Dynamic crack kinking from a PMMA/Homalite interface

The behavior of a pre-existing, dynamically loaded, interfacial crack kinking away from the interface separating two materials was experimentally investigated under dynamic loading conditions. Dynamic fracture experiments were performed on pre-cracked bimaterial panels of PMMA bonded with Homalite-100 impact loaded using a high-speed gas gun. By varying the location of impact, a large range of mixed mode loading at the crack tip was produced. Information about the stress state surrounding the crack tip was obtained through use of the lateral shearing interferometer of coherent gradient sensing in conjunction with high-speed photography. The high-speed interferogram corresponding, to the time of crack initiation was analyzed in each case to find the preinitiation mode mixity at the crack tip. Measurement of both the local initiation mode mixity and the crack kink angle allows for possible extension of existing quasi-static interface crack kinking criteria, such as maximum opening stress or maximum energy release rate, to the case of dynamic loading. It was found that for bimaterial systems with small material property mismatch, such as the PMMA/Homalite system, the maximum opening stress criterion accurately predicts the relation between crack tip mode mixity and resulting kink angle for small initial crack kinking speeds.     

Plasticity aspects of interfacial fracture for polymer/glass specimens

Experimental results suggest that the interfacial fracture resistance is minimal for approximate near tip Mode I accompanied by positive and negative near tip Mode II. Finite-strain FE analysis is made for an elastic–plastic medium bonded to an ideally elastic medium with an interface crack. Small-scale plasticity conditions are invoked and examined in relation to the elastic–plastic stress distribution along the bond line. Plasticity engenders a tendency to turn near tip biaxiality towards pure Mode I regardless of the mixed-mode loading. High levels of hydrostatic stress are attained. For different mode mixities of the applied load, the dependence of the elastic–plastic normal bond stress on load level is examined. It is found that under positive Mode II loading, the normal bond stress σ_yy tends to saturate as the load level rises. This does not occur for Mode I and negative Mode II loading. In addition, deformation patterns inside the plastic zone are examined for mixed-mode situations. A displacement criterion based on the normal bond crack opening suggests a dependence of the critical load level on the extent of mixed mode. Under positive mode II fracture, traces of the ductile material are found at the top of the elastic substrate. Some of these conclusions appear to be consistent with the fracture patterns observed for LD-polyethylene/glass interfacial mixed-mode fracture.     

界面裂纹的路径选择与数值模拟

利用界面断裂能和荷载混合度的概念研究界面裂纹的扩展路径，利用有限元数值方法模拟界面裂纹的扩展过程，再现界面断裂的各种几何构型．研究表明，界面的断裂能和混合度完全控制了裂纹在界面附近的扩展过程．数值预测的裂纹路径与理论结果一致     

Interfacial mixed-mode fracture of adhesive bonds undergoing large deformation

Interfacial fracture of adhesive bonds undergoing large-scale yielding is studied using a combined experimental/finite-element approach. The full range of in-plane mode mixity is produced over bond thickness ranging from 30 to 500 μm using the scarf and the ENF joint geometries. Novel techniques for introducing pre-cracks and surface decoration, together with in situ observations, facilitate accurate determination of the bond-average and the local shear strains at the crack tip during the onset as well as the rest of the crack propagation event. The crack generally grew along one of the two interfaces of the bond, although the failure was always fully cohesive. The local shear strain at the crack tip is independent of the bond thickness, and, under quasi-static conditions, it remains constant throughout the growth, which make it a viable fracture parameter. This quantity strongly depends on the mode mixity, the sign of the phase angle (i.e., shearing direction) and the crack speed, however.A finite-element analysis is used to obtain the crack tip deformation field for an interface crack in adhesively bonded scarf and ENF joints. Large-strain and quasi-static conditions are assumed. A distinct material model in the fracture process zone that allows for volume change in the post-yield regime is incorporated into the analysis. The local deformation is characterized by a pair of bond-normal and tangential displacements corresponding to the nodal points adjacent to the crack tip. The critical values of these quantities are obtained when the FEM bond-average shear strain at the crack tip becomes equal to its experimental counterpart. The so defined critical local displacements, after an appropriate normalization, seem to conform to a single-valued, linear type interrelationship over the entire range of mode mixity. The fact that this relationship is independent of the bond thickness, and furthermore it encompasses both cases of positive and negative phase angles, makes it a viable candidate for characterizing mixed-mode interfacial fracture under large-deformation conditions.     

