低温退火对重掺砷直拉硅片的氧沉淀形核的作用

通过对比研究重掺砷直拉硅片和轻掺n型直拉硅片经过低温(450—800℃)和高温(1000℃)两步退火的氧沉淀行为,阐明了低温退火对重掺掺砷直拉硅片的氧沉淀形核的作用.研究指出：重掺砷硅片在450℃和650℃退火时的氧沉淀形核比在800℃退火时更显著,这与轻掺硅片的情况截然相反;此外,与轻掺硅片相比,重掺砷硅片在450℃和650℃退火时氧沉淀的形核得到增强,而在800℃退火时氧沉淀的形核受到抑制.分析认为,重掺砷硅片在450℃和650℃退火时会形成砷-空位-氧(As-V-O)复合体,它们促进了 关键词： 重掺砷直拉硅片 氧沉淀形核 低温退火     

Point-defect production in arsenic-doped silicon studied with variable-energy positrons

Silicon epilayers grown by molecular beam epitaxy and doped in-situ using low-energy implantation were examined using a variable-energy positron beam. The samples had been previously characterized using electrical measurements, ion channeling, SIMS, and electron microscopy. The positron results show that defects have been created in layers grown at 460°C and in the highly doped layers grown at 700°C. The assignment of defect structures is difficult at present, but is consistent with the formation of As clusters or Asvacancy complexes.     

Reflectancevs. Electroreflectance measurements on arsenic-doped silicon crystal

Summary Reflectance and electroreflectance measurements from 2.5 to 5.5 eV, performed on arsenic heavily doped silicon samples, are reported and discussed. Silicon crystals implanted with arsenic up to a fluence of 10¹⁷ cm⁻² were laser irradiated and a free-carrier concentration of the order of 10²¹cm⁻³ was reached. The reordering of the system is studied in detail at different initial conditions. A comparison between reflectance and electro-reflectance appears to be quite useful to determine the behaviour of the heavily doped semiconductor. To speed up publication, the authors of this paper have agreed to not receive the proofs for correction.     

Electron mobility in heavily doped silicon

We have calculated the mobility of conduction electrons in heavily doped n-type silicon. The Thomas-Fermi screening and the Born approximation are employed. The dependence of the effective mass on carrier density determined empirically is considered. The results are compared with experimental data obtained recently.     

Fano resonance in heavily doped porous silicon

Unexpectedly, the Fano resonance caused by the interference of continuum electron excitations with the longitudinal optical (LO) phonons was observed in random porous Si by Raman scattering. The analysis of the experimental data shows that the electron states trapped at the Si SiO₂ interface dominate in the observed Raman scattering. The gap energy associated with the interface states was determined. Copyright © 2011 John Wiley & Sons, Ltd.     

Nuclear spin-lattice relaxation in heavily doped silicon

The anomalous temperature and magnetic field dependences of spin-lattice relaxation time were observed in heavily phosphorus doped silicon. These anomalies should be attributed to the dynamical nature of the highly correlated electron gas which contributes to metallic impurity conduction.     

Thermoreflectance investigation of heavily doped silicon

The effect of the presence of high concentrations of dopants on the interband spectra of silicon has been studied by means of thermoreflectance. Heavy doping has been performed through ion implantation and eventually laser annealing. From the analysis of the thermoreflectance spectra a wide set of parameters characterizing in particular the E₁andE₂ structures has been obtained.     

A silicon donor layer in heavily doped GaN

The properties of GaN layers heavily doped with silicon are investigated via photoluminescence spectroscopy. It is shown that excitons cease localizing on donors at a silicon atom concentration of 1.6 × 10¹⁹ cm^?3; at higher dopant concentrations, the excitons decay. It is established that the donor binding energy falls as the silicon concentration rises.     

Fluorine in silicon: diffusion,trapping, and precipitation

The effect of vacancies on the behavior of F in crystalline Si has been elucidated experimentally for the first time. With positron annihilation spectroscopy and secondary ion mass spectroscopy, we find that F retards recombination between vacancies (V) and interstitials (I) because V and I trap F to form complexes. F diffuses in the V-rich region via a vacancy mechanism with an activation energy of 2.12+/-0.08 eV. After a long annealing time at 700 degrees C, F precipitates have been observed by cross-section transmission electron microscopy which are developed from the V-type defects around the implantation range and the I-type defects at the end of range.     

