Effect of T-stress on the mode-I fracture toughness of concrete

T-stress expressions are provided for three-point bending (TPB) beams and compact tension (CT) specimens and then its influence on mode I fracture toughness of concrete is investigated. The study shows that T-stress is dependent on the specimen's geometry and the material's property as well, and for TPB and CT specimens of regular size, T-stress is so small that its consequences can be neglected. The study also indicates that concrete specimen size should be carefully chosen to make sure the existence of K-dominance ahead of the crack tip, thus fracture toughness extracted from these specimen configurations can be reliable.     

Formulation of strain gradient plasticity with interface energy in a consistent thermodynamic framework

In this work, the strain gradient formulation is used within the context of the thermodynamic principle, internal state variables, and thermodynamic and dissipation potentials. These in turn provide balance of momentum, boundary conditions, yield condition and flow rule, and free energy and dissipative energies. This new formulation contributes to the following important related issues: (i) the effects of interface energy that are incorporated into the formulation to address various boundary conditions, strengthening and formation of the boundary layers, (ii) nonlocal temperature effects that are crucial, for instance, for simulating the behavior of high speed machining for metallic materials using the strain gradient plasticity models, (iii) a new form of the nonlocal flow rule, (iv) physical bases of the length scale parameter and its identification using nano-indentation experiments and (v) a wide range of applications of the theory. Applications to thin films on thick substrates for various loading conditions and torsion of thin wires are investigated here along with the appropriate length scale effect on the behavior of these structures. Numerical issues of the theory are discussed and results are obtained using Matlab and Mathematica for the nonlinear ordinary differential equations (NODE) which constitute the boundary value problem.This study reveals that the micro-stress term has an important effect on the development of the boundary layers and hardening of the material at both hard and soft interface boundary conditions in thin films. The interface boundary conditions are described by the interfacial length scale and interfacial strength parameters. These parameters are important to control the size effect and hardening of the material. For more complex geometries the generalized form of the boundary value problem using the nonlocal finite element formulation is required to address the problems involved.     

Determination of the yield properties of thin films using enhanced coherent gradient sensing

This paper describes coherent gradient sensing (CGS) as an optical, full-field, real-time, nonintrusive, noncontact technique for measurement of curvature and curvature changes in single-layered and multilayered thin films deposited on substrates. The sensitivity of the basic CGS technique is enhanced using optical fringe multiplication to map curvature in very flat specimens (k0.001 m^–1). Subsequently, this curvature measurement technique is applied to the determination of the yield properties of thin films subjected to cyclic thermomechanical loading.     

Modeling the interfacial effect on the yield strength and flow stress of thin metal films on substrates

It is shown in this paper that interfacial effects have a profound impact on the scale-dependent yield strength and strain hardening rates (flow stress) of metallic thin films on elastic substrates. This is achieved by developing a higher-order strain gradient plasticity theory based on the principle of virtual power and the laws of thermodynamics. This theory enforces microscopic boundary conditions at interfaces which relate a microtraction stress to the interfacial energy at the interface. It is shown that the film bulk length scale controls the size effect if a rigid interface is assumed whereas the interfacial length scale dominates if a compliant interface is assumed.     

Study of size effects in thin films by means of a crystal plasticity theory based on DiFT

In a recent publication, we derived the mesoscale continuum theory of plasticity for multiple-slip systems of parallel edge dislocations, motivated by the statistical-based nonlocal continuum crystal plasticity theory for single-glide given by Yefimov et al. [2004b. A comparison of a statistical-mechanics based plasticity model with discrete dislocation plasticity simulations. J. Mech. Phys. Solids 52, 279-300]. In this dislocation field theory (DiFT) the transport equations for both the total dislocation density and geometrically necessary dislocation (GND) density on each slip system were obtained from the Peach-Koehler interactions through both single and pair dislocation correlations. The effect of pair correlation interactions manifested itself in the form of a back stress in addition to the external shear and the self-consistent internal stress. We here present the study of size effects in single crystalline thin films with symmetric double slip using the novel continuum theory. Two boundary value problems are analyzed: (1) stress relaxation in thin films on substrates subject to thermal loading, and (2) simple shear in constrained films. In these problems, earlier discrete dislocation simulations had shown that size effects are born out of layers of dislocations developing near constrained interfaces. These boundary layers depend on slip orientations and applied loading but are insensitive to the film thickness. We investigate the stress response to changes in controlled parameters in both problems. Comparisons with previous discrete dislocation simulations are discussed.     