CFRP-混凝土界面粘结的疲劳性能试验研究

外贴FRP是重要的混凝土结构加固技术,但目前对外贴FRP加固混凝土结构的疲劳性能研究尚不充分,尤其对FRP-混凝土粘结界面的疲劳退化规律和破坏模式的研究更为缺乏。本文采用双面剪切试件,通过2个静载试件和4个疲劳试件的试验研究,考察了粘结长度和胶层厚度等因素对FRP-混凝土界面粘结疲劳性能的影响。通过分析沿粘结长度的FRP应变分布在疲劳循环过程中和疲劳后静载过程中的变化情况,讨论了不同粘结长度和粘结胶层厚度条件下的粘结界面疲劳退化规律和疲劳后静载性能。试验结果表明:胶层树脂-混凝土粘结界面是发生疲劳剥离破坏的薄弱环节;胶层厚度增大时,由于疲劳引起的界面损伤累积发展显著减小,疲劳后静载中胶层厚度较大试件的粘结承载力也更大;粘结长度增大时,界面粘结呈现更为明显的损伤退化,但由于试验粘结长度小于有效粘结长度,疲劳后的静粘结承载力仍更大。     

A simple cohesive zone model that generates a mode-mixity dependent toughness

A simple, mode-mixity dependent toughness cohesive zone model (MDG_c CZM) is described. This phenomenological cohesive zone model has two elements. Mode I energy dissipation is defined by a traction–separation relationship that depends only on normal separation. Mode II (III) dissipation is generated by shear yielding and slip in the cohesive surface elements that lie in front of the region where mode I separation (softening) occurs. The nature of predictions made by analyses that use the MDG_c CZM is illustrated by considering the classic problem of an elastic layer loaded by rigid grips. This geometry, which models a thin adhesive bond with a long interfacial edge crack, is similar to that which has been used to measure the dependence of interfacial toughness on crack-tip mode-mixity. The calculated effective toughness vs. applied mode-mixity relationships all display a strong dependence on applied mode-mixity with the effective toughness increasing rapidly with the magnitude of the mode-mixity. The calculated relationships also show a pronounced asymmetry with respect to the applied mode-mixity. This dependence is similar to that observed experimentally, and calculated results for a glass/epoxy interface are in good agreement with published data that was generated using a test specimen of the same type as analyzed here.     

聚氯乙烯复合断裂性能研究

从弹塑性断裂力学理论出发,进行了硬质聚氯乙烯材料多角度下的Ⅰ/Ⅱ复合断裂试验,研究硬质聚氯乙烯材料复合断裂性能.利用数字图像相关技术,计算复合裂纹稳定扩展的临界裂纹尖端张开角值(ΨC1),尝试用该值作为一种断裂参数来描述硬质聚氯乙烯材料的断裂韧性.结果表明:(1)此材料与常见的金属材料不同,Ⅱ型加载模式下承载能力最大,纯Ⅰ型时承载能力最小;(2)当裂纹稳定扩展时,ΨC1值趋于稳定.故临界裂纹尖端张开角可作为硬质聚氯乙烯材料裂纹稳定扩展的断裂韧性.     

A novel method in determination of dynamic fracture toughness under mixed mode I/II impact loading

The objective of this paper is to propose a novel methodology for determining dynamic fracture toughness (DFT) of materials under mixed mode I/II impact loading. Previous experimental investigations on mixed mode fracture have been largely limited to qusi-static conditions, due to difficulties in the generation of mixed mode dynamic loading and the precise control of mode mixity at crack tip, in absence of sophisticated experimental techniques. In this study, a hybrid experimental–numerical approach is employed to measure mixed mode DFT of 40Cr high strength steel, with the aid of the split Hopkinson tension bar (SHTB) apparatus and finite element analysis (FEA). A fixture device and a series of tensile specimens with an inclined center crack are designed for the tests to generate the components of mode I and mode II dynamic stress intensity factors (DSIF). Through the change of the crack inclination angle β (=90°, 60°, 45°, and 30°), the K_II/K_I ratio is successfully controlled in the range from 0 to 1.14. A mixed mode I/II dynamic fracture plane, which can also exhibit the information of crack inclination angle and loading rate at the same time, is obtained based on the experimental results. A safety zone is determined in this plane according to the characteristic line. Through observation of the fracture surfaces, different fracture mechanisms are found for pure mode I and mixed mode fractures.     

Effects of adhesive thickness on global and local Mode-I interfacial fracture of bonded joints

The interfacial fracture of adhesively bonded structures is a critical issue for the extensive applications to a variety of modern industries. In the recent two decades, cohesive zone models (CZMs) have been receiving intensive attentions for fracture problems of adhesively bonded joints. Numerous global tests have been conducted to measure the interfacial toughness of adhesive joints. Limited local tests have also been conducted to determine the interface traction-separation laws in adhesive joints. However, very few studies focused on the local test of effects of adhesive thickness on the interfacial traction-separation laws. Interfacial toughness and interfacial strength, as two critical parameters in an interfacial traction-separation law, have important effect on the fracture behaviors of bonded joints. In this work, the global and local tests are employed to investigate the effect of adhesive thickness on interfacial energy release rate, interfacial strength, and shapes of the interfacial traction-separation laws. Basically, the measured laws in this work reflect the equivalent and lumped interfacial fracture behaviors which include the cohesive fracture, damage and plasticity. The experimentally determined interfacial traction-separation laws may provide valuable baseline data for the parameter calibrations in numerical models. The current experimental results may also facilitate the understanding of adhesive thickness-dependent interface fracture of bonded joints.     

