Size-dependent bending of thin metallic films

Size-dependent large curvature pure bending of thin metallic films has been analytically studied taking into account the associated strengthening mechanisms at different thickness scales. The classical plasticity theory is applicable to films thicker than 100 μm. Consequently, their bending capacity is governed by the competition between the material hardening and the thickness reduction. For films with a thickness ranging from fractions of a micron to a few microns, in addition to the above mechanisms, the strain gradient effect plays an important role and introduces an internal length scale. When the film thickness reduces to the nano-scale, the strain gradient effect is gradually replaced by the dominant surface stress/energy effect.     

Mode II fracture behavior of a Zr-based bulk metallic glass

Shear band formation and fracture are characterized during mode II loading of a Zr-based bulk metallic glass. The measured mode II fracture toughness, K_IIc=75±4 MPa√m, exceeds the reported mode I fracture toughness by ∼4 times, suggesting that normal or mean stresses play a significant role in the deformation process at the crack tip. This effect is explained in light of a mean stress modified free volume model for shear localization in metallic glasses. Thermal imaging of deformation at the mode II crack tip further reveals that shear bands initiate, arrest, and reactivate along the same path, indicating that flow in the shear band leads to permanent changes in the glass structure that retain a memory of the shear band path. The measured temperature increase within the shear band is a fraction of a degree. However, heat dissipation models indicate that the temperature could have exceeded the glass transition temperature for less than 1 ms immediately after the shear band formed. It is shown that this time scale is sufficient for mechanical relaxation slightly above the glass transition temperature.     

Size effects in indentation response of thin films at the nanoscale: A molecular dynamics study

The indentation response of Ni thin films of thicknesses in the nanoscale was studied using molecular dynamics simulations with embedded atom method (EAM) interatomic potentials. A series of simulations were performed in films in the [1 1 1] orientation with thicknesses varying from 4 to 12.8 nm. The study included both single crystal films and films containing low angle grain boundaries perpendicular to the film surface. The simulation results for single crystal films show that as film thickness decreases larger forces are required for similar indentation depths but the contact stress necessary to emit the first dislocation under the indenter is nearly independent of film thickness. The low angle grain boundaries can act as dislocation sources under indentation. The mechanism of preferred dislocation emission from these boundaries operates at stresses that are lower as the film thickness increases and is not active for the thinnest films tested. These results are interpreted in terms of a simple model.     

Fracture toughness of CIP-HIP Beryllium at elevated temperatures

The fracture toughness of CIP-HIP Beryllium was determined using the short bar fracture toughness (K_IcSB) method. The K_IcSB value measured was 10.96 MPa√m at room temperature. This falls well within the expected range of 9 to 12 MPa√m as observed from previous fracture toughness measurements of beryllium. Toughness increased rapidly between 400°F and 500°F reaching a value of 16.7 MPa√m at 500°F.     

Measurement of liquid film thickness in a micro parallel channel with interferometer and laser focus displacement meter

In the present study, liquid film thicknesses in parallel channels with heights of H = 0.1, 0.3 and 0.5 mm are measured with two different optical methods, i.e., interferometer and laser focus displacement meter. Ethanol is used as a working fluid. Liquid film thicknesses obtained from two optical methods agree very well. At low capillary numbers, dimensionless liquid film thickness is in accordance with Taylor’s law. However, as capillary number increases, dimensionless liquid film thickness becomes larger than Taylor’s law for larger channel heights. It is attributed to the dominant inertial effect at high capillary numbers. Using channel height H for dimensionless liquid film thickness δ₀/H and hydraulic diameter D_h = 2H as the characteristic length for Reynolds and Weber numbers, liquid film thickness in a parallel channel can be predicted well by the circular tube correlation previously proposed by the authors. This is because curvature differences between bubble nose and flat film region are identical in circular tubes and parallel channels.     

