Modeling the curing kinetics for a modified bismaleimide resin

The kinetics of curing for a modified bismaleimide (BMI) has been investigated to ascertain a suitable cure model for the material. The experimental data for characterizing the curing kinetics for a modified bismaleimide resin were determined using a DSC isothermal scan method and indicated a curing mechanism involving multiple reactions. The reaction process was shown to be dominated by a different mechanism at different stages of the cure process, with an initial autocatalytic reaction shifting into an nth order reaction as the reaction proceeded. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 907–913, 2000     

Curing characteristics of o-cresol novolac epoxy resin modified by bismaleimide

Curing characteristics of o-cresol novolac epoxy resin modified by 4,4-diaminodiphenylmethane bismaleimide (DDM-BMI) using FTIR were investigated and the glass transition temperature was measured. With the addition of DDM as hardener, the relative curing reaction conversion of DDM-BMI increased with equivalent weight ratio [R₁ = (equiv wt summation of epoxy and DDM-BMI)/equiv wt of DDM] and weight ratio of epoxy and DDM-BMI (R₂ = wt of epoxy resin/wt of DDM-BMI). Using phenol novolac resin (PN) as hardener, the curing reaction conversion of DDM-BMI was hardly changed, but the variation of that in the epoxy resin was observed with R₂ change. © 1996 John Wiley & Sons, Inc.     

Allyl ether of aralkyl phenolic resin with low melt viscosity and its Alder‐ene blends with bismaleimide: synthesis,curing, and laminate properties

This paper outlines the synthesis and characterization of O‐allyl aralkyl phenolic (O‐allyl Xylok, OAX) resins having low melt viscosity and its Alder‐ene blends with 2, 2′‐bis 4‐[(4′‐maleimido phenoxy) phenyl] propane. The blends manifested a three‐stage curing pattern that converged to a two‐stage pattern on enhancing the maleimide content. The polymerization kinetics of typical allyl and maleimide rich resin systems showed apparent activation energy increasing and pre‐exponential factor decreasing from ene to the Diels–Alder step. Increased allyl content improved mechanical and impact properties of the composites at ambient temperature, although it diminished the retention of interlaminar shear strength at elevated temperature. Increased maleimide content of the resin was conducive for the higher rigidity for the composite and its retention at elevated temperature. A substantial increase in T_g (from 153°C to 280°C) and thermal stability was observed with an increase in maleimide content. High allyl content resulted in improved mechanical properties thanks to better resin–reinforcement interaction as revealed from morphological analysis. Copyright © 2014 John Wiley & Sons, Ltd.     

Synthesis of mesoporous silica and its modification of bismaleimide/cyanate ester resin with improved thermal and dielectric properties

A novel method is proposed to synthesize new mesoporous silica containing amine groups (MPSA), and it was further employed to modify bismaleimide‐dialllyl bisphenol (BD)/cyanate ester (CE) resin to form novel MPSA/BD/CE hybrids; in addition, the typical properties of MPSA/BD/CE were systematically investigated. Results show that these hybrids have very low dielectric constant and loss as well as good thermal properties. Compared with BD/CE resin, all hybrids have not only decreased dielectric constant and loss but also similar dependence of dielectric properties on frequency over the whole frequency from 10 to 10⁶ Hz. Specifically, with the addition of MPSA to BD/CE resin, the dielectric constant reduces from 3.5 to 3.0, and the dielectric loss is only 85% of that of BD/CE resin. Note that all hybrids show better thermal resistance (reflected by higher glass transition temperature, decreased maximum degradation rate, and higher char yield at 800°C) than BD/CE resin. All these differences in macro‐properties are attributed to the different structure between MPSA/BD/CE hybrids and BD/CE resin. Copyright © 2011 John Wiley & Sons, Ltd.     

