Tunneling of X-ray photons through a thin film under total internal reflection conditions

Tunneling of 0.154-and 0.139-nm x-ray photons through a thin film under total internal reflection conditions has been experimentally demonstrated. The NiSi₂ film 13 nm thick is deposited by magnetron sputtering on a polished Si substrate. A beam with an angular spread of 20″ is directed to the Si/NiSi₂ interface from the inside through the lateral surface of a sample. A peak associated with tunneling of photons from Si to air through the NiSi₂ film is observed at grazing angles of θ₁ > 0.4θ_c, where θ_c is the critical angle of total internal reflection at the Si/NiSi₂ interface. The integral intensity of tunneling peaks that is measured for various θ₁ angles agrees with the calculations.     

Epitaxial growth of uniform NiSi2 layers with atomically flat silicide/Si interface by solid-phase reaction in Ni-P/Si(1 0 0) systems

As metal-oxide-semiconductor field-effect transistor (MOSFET) devices are shrunk to the nanometer scale, flat shallow metal/Si electrical contacts must be formed in the source/drain region. This work demonstrates a method for the formation of epitaxial NiSi₂ layers by a solid-phase reaction in Ni-P(8 nm)/Si(1 0 0) samples. The results show that the sheet resistance remained low when the samples were annealed at temperatures from 400 to 700 °C. P atoms can be regarded as diffusion barriers against the supply of Ni to the Si substrate, which caused the formation of Si-rich silicide (NiSi₂) at low temperature. Furthermore, elemental P formed a stable capping layer with O, Ni and Si during the annealing process. A uniform NiSi₂ layer with an atomically flat interface was formed by annealing at 700 °C because of the formation of a Si-Ni-P-O capping layer and a reduction in the total interface area.     

Effect of erbium interlayer on nickel silicide formation on Si(1 0 0)

To reveal the influence of erbium interlayer on the formation of nickel silicide and its contact properties on Si substrate, Er(0.5-3.0 nm) and Ni(20 nm) are successively deposited onto Si(1 0 0) substrate and are treated by rapid thermal annealing in pure N₂ ambient. The NiSi formation temperature is found to increase depending on the Er interlayer thickness. The formation temperature of NiSi₂ (700 °C) is not influenced by Er addition. But with 2 nm Er interlayer, the formed NiSi₂ is observed textured with preferred orientation of (1 0 0). During the formation of NiSi, Er segregates to the surface and little Er remains at the NiSi/Si(1 0 0) interface. Therefore, the Schottky barrier height of the formed NiSi/n-Si(1 0 0) contact is measured to be 0.635 ∼ 0.665 eV which is nearly invariable with different Er addition.     

Oxidation behaviour of nickel silicides investigated by AES and XPS

The oxygen interaction with Ni silicide surfaces in a wide range of composition, from NiSi₂ to Ni₃Si, has been investigated at room temperature by AES and XPS techniques. It has been found that the Si oxidation is enhanced over that of pure Si in all the Ni-Si compounds, and that the strongest oxidation occurs in Ni richer silicides. In general, oxygen bonds with Si leaving the metal unoxidized, but in Ni₃Si evidence for the occurrence of Ni oxidation has been found at high exposures.     

Formation of high-conductivity NiSi2 layers on Si at zero-mismatch temperature by high-current Ni-ion implantation

2 and Si lattices at 380 °C, which was defined as zero-mismatch temperature. The implantation was conducted with a metal vapor vacuum arc (MEVVA) ion implanter at an extraction voltage of 45 kV. Based on a thermal conduction estimation, a temperature rise of 380 °C required the Ni-ion current density to be 35 μA/cm². For the Si(111) wafers, the high conducting NiSi₂ layers were indeed directly formed after Ni-ion implantation with this specific current density to a normal dose of 2×10¹⁷ ions/cm² and the resistivity was as low as 9 μΩ cm. For the Si(111) wafers pre-covered with a 10-nm Ni overlayer, the resistivity of the NiSi₂ layers obtained under the same conditions decreased down to about 6 μΩ cm. The superior electrical property of the NiSi₂ was thought to be related to its formation temperature, i.e. at a zero-mismatch temperature of 380 °C, which resulted in minimizing the stress and stress-induced defects involved in its formation as well as cooling process. Received: 27 April 1998 / Accepted: 26 October 1998     

Ion beam modification of silicide-silicon interfaces

We have modified the contact interface between Pd₂Si and n-Si by ion implantation and investigated the effect of the implantation on Schottky barrier height and rate of silicide formation by electrical current-voltage measurements and Rutherford backscattering spectroscopy. Various ions, As. P, B. O and Si at 50 keV and up to a dose of 5 × 10¹⁴ ions/cm² were implanted into Si wafers before the Pd-deposition to form Pd₂Si. In the case of As and P, the implantation showed a large erect on the subsequent Pd₂Si formation; the formation is enhanced in the as-implanted samples, but it is retarded if an annealing at 600°C precedes the Pd-deposition. Silicide formation was found generally to help reduce the implantation damage (with or without the 600°C annealing) and showed improvements on the electrical characteristics of the contact interface. Consumption of the entire implanted region by silicide formation is found necessary for obtaining a good diode performance. In the case of As implantation, a lowering of the Schottky barrier height of Pd₂Si has been observed.     

