非晶铟镓锌氧薄膜晶体管钼/铜源漏电极的研究

针对非晶铟镓锌氧薄膜晶体管（a-IGZO TFT）的钼/铜源漏电极开展研究。实验证明,单层Mo源漏电极与栅绝缘层之间的粘附性好、表面粗糙度较小、电阻率较大,而单层Cu源漏电极与栅绝缘层之间的结合性差且Cu原子扩散问题严重、表面粗糙度较大、电阻率较小。为了实现优势互补,我们设计了双层Mo（20 nm）/Cu（80 nm）源漏电极,并采用优化工艺制备了包含该电极结构的a-IGZO TFT。器件具有良好的电学特性,场效应迁移率为 8.33 cm²·V^-1·s^-1, 阈值电压为6.0 V,亚阈值摆幅为2.0 V/dec,开关比为 1.3×10⁷,证明了双层Mo/Cu源漏电极的可行性和实用性。     

Al_2O_3薄层修饰SiN_x绝缘层的IGZO-TFTs器件的性能研究

采用原子层沉积工艺(ALD)生长均匀致密的三氧化二铝(Al2O3)薄层对氮化硅(Si Nx)绝缘层进行修饰,研究了铟镓锌氧薄膜晶体管(IGZO-TFTs)器件的性能。当Al2O3修饰层厚度为4 nm时,绝缘层-有源层界面的最大缺陷态密度相比于未修饰器件降低了17.2%,器件性能得到显著改善。场效应迁移率由1.19 cm2/(V·s)提高到7.11 cm2/(V·s),阈值电压由39.70 V降低到25.37 V,1 h正向偏压应力下的阈值电压漂移量由2.19 V减小到1.41 V。     

低电压有机薄膜晶体管驱动顶发射有机发光二极管的集成像素的研制

研究了有机薄膜晶体管(OTFT)驱动顶发射有机发光二极管(OLED)的集成制备技术。通过减小栅绝缘层的厚度,达到降低OTFT工作电压的目的。OLED采用标准的绿光器件,利用超薄的Al薄膜作为半透明阴极实现顶发射功能。实现了低电压工作的OTFT与顶发射OLED的集成,其中OTFT的阈值电压为2.0 V,饱和场效应迁移率为0.40 cm2·V-1·s-1。基于实验数据,对集成像素的电特性进行了计算分析,在-5~-10 V的栅电压调控下,像素亮度能在50~250 cd/m2的范围内实现线性灰度调控。     

溶胶凝胶法制备以Al_2O_3为界面修饰层的铪铟锌氧薄膜晶体管

利用溶液法制备了以HfSiOx为绝缘层、HfInZnO为有源层、Al_2O_3为界面修饰层的TFT器件。HfSiOx薄膜经Al_2O_3薄膜修饰后,薄膜表面粗糙度从0.24nm降低至0.16nm。Al2O3薄膜与HfSiOx薄膜之间的界面接触良好,以Al_2O_3为界面修饰层的TFT器件整体性能得到提升,具体表现为:栅极电压正向和反向扫描过程中产生的阈值电压漂移显著减小,器件的阈值电压和亚阈值摆幅降低,迁移率与开关比增大。研究证明,溶液法制备Al_2O_3薄膜适合作为改善器件性能的界面修饰层。     

非晶InGaZnO薄膜晶体管驱动OLED像素电路的仿真研究

为解决非晶InGaZnO薄膜晶体管(a-IGZO TFT)因其阈值电压漂移而导致的OLED电流衰减的问题,本文研究了基于a-IGZO TFT的有源矩阵有机发光显示(AMOLED)像素电路的阈值电压补偿问题。利用实验室制备的a-IGZO TFT器件进行参数提取后建立的SPICE仿真模型并进行仿真计算,对电压驱动型2T1C和4T1C的像素电路进行稳定性的比较研究,证明了4T1C电路对阈值漂移有非常好的补偿效果,并指出增加存储电容值和驱动TFT的宽长比可有效提高OLED电流的保持能力。     

