy show unimodel reaction exotherms. The thermal degradation temperature and heat distortion temperature of the cured bismaleimide modified epoxy and cyanate ester-epoxy systems increased with increasing bismaleimide content. The morphology of the bismaleimide modified epoxy and cyanate ester-epoxy systems were also studied by scanning electron microscopy. Copyright © 2003 John Wiley & Sons, Ltd.     

Benzoxazine modified diglycidyl ether of bisphenol-a/silicon/siliconized epoxy hybrid polymer matrices: Mechanical,thermal, electrical and morphological properties

Benzoxazines modified epoxy hybrid polymer matrices were developed using benzoxazines (CB_DDM and BMPB_DDM) and epoxy resins (DGEBA, SE and EP-HTPDMS) to make them suitable for high performance applications. The benzoxazine-epoxy hybrid polymer matrices were prepared via in-situ polymerization and were investigated for their thermal, thermo-mechanical, mechanical, electrical and morphological properties. Two types of skeletal modified benzoxazines namely 1,1-bis(3-methyl-4-hydroxyphenyl)cyclohexane benzoxazine (CB_DDM) and bis(4-maleimidophenyl) benzoxazine (BMPB_DDM) were synthesized by reacting paraformaldehyde and 4,4′-diaminodiphenylmethane with 1,1-bis (3-methyl-4-hydroxyphenyl)cyclohexane and N-(4-hydroxyphenyl)maleimide respectively. Epoxy resins viz., diglycidyl ether of bisphenol-A (DGEBA), silicon incorporated epoxy (SE) and siliconized epoxy resin (EP-HTPDMS) were modified with 5, 10 and 15 wt% of benzoxazines using 4,4′-diaminodiphenylmethane as a curing agent at appropriate conditions. The chemical reaction of benzoxazines with the epoxy resin was carried out thermally and the resulting product was analyzed by FT-IR spectra. The glass transition temperature, curing behavior, thermal stability, char yield and flame resistance of the hybrid polymers were analysed by means of DSC, TGA and DMA. Mechanical properties were studied as per ASTM standards. The benzoxazines modified epoxy resin systems exhibited lower values of dielectric constant and dielectric loss with an enhanced values of of arc resistance, glass transition temperatures, degradation temperatures, thermal stability, char yield, storage modulus, tensile strength, flexural strength and impact strength.     

Mechanical,thermal and morphological behavior of bismaleimide modified polyurethane‐epoxy IPN matrices

An intercrosslinked network of bismaleimide modified polyurethane‐epoxy systems were prepared from the bismaleimide having ester linkages, polyurethane modified epoxy and cured in the presence of 4,4′‐diaminodiphenylmethane. Infrared spectral analysis was used to confirm the grafting of polyurethane into the epoxy skeleton. The prepared matrices were characterized by mechanical, thermal and morphological studies. The results obtained from the mechanical and thermal studies reveal that the incorporation of polyurethane into the epoxy skeleton increases the mechanical strength and decreases the glass transition temperature, thermal stability and heat distortion temperature. Whereas, the incorporation of bismaleimide having ester linkages into polyurethane modified epoxy systems increases the thermal stability, tensile and flexural properties and decreases the impact strength, glass transition temperature and heat distortion temperature. Surface morphology of polyurethane modified epoxy and bismaleimide modified polyurethane‐epoxy systems were studied using scanning electron microscopy. Copyright © 2003 John Wiley & Sons, Ltd.     

Synthesis of a novel epoxy resin containing naphthalene moiety and properties of its cured polymer with phenol novolac

A new epoxy resin (Bis-ENA) containing naphthalene structure linked with a 1,4-bis(isopropylidene)phenylene was synthesized and was confirmed by elemental analysis, infrared spectroscopy, and ¹H nuclear magnetic resonance spectroscopy. To estimate the effect of naphthalene moiety on the cured polymer, an epoxy resin (Bis-EP) having phenyl moiety was synthesized, and curing behaviors of Bis-ENA and Bis-EP with phenol novolac were evaluated by differential scanning calorimetry. The incorporation of naphthalene structure into the resin backbone increased the curing temperature and reduced the curing reactivity. Thermal properties of the cured polymers obtained from Bis-ENA and Bis-EP with phenol novolac were examined by thermomechanical analysis and dynamic mechanical analysis. Mechanical properties and moisture resistance were evaluated by flexural strength, flexural modulus, and moisture absorption measurements. The cured polymer obtained from Bis-ENA showed higher glass transition temperature, higher flexural modulus, lower thermal expansion, and lower moisture absorption than that from Bis-EP. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 3063–3069, 1999     