BMD/UP体系非等温固化动力学研究

不饱和聚酯是最常用的一种热固性材料,其力学性能和耐热性是较受关注的两个方面,利用双马来酰亚胺作为第二组分对不饱和聚酯进行耐热改性的工作取得了较好的效果。研究其动力学过程对于固化反应温度、时间等工艺合理优化控制,制备高性能复合材料具有重要意义。考虑到BMD／UP体系中反应的复杂性,本文采用n级动力学模型,进行了非等温动力学研究。     

水性环氧树脂的研制及其固化性能研究

采用端甲氧基聚乙二醇、马来酸酐、E-44环氧树脂合成了反应型环氧树脂乳化剂MeO-PEG-Ma-E-44,以相反转乳化技术制备E-44水性环氧树脂,研究了工艺条件对其性能的影响。结果表明:酯化率达98.5%的MeO-PEG-Ma-E-44,用量为E-44的ω=16.5%-20%得到的水性环氧树脂乳液最稳定。DSC和TG分析结果表明:乳化前后的E-44环氧树脂都能室温条件2h内很好的固化,固化后热性能基本不变,分解温度约在380℃,热失重率89%,其玻璃转变温度有所降低,韧性有所提高,其它性能基本不受影响。     

Effect of new nonionic curing agent on curing kinetics and mechanical properties of epoxy resin

The current research work presents a novel nonionic curing agent (AEDA) synthesized by utilizing ethylene glycol diglycidyl ether (EGDE), 3,4-dimethoxyaniline (DI), and triethylenetetramine (TETA). Infrared spectroscopy and nuclear magnetic resonance spectroscopy were used to characterize the structure of AEDA curing agent. Non-isothermal scanning calorimetry was used to determine the activation energy and curing conditions of epoxy resin in the curing process. An impact testing machine, a tensile testing machine and a scanning electron microscope (SEM) were used to analyze the impact strength, tensile strength, bending strength, and micromorphology of the AEDA/E-51 system with different mass ratios. The results show that AEDA is an effective high-temperature curing agent. For the AEDA/E-51 system with the optimal mass ratio of 10:100, the best curing temperature is 92.15°C, and the post-curing temperature is 135.65°C. Furthermore, the apparent activation energy (E_a) of 1670 J/mol, the pre-exponential factor (A) of 3.7 × 10^?4, and the reaction series (n) value of 0.76 are obtained for the AEDA/E-51 system. The impact strength of AEDA/E-51 epoxy resin polymer is 7.82 kJ/m², tensile strength is 14.2 MPa, and bending strength is 18.92 MPa. The micromorphological results of the AEDA/E-51 system are consistent with the results of DSC test and mechanical properties test. Hence, this study provides theoretical support for the practical applications of AEDA as curing agent.     

Effect of organoclay on the curing reactions in bismaleimide/diallyl bisphenol a resin

4,4′‐Bismaleimidodiphenyl methane (BMPM)/2,2′‐diallyl bisphenol A (DBA)/organoclay nanocomposites were synthesized. The effects of organoclays on the curing reactions in the BMPM/DBA system at low temperatures (ene reaction) and high temperatures (Diels–Alder reaction, homopolymerization of BMPM, and alternative copolymerization) were investigated with differential scanning calorimetry and Fourier transform infrared techniques. The results showed that these reactions were affected to different extents in the presence of organoclays. The ene reaction was accelerated to different degrees depending on the acidity of the modifier and the accessibility of the organoclays used. The exfoliation degree of organoclays in the prepolymers showed great effects on the curing behavior of BMPM/DBA. When an organoclay was less intercalated, the curing behavior of the system was different from that of neat BMPM/DBA. On the other hand, when the organoclay was better exfoliated in prepolymers, the curing behavior of the system was similar to that of the neat BMPM/DBA system. However, even in this case, the reactions at high temperatures occurred in different ways in the presence of an organoclay. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 994–1006, 2005     

Rheological study on structural transition in polyethersulfone‐modified bismaleimide resin during isothermal curing

