含刚性链节和脲端基聚醚增韧剂改性环氧树脂的研究———反应活性及力学性能

合成了一系列既含环氧丙烷聚醚（ＰＰＧ）柔性间隔基、又含刚性介晶结构单元的端脲基活性改性剂（ＬＣＥＵＰＰＧ），并对其改性环氧树脂Ｅ ５１／双氰双胺（Ｅ ５１／ｄｉｃｙ）体系的固化反应活性、改性剂含量对增韧体系动态力学性能及冲击性能的影响进行了研究．结果表明：ＬＣＥＵＰＰＧ的加入对固化体系具有明显的增韧作用，冲击强度提高了３～７倍；其对Ｅ ５１／ｄｉｃｙ固化反应具有明显的促进作用，可使固化反应表观活化能（Ｅａ）降低５０～７０ＫＪ／ｍｏｌ、固化温度降低３０～４０℃；体系的玻璃化转变温度（Ｔｇ）略有下降，但模量基本不降低或略有升高；β 转变向低温方向移动．     

氰酸酯树脂改性热固性丁苯树脂的固化及其动力学

利用傅里叶变换红外光谱法(FT-IR)和差示扫描量热法(DSC)研究了氰酸酯树脂改性热固性丁苯树脂的固化反应特性及其动力学.以温度-升温速率外推法计算得到固化反应起始温度(Ti0)、峰顶温度(Tp0)和终止温度(Tf0)分别为414.2、444.5、460.6 K,对改性树脂的固化过程进行优化.采用Freeman-Ca...     

Preparation and characterization of bismaleimide/1,3-dicyanatobenzene modified epoxy intercrosslinked matrices

An intercrosslinked network of cyanate ester (CE)-bismaleimide (BMI) modified epoxy matrix system was made by using epoxy resin, 1,3-dicyanatobenzene and bismaleimide (N,N^′-bismaleimido-4,4^′-diphenyl methane) with diaminodiphenylmethane as curing agent. BMI-CE-epoxy matrices were characterised using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and heat deflection temperature (HDT) analysis. The matrices, in the form of castings, were characterised for their mechanical properties such as tensile strength, flexural strength and unnotched Izod impact test as per ASTM methods. Mechanical studies indicated that the introduction of cyanate ester into epoxy resin improves the toughness and flexural strength with reduction in tensile strength and glass transition temperature, whereas the incorporation of bismaleimide into epoxy resin influences the mechanical and thermal properties according to its percentage content. DSC thermograms of cyanate ester as well as BMI modified epoxy resin show an unimodal reaction exotherm. Electrical properties were studied as per ASTM method and the morphology of the BMI modified epoxy and CE-epoxy systems were studied by scanning electron microscope.     

液体氯丁二烯-甲基丙烯酸羟乙酯共聚物改性环氧树脂——N,N-二甲基苄胺固化体系

本工作制备了一系列以N,N-二甲基苄胺为固化剂的液体氯丁二烯-甲基丙烯酸羟乙酯共聚物改性环氧树脂固化物。研究了液体共聚物用量和固化条件对改性体系物理性能的影响。用红外光谱法和固化仪方法,测定了固化反应速度,讨论了固化反应机理。用扫描电镜的方法,观察了液体共聚物用量和固化条件对改性体系形态结构的影响。     

PREPARATION AND PROPERTIES OF EPOXY RESIN MODIFIED BY LIQUID CHLOROPRENE-HYDROXYETHYLMETHACRYLATE COPOLYMER

The epoxy resin modified by liquid chloroprene-hydroxyethylmethacrylate copolymer (CP-HEMA) is a new kind of structural adhesives with good mechanical properties. By changing its mole-cular structure, it may also have such desirable properties as retardation of combustion, enduringweather aging, inert oils and chemicals. A series of the thermosets of the epoxy resin modifiedby CP-HEMA used as a toughener were prepared. The effects of CP-HEMA content, catalyst con-tent and curing temperature on the mechanical properties of modified epoxy resin system were studied.The thermal weight-loss curves were examined. The two-phase morphology was observed and dis-cussed.     

