圆筒和圆柱残余应力沿层深分布的X射线测定

在圆筒或圆柱的剥层Ｘ射线应力测定中，可以用幂级数来分段近似剥离面的实测切向应力一层深函数和实测轴向应力一层深函数，从而计算剥层应力释放所产生的附加应力，求得原始的真实径向、切向和轴向应力沿半径方向的分布，文中给出计算应力校正量的公式。     

X-ray Diffraction Technique with Imaging Plate for Detecting Surface Distribution of Residual Stress in Diaphysis of Bovine Femurs

Stress measurements of bone are essential for evaluating the risk of bone fracture, the cure of bone diseases (e.g., osteoporosis), and the bone adaptation. Previously, a method using X-ray diffraction (XRD) was used to assess the presence of residual stress in the diaphysis of bovine and rabbit extremities. However, the previous method required a complicated experimental setup, long irradiation time, and limitations of the sample size. To profoundly enhance the understanding of distribution and biomechanical implications of bone residual stresses, it is necessary to develop an alternative method that features a simple setup without limitations on the sample size and shape. An imaging plate (IP) can obtain the two-dimensional distribution of hydroxyapatite crystal deformation and has the potential to resolve the previously mentioned issues. The aim of this study was to develop a measurement system using an XRD technique with an IP for obtaining the surface distribution of residual stress in the diaphysis of extremities. A mid-diaphysis specimen taken from an adult bovine femur was irradiated with characteristic Mo-Kα X-rays under no external forces and the diffracted X-rays were detected by an IP in the reflection side. The residual stress in the bone axis was calculated from the XRD pattern. As a result, tensile residual stresses were detected at the diaphyseal surface, corresponding to the results of the previous method. The developed system reduced the irradiation time by two thirds and the limitations of the sample size were removed.     

Residual Stress Determination by Hole Drilling Combined with Optical Methods

An overview is provided of the use of eight different optical methods with hole drilling to determine residual stresses. The methods considered are: brittle and photoelastic coatings, Moire interferometry, holographic interferometry, electronic speckle pattern interferometry, interferometric strain rosette, digital image correlation and shearography. A number of applications are summarized, such as the use of hole drilling with holographic interferometry to investigate stresses in rock structures accessed by deep boreholes and to determine manufacturing-induced residual stresses in fillets of small radii.     

Non-destructive Surface Residual Stress Profiling by Multireflection Grazing Incidence X-Ray Diffraction: a 7050 Al Alloy Study

Experimental Mechanics - The multireflection grazing incidence X-ray diffraction method (MGIXD) was used to analyze the surface residual stresses in 7050 Al alloy samples. This technique can...     

Quantifying Three-Dimensional Residual Stress Distributions Using Spatially-Resolved Diffraction Measurements and Finite Element Based Data Reduction

Residual stress can play a significant role in the processing and performance of an engineered metallic component. The stress state within a polycrystalline part can vary significantly between its surface and its interior. To measure three-dimensional (3D) residual stress fields, a synchrotron x-ray diffraction-based experimental technique capable of non-destructively measuring a set of lattice strain pole figures (SPFs) at various surface and internal points within a component was developed. The resulting SPFs were used as input for a recently developed bi-scale optimization scheme McNelis et al. J Mech Phys Sol 61:428–1007 449 (2013) that combines crystal-scale measurements and continuum-scale constraints to determinethe 3D residual stress field in the component. To demonstrate this methodology, the 3D residual stress distribution was evaluated for an interference-fit sample fabricated from a low solvus high refractory (LSHR) polycrystalline Ni-base superalloy.     

Neutron Diffraction Analysis of Complete Residual Stress Tensors in Conventional and Rolled Gas Metal Arc Welds

Mitigation of residual stress in an arc weld by high-pressure rolling of the weld seam has been investigated using neutron diffraction. Rolling was found to greatly improve the residual stress distribution, causing significant compressive stresses at the weld line. A novel aspect of the data presented is that at each measurement location, normal strains in nine separate directions were evaluated, enabling calculation of the complete strain and stress tensors. It is thus confirmed that the principal stress directions generally lay close to the specimen coordinate axes (i.e. that they are well-aligned with the direction of welding and rolling), and that rolling does not cause any significant additional residual stresses which could have detrimental effects. Methods of uncertainty estimation and the applications of full-tensor residual stress measurements are also discussed.     