The structural transition in the polyethersulfone (PES)‐modified bismaleimide resin, 4,4′‐bismaleimidodiphenylmethane (BDM), during isothermal curing was studied by using rheological technique, different scanning calorimetry (DSC), and time resolved light scattering (TRLS). Comparing with the cure of neat bismaleimide, two separate tan δ crossover points were observed because of the phase separation during curing the blends of PES/BDM. These two structural transitions stemmed from the fixing of phase structure of the system and the chemical crosslinking of bismaleimide, respectively. The effect of curing temperature and the PES content on structural transition was discussed and found that the occurrence of two structural transition exhibited the different dependency of curing temperature and PES content. The relaxation exponent n and gel strength S were also found to be temperature‐dependent and composition‐dependent. Moreover, the relaxation exponent n of the second structural transition is much lower than that of the first structural transition in the PES/bismaleimide blends. © 2006 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 3102–3108, 2006     

Studies on thermal and morphological properties of 1,1-bis(3-methyl-4-cyanatophenyl)cyclohexane-epoxy-bismaleimide matrices

A new cyanate ester monomer, 1,1-bis(3-methyl-4-cyanatophenyl)cyclohexane has been synthesized and characterized. Epoxy modified with 4, 8 and 12% (by weight) of cyanate ester were made using epoxy resin and 1,1-bis(3-methyl-4-cyanatophenyl)cyclohexane and cured by using diaminodiphenylmethane. The cyanate ester modified epoxy matrix systems were further modified with 4, 8 and 12% (by weight) of bismaleimide (N,N′-bismaleimido-4,4′-diphenylmethane). The formation of oxazolidinone and isocyanurate during cure reaction of epoxy and cyanate ester blend was confirmed by IR spectral studies. Bismaleimide-cyanate ester-epoxy matrices were characterized using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and heat deflection temperature (HDT) analysis. Thermal studies indicate that the introduction of cyanate ester into epoxy resin improves the thermal degradation studies at the expense of glass transition temperature. Whereas the incorporation of bismaleimide into epoxy resin enhances the thermal properties according to its percentage content. However, the introduction of both cyanate ester and bismaleimide influences the thermal properties according to their percentage content. DSC thermogram of cyanate ester modified epoxy and bismaleimide modified epoxy show unimodel reaction exotherms. The thermal degradation temperature and heat distortion temperature of the cured bismaleimide modified epoxy and cyanate ester-epoxy systems increased with increasing bismaleimide content. The morphology of the bismaleimide modified epoxy and cyanate ester-epoxy systems were also studied by scanning electron microscopy. Copyright © 2003 John Wiley & Sons, Ltd.     

Novel high performance RTM bismaleimide resin with low cure temperature for advanced composites

A novel performance matrix, coded as LCRTM, with low cure and post‐cure temperature (≤ 200°C) for fabricating advanced polymer composites via resin transfer molding (RTM), was successfully developed, made up of 4,4′‐bismaleimidodiphenylmethane (BDM) and N‐allyl diaminodiphenylether (ADDE). Investigations show that the stoichiometry of BDM and ADDE has great effect on the processing and performance parameters of the resultant resins. In the case of the optimum formulation (the mole ratio of BDM and ADDE is 1:0.55), the injection temperature range is between 70–82°C, and the pot life at 80°C is 300 min, moreover, the cured resin has desirable thermal and mechanical properties after being cured at 200°C for 6 hr, reflecting a great potential as high performance matrices for fabricating advanced composites via the RTM technique. Copyright © 2005 John Wiley & Sons, Ltd.     

Synthesis of an epoxy functionalized spiroorthocarbonate used as low shrinkage additive in cationic UV curing of an epoxy resin

The synthesis of an epoxy functionalized spiroorthocarbonate (SOC) is reported. The obtained monomer has been used a slow shrinkable additive in cationic UV curing of a commercially available dicycloepoxy resin. A polymer network flexibilization was evidenced by increasing the SOC content in the photocurable formulation. It has been demonstrated that SOC acts as shrinkage reduction additive reaching expansion on volume after polymerization in the presence of 10 wt% of the functionalized spiroorthocarbonate.     

