Curing properties of novel curing agent based on phenyl bisthiourea for an epoxy resin system

Phenyl bisthioureas: 4,4′-(bisthiourea)diphenylmethane (DTM), 4,4′-(bisthiourea)diphenyl ether (DTE), and 4,4′-(bisthiourea)diphenyl sulfone (DTS) were synthesized and used as curing agents for the epoxy resin diglydicyl ether bisphenol A (DGEBA). Synthesized phenyl bisthioureas were characterized using FT-IR and ¹H-NMR analysis. For comparison studies the epoxy system was also cured using the conventional aromatic amine 4,4′-diaminodiphenyl ether (DDE). Curing kinetics of epoxy/amine system was studied by dynamic and isothermal differential scanning calorimeter (DSC). Curing kinetic was evaluated based on model-free kinetics (MFK) and ASTM E 698 model, and the activation energy was compared with DDE. Curing system of phenyl bisthiourea link (DGEBA/DTM, DGEBA/DTE, and DGEBA/DTS) shows two exothermic peaks, while that of the conventional aromatic amines showed only a single peak. The initial exothermic peak is due to the primary nitrogen of the thiourea group, and the exotherm at higher temperature is due to the presence of thiourea groups. Glass transition temperature (T _g) of DGEBA/DTM, DGEBA/DTE, and DGEBA/DTS cured resins were lowered by 323 K when compared to the widely used diaminodiphenyl ether (DDE) cured resin. Oxidation induction temperature measurement performed on DSC suggests that the DGEBA/DTM, DGEBA/DTE, and DGEBA/DTS system cured resins has better oxidative stability when compared to cured DGEBA/DDE resin system.     

Synthesis and thermal characterization of phosphorus containing siliconized epoxy resins

Siliconized epoxy matrix resin was developed by reacting diglycidyl ethers of bisphenol A (DGEBA) type epoxy resin with hydroxyl terminated polydimethylsiloxane (silicone) modifier, using γ-aminopropyltriethoxysilane crosslinker and dibutyltindilaurate catalyst. The siliconized epoxy resin was cured with 4, 4-diaminodiphenylmethane (DDM), 1,6-hexanediamine (HDA), and bis (4-aminophenyl) phenylphosphate (BAPP). The BAPP cured epoxy and siliconized epoxy resins exhibit better flame-retardant behaviour than DDM and HDA cured resins. The thermal stability and flame-retardant property of the cured epoxy resins were studied by thermal gravimetric analysis (TGA) and limiting oxygen index (LOI). The glass transition temperatures (T_g) were measured by differential scanning calorimetry (DSC) and the surface morphology was studied by scanning electron microscopy (SEM). The heat deflection temperature (HDT) and moisture absorption studies were carried out as per standard testing procedure. The thermal stability and flame-retardant properties of the cured epoxy resins were improved by the incorporation of both silicone and phosphorus moieties. The synergistic effect of silicone and phosphorus enhanced the limiting oxygen index values, which was observed for siliconized epoxy resins cured with phosphorus containing diamine compound.     

Effect of structure on thermal behaviour of epoxy resins

The paper deals with the curing behaviour of diglycidyl ether of bisphenol-A (DGEBA) using three novel multifunctional aromatic amines having phosphine oxide and amide-acid linkages. The amines were prepared by reacting tris(3-aminophenyl)phosphine oxide (TAP) with 1,2,4,5-benzenetetracarboxylic acid anhydride (P)/4,4^′-(hexafluoroisopropylidene)diphthalic acid anhydride (F)/3,3^′,4,4^′-benzophenonetetracarboxylic acid dianhydride (B). Amide-acid linkage in these amines is converted to thermally stable imide linkage during curing reaction. Curing temperatures of DGEBA were higher with phosphorylated amines than the conventional amine 4,4^′-diamino diphenyl sulphone (D). A decrease in initial decomposition temperature and higher char yields were observed when phosphorus containing amide-acid amines were used as curing agents for DGEBA.     