High resolution studies of NiSi2 ultrathin film formation by ion scattering and cross-section tem

Ultrathin epitaxial NiSi₂ films (0–40 Å) have been grown on Si(111) surfaces. Medium energy ion shadowing and blocking has been used to determine the orientation, morphology and interfacial order of these films. For the whole coverage range studied ((0–1) × 10¹⁶ Ni $\text{atoms}\text{cm}{}^2$) the films are found to be rotated 180° about the surface normal with respect to the Si(111) substrate. Using the high depth resolution of the technique the annealed films are shown to consist initially of islands, which coalesce into continuous films for coverages above ≈ 5 × 10¹⁵ Ni $\text{atoms}\text{cm}{}^2$. High resolution cross-section transmission electron microscopy shows the NiSi₂Si interface to be atomically abrupt. This interface has been probed directly using the ion channeling technique, and the number of disordered Ni atoms at the interface is found to be less than 7.5 × 10¹³$\text{atoms}\text{cm}{}^2$.     

Silicidation in Ni/Si thin film system investigated by X-ray diffraction and Auger electron spectroscopy

Silicide formation induced by thermal annealing in Ni/Si thin film system has been investigated using glancing incidence X-ray diffraction (GIXRD) and Auger electron spectroscopy (AES). Silicide formation takes place at 870 K with Ni₂Si, NiSi and NiSi₂ phases co-existing with Ni. Complete conversion of intermediate silicide phases to the final NiSi₂ phase takes place at 1170 K. Atomic force microscopy measurements have revealed the coalescence of pillar-like structures to ridge-like structures upon silicidation. A comparison of the experimental results in terms of the evolution of various silicide phases is presented.     

Growth of size-tunable periodic Ni silicide nanodot arrays on silicon substrates

The fabrications of size-tunable periodic arrays of nickel metal and silicide nanodots on (0 0 1)Si substrates using polystyrene (PS) nanosphere lithography (NSL) and heat treatments have been investigated. The growth of epitaxial NiSi₂ was found to be more favorable for the Ni metal nanodot arrays. The effect becomes more pronounced with a decrease in the size of the Ni nanodots. The sizes of the epitaxial NiSi₂ nanodots were tuned from 38 to 110 nm by varying the diameter of the PS spheres and heat treatment conditions. These epitaxial NiSi₂ nanodots formed on (0 0 1)Si were found to be heavily faceted and the faceted structures were more prone to form at higher temperatures. Based on TEM, HRTEM and SAED analysis, the faceted NiSi₂ nanodots were identified to be inverse pyramids in shape. Compared with the NiSi₂ nanodot arrays formed using single-layer PS sphere masks, the epitaxial NiSi₂ nanodot arrays formed from the double-layer PS sphere templates exhibit larger interparticle spacings and smaller particle sizes. Since the nanoparticle sizes, shapes and interparticle spacings can be adjusted by tuning the diameter of the PS spheres, stacking conditions, and heat treatment conditions, the PS NSL technique promises to be an effective patterning method for growth of other nanostructures.     

Light-emitting Si nanostructures formed in silica layers by irradiation with swift heavy ions

Thin SiO₂ layers were implanted with 140 keV Si ions to a dose of 10¹⁷ cm⁻². The samples were irradiated with 130 Mev Xe ions in the dose range of 3×10¹²–10¹⁴ cm⁻², either directly after implantation or after pre-annealing to form the embedded Si nanocrystals. In the as-implanted layers HREM revealed after Xe irradiations the 3–4 nm-size dark spots, whose number and size grew with increase in Xe dose. A photoluminescence band at 660–680 nm was observed in the layers with the intensity dependent on the Xe dose. It was found that passivation with hydrogen quenched that band and promoted emission at ∼780 nm, typical of Si nanocrystals. In spectra of pre-annealed layers strong ∼780 nm peak was observed initially. Under Xe bombardment its intensity fell, with subsequent appearance and growth of 660–680 nm band. The obtained results are interpreted as the emission at ∼660–680 nm belonging to the imperfect Si nanocrystals. It is concluded that electronic losses of Xe ions are mainly responsible for formation of new Si nanostructures in ion tracks, whereas elastic losses mainly introduce radiation defects, which quench the luminescence. Changes in the spectra with growth of Xe ion dose are accounted for by the difference in the diameters of Xe ion tracks and their displacement cascades.     