Study of phenolic resin/EVA blends by thermal analysis

The properties of polymeric blends originate from the synergistic association of their components. In this investigation, phenolic resins obtained by the reaction of cashew-nut shell liquid (CNSL) and aldehyde are used in several applications. Mixtures of CNSL with industrial reject ethylene-co-vinyl acetate (EVA reject) were prepared with an EVA reject content up to 70%. The thermal compatibility and stability were evaluated by means of thermogravimetry (TG), derivative thermogravimetry (DTG) and differential scanning calorimetry (DSC). For blends containing a high percentage of EVA reject, the TG curves clearly show two decomposition stages, one at 350C and the other at 450C (onset 467C). The DIG curves of the blend containing 70% CNSL exhibit decomposition at 240C. The DSC curves show that the samples containing a high percentage of EVA reject are incompatible, withT _g values around –30C.The authors would like to thank PETROBRAS/CENPES/DIQUIM for the NMR facilities and thermal measurements.     

Study on curing reaction of epoxy resin modified with prepolymers containing spiro orthocarbonate

Prepolymers were prepared by the reaction of 3,9-dihydroxyethyl-3′9′-dibenzyl-1,5,7,11-tetraoxaspiro(5,5)undecane with 4,4′-diphenylmethane diisocyanate (MDI) and 1,6-hexa-methylene diisocyanate (HDI). The number-average molecular weights of the prepolymers can be controlled by changing the mole ratios of spiro compound and diisocyanates. Kinetic studies of the cure reaction for the epoxy resin system modified with or without prepolymers were followed by a HLX-1 dynamic torsional vibration apparatus. The results indicated that gel time (t_g) and activation energy (E_a) increased as the content of prepolymers in the epoxy resin system increased. A difference with the cure reaction of the pure epoxy resin, the second-order reaction for the epoxy resin modified with the prepolymers, was obtained. Rate constants (k) of the cure reaction are 0.231 min^?1 for the epoxy resin, and 0.312 min^?1 for the modified epoxy resin. The mechanism of the cure reaction was discussed. © 1995 John Wiley & Sons, Inc.     

Mechanical,thermal and morphological behavior of bismaleimide modified polyurethane‐epoxy IPN matrices

An intercrosslinked network of bismaleimide modified polyurethane‐epoxy systems were prepared from the bismaleimide having ester linkages, polyurethane modified epoxy and cured in the presence of 4,4′‐diaminodiphenylmethane. Infrared spectral analysis was used to confirm the grafting of polyurethane into the epoxy skeleton. The prepared matrices were characterized by mechanical, thermal and morphological studies. The results obtained from the mechanical and thermal studies reveal that the incorporation of polyurethane into the epoxy skeleton increases the mechanical strength and decreases the glass transition temperature, thermal stability and heat distortion temperature. Whereas, the incorporation of bismaleimide having ester linkages into polyurethane modified epoxy systems increases the thermal stability, tensile and flexural properties and decreases the impact strength, glass transition temperature and heat distortion temperature. Surface morphology of polyurethane modified epoxy and bismaleimide modified polyurethane‐epoxy systems were studied using scanning electron microscopy. Copyright © 2003 John Wiley & Sons, Ltd.     

The effect of the curing agent content on the curing and liquid‐crystalline phase of liquid‐crystalline epoxy resin

The effect of the curing agent content on the curing behavior and liquid‐crystalline (LC) phase of the liquid‐crystalline epoxy (LCE) resin 4,4′‐di(2,3‐epoxypropyloxy)phenyl benzoate was studied. Diaminodiphenylester (DDE) was used as a curing agent. The curing behavior was observed via differential scanning calorimetry, and the LC phase was investigated with a polarized optical microscopy. The LC phase in the LCE/DDE mixture with a high DDE content was developed during curing. The onset time was inversely proportional to the DDE content. The mesophase stability of LCE/DDE was enhanced by the addition of large amounts of DDE. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 39: 374–379, 2001     

A comparison of commercially available DSC kinetic methods in evaluating bismaleimide resins

The ability of commercially available software, based upon literature methods, to derive kinetic data has been demonstrated. Care, however, must be taken in selecting the appropriate model for the reaction under investigation.     