Incremental Hole Drilling for Residual Stress Analysis of Thin Walled Components with Regard to Plasticity Effects

The incremental hole-drilling method is widely used in residual stress depth distribution analysis. However, two specific difficulties with the generalization of the incremental method exist, including the consideration of the sample thickness and residual stress states close to the local material’s yield strength. The stress concentration effect of the hole can lead to plastic deformation in the vicinity of the hole, which results in an overestimation of residual stresses. Typically, the effect of the component’s thickness and the plasticity effects are analyzed separately and correction approaches are proposed. In the current paper, we analyze the combined effects of plasticity and thickness on residual stress analysis using the incremental hole-drilling method. A systematic study was performed on steel samples with (i) isotropic and (ii) anisotropic elastic and elasto-plastic material behavior with varying thicknesses ranging between 1 mm and 4 mm. Electronic speckle pattern interferometry (ESPI) hole-drilling experiments were conducted on beam samples loaded using a 4-point bending fixture. Finite element simulations were conducted to gain insight into the effects of incremental hole-drilling. The results indicate that reducing the component’s thickness increases the plastic deformation in the vicinity of the hole and results in significant stress deviations. Thin components bend during hole-drilling as a result of the loss of stiffness, which amplifies the plasticity effect.     

Characterization and Control of Residual Stress and Curvature in Anodically Bonded Devices and Substrates with Etched Features

While anodic bonding is commonly used in a variety of microelectromechanical systems (MEMS) applications, devices and substrates that incorporate this processing technique are often subjected to significant residual stress and curvature that create post-processing and reliability issues. Here, using an anisothermal anodic bonding procedure, residual stresses and the resulting wafer curvature in these structures are controlled by varying the initial bond temperatures of the silicon and Pyrex wafers independently. Residual stresses are quantified by measuring bulk wafer curvature and, locally, stress concentrations are measured using infrared photoelasticity accompanied by 3-D thermomechanical finite element analysis. Based on the good agreement between numerical predictions and experimental results, this process can be used to determine the bulk post-bond wafer curvature and to reduce the likelihood of structural failure at these sites, by changing the residual stresses from tensile in nature, which may drive initiation and growth of cracks, to compressive, which can suppress such failures.     

Measurement of Applied Stresses and Residual Stresses on a Residual Stress Model by Applying Two Different Loads

Applied stresses on a residual stress model have previously been obtained by measuring the residual stresses and the resultant stresses generated by applying a load. The present paper reports that the applied stresses and the residual stresses on the residual stress model can be obtained by measuring two resultant stresses generated by applying loads of two different magnitudes. In the proposed method, the residual stresses need not be obtained from the residual stress model before applying a load. The residual stress model used to test the proposed method is a circular disk with frozen stresses that is subjected to a diametral compressive load at a certain angle. The applied stresses and the residual stresses on a residual stress model were experimentally and precisely obtained by digital photoelasticity using linearly polarized light.     

Intralaboratory Repeatability of Residual Stress Determined by the Slitting Method

This paper presents repeated slitting method measurements of the residual stress versus depth profile through the thickness of identically prepared samples, which were made to assess repeatability of the method. Measurements were made in five 17.8 mm thick blocks cut from a single plate of 316L stainless steel which had been uniformly laser peened to induce a deep residual stress field. Typical slitting method techniques were employed with a single metallic foil strain gage on the back face of the coupon and incremental cutting by wire EDM. Measured residual stress profiles were analyzed to assess variability of residual stress as a function of depth from the surface. The average depth profile had a maximum magnitude of −668 MPa at the peened surface. The maximum variability also occurred at the surface and had a standard deviation of 15 MPa and an absolute maximum deviation of 26 MPa. Since measured residual stress exceeded yield strength of the untreated plate, microhardness versus depth profiling and elastic–plastic finite element analysis were combined to bound measurement error from inelastic deformation.     