Effects of lattice incompatibility-induced hardening on the fracture behavior of ductile single crystals

Plane-strain mode-I cracks in a ductile single crystal are studied under conditions of small scale yielding. The specific case of a (0 1 0) crack growing in the [1 0 1] direction for an FCC crystal is considered. Crack initiation and its subsequent growth are computed by specifying a traction-separation relation in the crack plane ahead of the crack tip. The crystal is characterized by a hardening model that incorporates physically motivated gradient effects. Significant traction elevation ahead of the crack tip is obtained by incorporating such effects, allowing a better basis for the explanation of experimentally observed cleavage in the presence of substantial plastic flow in slowly deforming ductile materials. Resistance curves based on parameters characterizing the fracture process and the continuum properties of the crystal are computed. Simulation results indicate that the length-scale of the lattice incompatibility-dominated region has to be comparable or larger than the length of the fracture process zone for gradient effects to have a significant effect on fracture resistance. Both the work of separation and the peak separation stress also play important roles in determining the fracture resistance of the crystal.     

Dislocation shielding and flaw tolerance in titanium nitride

Titanium nitride is a very brittle and flaw sensitive ceramic material at temperatures below 750 °C. In this study, we present experimental evidence of room temperature dislocation-based plasticity in the material as well as insensitivity to flaws in form of single edge notches. We performed in-situ fracture experiments inside the transmission electron microscope on 150-300 nm thick, 5 μ wide freestanding films fabricated from titanium nitride/titanium multi-layers with titanium nitride as the notched and titanium as un-notched layers. The calculated stress concentration factor for the 800 nm to 1.5 μ long notches were greater than 8, however, the terminal cracks always nucleated at the un-notched edge of the specimens and not at the notch tip. To explain such remarkable flaw tolerance, we observe motion of dislocations (pre-existing and nucleated away from the notch) towards the notch tip. We suggest that the room temperature dislocation activities are facilitated by the residual stresses in the multi-layer specimens and the thickness dependence of image forces, which reduces the effective shear modulus to promote dislocation motion. The migration of dislocations towards the notch tip shields it from stress concentration to manifest the flaw tolerance in 150 nm specimens, which is observed real time in the microscope.     

A microbeam bending method for studying stress-strain relations for metal thin films on silicon substrates

We have developed a microbeam bending technique for determining elastic-plastic, stress-strain relations for thin metal films on silicon substrates. The method is similar to previous microbeam bending techniques, except that triangular silicon microbeams are used in place of rectangular beams. The triangular beam has the advantage that the entire film on the top surface of the beam is subjected to a uniform state of plane strain as the beam is deflected, unlike the standard rectangular geometry where the bending is concentrated at the support. To extract the average stress-strain relations for the film, we present a method of analysis that requires computation of the neutral plane for bending, which changes as the film deforms plastically. This method can be used to determine the elastic-plastic properties of thin metal films on silicon substrates up to strains of about 1%.Utilizing this technique, both yielding and strain hardening of Cu thin films on silicon substrates have been investigated. Copper films with dual crystallographic textures and different grain sizes, as well as others with strong 〈1 1 1〉 textures have been studied. Three strongly textured 〈1 1 1〉 films were studied to examine the effect of film thickness on the deformation properties of the film. These films show very high rates of work hardening, and an increase in the yield stress and work hardening rate with decreasing film thickness, consistent with current dislocation models.     

Strain strengthening effects in Witwatersrand quartzite

A series of uniaxial compression specimens were tested over a range of applied ram displacement rates of 8.9 × 10⁻⁴ to 8.9 mm/sec to elucidate the effects of loading rate on the uniaxial compressive fracture stress of Witwatersrand quartzite. It was demonstrated that even within standard loading rate ranges, considerable scatter in the fracture strength (under uniaxial compression) existed in this particular quartzite rock. Nevertheless, a definite trend of increasing fracture resistance with increasing monotonic loading rate was evident inasmuch that increasing the loading rate (strain rate) by four orders of magnitude increase the fracture strength by almost 2.8 times. Prior fatigue loading also produced a significant strain strengthening as the uniaxial compressive fracture stress tended to increase in a sigmoidal fashion with increasing number of fatigue cycles prior to testing. Indeed, the fracture strength of quartzite was almost doubled in value after 10⁻ cycles. Plane strain fracture toughness tests utilising three point bend specimens were conducted and an average of K_lc = 1.7 MPa√m was realized. In both the uniaxial compression tests and the fracture toughness tests, failure occurred by crack extension predominantly by a transgranular flat cleavage-like mode through pure quartzite (silica) regions. However, crack extension was also observed to occur in an intergranular “ductile-like” mode through areas associated with inclusions prevalent in the quartzite.     