EXPERIMENTAL INVESTIGATIONS OF STRENGTH,TOUGHNESS AND FAILURE MECHANISM OF THE METAL/EPOXY/METAL ADHESIVE SYSTEM

本文系统地开展了金属/环氧/金属胶结体系的强韧机理及失效行为实验研究,针对铝合金圆棒与铝合金圆棒通过环氧树脂胶层的各种斜截面方向粘结,实验观测了该体系的拉伸变形和失效行为,测量了界面失效载荷对胶层厚度和粘结界面倾斜角的依赖关系;通过引入胶结界面平均正应力、平均剪应力、平均正应变、平均剪应变等概念,可对界面失效强度进行测量,获得界面强度与界面粘结角度以及胶层厚度的关系,进而获得了铝合金/环氧胶层/铝合金体系的强度失效面以及胶结界面的断裂能和胶结体系的能量释放率.上述研究结果为深入认识金属胶结体系的强韧性能和失效机制提供了科学依据,对金属胶结体系的优化设计和性能评判具有重要指导意义.研究结果表明,铝合金/环氧胶层/铝合金体系的拉伸失效总体呈弹脆性破坏特征,失效表现为胶层粘结界面的断裂,失效强度和界面断裂能在胶层厚度为百微米量级时表现出强烈的尺度效应：界面粘结强度随着胶层厚度的减小而显著增大,临界状态的平均正应力和平均剪应力在强度破坏面上近似位于同一圆上,界面断裂能随着胶层厚度的减小而显著减小;与此同时,界面失效强度和界面断裂能也密切依赖于界面粘结角度.     

Mixed-mode interfacial adhesive strength of a thin film on an anisotropic substrate

The mixed-mode interfacial adhesion strength between a gold (Au) thin film and an anisotropic passivated silicon (Si) substrate is measured using laser-induced stress wave loading. Test specimens are prepared by bonding a fused silica (FS) prism to the back side of a 〈1 0 0〉 Si substrate with a thin silicon nitride (Si_xN_y) passivation layer deposited on the top surface. A high-amplitude stress wave is developed by pulsed laser ablation of a sacrificial absorbing layer on one of the lateral surfaces of the FS prism. Due to the negative non-linear elastic properties of the FS, the compressive stress wave evolves into a decompression shock with fast fall time. Careful selection of the incident angle between the pulse and the FS/Si interface generates a mode-converted shear wave in refraction, subjecting the Si_xN_y/Au thin film interface to dynamic mixed-mode loading, sufficient to cause interfacial fracture. A detailed analysis of the anisotropic wave propagation combined with interferometric measurements of surface displacements enables calculation of the interfacial stresses developed under mixed-mode loading. The mixed-mode interfacial strength is compared to the interfacial strength measured under purely tensile loading.     

FRP-混凝土界面粘结行为的参数影响研究

FRP-混凝土界面的粘结性能对FRP加固混凝土结构力学行为和破坏模式有着重要影响。本文对表征FRP-混凝土界面粘结性能的三个重要参数(界面初始刚度、最大剪应力、界面破坏能)开展研究,通过13个单剪试件的试验考察了混凝土强度、胶层厚度和粘结长度等因素对界面粘结行为的影响,根据试验结果拟合了界面破坏能、最大剪切应力与胶层剪切刚度、混凝土强度之间的函数关系。在试验研究基础上,构建了外贴FRP-混凝土界面粘结的有限元模型。通过有限元分析考察了界面破坏能等三个参数不变的前提下,不同的局部粘结滑移本构关系对界面粘结行为的影响;进而研究了其中一个参数变化时引起的界面粘结性能改变。研究结果表明:界面粘结承载力随着胶层厚度增加而逐渐提高;胶层厚度与界面破坏能成正比,与峰值剪应力成反比;当界面破坏能等三个参数保持不变时,局部粘结滑移本构关系对FRP-混凝土界面粘结性能的影响较小;三个参数中的一个增大时将延缓界面破坏的过程。     