Diglycidyl ether of bisphenol‐A epoxy resin modified using poly(ether ether ketone) with pendent tert‐butyl groups

Bisphenol‐A‐based difunctional epoxy resin was modified with poly(ether ether ketone) with pendent tert‐butyl groups (PEEKT). PEEKT was synthesized by the nucleophilic substitution reaction of 4,4′‐difluoro benzophenone with tert‐butyl hydroquinone in N‐methyl‐2‐pyrrolidone. Blends with various amounts of PEEKT were prepared by melt‐mixing. All the blends were homogeneous in the uncured state. The glass transition temperature of the binary epoxy/PEEKT blends was predicted using several equations. Reaction‐induced phase separation was found to occur upon curing with a diamine 4,4′‐diaminodiphenyl sulfone. The phase morphology of the blends was studied using scanning electron microscopy. From the micrographs, it was found that PEEKT‐rich phase was dispersed in a continuous epoxy matrix. The domain size increased with the amount of PEEKT in the blends. The increase in domain size was due to the coalescence of the domains after phase separation. Dynamic mechanical analysis of the blends gave two peaks corresponding to epoxy‐rich phase and thermoplastic‐rich phase. The tensile strength and modulus of the blends remained close to that of the unmodified resin, while the flexural properties decreased with the addition of PEEKT to epoxy resin. The fracture toughness of the epoxy resin increased with the addition of PEEKT. Investigation of the fracture surfaces revealed evidences for local plastic deformation of the matrix, crack pinning, crack path deflection, and ductile tearing of PEEKT‐rich phase. Thermogravimetric analysis revealed that the initial decomposition temperature of the blends were close to that of the unmodified resin. Finally, the properties of the blends were compared with other modified PEEK/epoxy blends. © 2007 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 45: 2481–2496, 2007     

Preparation and characterization of functionalized graphene oxide/carbon fiber/epoxy nanocomposites

Graphene oxide (GO) was functionalized using three different diamines, namely ethylenediamine (EDA), 4,4′-diaminodiphenyl sulfone (DDS) and p-phenylenediamine (PPD) to reinforce an epoxy adhesive, with the aim of improving the bonding strength of carbon fiber/epoxy composite. The chemical structure of the functionalized GO (FGO) nanosheets was characterized by elemental analysis, FT-IR and XRD. Hand lay-up, as a simple method, was applied for 3-ply composite fabrication. In the sample preparation, the fiber-to-resin ratio of 40:60 (w:w) and fiber orientations of 0°, 90°, and 0° were used. The GO and FGO nanoparticles were first dispersed in the epoxy resin, and then the GO and FGO reinforced epoxy (GO- or FGO-epoxy) were directly introduced into the carbon fiber layers to improve the mechanical properties. The GO and FGO contents varied in the range of 0.1–0.5 wt%. Results showed that the mechanical properties, in terms of tensile and flexural properties, were mainly dependent on the type of GO functionalization followed by the percentage of modified GO. As a result, both the tensile and flexural strengths are effectively enhanced by the FGOs addition. The tensile and flexural moduli are also increased by the FGO filling in the epoxy resin due to the excellent elastic modulus of FGO. The optimal FGO content for effectively improving the overall composite mechanical performance was found to be 0.3 wt%. Scanning electron microscopy (SEM) revealed that the failure mechanism of carbon fibers pulled out from the epoxy matrix contributed to the enhancement of the mechanical performance of the epoxy. These results show that diamine FGOs can strengthen the interfacial bonding between the carbon fibers and the epoxy adhesive.     

Development and characterization of a novel skeletal modified tetraglycidyl epoxy toughened DGEBA epoxy matrices

The present work investigates the improvement in mechanical properties observed for commercially available diglycidyl ethers of bisphenol-A (DGEBA) with the incorporation of a new type of skeletal modified tetra glycidyl epoxy resin TGBAPB as modifier. Varying weight percentages of TGBAPB have been blended with DGEBA and cured with diaminodiphenylmethane (DDM). The chemical structure of TGBAPB was confirmed by FTIR, NMR, and molecular weight determination was carried out by ESI-MS spectroscopic techniques. The thermal properties were characterized by differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and mechanical properties like tensile strength, flexural strength, impact strength were also studied by universal testing machine (UTM). Scanning electron microscopy (SEM) investigates the morphological behavior of the neat and blend epoxy resins. The results from different studies indicate that the blend epoxy resin system “B” comprising 75% DGEBA/25% TGBAPB has shown improvements in both toughness and stiffness, despite the fact that it is often found that the enhancement of these two properties together in a material cannot be simultaneously achieved. These aspects of this work are novel.     