Fracture in Microscale SU-8 Polymer Thin Films

In this work, the fracture of spin coated SU-8 epoxy thin films was investigated under mode I loading using in situ optical experiments on specimens with double edge notched tensile geometry. A method was developed to fabricate 3 μm thick SU-8 films with tapered Chevron type notches using a combination of electron beam and ultra-violet lithography techniques. Subsequently, through speckle patterning under tensile loading, the local deformation fields around the crack tip were extracted using digital image correlation. Since the notches were tapered through the thickness, a crack nucleated from them and grew stably until it spanned the entire thickness before propagating unstably leading to catastrophic failure. As SU-8 underwent brittle fracture with no evidence of a large process zone, the critical energy release rate, J _{I C} was computed from deformation fields, and was found to be 106.6 ± 12.03 J /m ². As the film thickness was small compared to lateral dimensions, assuming plane stress conditions, the critical stress intensity factor was calculated as 0.57 ± 0.03 MPa\(\sqrt {m}\). Furthermore, to assess the validity of the experimental method, a finite element simulation on the exact specimen geometry was conducted with experimentally evaluated far field displacement boundary conditions. The strain fields and J-integral value obtained from the simulation were in good agreement with the experimental results, implying the validity of the in situ experimental method proposed given the challenges of small scale specimens. Furthermore, using fractography and optical imaging it was confirmed that the unstable crack propagation started once the crack front reached full thickness, thereby providing sharp crack at the time of failure, which is necessary for brittle materials for valid fracture toughness experiment. It is expected that the proposed methods of specimen preparation and fracture experiments on microscale polymer thin films can be used on other materials.     

Evaluation Using Digital Image Correlation of Stress Intensity Factors in an Aerospace Panel

The fracture behavior of a crack propagating in a large (4.8 m × 1.4 m) aircraft panel was investigated quantitatively by experiment for the first time using digital image correlation. Mixed mode (I+II) stress intensity factors were evaluated using a methodology, which combined digital image correlation with the multi-point over-deterministic method to fit displacement field equations to the experimental data from around a crack tip. More than 800 images were taken during a 10-minute time period as the fracture of the panel occurred under monotonic loading. It was observed that the crack propagated through the skin of the panel at a relatively low speed, with an average crack tip velocity of 0.014 mm/s, and changed its propagation direction at particular points due to the reinforcement of the structure. In the later stages of the test, substantial shear lips were observed indicating a state of plane stress as would be expected in a thin, wide panel and the size of the plastic zone increased substantially. The value of the mode I stress intensity factor obtained from the measured displacement fields initially increased linearly to around 50 MPa√m (K_Ic = 37 MPa√m) and afterwards non-linearly reaching 300 to 400 MPa√m for crack extensions of the order of 100 mm. It is proposed that these high values of stress intensity factor do not represent an unrealistically high material fracture toughness but rather are indicative of the high resistance to crack growth of the structural assemblage of ribs, stringers and hole reinforcements in the panel which allow the skin to sustain a strain level that would otherwise cause unstable crack growth. Digital image correlation is demonstrated to be particularly powerful in elucidating this structural behavior.     

四面体无定型无氢非晶碳膜的制备及其摩擦学性能研究

采用磁过滤阴极真空弧系统分别在硅片[Si(100)]、W18Cr4V高速钢和Cr18Ni9不锈钢基体上沉积了一系列sp3键含量较高的四面体无定型无氢非晶碳膜(ta-C),研究了所合成薄膜的结构、硬度、附着强度和摩擦磨损性能,考察了基体和薄膜厚度对薄膜摩擦系数的影响,简要分析了相应ta-C膜的失效机理.结果表明,在高速钢基体上沉积的ta-C膜的显微硬度为76 GPa,结合力Lc值达42 N,具有优良的摩擦学性能,其摩擦系数为0.12,且摩擦系数可以在16 000 r范围内保持稳定.     