Controlled shrinkage polymers: Characterization of epoxy resins cured with spirobislactones

The diglycidyl ether of bisphenol A (DGEBA) was cured with either an aliphatic or an aromatic spirobislactone using a tertiary amine catalyst. The products were characterized by FTIR, TGA, DSC, dilatometry, and single-fiber adhesion measurements, and their performance was compared to that of DGEBA cured with acid anhydrides. Both aliphatic and aromatic bislactones are effective curing agents for DGEBA. FTIR and dilatometry confirm that both lactone rings open early in the curing reaction and initially offset shrinkage caused by polymerization. After the bislactone has been consumed, oxirane reactions proceed in a normal fashion. The final shrinkage of cured DGEBA polymers, with or without addition of bislactones, is 3.0–3.5%. Bislactone-modified materials possess superior thermal properties, when compared to those of anhydride-cured materials.     

Epoxy resins. II. The preparation,characterization, and curing of epoxy resins and their copolymers

A polymer with high aromatic ring content in the chain backbone usually has high heat and flame resistance. Three diglycidyl ethers of epoxy resins were prepared from bisphenol A (DGEBA), phenolphthalein (DGEPP), and 9,9-bis(4-hydroxyphenyl)fluorene (DGEBF) in a study of the relation between the cured polymer structure and properties. The epoxy resin prepared from phenolphthalein was separated by liquid chromatography and three fractions were obtained. The fractions had a basic structure of 3,3-disubstituted phthalide and differed only in molecular weight. The DGEPP resin changed color from yellow to red after mixing with trimethoxyboroxine (TMB), the curing agent, and to orange after completing the curing cycle. To prepare a highly crosslinked material with good thermal stability, TMB with three active Lewis sites in a molecule was used as the curing agent. The reactivity of the three different resins toward TMB, measured by differential scanning calorimetry (DSC), was DGEBA > DGEBF > DGEPP. For the same curing conditions the order of crosslink density was DGEBA > DGEPP > DGEBF. To modify the flammability of DGEBA, the conventional epoxy resin, it was copolymerized with DGEPP and DGEBF, the higher-performance epoxy resins. The glass transition temperatures of poly(DGEBA-co-DGEPP) and poly(DGEBA-co-DGEBF) systems deviated from this relationship. The DGEBF copolymers showed an increased char residue (40 wt % at 700°C) at 20 mole % of DGEBF. This deviation may be due to the lower crosslinking density of this system.     

Studies on the curing behaviour of bismaleimides and epoxy-resin blends

This paper describes the effect of diglycidyl ether of bisphenol A (DGEBA) on the curing behaviour of a chain-extended bismaleimide resin. 4,4'-Bismaleimidophenyl sulfone (BS) resin was treated with 4,4'-diaminodiphenyl ether or 4,4'-diaminodiphenyl methane to yield BS-M and BS-E resins which were then solution-blended with DGEBA containing stoichiometric amounts of amine as hardener. A decrease in the curing temperature of BS-M or BS-E was observed on blending with DGEBA. The thermal stability of the cured resin was reduced on blending.     

High resolution solid‐state 13C‐NMR study of as‐cured and irradiated epoxy resins

This article presents the effects of strong ionizing radiations on the physico‐chemical modifications of aliphatic or aromatic amine‐cured epoxy resins based on diglycidyl ether of bisphenol A (DGEBA). Such epoxy resins have a considerable number of applications in the nuclear industrial field and are known to be very stable under moderate irradiation conditions. Using extensively high resolution solid‐state ¹³C‐NMR spectroscopy we show that the aliphatic amine‐cured resin (DGEBA‐TETA) appears much more sensitive to gamma rays than the aromatic amine‐cured one (DGEBA‐DDM). On the one hand, qualitative analyses of the high resolution solid‐state ¹³C‐NMR spectra of both epoxy resins, irradiated under similar conditions (8.5 MGy), reveal almost no change in the aromatic amine‐cured resin whereas new resonances are observed for the aliphatic amine‐cured resin. These new peaks were interpreted as the formation of new functional groups such as amides, acids and/or esters and to alkene groups probably formed in the aliphatic amine skeleton. On the other hand, molecular dynamics of these polymers are investigated by measuring the relaxation times, T_CH, T_1ρH and T_1C , before and after irradiation. The study of relaxation data shows the formation, under irradiation, of a more rigid network, especially for the aliphatic amine‐cured system and confirms that aromatic amine‐cured resin [DGEBA‐4,4′‐diaminodiphenylmethane(DDM)] is much less affected by ionizing radiations than the aliphatic amine‐cured resin [DGEBA‐triethylenetetramine(TETA)]. Moreover, it has been shown that the molecular modifications generated by irradiation on the powder of the aliphatic‐amine‐cured resin appear to be homogeneously distributed inside the polymers as no phase separations can be deduced from the above analyses. Copyright © 2001 John Wiley & Sons, Ltd.     