Studies on thermal, mechanical and morphological behaviour of caprolactam blocked methylenediphenyl diisocyanate toughened bismaleimide modified epoxy matrices

Diglycidyl ether of bisphenol A epoxy resin (DGEBA, LY 556) was toughened with 5%, 10% and 15% (by wt) of caprolactam blocked methylenediphenyl diisocyanate (CMDI) using 4,4′-diaminodiphenylmethane (DDM) as curing agent. The toughened epoxy resin was further modified with chemical modifier N,N′-bismaleimido-4,4′-diphenylmethane (BMI). Caprolactam blocked methylenediphenyl diisocyanate was synthesized by the reaction of caprolactam with methylenediphenyl diisocyanate in presence of carbon tetrachloride under nitrogen atmosphere. Thermal properties of the developed matrices were characterized by means of differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), heat distortion temperature (HDT) and dynamic mechanical analysis (DMA). Mechanical properties like tensile strength, flexural strength and impact strength were tested as per ASTM standards. The glass transition temperature (T_g) and thermal stability were decreased with increase in the percentage incorporation of CMDI. The thermomechanical properties of caprolactam blocked methylenediphenyl diisocyanate toughened epoxy resin were increased by increasing the percentage incorporation of bismaleimide. The values of impact strength for epoxy resin were increased with increase in the percentage concentration of CMDI. The homogeneous morphology of CMDI toughened epoxy resin and bismaleimide modified CMDI toughened epoxy resin system were ascertained from scanning electron microscope (SEM).     

Fabrication of high thermal stable cured novolac/Cloisite 30B nanocomposites by chemical modification of resin structure

Cloisite 30B as a modified kind of nanoclay was utilized for the formation of 3D network based on novolac resin with high thermal stable properties. Two types of phenolic resins including neat novolac (NR) and modified novolac resin were used to create a compatible matrix with nanoclay. For this purpose, NR modified with (3‐chloropropyl)triethoxysilane (CPTES) to form SiNR. For improvement of thermal behaviors, Cloisite 30B was dispersed in matrix via ultrasonic waves and cured with hexamethylenetetramine (HMTA) to form 3D network. X‐ray diffraction (XRD) analysis was used to measure the d‐spacing in intercalated systems and results indicated the optimum amount of clay for appropriate thermal properties. Investigation of the thermal properties of the samples by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) showed that the presence of Cloisite 30B in matrix resulted in much higher thermal stability and char yield with respect to modification of novolac resin originated from formation of 3D Si–O–Si network. Also, cured modified resin and its nanocomposites showed much higher thermal stability than cured NR and its nanocomposites. Such nanocomposite materials with high thermal stability have potential applications in advanced fields such electronic, industrial molds, coatings, adhesives, and aerospace composites.     

Facile fabrication of fast recyclable and multiple self‐healing epoxy materials through diels‐alder adduct cross‐linker

A reversibly cross‐linked epoxy resin with efficient reprocessing and intrinsic self‐healing was prepared from a diamine Diels‐Alder (DA) adduct cross‐linker and a commercial epoxy oligomer. The newly synthesized diamine cross‐linker, comprising a DA adduct of furan and maleimide moieties, can cure epoxy monomer/oligomer with thermal reversibility. The reversible transition between cross‐linked state and linear architecture endows the cured epoxy with rapid recyclability and repeated healability. The reversibly cross‐linked epoxy fundamentally behaves as typical thermosets at ambient conditions yet can be fast reprocessed at elevated temperature like thermoplastics. As a potential reversible adhesive, the epoxy polymer with adhesive strength values about 3 MPa showed full recovery after repeated fracture‐thermal healing processes. The methodology explored in this contribution provides new insights in modification of conventional engineering plastics as functional materials. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2015 , 53, 2094–2103     

Effects of organo-montmorillonite dispersion on thermal stability of epoxy resin nanocomposites

Montmorillonite (MMT) was modified with the acidified cocamidopropyl betaine (CAB) and the resulting organo-montmorillonite (O-MMT) was dispersed in an epoxy/methyl tetrahydrophthalic anhydride system to form epoxy nanocomposites. The dispersion state of the MMT in the matrix was investigated by X-ray diffraction and scanning electronic microscopy. The thermal stability of the epoxy nanocomposites was examined by TGA. Thermal stability of the epoxy nanocomposite is dependent upon the dispersion state of the OMMT in the epoxy matrix although all the epoxy nanocomposites had enhanced thermal stability compared with the neat epoxy resin. The thermal stability of the epoxy resin nanocomposites was correlated with the dispersion state of the MMT in the epoxy resin matrix.     