Mechanical properties of ultrananocrystalline diamond thin films relevant to MEMS/NEMS devices

The mechanical properties of ultrananocrystalline diamond (UNCD) thin films were measured using microcantilever deflection and membrane deflection techniques. Bending tests on several free-standing UNCD cantilevers, 0.5 μm thick, 20 μm wide and 80 μm long, yielded elastic modulus values of 916–959 GPa. The tests showed good reproducibility by repeated testing on the same cantilever and by testing several cantilevers of different lengths. The largest source of error in the method was accurate measurement of film thickness. Elastic modulus measurements performed with the novel membrane deflection experiment (MDE), developed by Espinosa and co-workers, gave results similar to those from the microcantilever-based tests. Tests were performed on UNCD specimens grown by both micro and nano wafer-seeding techniques. The elastic modulus was measured to be between 930–970 GPa for the microseeding and between 945–963 GPa for the nanoseeding technique. The MDE test also provided the fracture strength, which for UNCD was found to vary from 0.89 to 2.42 GPa for the microseeded samples and from 3.95 to 5.03 for the nanoseeded samples. The narrowing of the elastic modulus variation and major increase in fracture strength is believed to result from a reduction in surface roughness, less stress concentration, when employing the nanoseeding technique. Although both methods yielded reliable values of elastic modulus, the MDE was found to be more versatile since it yielded additional information about the structure and material properties, such as strength and initial stress state.     

Plastic deformation of freestanding thin films: Experiments and modeling

Experimental measurements and computational results for the evolution of plastic deformation in freestanding thin films are compared. In the experiments, the stress-strain response of two sets of Cu films is determined in the plane-strain bulge test. One set of samples consists of electroplated Cu films, while the other set is sputter-deposited. Unpassivated films, films passivated on one side and films passivated on both sides are considered. The calculations are carried out within a two-dimensional plane strain framework with the dislocations modeled as line singularities in an isotropic elastic solid. The film is modeled by a unit cell consisting of eight grains, each of which has three slip systems. The film is initially free of dislocations which then nucleate from a specified distribution of Frank-Read sources. The grain boundaries and any film-passivation layer interfaces are taken to be impenetrable to dislocations. Both the experiments and the computations show: (i) a flow strength for the passivated films that is greater than for the unpassivated films and (ii) hysteresis and a Bauschinger effect that increases with increasing pre-strain for passivated films, while for unpassivated films hysteresis and a Bauschinger effect are small or absent. Furthermore, the experimental measurements and computational results for the 0.2% offset yield strength stress, and the evolution of hysteresis and of the Bauschinger effect are in good quantitative agreement.     

Distribution of dislocation source length and the size dependent yield strength in freestanding thin films

A method is proposed to estimate the size-dependent yield strength of columnar-grained freestanding thin films. The estimate relies on assuming a distribution of the size of Frank-Read sources, which is then translated into a log-normal distribution of the source strength, depending on film thickness, grain size and theoretical strength of the material, augmented with a single fit parameter. Two-dimensional discrete dislocation plasticity (DDP) simulations are carried out for two sets of Cu films and the fit parameter is determined from independent experiments. Subsequent DDP predictions of the stress-strain curves in comparison with the corresponding experimental data show excellent agreement of initial yield strength and hardening rate for films of varying film thickness and grain size. Having thus demonstrated the power of the proposed strength distribution, it is shown that the mode of this distribution governs the most effective source strength. This is then used to suggest a method to estimate the yield strength of thin films as a function of film thickness and grain size. Simple maps are presented that are in very good agreement with recent experimental results for Cu thin films.     