Photogeneration of polyfunctional amines and novel thermal curing reactions of epoxy resin and polyurethane oligomer using these amines

Photochemical reactions of various blocked polyfunctional amines such as bis(4-formylaminophenyl)methane (FAPM), bis(4-acetylaminophenyl)methane (AAPM), bis(4-benzoylaminophenyl)methane (BAPM), 2,4-diformylaminotoluene (DFAT), m-xylene diformamide, and bis[[(2-nitrobenzyl)oxy]carbonyl]hexane-1.6-diamine were carried out to give the corresponding free amines in THF solution, in epoxy resin, or in polyurethane oligomer with terminal isocyanate groups. Photolysis of FAPM and DFAT to produce the corresponding polyfunctional amines such as 4,4'-methylenedianiline and 2,4-diaminotoluene proceeded with 80 and 75% conversions, respectively, in THF solution under UV irradiation at 5 h. AAPM and BAPM also produced the corresponding photo-Fries rearrangement products with 32 and 38% conversions, respectively, under the same irradiation conditions. The photolysis of those compounds also occurred with similar conversions in the epoxy resin and in the polyurethane oligomer under UV irradiation; and the thermal curing reactions of the epoxy resin and the polyurethane oligomer with photogenerated polyfunctional amines proceeded smoothly after heating at 140°C for 2 hrs. © 1993 John Wiley & Sons, Inc.     

Synthesis and curing of liquid crystalline epoxy resin based on naphthalene mesogen

Aromatic liquid crystalline epoxy resin (LCE) based on naphthalene mesogen was synthesized and cured with aromatic diamines to prepare heat‐resistant LCE networks. Diaminodiphenylester (DDE) and diaminodiphenylsulfone (DDS) were used as curing agents. The curing reaction and liquid crystalline phase of LCE were monitored, and mechanical and thermal properties of cured LCE network were also investigated. Curing and postcuring peaks were observed in dynamic DSC thermogram. LCE network cured with DDE displayed liquid crystalline phase in the curing temperature range between 183 and 260°C, while that cured with DDS formed one between 182 and 230°C. Glass transition temperature of cured LCE network was above 240°C, and crosslinked network was thermally stable up to 330°C. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 419–425, 1999     

Preparation of phosphorus-containing cyanate resin with low curing temperature while excellent flame resistance and dielectric properties

A novel cyanate resin was prepared by the reaction of 10-(2,5-Dihydroxyphenyl)-10-H-9-oxa-10-phospha-phenantbrene-10-oxide (DOPO-HQ) and 2, 2-Bis (4-cyanatophenyl) propane (BACY) when trace of cobalt(III) acetylacetonate(CoAt(III)) was added, The curing behavior during the reaction of DOPO-HQ/BACY/CoAt(III) system was analyzed by gelation time (GT), differential scanning calorimetry (DSC) and Fourier transformation infrared spectrometry (FTIR), respectively. Compared with the BACY/CoAt(III) system (GT = 1239?s, T_p (exothermic peak temperature) = 215?°C), the GT of DOPO-HQ/BACY/CoAt(III) system is 110?s at 180?°C, and the T_p is 154?°C when containing 10?wt % DOPO-HQ. The limit oxygen index (LOI) and vertical burning test (UL-94) demonstrate that the flame retardancy of BACY resin is improved by DOPO-HQ. Specifically, the DOPO-HQ/BACY resin prepared by a mass ratio of DOPO-HQ: BACY = 10:90 has a LOI value of 33.1% and a UL-94 of V-0 rating, while the LOI value of BACY resin is 28.5% and UL-94 is no rating. In addition, the DOPO-HQ/BACY resin containing 10?wt % DOPO-HQ has excellent dielectric properties, the dielectric constant (D_k) is 2.69 and dielectric loss (D_f) is 0.007. The as-synthesized DOPO-HQ/BACY resin shows promising application prospect as electronic packaging materials.