An analysis of the substitution effects involved in diepoxide-diamine copolymerization reactions

The relative reactivity of the functional groups present in aromatic amine and diepoxide monomers has been investigated by gel permeation chromatography. The ratio of rate constants for the consumption of the secondary and primary amine hydrogens involved in the reaction between aniline and phenyl glycidyl ether has been calculated to equal approximately 0.5. In the case of the reaction between N-methy aniline and diglycidyl ether of bisphenol A (DGEBA) the rate constant ratio for the consumption of the first and second epoxide groups in the DGEBA molecule is also approximately 0.5. In contradiction to previously published data these results suggest that substitution effects are unimportant for aromatic amines as well as DGEBA. Furthermore, etherification side reactions, consuming epoxide groups at the expense of the amine–epoxide reaction, also appear to be insignificant.     

Curing studies of epoxy resins with phosphorus‐containing amines

The curing system of diglycidyl ether of bisphenol A (DGEBA) with two phosphorus‐containing amine compounds—bis(3‐aminophenyl)methyl phosphine oxide and bis(4‐aminophenyl)‐bis(9,10‐dihydro‐9‐oxa‐10‐oxide‐10‐phosphaphenanthrene‐10‐yl)methane—was studied with differential scanning calorimetry under isothermal and nonisothermal conditions and compared with the DGEBA/diamino diphenyl methane system. The isoconversional method was used to evaluate the dependence of the effective activation energy on the extent of conversion. Modulated differential scanning calorimetry and dynamic mechanical thermal analysis were used to study the phenomena of vitrification and gelation. The thermal and flame‐retardant properties were evaluated, and the limiting oxygen index values of the phosphorylated resins, above 30, confirmed that phosphorus‐containing epoxy resins are effective flame retardants. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 1676–1685, 2006     

Curing kinetics and thermal stability of diglycidyl ether of bisphenol

Curing kinetics of diglycidyl ether of bisphenol-A (DGEBA) in the presence of varying molar ratios of aromatic imide-amines and 4,4′-diaminodiphenylsulfone (DDS) were investigated by the dynamic differential scanning calorimetry. The imide-amines were prepared by reacting 1 mole of benzophenone 3,3′,4,4′-tetracarboxylic acid dianhydride (B) with 2.5 moles of 4,4′-diaminodiphenyl ether (E)/ or 4,4′-diaminodiphenyl methane (M)/ or 4,4′-diaminodiphenylsulfone (S) and designated as BE/ or BM/ or BS. The mixture of imide-amines and DDS at ratio of 0:1, 0.25:0.75, 0.5:0.5, 0.75:0.25 and 1:0 were used to investigate the curing behaviour of DGEBA. The multiple heating rate method (5, 10, 15 and 20°C min⁻¹) was used to study the curing kinetics of epoxy resins. The peak exotherm temperature was found to be dependent on the heating rate, structure of imide-amines as well as on the ratio of imide-amine: DDS used. A broad exotherm was observed in the temperature range of 180–230°C on curing with mixture of imide-amines and DDS. Curing of DGEBA with mixture of imide-amines and/or DDS resulted in a decrease in characteristic curing temperatures. Activation energy of curing reaction as determined in accordance to the Ozawa’s method was found to be dependent on the structure of amine. The thermal stability of the isothermally cured resins was also evaluated using dynamic thermogravimetry in a nitrogen atmosphere. The char yield was highest in case of resins cured using mixture of DDS: BS (0.25:0.75; EBS-3), DDS: BM (0.5: 0.5; EBM-2) and DDS: BE (0.5: 0.5; EBE-2).     