Thermal study of phenol–formaldehyde resin modified with cashew nut shell liquid

In this study, an experimental phenol–formaldehyde resin with 20% phenol replacement by cashew nut shell liquid (CNSL) was studied and compared with a conventional phenol–formaldehyde resin synthesized totally from petrochemical raw materials. The resins were characterized with standard lab analysis for their physicochemical specifications, while their thermal properties were studied with thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC). For comparison reasons pure CNSL and wood were also included in the TGA study. A DSC study conducted both for the neat resins and the system wood–resin as to examine the effect of wood on the curing performance of the resins in the real time conditions of their usage at the wood-based panels industry.The adhesion strength of these resins was investigated by their application in plywood production. The plywood panels were tested for their shear strength and wood failure performance while their free formaldehyde emissions were determined with the desiccator method. It was proved that although the neat CNSL modified PF resin (PCF) cures at longer time and higher temperature than a conventional PF resin, wood affects it more significantly, resulting in the evening of their curing performance. This is a novel finding that manifests the possibility of replacing a convention PF resin by a CNSL modified one in the plywood production, without changing any of their production conditions and with improvement to their overall properties.     

Rheological study on structural transition in polyethersulfone‐modified bismaleimide resin during isothermal curing

The structural transition in the polyethersulfone (PES)‐modified bismaleimide resin, 4,4′‐bismaleimidodiphenylmethane (BDM), during isothermal curing was studied by using rheological technique, different scanning calorimetry (DSC), and time resolved light scattering (TRLS). Comparing with the cure of neat bismaleimide, two separate tan δ crossover points were observed because of the phase separation during curing the blends of PES/BDM. These two structural transitions stemmed from the fixing of phase structure of the system and the chemical crosslinking of bismaleimide, respectively. The effect of curing temperature and the PES content on structural transition was discussed and found that the occurrence of two structural transition exhibited the different dependency of curing temperature and PES content. The relaxation exponent n and gel strength S were also found to be temperature‐dependent and composition‐dependent. Moreover, the relaxation exponent n of the second structural transition is much lower than that of the first structural transition in the PES/bismaleimide blends. © 2006 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 3102–3108, 2006     

Studies on thermal, mechanical and morphological behaviour of caprolactam blocked methylenediphenyl diisocyanate toughened bismaleimide modified epoxy matrices

Diglycidyl ether of bisphenol A epoxy resin (DGEBA, LY 556) was toughened with 5%, 10% and 15% (by wt) of caprolactam blocked methylenediphenyl diisocyanate (CMDI) using 4,4′-diaminodiphenylmethane (DDM) as curing agent. The toughened epoxy resin was further modified with chemical modifier N,N′-bismaleimido-4,4′-diphenylmethane (BMI). Caprolactam blocked methylenediphenyl diisocyanate was synthesized by the reaction of caprolactam with methylenediphenyl diisocyanate in presence of carbon tetrachloride under nitrogen atmosphere. Thermal properties of the developed matrices were characterized by means of differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), heat distortion temperature (HDT) and dynamic mechanical analysis (DMA). Mechanical properties like tensile strength, flexural strength and impact strength were tested as per ASTM standards. The glass transition temperature (T_g) and thermal stability were decreased with increase in the percentage incorporation of CMDI. The thermomechanical properties of caprolactam blocked methylenediphenyl diisocyanate toughened epoxy resin were increased by increasing the percentage incorporation of bismaleimide. The values of impact strength for epoxy resin were increased with increase in the percentage concentration of CMDI. The homogeneous morphology of CMDI toughened epoxy resin and bismaleimide modified CMDI toughened epoxy resin system were ascertained from scanning electron microscope (SEM).     