低温透明非晶IGZO薄膜晶体管的光照稳定性

采用室温射频磁控溅射非晶铟镓锌氧化合物(a-IGZO), 在相对低的温度(<200 ℃)下成功制备底栅a-IGZO 薄膜晶体管器件, 其场效应迁移率10 cm^-2·V^-1·s^-1, 开关比大于10⁷, 亚阈值摆幅 SS为0.4 V/dec, 阈值电压为3.6 V. 栅电压正向和负向扫描未发现电滞现象. 白光发光二极管光照对器件的输出特性基本没有影响, 表明制备的器件可用于透明显示器件. 研究了器件的光照稳定性, 光照10000 s后器件阈值电压负向偏移约0.8 V, 这种漂移是由于界面电荷束缚所致. 关键词： 非晶铟镓锌氧化合物 薄膜晶体管 光照稳定性 电滞现象     

Ta_2O_5-PMMA复合栅绝缘层对OFETs性能的影响（英文）

选用五氧化二钽(Ta_2O_5)-聚甲基丙烯酸甲酯(PMMA)复合材料作为栅绝缘层制备了并五苯有机场效应晶体管(OFETs)。通过在Ta_2O_5表面旋涂一层PMMA可以降低栅绝缘层的表面粗糙度,增大其场效应晶体管的迁移率。研究了厚度在20~60 nm范围内的PMMA对复合绝缘层表面形貌、粗糙度以及器件电学性能的影响。结果表明,当PMMA厚度为40 nm时,器件的电学性能最佳。与单一的Ta_2O_5栅绝缘层器件相比,其场效迁移率由4.2×10~(-2)cm~2/(V·s)提高到0.31 cm~2/(V·s);栅电压增加到-20 V时,开关电流比由2.9×10~2增大到2.9×10~5。     

基于a-IGZO TFT的AMOLED像素电路稳定性的仿真研究

非晶铟镓锌氧化物薄膜晶体管(a-IGZO TFT)有望在有源矩阵有机发光显示(AMOLED)像素电路中得到实际应用,但其电压偏置效应仍会引起电路特性的不稳定。本文利用实验室制备的a-IGZO TFT器件进行参数提取并建立了SPICE仿真模型,通过拟合得到了它的阈值电压随时间变化的方程。在此基础上,采用SPICE软件对基于a-IGZO TFT的2T1C和3T1C两种AMOLED像素电路的稳定性进行了比较研究,证明3T1C电路对阈值电压偏移确实存在一定的补偿效果。最后讨论了进一步改善AMOLED像素电路稳定特性的方法和实际效果。     

氧化锌锡薄膜晶体管的研究

在ITO玻璃基底上用射频磁控溅射技术生长氧化锌锡(ZnSnO)沟道有源层、用PECVD生长SiO₂薄膜作为薄膜晶体管的栅绝缘层研制了薄膜晶体管(TFT), 器件的场效应迁移率最高达到μ_n=9.1 cm²/(V ·s),阈值电压-2 V,电流开关比为10⁴. 关键词： 氧化锌锡 薄膜晶体管 场效应迁移率     

具有高阈值电压和大栅压摆幅的常关型槽栅AlGaN/GaN金属氧化物半导体高电子迁移率晶体管（英文）

介绍了一种具有高阈值电压和大栅压摆幅的常关型槽栅AlGaN/GaN金属氧化物半导体高电子迁移率晶体管。采用原子层淀积(ALD)方法实现Al_2O_3栅介质的沉积。槽栅常关型AlGaN/GaN MOS-HEMT的栅长(Lg)为2μm,栅宽(Wg)为0.9 mm(0.45 mm×2),栅极和源极(Lgs)之间的距离为5μm,栅极和漏极(Lgd)之间的距离为10μm。在栅压为-20 V时,槽栅常关型AlGaN/GaN MOS-HEMT的栅漏电仅为0.65 nA。在栅压为+12 V时,槽栅常关型AlGaN/GaN MOS-HEMT的栅漏电为225 nA。器件的栅压摆幅为-20~+12V。在栅压V_(gs)=+10 V时,槽栅常关型AlGaN/GaN MOS-HEMT电流和饱和电流密度分别达到了98 mA和108 mA/mm(Wg=0.9 mm),特征导通电阻为4 mΩ·cm2。槽栅常关型AlGaN/GaN MOS-HEMT的阈值电压为+4.6 V,开启与关断电流比达到了5×108。当V_(ds)=7 V时,器件的峰值跨导为42 mS/mm(Wg=0.9 mm,V_(gs)=+10 V)。在V_(gs)=0 V时,栅漏间距为10μm的槽栅常关型AlGaN/GaN MOS-HEMT的关断击穿电压为450 V,关断泄露电流为0.025 mA/mm。     