纳米压痕法测磁控溅射铝薄膜屈服应力

为了在考虑残余应力下测量出磁控溅射铝薄膜的屈服应力,提出了一种实验测量方法,通过曲率测试法和球形压头纳米压痕法测出磁控溅射铝薄膜的屈服应力．建立球形压痕力学模型,并用ANSYS对球形压痕进行力学有限元仿真,利用直流磁控溅射技术在硅基上淀积一层1 μm厚的铝薄膜,首先通过曲率测试法测量膜内等双轴残余应力,再利用最小二乘曲线拟合法从薄膜/基底系统的球形压头纳米压痕实验数据中提取出铝薄膜的屈服应力,测得磁控溅射铝薄膜的屈服应力为371 MPa．该方法也可以用来研究其他材料的薄膜和小体积材料的力学特性．     

Fatigue crack initiation life of fine grain brass H62

Fine grain alloys possess excellent properties entailing high strength and toughness. Fine brass H62 is made by re-crystallization with grain size ranging from 5 to 10 μm. Fatigue initiation life is investigated from specimens tested on Instron 1341 machine a frequency of 30 Hz. Furthermore fatigue crack initiation life of this fine brass H62 is predicted by the energetic approach. It is found that: (1) the finer the grain size, the longer the fatigue life, which is due to its higher toughness; (2) intergranular cracking is the main mechanism of fatigue failure. Concave pits were found in the zone of fatigue crack propagation; and (3) the energetic approach gave acceptable fatigue crack initiation life estimation.     

The fracture toughness of planar lattices: Imperfection sensitivity

The imperfection sensitivity of in-plane modulus and fracture toughness is explored for five morphologies of 2D lattice: the isotropic triangular, hexagonal and Kagome lattices, and the orthotropic 0/90^° and ±45^° square lattices. The elastic lattices fail when the maximum local tensile stress at any point attains the tensile strength of the solid. The assumed imperfection comprises a random dispersion of the joint position from that of the perfect lattice. Finite element simulations reveal that the knockdown in stiffness and toughness are sensitive to the type of lattice: the Kagome and square lattices are the most imperfection sensitive. Analytical models are developed for the dependence of modes I and II fracture toughness of the 0/90^° and ±45^° lattices upon relative density. These models explain why the mode II fracture toughness of the 0/90^° lattice has an unusual functional dependence upon relative density.     

Equivalent thickness conception for corner cracks

Thickness dependence of the one-parameter-based fracture toughness has been well recognized and widely studied. However, it is still a challenge to predict the fracture of structures with curved cracks from the fracture toughness data obtained from the standard through-the-thickness cracked specimens. The complicated three-dimensional (3D) stress fields near the crack front play a vital role in the fracture strength of materials. Based on a systematical numerical study of the 3D stress fields near the crack tip of quarter elliptic corner cracks and comparison with that of ideal through-the-thickness cracks, an equivalent thickness conception for curved cracks is proposed from the viewpoint of out-of-plane constraint, and a semi-analytical solution for the equivalent thickness of corner cracks is obtained. With the evaluated equivalent thickness, the fracture toughness of corner cracked specimens is predicted efficiently by the plane-strain toughness value of the material obtained from the standard through-the-thickness specimen.     

Interlaminar fracture toughness of graphite/epoxy composite under mixed-mode deformations

An antisymmetric test fixture is employed to investigate interlaminar fracture behavior in graphite/epoxy composite material under mixed-mode deformations. Finite correction factors for the graphite/epoxy fracture specimen with various crack lengths are used to determine the interlaminar fracture toughness by finite-element stress analysis. Interlaminar fracture characteristics of graphite/epoxy composite material under mode-I, mode-II and mixed-mode deformations are evaluated experimentally. A mixed-mode fracture criterion is also investigated to obtain information on mixedmode interlaminar fracture behavior of graphite/epoxy composite material.Paper was presented at the 1988 SEM Spring Conference on Experimental Mechanics held in Portland, OR on June 5–10.     