Study on affecting factors of curing rate in ultraviolet curing adhesives containing modified acrylic ester prepolymers

Abstract

Ultraviolet (UV) curing adhesives have been extensively utilized in fields of health care and electronic components due to low energy consumption and solvent pollution. The most used system is modified acrylic ester system whose merits are low cost, high reliability and tensile strength. However, higher UV curing rate is still pursued especially in field of quick dry adhesives as well as influencing factors of curing rate are very complex. For clarifying affecting factors of curing rate as well as achieving higher curing rate, in this work, several UV curing adhesives with acrylic photosensitive resin prepolymers modified by epoxy and polyurethane were prepared. The impacts of class and content of radical photo-initiators, prepolymers and reactive diluents on UV curing rate were deeply researched. Moreover, the influence of oxygen polymerization inhibition on curing rate was discussed as well. The significantly elevated curing rates were obtained in as-prepared adhesives, in comparison with commercial ones. This work might offer a facile and effective strategy to obtain the promising high-performance modified acrylic ester prepolymer bearing UV curing adhesives with a significantly elevated high curing rate by well controlling these investigated affecting factors.     

含聚醚间隔链的扩链脲改性环氧树脂/双氰双胺固化体系性能研究

合成了一系列含不同分子量聚环氧丙烷 (PPG)柔性间隔链的扩链脲 ,系统考察了扩链脲改性环氧树脂E 5 1/双氰双胺 (dicy)固化体系的固化反应活性、动态力学行为、冲击性能和断裂面形态结构 ,并对体系的冲击性能、形态结构与动态力学行为之间的关系进行了探讨 .结果表明 ,改性体系固化反应活性明显提高 ,固化反应表观活化能降低 ,固化反应峰顶温度从 190℃降低至 14 0℃ ,固化反应的表观活化能由 14 5 5kJ/mol降至 70～ 80kJ mol;改性体系冲击强度明显提高 ,其中所含PPG柔性链分子量为 10 0 0的扩链脲改性的E 5 1/dicy体系冲击强度较未改性的E 5 1/dicy体系提高了 8倍 ,其冲击试样断裂面的形态具有明显的韧性断裂特征 ,微观两相网络结构的存在导致了改性体系冲击强度显著提高     

含介晶单元的反应性增韧剂改性环氧树脂研究

合成了既含聚乙二醇醚(PEG)柔性链、又含刚性液晶结构单元的活性增韧促进剂(LCEU_PEG),对其促进环氧树脂/双氰双胺体系的固化反应活性、反应机制;增韧剂的用量与动态力学性能、冲击性能之间的关系进行了研究.结果表明:LCEU_PEG对E-51/dicy固化体系具有明显的促进作用,能有效的降低固化反应活化能及固化反应温度;改性体系的冲击强度较单纯的E-51/dicy体系提高3～7倍;模量较未增韧体系有所提高.     

含介晶结构单元的反应性增韧剂改性环氧树脂研究──Ⅱ.材料断裂面形态结构的研究

该文合成了一种既含聚醚柔性链又含介晶结构单元的环氧树脂改性剂LCEU（PEG），用其改性环氧树脂／双氰双胺（E－51／dicy）固化体系，对改性体系的动态力学行为和冲击性能作了研究，用扫描电子显微镜（SEM）对试样断裂面的形态结构进行了观察，并探讨了体系的形态结构与动态力学行为、冲击性能之间的关系。结果表明改性体系断裂时产生大量应力条纹，断裂面呈微观两相网络结构，为韧性断裂。     

Benzoxazine modified diglycidyl ether of bisphenol-a/silicon/siliconized epoxy hybrid polymer matrices: Mechanical,thermal, electrical and morphological properties