Curing and thermal behaviour of epoxy resin in the presence of a mixture of imide-amines

The curing behaviour of diglycidyl ether of bisphenol-A (DGEBA) was investigated by the dynamic differential scanning calorimetry using varying molar ratios of aromatic imide-amines and 4,4′-diaminodiphenylsulfone (DDS). The imide-amines were prepared by reacting 1 mole of naphthalene 1,4,5,8-tetracarboxylic dianhydride (N) and 4,4′-oxodiphthalic anhydride (O) with 2.5 moles of 4,4′-diaminodiphenyl ether (E) or 4,4′-diaminodiphenyl methane (M) or 4,4′-diaminodiphenylsulfone (S) and designated as NE/OE or NM/OM or NS/OS. The mixture of the imide-amines and DDS at ratio of 0:1, 0.25:0.75, 0.5:0.5, 0.75:0.25 and 1:0 were used to investigate the curing behaviour of DGEBA. A single exotherm was observed on curing with mixture of imide-amines and DDS. This clearly shows that the two amines act as co-curing agents. Curing temperatures were higher with imide-amines having sulfone linkage irrespective of anhydride. Curing of DGEBA with mixture of imide-amines and or DDS resulted in a decrease in characteristic curing temperatures. The thermal stability of the isothermally cured resins was also evaluated using dynamic thermogravimetry in a nitrogen atmosphere. The char yield was higher in case of resins cured imide-amines based on N and E. The activation energy of decomposition and integral procedural decomposition temperature were also calculated from the TG data.     

Studies on the curing kinetics of epoxy resins using silicon containing amide-amines

Curing kinetics of diglycidyl ether of bisphenol-A (DGEBA) in the presence of novel silicon containing amide-amines were investigated by the dynamic differential scanning calorimetry. Silicon containing amide-amines were prepared by reacting 2.5 moles of 4,4'-diaminodiphenyl ether (E)/4,4'-diaminodiphenyl methane (M)/3,3'-diaminodiphenyl sulfone (mS)/bis(m-aminophenyl) methyl phosphine oxide (B) with one mole of bis(4-chlorobenzoyl) dimethyl silane. The multiple heating rate method (5, 10, 15 and 20°C min^-1) was used to study the curing kinetics of epoxy resins in the presence of stoichiometric amounts of amide-amines having molecular masses in the range of 660 to 760 g mol^-1. The peak exotherm temperature depends on the heating rate as well as on the structure of amide-amines. Activation energy of curing reaction as determined in accordance to the Ozawa's method was found to be dependent on the structure of amine. The thermal stability of the isothermally cured resins was also evaluated using dynamic thermogravimetry in a nitrogen atmosphere. The char yield was the highest in case of resins cured with amide-amines having both phosphorus and silicon atoms. This revised version was published online in July 2006 with corrections to the Cover Date.     

Curing kinetics and thermal stability of epoxy blends containing phosphorous-oxirane with aromatic amide-amine as curing agents

This article describes the synthesis of a series of aromatic amide-amines and their potential use as epoxy hardeners. These amines were synthesized by the reaction of L-phenylalanine（PA） with diamines of different structures i.e.1,4- phenylene diamine（PD）,1,5-diamino naphthalene（N）,4,4’-（9-fluorenyllidene）-dianiline（F）,4,4’-diaminodiphenyl sulphide （DS） and 3,4’-oxydianiline（O） in a stoichiometric ratio（1:1）.Structural characterization of synthesized amide-amines was done with the help of elemental analysis and spectroscopic techniques viz.FT-IR,¹H-NMR and ¹³C-NMR.An epoxy blend was prepared by mixing tris（glycidyloxy） phosphine oxide（TGPO） with conventional epoxy i.e.diglycidyl ether of bisphenol-A（DGEBA） in an equivalent ratio of 2:3 to incorporate phosphorous into the main chain.The curing kinetics of the epoxy blend with synthesized aromatic amide-amines was investigated by non-isothermal DSC technique using multiple heating rate method（5,10,15 and 20 K/min.）.The activation energies were determined by fitting the experimental data into Kissinger and Ozawa kinetic models.The activation energies obtained through Ozawa method were slightly higher than those of Kissinger method but were comparable.However,both the energies were found to be dependent on the structure of amines.The thermal stability and weight loss behavior of isothermally cured thermosets were also investigated using thermogravimetric analysis（TGA） in nitrogen atmosphere.All the samples showed improved thermal stability in terms of char yield than using only amines as hardeners.     