Micron-Scale Residual Stress Measurement by Micro-Hole Drilling and Digital Image Correlation

This paper reports a new technique, namely the incremental micro-hole-drilling method (IμHD) for mapping in-plane residual or applied stresses incrementally as a function of depth at the micron-scale laterally and the sub-micron scale depth-wise. Analogous to its macroscale counterpart, it is applicable either to crystalline or amorphous materials, but at the sub-micron scale. Our method involves micro-hole milling using the focused ion beam (FIB) of a dual beam FEGSEM/FIB microscope. The resulting surface displacements are recorded by digital image correlation of SEM images recorded during milling. The displacement fields recorded around the hole are used to reconstruct the stress profile as a function of depth. In this way residual stresses have been characterized around a drilled hole of 1.8microns. diameter, enabling the profiling of the stress variation at the sub-micron scale to a depth of 1.8 microns. The new method is used to determine the near surface stresses in a (peened) surface-severe-plastically-deformed (S²PD) Zr₅₀Cu₄₀Al₁₀ (in atomic percent, at.%) bulk metallic glass bar. In plane principal stresses of -800 MPa ± 90 MPa and −600 MPa ± 90 MPa were measured, the maximum compressive stress being oriented 15° to the axis of the bar.     

Non-Destructive Characterization of Subsurface Residual Stress Fields and Correlation with Microstructural Conditions in a Shot-Peened Inconel Component

Shot-peening is an important surface treatment used in a preventative way to guard against fatigue failures. The residual stress state imparted by shot-peening deters the formation and propagation of surface cracks. In this paper, we describe the measurement of residual stresses in an Inconel, IN100, sample using lattice strains measured using High Energy X-ray Diffraction (HEXD) and a Bi-Scale Optimization Method (BSOM). HEXD enabled rapid, non-destructive lattice strain measurements over a large region of the sample. Subsurface strains were obtained using a conical slit setup. The BSOM utilizes a macroscale representation of the sample and a spherical harmonic-based crystal scale representation of crystal orientation space at each experimental point (diffraction volume). A roughly biaxial stress state was predicted with a von Mises equivalent stress between 300 MPa and 400 MPa near the surface. The layer of material with high residual stress induced by shot-peening was found to be approximately 1 mm thick. Diffraction peak width, EBSD, and microhardness measurements were also made on the same sample, which rendered more qualitative measures of the plasticity-related effects of the shot-peening induced residual stress field. All of these measurements show a dimishing shot-peening plasticity with the increasing depth.     

Residual Stress Analysis of Orthotropic Materials by the Through-hole Drilling Method

The present study deals with the development and the application of the through-hole drilling method for the residual stress analysis in orthotropic materials. Through a systematic theoretical study of the stress field present on orthotropic plates with a circular hole, the relationships between the relaxed strains measured by a rectangular strain gauge rosette and the Cartesian components of the unknown residual stresses are obtained. The theoretical formulas of each influence coefficient allow the user an easy application of the method to the analysis of uniform-residual stresses on a generic homogeneous orthotropic material. Furthermore, to extend the method to the analysis of the residual stresses on orthotropic laminates, caused by initial in-plane loadings, an alternative formulation is implemented. The accuracy of the proposed method has been assessed through 3D numerical simulations and experimental tests carried out on unidirectional, cross-ply and angle-ply laminates.     

Measurement and Prediction of Residual Stresses in Quenched Stainless Steel Components

Austenitic stainless steel cylinders and rings are spray water quenched to create residual stresses at or greater than the yield strength. The residual stresses are measured using neutron diffraction, and two mechanical strain relaxation methods: deep hole drilling and incremental centre hole drilling. This paper compares the measurements with predictions of quenching using finite element analysis. Also finite element analysis is used to mimic deep hole and incremental centre hole drilling methods and to reconstruct residual stresses as if they have been measured. The measurements reveal similar trends to the predictions but there is only limited agreement between their magnitudes. However, there is better agreement between the reconstructed stresses and the measurements. Both the two mechanical strain relaxation methods reveal that large discrepancies occur between measurements and predictions arise because of plasticity. Irrespective of this and surprisingly there is good agreement between deep hole drilling and neutron diffraction measurements.     

云纹干涉与钻孔法测量搅动摩擦焊接头的残余应力

搅动摩擦焊是90年代出现的一种新型焊接技术,特别适用于熔化焊接性差的有色金属等材料.搅动摩擦焊接头的残余应力分别具有高应力梯度的特点,传统的应变片钻孔法不能满足测量要求.本文结合云纹干涉法与钻孔法的技术,得到了铝合金薄板搅拌摩擦焊接头残余应力沿深度和沿垂直焊缝方向的分布.