Benzoxazines modified epoxy hybrid polymer matrices were developed using benzoxazines (CB_DDM and BMPB_DDM) and epoxy resins (DGEBA, SE and EP-HTPDMS) to make them suitable for high performance applications. The benzoxazine-epoxy hybrid polymer matrices were prepared via in-situ polymerization and were investigated for their thermal, thermo-mechanical, mechanical, electrical and morphological properties. Two types of skeletal modified benzoxazines namely 1,1-bis(3-methyl-4-hydroxyphenyl)cyclohexane benzoxazine (CB_DDM) and bis(4-maleimidophenyl) benzoxazine (BMPB_DDM) were synthesized by reacting paraformaldehyde and 4,4′-diaminodiphenylmethane with 1,1-bis (3-methyl-4-hydroxyphenyl)cyclohexane and N-(4-hydroxyphenyl)maleimide respectively. Epoxy resins viz., diglycidyl ether of bisphenol-A (DGEBA), silicon incorporated epoxy (SE) and siliconized epoxy resin (EP-HTPDMS) were modified with 5, 10 and 15 wt% of benzoxazines using 4,4′-diaminodiphenylmethane as a curing agent at appropriate conditions. The chemical reaction of benzoxazines with the epoxy resin was carried out thermally and the resulting product was analyzed by FT-IR spectra. The glass transition temperature, curing behavior, thermal stability, char yield and flame resistance of the hybrid polymers were analysed by means of DSC, TGA and DMA. Mechanical properties were studied as per ASTM standards. The benzoxazines modified epoxy resin systems exhibited lower values of dielectric constant and dielectric loss with an enhanced values of of arc resistance, glass transition temperatures, degradation temperatures, thermal stability, char yield, storage modulus, tensile strength, flexural strength and impact strength.     

Chemorheology and Curing Kinetics of a New RTM Benzoxazine Resin

The chemorheology and curing kinetics of a new high performance resin transfer molding benzoxazine resin was investigated. A chemorheological model based on a modified Arrhenius equation that describes the resin viscosity as a function of temperature and time was proposed. The model, which agreed well with the experimental data, can provide theoretical support for the mold-filling stage in the resin transfer molding process. The average activation energies of the polymerization reaction were obtained by means of gelation times at different temperatures based on the Arrhenius equation and from dynamic differential scanning calorimetry (DSC) results based on the Kissinger and Ozawa methods; the values were 96.0,84.0 and 87.8 KJ/mol, respectively. A plot of activation energy vs. conversion in the curing process was obtained using the Flynn-Wall-Ozawa model. The reaction orders were estimated from isothermal DSC based on a modified Kamal kinetics model which can describe both the autocatalytic and diffusion-controlled curing mechanism.     

低聚端羟基聚硅氧烷接枝增韧酚醛树脂的制备及性能

由低聚羟基封端聚硅氧烷（HO-PDM）与甲醛和苯酚的接枝反应制备了增韧改性酚醛树脂,用FT-IR对改性酚醛树脂的结构进行表征,用电子万能试验机测试了改性前后酚醛树脂的力学性能,用热重分析仪测试改性酚醛树脂的热稳定性。 测得改性酚醛树脂的断裂伸长率、冲击强度、抗拉强度分别为2.8%、2.875 kJ/m2和23.2 MPa;树脂失重20%的温度为431.28 ℃,峰值温度为441.8 ℃,800 ℃的残重率为51.02%。     

Morphology, flexural, and thermal properties of sepiolite modified epoxy resins with different curing agents

A bisphenol A-based epoxy resin was modified with 5 wt% organically modified sepiolite (Pangel B40) and thermally cured using two different curing agents: an aliphatic diamine (Jeffamine D230, D230) and a cycloaliphatic diamine (3DCM). The morphology of the cured materials was established by scanning and transmission electron microscopy analysis. The thermal stability, thermo-mechanical properties, and flexural behaviour of the sepiolite-modified matrices were evaluated and compared with the corresponding neat matrix. The initial thermal decomposition temperature did not change with the addition of sepiolite. The flexural modulus of the epoxy matrix slightly increases by the incorporation of the organophilic sepiolite. The flexural strength of the sepiolite modified resin cured with D230 increased by a 10% while the sepiolite modified resin cured with 3DCM resulted in a lower flexural strength compared with the unmodified resin. The reduced flexural strength was attributed to the stress concentrations caused by the sepiolite modifier, which rendered the resins more brittle.     