Experimental investigation of interparticle collision in the upper dilute zone of a cold CFB riser

Interparticle collision plays an important role in the mechanics of gas–solid two-phase flows. The paper presents direct measurements of collision rate as well as collision properties of spherical glass beads with sizes of 500 ± 50 μm in the upper dilute zone of a cold pilot-scale CFB riser, by using a high-speed imaging system. The recording rate of the high-speed digital camera is as high as 5000 fps with a resolution of 640 × 480. A large number of particle movement images at a height of 3.54 m above the distributor plates were taken. Manual inspection and automatic methods based on digital image processing algorithms were carried out to analyze particle image sequences. The experimental results show that the measured particle collision rate is proportional both to the particles’ average relative translational velocity and the square of the particle number density, which coincides with the collision theory derived according to the analogy of kinetic theory of gases. But the theoretical model is found to overestimate the real collision rates, and a coefficient a of 0.33 may be used to correct this discrepancy. The possible reasons for this discrepancy are also discussed. The measurement results of collision properties based on more than 50 particle collision events agrees well with Walton’s hard-sphere collision model. The three collision parameters, i.e., the average coefficient of friction μ, the normal and tangential coefficients of restitution e and β₀, for the glass beads used are measured to be 0.175 ± 0.005, 0.96 ± 0.02, and 0.43 ± 0.09, respectively.     

Experimental study on axial development of liquid film in vertical upward annular two-phase flow

Accurate measurements of the interfacial wave structure of upward annular two-phase flow in a vertical pipe were performed using a laser focus displacement meter (LFD). The purpose of this study was to clarify the effectiveness of the LFD for obtaining detailed information on the interfacial displacement of a liquid film in annular two-phase flow and to investigate the effect of axial distance from the air–water inlet on the phenomena. Adiabatic upward annular air–water flow experiments were conducted using a 3 m long, 11 mm ID pipe. Measurements of interfacial waves were conducted at 21 axial locations, spaced 110 mm apart in the pipe. The axial distances from the inlet (z) normalized by the pipe diameter (D) varied over z/D = 50–250. Data were collected for predetermined gas and liquid flow conditions and for Reynolds numbers ranging from Re_G = 31,800 to 98,300 for the gas phase and Re_L = 1050 to 9430 for the liquid phase. Using the LFD, we obtained such local properties as the minimum thickness, maximum thickness, and passing frequency of the waves. The maximum film thickness and passing frequency of disturbance waves decreased gradually, with some oscillations, as flow developed. The flow development, i.e., decreasing film thickness and passing frequency, persisted until the end of the pipe, which means that the flow might never reach the fully developed state. The minimum film thickness decreased with flow development and with increasing gas flow rate. These results are discussed, taking into account the buffer layer calculated from Karman’s three-layer model. A correlation is proposed between the minimum film thickness obtained in relation to the interfacial shear stress and the Reynolds number of the liquid.     

Evaluation of the Material Properties of an OFHC Copper Film at High Strain Rates Using a Micro-Testing Machine

The material properties of an oxygen-free high thermal conductivity (OFHC) film with a thickness of 0.1 mm were evaluated at strain rates ranging from 10⁻³/s to 10³/s using a high-speed material micro-testing machine (HSMMTM). The high strain-rate material properties of thin films are important especially for an evaluation of the structural reliability of micro-formed parts and MEMS products. The high strain-rate material testing methods of thin films, however, have yet to be established to the point that the testing methods of larger specimens for electronics, auto-body, train, ship, and ocean structures are. For evaluation, a new type of HSMMTM was developed to conduct high-speed tensile tests of thin films. This machine is capable of testing at a sufficiently high tensile speed with an electromagnetic actuator, a novel gripping mechanism, and an accurate load measurement system. The OFHC copper film shows high strain-rate sensitivity in terms of the flow stress, fracture elongation, and strain hardening. These measures increase as the tensile strain rate increases. The rate-dependent material properties of an OFHC copper film are also compared with those of a bulk OFHC copper sheet with a thickness of 1 mm. The flow stress of an OFHC copper film is relatively low compared to that of a bulk OFHC copper sheet in the entire range of strain rates, while the fracture elongation of an OFHC copper film is much larger than that of a bulk OFHC copper sheet. A quantitative comparison would provide material data at high strain rates for the design and analysis of micro-appliances and different types of micro-equipment.