氧对IZO低压无结薄膜晶体管稳定性的影响

本文在室温下制备了无结结构的低压氧化铟锌薄膜晶体管, 并研究了氧分压对其稳定性的影响. 氧化铟锌无结薄膜晶体管具有迁移率高、结构新颖等优点, 然而氧化物沟道层易受氧、水分子等影响, 造成稳定性下降. 在室温下, 本文通过改变高纯氧流量制备氧化铟锌透明导电薄膜作为沟道层、源漏电极, 分析了氧压对于氧化物无结薄膜晶体管稳定性的影响. 为使晶体管在低电压(<2 V)下工作, 达到低压驱动效果, 本文采用具有双电层效应和栅电容大的二氧化硅纳米颗粒膜作为栅介质; 通过电学性能测试, 制备的晶体管工作电压仅为1 V、 开关电流比大于10⁶、亚阈值斜率小于100 mV/decade以及场效 应迁移率大于20 cm²/V·s. 实验研究表明, 通氧制备的氧化铟锌薄膜的电阻率会上升, 导致晶体管的阈值电压向正向漂移, 最终使晶体管的工作模式由耗尽型转变为增强型. 关键词： 薄膜晶体管 无结 氧化铟锌 氧分子     

Room temperature fabrication Oxide TFT with Y2O3 as a gate oxide and Mo contact

In this investigation, an operating voltage as low as 5 V has been achieved for Oxide TFT with Y₂O₃ as a gate oxide and a-IGZO as an active layer. The OTFT has been fabricated at room temperature using RF sputter. The mobility and threshold voltages are 11.3 cm²/V s and 3.4 V for the device with W/L = 0.8, respectively. The annealing at 400 °C in N₂ containing 5% H₂ ambient has been utilized to improve the electrical performance of TFT. The on-off current which is determined by gate dielectric has been observed to be 10⁴. It has also been observed that the dielectric properties of gate oxide deteriorate on annealing. The dielectric constant of Y₂O₃ is observed in the range between 5.1 and 5.4 measured on various devices.     

射频磁控溅射低温制备非晶铟镓锌氧薄膜晶体管

利用射频磁控溅射技术室温制备了铟镓锌氧(IGZO)薄膜,采用X射线衍射(XRD)表征薄膜的晶体结构,原子力显微镜(AFM)观察其表面形貌,分光光度计测量其透光率。结果表明:室温制备的IGZO薄膜为非晶态且薄膜表面均匀平整,可见光透射率大于80%。将室温制备的IGZO薄膜作为有源层,在低温(<200℃)条件下成功地制备了铟镓锌氧薄膜晶体管(a-IGZO TFT),获得的a-IGZO-TFT器件的场效应迁移率大于6.0 cm2.V-1.s-1,开关比约为107,阈值电压为1.2 V,亚阈值摆幅(S)约为0.9 V/dec,偏压应力测试a-IGZO TFT阈值电压随时间向右漂移。     

铟镓锌氧薄膜晶体管的悬浮栅效应研究

为了避免光照对铟镓锌氧薄膜晶体管(InGaZnO thin film transistors,IGZO TFTs)电学特性的影响,IGZO TFT要增加遮光金属层.本文研究了遮光金属栅极悬浮时,IGZO TFT的输出特性.采用器件数值计算工具TCAD(technology computer-aided design)分析了IGZO层与栅介质层界面处电势分布,证实了悬浮栅(floating gate,FG)IGZO TFT输出曲线的不饱和现象是由悬浮栅与TFT漏端的电容耦合造成.基于等效电容的电压分配方法,提出了悬浮栅IGZO TFT电流的一阶模型.TCAD数值分析及一阶物理模型结果与测试具有较高程度的符合,较完整地解释了悬浮栅IGZO TFT的电学特性.     

Migration of weakly bonded oxygen atoms in a-IGZO thin films and the positive shift of threshold voltage in TFTs

Amorphous indium-gallium-zinc oxide (a-IGZO) thin films are prepared by pulsed laser deposition and fabricated into thin-film transistor (TFT) devices. In-situ x-ray photoelectron spectroscopy (XPS) illustrates that weakly bonded oxygen (O) atoms exist in a-IGZO thin films deposited at high O₂ pressures, but these can be eliminated by vacuum annealing. The threshold voltage (V_th) of the a-IGZO TFTs is shifted under positive gate bias, and the V_th shift is positively related to the deposition pressure. A temperature variation experiment in the range of 20 K-300 K demonstrates that an activation energy of 144 meV is required for the V_th shift, which is close to the activation energy required for the migration of weakly bonded O atoms in a-IGZO thin films. Accordingly, the V_th shift is attributed to the acceptor-like states induced by the accumulation of weakly bonded O atoms at the a-IGZO/SiO₂ interface under positive gate bias. These results provide an insight into the mechanism responsible for the V_th shift of the a-IGZO TFTs and help in the production of reliable designs.     