A methodology for determining mechanical properties of freestanding thin films and MEMS materials

We have developed a novel chip-level membrane deflection experiment particularly suited for the investigation of sub-micron thin films and microelectro-mechanical systems. The experiment consists of loading a fixed-fixed membrane with a line load applied at the middle of the span using a nanoindenter. A Mirau microscope interferometer is positioned below the membrane to observe its response in real time. This is accomplished through a micromachined wafer containing a window that exposes the bottom surface of the specimen. A combined atomic force microscope/nanoindenter incorporates the interferometer to allow continuous monitoring of the membrane deflection during both loading and unloading. As the nanoindenter engages and deflects the sample downward, fringes are formed and acquired by means of a CCD camera. Digital monochromatic images are obtained and stored at periodic intervals of time to map the strain field. Stresses and strains are computed independently without recourse to mathematical assumptions or numerical calibrations. Additionally, no restrictions on the material behavior are imposed in the interpretation of the data. In fact, inelastic mechanisms including strain gradient plasticity, piezo and shape memory effects can be characterized by this technique.The test methodology, data acquisition and reduction are illustrated by investigating the response of 1-μm thick gold membranes. A Young's modulus of , a yield stress of and a residual stress of are consistently measured. The post-yield behavior leading to fracture exhibits typical statistical variations associated to plasticity and microcrack initiation.     

Determination of mixed-mode stress intensity factors, fracture toughness, and crack turning angle for anisotropic foam material

A numerical and experimental investigation for determining mixed-mode stress intensity factors, fracture toughness, and crack turning angle for BX-265 foam insulation material, used by NASA to insulate the external tank (ET) for the space shuttle, is presented. BX-265 foam is a type of spray-on foam insulation (SOFI), similar to the material used to insulate attics in residential construction. This cellular material is a good insulator and is very lightweight. Breakup of segments of this foam insulation on the shuttle ET impacting the shuttle thermal protection tiles during liftoff is believed to have caused the space shuttle Columbia failure during re-entry. NASA engineers are interested in understanding the processes that govern the breakup/fracture of this material from the shuttle ET. The foam is anisotropic in nature and the required stress and fracture mechanics analysis must include the effects of the direction dependence on material properties. Material testing at NASA Marshall Space Flight Center (MSFC) has indicated that the foam can be modeled as a transversely isotropic material. As a first step toward understanding the fracture mechanics of this material, we present a general theoretical and numerical framework for computing stress intensity factors (SIFs), under mixed-mode loading conditions, taking into account the material anisotropy. We present SIFs for middle tension – M(T) – test specimens, using 3D finite element stress analysis (ANSYS) and FRANC3D fracture analysis software. SIF values are presented for a range of foam material orientations. Mode I fracture toughness of the material is determined based on the SIF value at failure load. We also present crack turning angles for anisotropic foam material under mixed-mode loading. The results represent a quantitative basis for evaluating the strength and fracture properties of anisotropic foam insulation material.     

A variational approach to the fracture of brittle thin films subject to out-of-plane loading

We address the problem of fracture in homogenous linear elastic thin films using a variational model. We restrict our attention to quasi-static problems assuming that kinetic effects are minimal. We focus on out-of-plane displacement of the film and investigate the effect of bending on fracture. Our analysis is based on a two-dimensional model where the thickness of the film does not need to be resolved. We derive this model through a formal asymptotic analysis. We present numerical simulations in a highly idealized setting for the purpose of verification, as well as more realistic micro-indentation experiments.     

Analytical solution for motion of an elliptical inclusion in gradient stress field

We present a rigorous analytical solution for motion of an elliptical inclusion in isotropic matrix driven by gradient stress field. The interfacial diffusion is considered as the dominant mechanism for the motion. We demonstrate that normal stress gradient on the interface is the major driven force, while the strain energy density gradient is negligible. A key prediction of the solution is that for a given inclusion the motion velocity is proportional to stress gradient only, indicating that the solution is applicable for inclusion motion in nonuniform stress field of varying stress gradient, and that the inclusion tends to move towards the region of lower stress in nonuniform stressed materials.     