An inclined surface crack subject to biaxial loading

The elastic–plastic stress fields and mode mixity parameters for semi-elliptical surface cracks on biaxial loaded plates have been investigated using detailed three-dimensional finite element calculations. Different degrees of mode mixity are given by combinations of the far-field stress level, biaxial stress ratio and inclined crack angle. These analyses were performed for different surface flaw geometries to study the combined load biaxiality and mode mixity effects on the crack-front stress fields and the size and shape of the plastic zones. It is clear from considering the local stress distributions along the crack front that the elastic crack tip singularities have been derived for several particular cases of mixed mode biaxial loading. By theoretical analysis, the new formulae have been introduced for both the elastic and plastic mode-mixity parameters, accounting for ratios between the I/II, II/III and III/I modes. Particular attention was paid to the strong variations of the mode-mixity parameters along the semi-elliptical surface crack front. The mixed-mode behavior of the crack growth direction angle along the semi-elliptical crack front for different combinations of biaxial loading and inclination crack angles was also determined. It was done using methods based on the maximum tangential stress and the strain energy density criteria.     

Local Interface Shear Fracture of Bonded Steel Joints with Various Bondline Thicknesses

Interfacial fracture is a critical issue for extensive applications of adhesively bonded structures to a variety of modern industries. Extensive global experimental tests have been conducted to measure the global behavior of adhesively bonded joint, such as ultimate load capacity and toughness. Recently, several studies have also been employed to characterize the local interfacial traction–separation laws. However, very few tests have investigated the dependency of the local interfacial constitutive laws on the adhesive thickness, particularly, under Mode-II loading conditions. In this work, six typical adhesive thicknesses (from 0.1 mm to 1.0 mm) are prepared for the bonded joints with a configuration of end notched flexure (ENF) specimen to realize the Mode-II fracture loading (shear fracture). With a recently developed analytical model, the global energy release rates of the ENF specimens are experimentally measured. Meanwhile, with the image analysis technique, the local slips between the two adherends are obtained. Finally, based on the J-integral theory, the local interfacial constitutive laws at different bondline thicknesses are obtained. Several experimental findings are reported in this work. This work may provide valuable baseline experimental data for the input in cohesive zone model (CZM) based analytical and numerical simulations.     

Residual stress analysis of joints of ceramics and metals

Development of reliable bonding techniques for ceramics and metals is considered to be very important for more useful applications of ceramics to machinery parts. However, a high thermal stress concentration occurs at the corner of bonded interface in ceramics during the bonding process. This occurs because of the difference in thermal properties of the bond materials and reduces the strength of the bonded joint considerably.The authors have been investigating various methods for effectively decreasing this stress concentration. In this paper, they present theoretical and experimental evidence that the stress concentration can be successfully diminished by varying the apex angle of joints. It is found that the tensile strength of joints increases as the apex angle of metals decreases from 90 deg to 45 deg. It also increases with increasing the apex angle of metals. Numerical calculations confirm these experimental results and the proposed procedure may be useful in the design and manufacture dissimilar joints.Paper was presented at the 1992 SEM Spring Conference on Experimental Mechanics held in Las Vegas, NV on June 8–11.     

Atomistic/continuum simulation of interfacial fracture part I: Atomistic simulation

The phenomenon of interfacial fracture, as manifested by atomistic cleavage, debonding and dislocation emission provides a challenge for combined atomistic-continuum analysis. As a precursor for fully coupled atomistic-continuum simulation^[1] of interfacial fracture, we focus here on the atomistic behavior within a nanoscopic core surrounding the crack tip. The inter-atomic potential under Embedded Atom Method is recapitulated to form an essential framework of atomistic simulation. The calculations are performed for a side-cracked disc configuration under a remoteK field loading. It is revealed that a critical loading rate defines the brittle-to-ductile transition of homogeneous materials. We further observe that the near tip mode mixity dictates the nanoscopic profile near an interfacial crack tip. A zigzag interface structure is simulated which plays a significant role in the dislocation emission from an interfacial crack tip, as will be explored in the second part of this investigation. The project supported by the National Natural Science Foundation of China     

Telephone cord buckles—A relation between wavelength and adhesion

Thin films with low adhesion and large residual stresses may buckle. The resulting morphologies are varied, but one of the most commonly observed is an intriguing oscillating pattern – the so-called “telephone cord” – which has been extensively investigated in the recent years. We have studied the kinematics of formation of telephone cords using a geometrically non-linear plate model and mode dependent interfacial toughness, captured via a cohesive zone. Through extensive Finite Element Simulations, we have demonstrated a simple, non-trivial relation between telephone cord wavelength and interfacial toughness. To validate this prediction, highly stressed Mo thin films were deposited on Si wafers, with a well defined interface and very reproducible adhesion. Studying the morphology of the resulting buckles for different film thicknesses and stresses, we observed a trend which was fully consistent with our simulation results. From the data fit, an adhesion energy of 0.58±0.04 J m⁻² for the SiO₂/Ag interface was inferred, which compares well with literature estimates.