Flame retardant epoxy polymers based on all phosphorus-containing components

A phosphorus-containing epoxy resin, bis(3-t-butyl-4-glycidyloxyphenyl-2,4-di-t-butylphenyl)resorcinol diphosphate, was synthesized and subsequently cured with non-phosphorus containing amines, and/or novel phosphorus-containing aromatic or polyoxyalkylene amines. Chemical structures of these materials were characterized with FTIR, NMR, elemental analysis, and amine titration. The introduction of soft -P-O- linkage, polyoxyalkyene, or hard aromatic group into the backbones of the synthesized phosphorus-containing amines provides epoxy polymers with high phosphorus contents and tailored flexibility. Thermal analysis of differential scanning calorimeter and thermal gravimetric analysis (TGA) reveals that these resulted epoxy polymers possess moderate T_gs and thermal stability. Furthermore, high char yields in TGA analysis and high limited oxygen index values indicate that these phosphorus-containing epoxy polymers possess excellent flame retardant properties.     

Effect of Phosphorus Content on Thermal Behaviour of Diglycidyl Ether of Bisphenol-A/phosphorus Containing Amines

Curing of diglycidyl ether of bisphenol-A (DGEBA) with phosphorus containing amide amines i.e. bis[3(3’-aminobenzamido phenyl)]methyl phosphine oxide (MB),bis[3(4’-aminobenzamido phenyl)]methyl phosphine oxide (PB), tris[3(3’-aminobenzamidophenyl)] phosphine oxide (MT) and tris[3(4’-aminobenzamido phenyl)] phosphine oxide (PT)and conventionally used curing agent 4,4’-diaminodiphenyl sulfone (D) was studied by DSC. The amines MB, PB, MT and PT were synthesised in the laboratory and were characterized by determining elemental composition, melting point, and amine equivalent. Structural characterization was done by ¹H-NMR and FTIR. The onset temperature of curing depended on the nucleophilicity of the amines and was in the orderMT≈MB<PT<PB<D. The exothermic peak temperatures were in the orderD>PB>PT>MT≈MB. The char residue of cured epoxy resin was significantly higher when phosphorus was incorporated in the cured network. Using mixed amine formulations based on amine D and P-containing amines and the molar ratio of these amines could easily control the curing characteristics. A linear relationship between char yield and P-content was observed in such formulations. This revised version was published online in August 2006 with corrections to the Cover Date.     

Preparation, characterization and curing properties of epoxy-terminated poly(alkyl-phenylene oxide)s

A series of dihydroxyl telechelic poly(alkyl-phenylene oxide)s (1) have been synthesized by oxidative polymerization of alkylphenols with various aromatic diols using manganese or copper amine catalysts. The novel telechelic derivatives (1) were epoxidized with epichlorohydrin yielding a series of new epoxidized poly(alkyl-phenylene oxide)s (EPPO, 2) and the structures, properties were studied by nuclear magnetic resonance spectroscopy (NMR), differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA) and gel permeation chromatography (GPC). The 1:1 blends of diglycidyl ether of bisphenol-A (DGEBA) with EPPO resins were cured with three curing agents and the effects of chemical structure change on thermal property of the curing matrixes were discussed. Incorporation of EPPOs to DGEBA epoxy system resulted in a significant increase in its glass transition temperature (T_g), thermal stability and flame resistance. The T_g values and char yields arising from a DDM-cured epoxy resin are usually higher than those of dicyandiamide (DICY) or 2-methylimidazole (2-MI) analogues and the reactivity of epoxy blends with three curing agents presents an increase in the order of 2-MI, DDM and DICY. In general, the tetramethylbisphenol-A (TMBPA)-derived polymer exhibits the lowest T_g, char yield and dielectric constant among PPO derivatives whereas the biphenol polymers usually results in higher T_g and char yield due to its rigid rod structure.     