Glass-modified stress waves for adhesion measurement of ultra thin films for device applications

Laser-generated stress wave profiles with rarefaction shocks (almost zero post-peak decay times) have been uncovered in different types of glasses and presented in this communication. The rise time of the pulses was found to increase with their amplitude, with values reaching as high as . This is in contrast to measurements in other brittle crystalline solids where pulses with rise times of and post-peak decay times of were recorded. The formation of rarefaction shock is attributed to the increased compressibility of glasses with increasing pressures. This was demonstrated using a one-dimensional nonlinear elastic wave propagation model in which the wave speed was taken as a function of particle velocity. The technological importance of these pulses in measuring the tensile strength of very thin film interfaces is demonstrated by using a previously developed laser spallation experiment in which a laser-generated compressive stress pulse in the substrate reflects into a tensile wave from the free surface of the film and pries off its interface at a threshold amplitude. Because of the rarefaction shock, glass-modified waves allow generation of substantially higher interfacial tensile stress amplitudes compared with those with finite post-peak decay profiles. Thus, for the first time, tensile strengths of very strong and ultra thin film interfaces can be measured. Results presented here indicate that interfaces of 185-nm-thick films, and with strengths as high as , can be measured. Thus, an important advance has been made that should allow material optimization of ultra thin layer systems that may form the basis of future MEMS-based microelectronic, mechanical and clinical devices.     

Influence of domain switching zones on the fracture toughness of ferroelectrics

The paper presents a fracture model for ferroelectric materials taking into account the hysteretic domain switching processes near to the tip of a macroscopic crack. The model is based on the balance of energy supplied by the driving forces, on the one hand, and the total of energies either dissipated by domain switching, stored in the crack wake region or consumed by the formation of new fracture surface, on the other hand. An internal variable theory describes the nonlinear coupled electromechanical material response within the framework of a three-dimensional continuum model. For simplicity, the complex orientation distribution function of domains in a polycrystalline ceramic is approximated by only six representative space orientations. The theory predicts certain dimensionless material parameter combinations which govern the change of fracture toughness under the application of different mechanical and electrical loadings. A comparison with data available in the literature for barium titanate ceramics yields a reasonable coincidence.     

Effect of interface stress on the fracture behavior of a nanoscale linear inclusion along the interface of bimaterials

This paper investigates the influence of residual interface tension on the fracture behavior of a nanoscale linear interface inclusion in a bimaterial matrix. Solutions to the inclusion opening displacement and the energy release rate are obtained. The results show that the interface effect on the inclusion deformation and inclusion tip field are prominent at nanoscale. Especially, the residual interface stress has a dramatic influence on the energy release rate. It is also found that the importance of the interface effect depends on the size of the inclusion, the shear modulus ratios of the bimaterial. The inclusion opening displacement and the energy release rate can be reduced considerably by decreasing the inclusion length at nanoscale.     

Coupling effects of void size and void shape on the growth of prolate ellipsoidal microvoid

The combined effects of void size and void shape on the void growth are studied by using the classical spectrum method. An infinite solid containing an isolated prolate spheroidal void is considered to depict the void shape effect and the Fleck-Hutchinson phenomenological strain gradient plasticity theory is employed to capture the size effects. It is found that the combined effects of void size and void shape are mainly controlled by the remote stress triaxiality. Based on this, a new size-dependent void growth model similar to the Rice-Tracey model is proposed and an important conclusion about the size-dependent void growth is drawn: the growth rate of the void with radius smaller than a critical radius r_c may be ignored. It is interesting that r_c is a material constant independent of the initial void shape and the remote stress triaxiality.The project supported by the National Natural Science Foundation of China (A10102006) and the New Century Excellent Talents in Universities of China. The English text was polished by Keren Wang.     

The brittle fracture criterion based on the maximum tensile stress on the surface of blunt crack tip

The brittle fracture criterion is developed for a blunted crack. The curvature radius of the blunt crack tip is suggested as a characteristic length for brittle materials, and then the fracture toughness of the brittle materials can be determined from the cohesion strength and the characteristic length of the materials.     

Effect of an adverse pressure gradient on the streamwise Reynolds stress profile maxima in a turbulent boundary layer

It is widely accepted that in a turbulent boundary layer （TBL） with adverse pressure gradient （APG） an outer peak usually appears in the profile of streamwise Reynolds stress. However, the effect of APG on this outer peak is not clearly understood. In this paper, the effect of APG is analysed using the numerical and experimental results in the literature. Because the effect of upstream flow is inherent in the TBL, we first analyse this effect in TBLs with zero pressure gradient on flat plates. Under the individual effect of upstream flow, an outer peak already appears in the profile of streamwise Reynolds stress when the TBL continues developing in the streamwise direction. The APG accelerates the appearance of the outer peak, instead of being a trigger.