Synthesis and properties of phosphorus-containing bio-based epoxy resin from itaconic acid

A phosphorus-containing bio-based epoxy resin (EADI) was synthesized from itaconic acid (IA) and 9,10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide (DOPO). As a matrix, its cured epoxy network with methyl hexahydrophthalic anhydride (MHHPA) as the curing agent showed comparable glass-transition temperature and mechanical properties to diglycidyl ether in a bisphenol A (DGEBA) system as well as good flame retardancy with UL94 V-0 grade during a vertical burning test. As a reactive flame retardant, its flame-resistant effect on DGEBA/MHHPA system as well as its influence on the curing behavior and the thermal and mechanical properties of the modified epoxy resin were investigated. Results showed that after the introduction of EADI, not only were the flame retardancy determined by vertical burning test, LOI measurement, and thermogravimetric analysis significantly improved, but also the curing reactivity, glass transition temperature (T _g), initial degradation temperature for 5% weight loss (T _d(5%)), and flexural modulus of the cured system improved as well. EADI has great potential to be used as a green flame retardant in epoxy resin systems.     

一种液晶环氧增韧环氧树脂的研究

环氧树脂具有优异的机械性能 ,耐高温以及良好的加工工艺性 .被广泛用于机械、航天、船舶等领域 .由于环氧树脂固化后断裂延伸率小 ,脆性大 ,使其应用受到了一定的限制 .为此 ,国内外学者对环氧树脂进行了大量的改性研究工作 .用含有“柔性链段”的固化剂固化环氧 ,在交联网络中引入柔性链段[1] ;在环氧基体中加入橡胶弹性体[2 ] 、热塑性树脂[3 ,4] 、液晶聚合物[5,6] 等分散相或用热固性树脂连续贯穿于环氧树脂网络中形成互穿、半互穿网络结构[7] ,以改善环氧树脂的韧性 .本文采用液晶环氧化合物原位复合增韧环氧树脂 ,考察了液晶环氧对环…     

Highly efficient multielement flame retardant for multifunctional epoxy resin with satisfactory thermal,flame‐retardant,and mechanical properties

Multifunctional epoxy resins with excellent, thermal, flame‐retardant, and mechanical properties are extremely important for various applications. To solve this challenging problem, a novel highly efficient multielement flame retardant (PMSBA) is synthesized and the flame‐retardant and mechanical properties of modified epoxy resins are greatly enhanced without significantly altering their and thermal properties by applying the as‐synthesized PMSBA. The limiting oxygen index value reaches up to 29.6% and could pass the V‐0 rating in the UL‐94 test with even low P content (0.13%). Furthermore, cone calorimetry results demonstrate that 30.3% reduction in the peak heat release rate for the sample with 10.0 wt% PMSBA is achieved. X‐ray photoelectron spectroscopy and scanning electron microscopy indicate that Si‐C, Si‐N, and phosphoric acid derivative can be transformed into a multihole and intumescent char layer as an effective barrier, preserving the epoxy resin structure from fire. More importantly, mechanical properties such as impact strength, tensile strength, and flexural strength are also increased by 63.86%, 33.54%, and 15.65%, respectively, which show the incorporation of PMSBA do not deteriorate the mechanical properties of modified epoxy resins. All the results show that PMSBA is a promising strategy for epoxy resin with satisfactory, thermal, flame‐retardant, and mechanical properties.     

纳米Al_2O_3改性双酚A型环氧丙烯酸酯的制备与性能研究

选用硅烷偶联剂KH570对纳米Al_2O_3进行表面改性处理,并用改性后的Al_2O_3对双酚A环氧丙烯酸酯进行复合改性,研究了纳米Al_2O_3含量(1%(wt)~5%(wt))对树脂性能的影响。结果表明:改性纳米Al_2O_3质量分数为5%时的复合材料的体积收缩率最小,为6.48%;粒子质量分数为2%时,树脂的凝胶率最大,为88.3%;热失重测试结果表明,改性纳米Al_2O_3提高了树脂的热稳定性;拉伸性能显示,随着改性纳米Al_2O_3质量分数的增加,复合材料的拉伸强度先升高后下降,当改性纳米Al_2O_3质量分数为3%时,复合树脂拉伸强度最大,为34.74MPa,与未改性树脂相比,拉伸强度提高了108.27%。本文所制备的改性光敏树脂可适用于3D打印环境。