TiSi2薄膜形成中扩散标记的研究

用Xe离子注入作扩散标记,确定了TiSi₂薄膜形成过程中主要扩散元素是Si。应用Kidson和Tu推导的方程根据试验结果计算了600℃退火TiSi₂形成中Si和Ti的扩散系数。 关键词：     

Investigation on the 773 K isothermal section of Dy–Ni–Si ternary phase diagram by X-ray powder diffraction

The 773 K isothermal section of the Dy–Ni–Si ternary system was investigated and constructed by X-ray powder diffraction in this paper. Eighteen ternary phases (DyNiSi, DyNi₂Si₂, DyNiSi₂, Dy₂Ni₃Si₅, DyNiSi₃, Dy₂NiSi₃, Dy₃Ni₆Si₂, DyNi₁₀Si₂, Dy₄NiSi₇, DyNi₂Si, DyNi₅Si₃, DyNi₄Si, Dy₃NiSi₂, DyNi₆Si₆, Dy₈Ni₃₁Si₁₁, Dy₃Ni₂Si₄, Dy₄Ni₅Si and Dy₉Ni₂Si₁₄) were confirmed to exist in this work. In those ternary phases, Dy₉Ni₂Si₁₄ is a new phase, Dy₂NiSi₃ and Dy₄NiSi₇ have solid solution phenomena and the solid solution ranges are Dy_33.3Ni_14.7–18.7Si_52–48 and Dy₄Ni_0.3–1.2Si_7.7–6.8, respectively. We constructed 14 two phase regions and 52 three phase regions in the Dy–Ni–Si ternary phase diagram at 773 K. Because the phase relation is not very clear between 66.7 and 50 Si at.% in the Dy–Si binary system, we use dot lines to estimate tentative phase regions in this region.     

Interfacial reaction barriers during thin-film solid-state reactions: The crystallographic origin of kinetic barriers at the NiS2/Si(111) interface

Epitaxial NiSi₂ islands have been grown on Si(111) substrates by the direct reaction of nickel vapour with the silicon substrate in ultra-high vacuum at 400° C. Growth kinetics was shown to depend on the orientation of the islands: A-oriented islands grow about ten times faster than B-oriented ones, with the ratio of the advance rates of the main growth fronts even reaching 30. Applying plan-view transmission electron microscopy and high-resolution electron microscopy of cross sections, a corresponding difference was found in the structure of the NiSi₂/Si(111) growth front: Steps at the B-oriented growth front were of three or six interplanar (111) spacings in height, whereas at the A-oriented growth front step-like defects of less than one interplanar (111) spacing in height were observed. These observations are explained by an atomic-scale model of the solid-state reaction, which involves the diffusion of nickel to the interfaces and the nucleation and subsequent lateral propagation of interfacial steps. The difference in the reaction kinetics originates from the presence of kinetic reaction barriers at the NiSi₂/Si(111) growth fronts, the barrier at the B-front being higher owing to the lower formation rate of steps of triple atomic height than that of steps of lower height at the A-NiSi₂/Si(111) growth front.     

Epitaxial nickel and cobalt suicide formation by rapid thermal annealing

Thin films of epitaxial NiSi₂ and CoSi₂ were formed by short-duration incoherent light exposure of evaporated Ni or Co films on <111> Si single crystals. The crystalline quality of these suicides is comparable to what has been obtained for long-duration furnace annealed suicides, as deduced from channeling measurements. NiSi₂ is of high crystalline quality at all temperatures at which it is formed whereas the CoSi₂ films recrystallize at a temperature of 980°C.     

Formation of epitaxial SiC nanocrystals

Epitaxial 3C-SiC grains are formed at 1190 °C in the top region of silicon, when Si wafers coated by SiO₂ are annealed in CO atmosphere. The formed SiC grains are 40-50 nm high and 100 nm wide in cross-section and contain only few defects. Main advantage of the method is that the final structure is free of voids.The above method is further developed for the generation of SiC nanocrystals, embedded in SiO₂ on Si, and aligned parallel with the interface. The nanometer-sized SiC grains were grown into SiO₂ close to the Si/SiO₂ interface by a two-step annealing of oxide covered Si: first in a CO, than in a pure O₂ atmosphere. The first (carbonization) step created epitaxial SiC crystallites grown into the Si surface, while the second (oxidation) step moved the interface beyond them. Conventional and high resolution cross-sectional electron microscopy showed pyramidal Si protrusions at the Si/SiO₂ interface under the grains. The size of the grains, as well as their distance from the Si/SiO₂ interface (peak of pyramids) can be controlled by the annealing process parameters. The process can be repeated and SiC nanocrystals (oriented in the same way) can be produced in a multilevel structure.     