薄膜热处理对ZnO薄膜晶体管性能的提高

制备了两种以SiO2为绝缘层的底栅ZnO薄膜晶体管,分别以未退火和退火处理的ZnO薄膜作为有源层.与未退火处理的ZnO薄膜晶体管相比,退火处理的ZnO薄膜晶体管的饱和迁移率由2.3 cm2/(V·s)增大至3.12 cm2/(V·s),阈值电压由20.8V减小至9.9V,亚阈值摆幅由2.6 V/dec减小至1.9 V/...     

室温下溅射法制备高迁移率氧化锌薄膜晶体管

为降低氧化锌薄膜晶体管(ZnO TFT)的工作电压,提高迁移率,采用磁控溅射法在氧化铟锡(ITO)导电玻璃基底上室温下依次沉积NbLaO栅介质层和ZnO半导体有源层,制备出ZnO TFT,对器件的电特性进行了表征。该ZnO TFT呈现出优异的器件性能:当栅电压为5 V、漏源电压为10 V时,器件的饱和漏电流高达2.2 m A;有效场效应饱和迁移率高达107 cm~2/(V·s),是目前所报道的室温下溅射法制备ZnO TFT的最高值,亚阈值摆幅为0.28 V/decade,开关电流比大于107。利用原子力显微镜(AFM)对NbLaO和ZnO薄膜的表面形貌进行了分析,分析了器件的低频噪声特性,对器件呈现高迁移率、低亚阈值摆幅以及迟滞现象的机理进行了讨论。     

High‐mobility flexible thin‐film transistors with a low‐temperature zirconium‐doped indium oxide channel layer

Thin film transistors (TFTs) with zirconium‐doped indium oxide (ZrInO) channel layer were successfully fabricated on a flexible PEN substrate with process temperature of only 150 °C. The flexible ZrInO TFT exhibited excellent electrical performance with a saturation mobility of as high as 22.6 cm² V^–1 s^–1, a sub‐threshold swing of 0.39 V/decade and an on/off current ratio of 2.5 × 10⁷. The threshold voltage shifts were 1.89 V and ?1.56 V for the unpassivated flexible ZrInO TFT under positive and negative gate bias stress, respectively. In addition, the flexible ZrInO TFT was able to maintain the relatively stable performance at bending curvatures larger than 20 mm, but the off current increased apparently after bent at 10 mm. Detailed studies showed that Zr had an effect of suppress the free carrier generation without seriously distorting the In₂O₃ lattice. (© 2016 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Influence of white light illumination on the performance of a-IGZO thin film transistor under positive gate-bias stress

The influence of white light illumination on the stability of an amorphous In GaZnO thin film transistor is investigated in this work. Under prolonged positive gate bias stress, the device illuminated by white light exhibits smaller positive threshold voltage shift than the device stressed under dark. There are simultaneous degradations of field-effect mobility for both stressed devices, which follows a similar trend to that of the threshold voltage shift. The reduced threshold voltage shift under illumination is explained by a competition between bias-induced interface carrier trapping effect and photon-induced carrier detrapping effect. It is further found that white light illumination could even excite and release trapped carriers originally exiting at the device interface before positive gate bias stress, so that the threshold voltage could recover to an even lower value than that in an equilibrium state. The effect of photo-excitation of oxygen vacancies within the a-IGZO film is also discussed.     

High performance IGZO/TiO2 thin film transistors using Y2O3 buffer layers on polycarbonate substrate

In this work, we fabricate IGZO TFT devices on flexible substrate at room temperature. The IGZO/TiO₂ TFT has small subthreshold swing of 0.16 V/dec, but suffers large gate leakage and negative threshold voltage. However, the TiO₂ TFT with Y₂O₃ buffer layers shows improved characteristics including a low threshold voltage of 0.55 V, a small sub-threshold swing of 0.175 V/decade and high field-effect mobility of 43 cm²/Vs. Such good performance can be attributed to the enhanced capacitance density and lowered gate leakage owing to the integration of large band gap Y₂O₃ and low-temperature higher-κ TiO₂.