Novel toughened cyanate ester resin with good dielectric properties and thermal stability by copolymerizing with hyperbranched polysiloxane and epoxy resin

A novel toughened cyanate ester (CE) resin with good dielectric properties and thermal stability was developed by copolymerizing 2,2′‐bis(4‐cyanatophenyl)iso‐propylidene (BCE) with a combined modifier (HBPSiEP) made up of hyperbranched polysiloxane (HBPSi) and epoxy (EP) resin. HBPSi was synthesized through the hydrolysis of 3‐(trimethoxysilyl)propyl methacrylate. The effect of differing stoichiometries of HBPSiEP on the curing characteristics and performance of BCE resin is discussed. Results show that the incorporation of HBPSiEP can not only effectively promote the curing reaction of BCE, but can also significantly improve the toughness of the cured BCE resin. In addition, the toughening effect of HBPSiEP is greater than single EP resin. For example, the impact strength of modified BCE resin with 30 wt% of HBPSiEP is 23.3 KJ/m², which is more than 2.5 times of that of pure BCE resin, while the maximum impact strength of EP/BCE resin is about 2 times of pure BCE resin. It is worthy to note that HBPSiEP/BCE resins also exhibit improved thermal stability, dielectric properties, and flame retardancy, suggesting that the novel toughened CE resins have great potentiality to be used as a matrix for advanced functional composites or electronic packing resins. Copyright © 2009 John Wiley & Sons, Ltd.     

Curing kinetics of bio-based epoxy resin-toughened DGEBA epoxy resin blend

In the present study, TEIA bioresin was blended with the diglycidyl ether bisphenol A (DGEBA) epoxy resin in different ratios (i.e. 10, 20, 30, 40 mass%), cured with methylhexahydrophthalic anhydride curing agent in the presence of 2-methylimidazole catalyst. The optimized composition of DGEBA and TEIA bioresin blends system was employed as an adhesive strength. The adhesive strength of the TEIA-modified DGEBA epoxy resin blend system was increased from 4.14 to 6.31 MPa on an aluminium substrate compared to the DGEBA epoxy resin. The curing kinetics of non-isothermal, DGEBA epoxy resin and its bio-based blend systems were investigated employing differential scanning calorimetry. An increase in the peak temperature and reduction in a heat of curing as well as activation energy in DGEBA epoxy resin were observed with the addition of TEIA bioresin content. The activation energy (E_a) of the DGEBA resin and their bio-based blend system were obtained from Kissinger and Flynn–Wall–Ozawa methods.

     

LIQUID CHLOROPRENE-HYDROXYETHYL METHACRYLATE COPOLYMER MODIFIED EPOXY RESIN Ⅱ. N, N-DIMETHYL BENZYL AMINE CURING SYSTEM

A series of liquid chloroprene-hydroxyethyl methacrylate copolymer (CP-HEMA) modifiedepoxy resin were prepared. The effects of CP-HEMA content, curing conditions on physical pro-perties of the modified system were examined. With IR and Viscoelastocuremeter, the curing reactionrate was determined and the mechanism of the curing reaction was discussed. The effects of CP-HEMA content and curing conditions on morphology were mainly observed by scanning electronmicroscopy.     

Effect of internal mold release agent on flexural and inter laminar shear properties of carbon and glass fabric reinforced thermoset composites

The study is focused on thermoset composites reinforced with carbon and glass woven fabrics. Two types of thermoset resins, for example, epoxy and vinyl ester were used as the matrix. Varying concentrations of internal mold releasing (IMR) agent was used in the resin. The composites were cured both at room temperature and at 80°C. The flexural properties were studied using 3‐point bending test method. Further theinter‐laminar shear strength (ILSS) was investigated using the short beam shear strength test based on 3‐point bending. The flexural modulus of room temperature cured epoxy resin is higher than that of high temperature cured epoxy resin and cured vinyl ester resin. The flexural modulus is lowest for 1% IMR sample in epoxy system and the modulus for 0% and 2% epoxy are not significantly different. Lowest flexural strength and modulus can be observed for the combination of reinforcement and curing conditions for samples containing 1% IMR for the epoxy systems. Carbon fiber is found to be less compatible with the vinyl ester resin system and the addition of IMR to the resin degraded the properties further. Inter‐laminar shear strength for epoxy‐based composites is not much affected by presence of IMR, but in case of vinyl ester based composites there is a decrease in ILSS on addition of IMR agent. The study explains variation in flexural properties on addition of IMR and change of curing conditions. These results can be used for ascertaining variation in mechanical properties in real use.