Control of high-k/germanium interface properties through selection of high-k materials and suppression of GeO volatilization

Two approaches to control high-k/Ge interface qualities were investigated. The first approach was using high-k materials that are intimate with Ge. These Ge-intimate high-k materials should have moderate reactivity with Ge to form an amorphized interface that will reduce the interface defects and will suppress the GeO desorption at the interface. The second approach was modifying the annealing processes by using a cap layer to block GeO out-diffusion. We found that Si works as the cap layer very efficiently. By combining those two approaches, we achieved fairly good high-k/Ge metal-insulator-semiconductor (MIS) characteristics with LaYO₃ as the Ge-intimate high-k material, and a NiSi_X electrode as the cap layer. These results provide us an important guide for controlling the high-k/Ge interface properties.     

CoSi2的能带结构

本文报道用自洽LMTO方法算得CoSi₂化合物的能带结构及状态密度。计算所得状态密度峰值位置与同步辐射光电子谱相应峰值位置很好地符合。计算结果表明:在CoSi₂及NiSi₂中,仍然是过渡金属原子的3d轨道与Si原子的3p轨道间的杂化成键决定它们的电子结构。Si原子并不保持像块状硅中的sp³型杂化。 关键词：     

Ionizing radiation effects on electrical and reliability characteristics of sputtered Ta2O5/Si interface

This paper describes the effect of ionizing radiation on the interface properties of Al/Ta₂O₅/Si metal oxide semiconductor (MOS) capacitors using capacitance–voltage (C–V) and current–voltage (I–V) characteristics. The devices were irradiated with X-rays at different doses ranging from 100?rad to 1?Mrad. The leakage behavior, which is an important parameter for memory applications of Al/Ta₂O₅/Si MOS capacitors, along with interface properties such as effective oxide charges and interface trap density with and without irradiation has been investigated. Lower accumulation capacitance and shift in flat band voltage toward negative value were observed in annealed devices after exposure to radiation. The increase in interfacial oxide layer thickness after irradiation was confirmed by Rutherford Back Scattering measurement. The effect of post-deposition annealing on the electrical behavior of Ta₂O₅ MOS capacitors was also investigated. Improved electrical and interface properties were obtained for samples deposited in N₂ ambient. The density of interface trap states (D_it) at Ta₂O₅/Si interface sputtered in pure argon ambient was higher compared to samples reactively sputtered in nitrogen-containing plasma. Our results show that reactive sputtering in nitrogen-containing plasma is a promising approach to improve the radiation hardness of Ta₂O₅/Si MOS devices.     

Structural and electrical characterization of the nickel silicide films formed at 850 °C by rapid thermal annealing of the Ni/Si(1 0 0) films

Nickel di-silicide formation induced by RTA process at 850 °C for 60 s in the Ni/Si(1 0 0) systems are investigated as a function of the initial Ni film thickness of 7-89 nm using XRD, RBS, SEM, X-SEM and AFM. Based on the XRD and RBS data, in the silicide films of 400-105 nm, NiSi and NiSi₂ silicide phases co-exist, indicating that Ni overlayer is completely transformed to NiSi and NiSi₂ silicide phases. SEM reveals that these films consist of large grains for co-existence of NiSi₂ and NiSi phases, separated from one another by holes, reflecting that NiSi₂ grows as islands in NiSi matrix. These films have low sheet resistance, ranging from 1.89 to 5.44 Ω/□ and good thermal stability. For thicknesses ≤ 80 nm RBS yields more Si-rich silicide phases compared to thicker films, whereas SEM reveals that Si-enriched silicide islands with visible holes grow in Si matrix. As the film thickness decreases from 400 to 35 nm, AFM reveals a ridge-like structure showing a general trend of decreasing average diameter and mean roughness values, while sheet resistance measurements exhibit a dramatic increase ranging from 1.89 to 53.73 Ω/□. This dramatic sheet resistance increase is generated by substantial grain boundary grooving, followed by island formation, resulting in a significant phase transformation from NiSi₂-rich to Si-rich silicide phases.     

Fermi Level Unpinning and Schottky Barrier Modification by Ti, Sc and V Incorporation at NiSi2/Si Interface

A new method is proposed to modify the Schottky barrier height （SBH） for nickel silicide/Si contact. Chemical and electrical properties for NiSi2/Si interface with titanium, scandium and vanadium incorporation are investigated by first-principles calculations. The metal/semiconductor interface states within the gap region are greatly decreased, which is related to the diminutions of junction leakage when Ti-cap is experimentally used in nickel silicide/Si contact process. It leads to an unpinning metal/semiconductor interface. The SBH obeys the Schottky-Mort theory. Compared to Ti substitution, the SBH for electrons is reduced for scandium and increases for vanadium.