Hydrogen implantation and diffusion in silicon and silicon dioxide

Depth profiles of hydrogen implanted into crystalline silicon in random direction at different fluences have been measured by the¹⁵N technique and by SIMS. Whereas hydrogen implanted at a fluence of 10¹⁵ ions/cm² shows some limited mobility, no such mobility is observed for higher implantation fluences. In these cases, ballistic computer codes describe the depth distributions well, within the ranges of both experimental and theoretical accuracy. Annealing up to 510 K does not change the hydrogen distributions.Furthermore, high-fluence hydrogen implantation into silicon dioxide has been examined. There is some indication for radiation-enhanced diffusion during the implantation process. Upon subsequent thermal annealing, the hydrogen is found to diffuse, probably via a trapping/detrapping mechanism associated with an OH/H₂ transformation of the hydrogen bonding.     

Infra-red properties of bulk heavily doped silicon

Summary In this work reflectance (R) and thermoreflectance (TR) spectra in the infra-red of bulk P and B heavily doped silicon samples are reported and discussed. The values of the scattering time and of the effective mass, as well as the temperature derivative of the plasma frequency, scattering time and high-frequency dielectric constant are extracted from the data and analysed in terms of free-carrier-photon and free-carrier-impurity interaction.

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Riassunto In questo lavoro sono riportati e discussi gli spettri di riflettanza (R) e termoriflettanza (TR) in infrarosso di campioni di silicio drogati pesantemente per diffusione con P e B. Dai dati sono ricavati i valori dei tempi di rilassamento e della massa effettiva, come pure la derivata in temperatura della frequenza di plasma, del tempo di rilassamento e della costante dielettrica ad alta frequenza, che sono analizzati sulla base delle interazioni fra portatori liberi e fononi e fra portatori liberi e impurezze.

     

Interaction between electronic and vibronic Raman scattering in heavily doped silicon

The asymmetry in the one-phonon Raman lines of heavily doped p-type Si is interpreted as the interference of a continuum of electronic excitations with the phonon line. The dependence of the line shape on the exciting frequency is produced by the different resonant behavior of these two scattering mechanisms.     

Knudsen diffusion in silicon nanochannels

Measurements on helium and argon gas flow through an array of parallel, linear channels of 12 nm diameter and 200 microm length in a single crystalline silicon membrane reveal a Knudsen diffusion type transport from 10(2) to 10(7) in Knudsen number Kn. The classic scaling prediction for the transport diffusion coefficient on temperature and mass of diffusing species, D(He) is proportional to square root T, is confirmed over a T range from 40 K to 300 K for He and for the ratio of D(He)/D(Ar) is proportional to square root (m(Ar)/m(He)). Deviations of the channels from a cylindrical form, resolved with electron microscopy down to subnanometer scales, quantitatively account for a reduced diffusivity as compared to Knudsen diffusion in ideal tubular channels. The membrane permeation experiments are described over 10 orders of magnitude in Kn, encompassing the transition flow regime, by the unified flow model of Beskok and Karniadakis.     

Point defects,diffusion processes,and swirl defect formation in silicon

The paper consists of three parts. In the first part we review the basic experimental and theoretical results which shaped our present knowledge on point defects and diffusion processes in silicon. These results concern on one side oxidation effects which established that silicon self-interstitials and vacancies coexist in silicon and on the other side diffusion of gold into dislocation-free silicon which allowed to determine the self-interstitial contribution to silicon self-diffusion and to estimate the corresponding vacancy contribution. In the second part we discuss topics for which an understanding is just emerging within the framework of coexisting self-interstitials and vacancies: reaching of local dynamical equilibrium between self-interstitials and vacancies; rough estimates of the thermal equilibrium concentrations of self-interstitials and vacancies and their respective diffusivities, and finally, various possibilities to generate an undersaturation of self-interstitials. In the third part we examine swirl defect formation in silicon in terms of vacancies and self-interstitials.