Thermal properties and toughness performance of hyperbranched‐polyimide‐modified epoxy resins

An amine‐terminated hyperbranched polyimide (HBPI) was prepared by the condensation polymerization of a commercially available triamine monomer with a dianhydride monomer. The effects of the HBPI content on the thermal and mechanical interfacial properties of diglycidyl ether of bisphenol A (DGEBA) epoxy resins were investigated with several techniques. The thermogravimetric analysis results showed that the thermal stability of the DGEBA/HBPI blends did not obviously change as the HBPI content increased. The glass‐transition temperature (T_g) of the DGEBA/HBPI blends increased with the addition of HBPI. Improvements in the critical stress intensity factor (K_IC) and impact strength of the blends were observed with the addition of HBPI. The K_IC value and impact strength were 2.5 and 2 times the values of the neat epoxy resins with only 4 wt % HBPI. The fractured surfaces were studied with scanning electron microscopy to investigate the morphology of the blends, and they showed that shear deformation occurred to prevent the propagation of cracks in the DGEBA/HBPI blends. These results indicated that a toughness improvement was achieved without a decrease in the thermal stability or T_g. © 2006 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 3348–3356, 2006     

Effect of the substituted benzene group on thermal and mechanical properties of epoxy resins initiated by cationic latent catalysts

Epoxy resins (DGEBA) were cured by cationic latent thermal catalysts, that is, N‐benzylpyrazinium hexafluoroantimonate (BPH) and N‐benzylquinoxalinium hexafluoroantimonate (BQH) to investigate the effect of substituted benzene group on cure kinetics and mechanical properties of epoxy system. Differential scanning calorimetry (DSC) was undertaken for activation energy of the system. It was also characterized in terms of flexural, fracture toughness, and Izod impact strengths for the mechanical tests. As a result, the cure reaction of both epoxy systems resulted in an autocatalytic kinetic mechanism accelerated by hydroxyl groups. Also, the conversion and cure activation energy of the DGEBA/BQH system were higher than those of DGEBA/BPH system. The mechanical properties of the DGEBA/BQH system were also superior to those of the DGEBA/BPH system, as well as the morphology. This was probably due to the consequence of the effect of the substituted benzene group of the BQH catalyst, resulting in increasing the crosslinking density and structural stability in the epoxy system studied. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 2419–2429, 2004     

Epoxy-modified, unsaturated polyester hybrid networks

Hybrid polymer networks (HPNs) based on unsaturated polyester resin (UPR) and epoxy resins were synthesized by reactive blending. The epoxy resins used were epoxidised phenolic novolac (EPN), epoxidised cresol novolac (ECN) and diglycidyl ether of bisphenol A (DGEBA). Epoxy novolacs were prepared by glycidylation of the novolacs using epichlorohydrin. The physical, mechanical, and thermal properties of the cured blends were compared with those of the control resin. Epoxy resins show good miscibility and compatibility with the UPR resin on blending and the co-cured resin showed substantial improvement in the toughness and impact resistance. Considerable enhancement of tensile strength and toughness are noticed at very low loading of EPN. Thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA) and differential scanning calorimetry (DSC) were employed to study the thermal properties of the toughened resin. The EPN/UPR blends showed substantial improvement in thermal stability as evident from TGA and damping data. The fracture behaviour was corroborated by scanning electron microscopy (SEM). The performance of EPN is found to be superior to other epoxy resins.     

Kinetics and thermal properties of epoxy resins based on bisphenol fluorene structure

The fluorene-containing epoxy, diglycidyl ether of 9,9-bis(4-hydroxyphenyl) fluorene (DGEBF) was synthesized by a two-step reaction procedure. In order to investigate the relationship between fluorene structure and material properties, DGEBF and a commonly used diglycidyl ether of bisphenol A (DGEBA) were cured with 4,4-diaminodiphenyl methane (DDM) and 4,4-(9-fluorenylidene)-dianiline (FDA). The curing kinetics, thermal properties and decomposition kinetics of these four systems (DGEBA/DDM, DGEBF/DDM, DGEBA/FDA, and DGEBF/FDA) were studied in detail. The curing reactivity of fluorene epoxy resins was lower, but the thermal stability was higher than bisphenol A resins. The onset decomposition temperature of cured epoxy resins was not significantly affected by fluorene structure, but the char yield and T_g value were increased with that of fluorene content. Our results indicated that the addition of fluorene structure to epoxy resin is an effective method to improve the thermal properties of resins, but excess fluorene ring in the chain backbone can depress the curing efficiency of the resin.