空心阴极放电沉积氮化碳薄膜的结构和成键性质

利用空心阴极放电等离子体源在Si(100)衬底上沉积了氮化碳薄膜.用XRD,SEM,XPS及拉曼和红外吸收光谱对薄膜的结构、成分和化学键等进行了研究.XRD分析表明,制备的氮化碳薄膜为非晶结构.XPS分析证实了薄膜中以C—C,sp2CN和sp3CN键为主,并得出薄膜中的氮碳比为0.71,而sp3—CN相的含量也达到了0.39.拉曼和红外吸收光谱的结果也与XPS分析的键态结果一致.     

氮直流辉光放电活性粒子（N^＋，N）的产生率

在氮直流辉光放电等离子体中采用快电子和离子(N2^ ，N^ )混合的蒙特卡罗模型，模拟研究了e N2→N^ /N N 2和N2^ N2→N^ N N2过程中粒子(N^ ，N)产生率的轴向分布随放电参数(工作气压、放电电压和温度)的变化规律。结果表明：两种离解过程中氮活性粒子(N^ ，N)的产生率都随气压和电压的增加而增大，随放电气体温度的升高而降低；但N2^ —H2离解碰撞主要发生在阴极附近。电压较高时，阴极处的离子N^ 主要由N2^ —N2离解过程产生；电压较低时，N2^ —N2离解过程可忽略。中性原子N主要由电子碰撞离解过程产生。     

大气压空气脉冲流光放电等离子体发射光谱分析

在大气压条件下采用尖-尖电极放电系统得到了稳定的放电等离子体, 并应用发射光谱方法对放电等离子体进行了实验研究。等离子体发射光谱呈现连续谱背景迭加分立谱的形式。连续谱背景来源于放电等离子体内轫致辐射和复合辐射过程; 分立谱归属为N2 C3∏u →B3∏g , N+, N, O的荧光辐射。N+荧光辐射对应的上能级电子组态为2s22p(2P0)3p和2s22p(2P0)3d, 能级高度介于20 eV和23.6 eV之间。实验还结合时间分辨光谱技术, 对放电等离子体中N2(336.8 nm)、N+(500.5 nm)、N+(399.7 nm)荧光信号进行时间分辨测量。结果表明, N2(336.8 nm)荧光首先出现, N+(500.5 nm、399.7 nm)荧光同时产生, 且滞后N2(336.8 nm)荧光约25 ns。根据时间分辨测量结果和相关参考文献, 文章对放电等离子体中N+的生成通道进行了分析。     

低压等离子体增强化学汽相沉积法制备立方氮化碳薄膜

用低压等离子体增强化学汽相沉积法和氮化硅中间过渡层的方法，在硅片和玻璃上，制备了立方氮化碳薄膜.用光电子能谱测试了其成分和结合能，薄膜含氮量为42.96%.C1s和N1s的结合能分别为285.01和398.60eV.透射电子显微镜研究表明，制备的氮化碳属于体心立方结构，根据衍射花样，计算的晶格常量a为0.536nm，这与理论预言的结果a为0.53973nm很接近.随着沉积的时间增长，还观测到了氮化碳薄膜的菊池花样.在玻璃上沉积的氮化碳薄膜在可见光和近红外区域是透明的，在400nm处有光吸收. 关键词：     

介质势垒放电(DBD)等离子体中NO荧光发射谱研究

利用介质阻挡放电 (DBD)等离子体技术对大气污染物NO分子进行了光谱研究 ,得到了低气压条件下放电等离子体在 2 1 0～ 2 80nm光谱范围内的荧光发射谱。该谱明显的表现为双峰结构 ,谱线均成对出现 ,强度分布符合Frank Condon原理 ,且最大峰值位置出现在 2 36nm处 ,将该组谱线归属为NO分子的A2 ΣA →X2 Π1 / 2 ,2 / 3 跃迁。荧光产生过程为 :基态NO分子与高能电子发生非弹性碰撞被激发至激发态A2 Σ 后自发跃迁回基态同时辐射出荧光。通过测量等离子体中NO分子和N2 分子 337nm谱线强度随时间的变化关系 ,初步证实了放电等离子体中存在的NO分子的分解机制为 :e NO→N O e,N NO→N2 O ,O NO→NO2 hν。     

衬底温度对Al/Zn_3N_2薄膜制备的影响

运用等离子体发射光谱,分析衬底温度对氮化锌薄膜制备过程中各等离子体活性基团的影响,随着温度升高,N*2第一正系B3Πg→A3Σ+u,N*2第二正系C3Πu→B3Πg,N+*2第一负系B2Σ+u→X2Σ+g,Zn*以及Zn+*活性基团等离子体发射光谱特征谱线强度逐渐增强;由于衬底温度升高,腔室中各离子动能增加,使得碰撞电离加剧,导致N*2,N+*2,Zn*以及Zn+*活性基团的等离子体离子密度增加;等离子体发射光谱分析结果表明衬底温度在一定范围内升高有利于氮化锌薄膜生长。采用离子源辅助磁控溅射技术在Al薄膜上制备Zn3N2薄膜;X射线衍射图谱(XRD)分析结果表明:室温下,反应生长出单一择优取向面(321)氮化锌薄膜;随着温度的升高,在Al膜上反应生长的氮化锌薄膜择优取向面逐渐丰富,出现(222),(400),(600),(411),(332),(431)以及(622)择优取向面,体现出随着衬底温度的升高,薄膜的结晶度逐渐增加。XP-1台阶仪分析的结果表明,随着衬底温度的升高,氮化锌薄膜的沉积率逐渐增大。场效应扫描电子显微镜(SEM)图表明氮化锌薄膜晶粒尺寸随着衬底温度的升高逐渐变小,表面结构更加致密,晶粒排列更加有序;SEM断面扫描显示Al膜和氮化锌薄膜结合非常紧密。衬底温度影响薄膜性能实验分析结果与等离子体发射光谱分析的结果基本一致,体现出等离子体发射光谱了解等离子体内在特性的有效、快捷性。     

用N2-H2等离子体氮化GaAs衬底对ECR-PEMOCVD生长立方GaN的影响

我们研究了采用电子回旋共振等离子体增强金属有机化学气相沉积(ECR-PEMOCVE)技术在GaAs(001)衬底上外延生长立方GaN的过程中衬底氮化条件对外延膜生长的影响.发现氮化时在氮等离子体中加入氢等离子体对于立方GaN薄膜生长具有显著影响.和氮化过程中不加入氢等离子体相比,氮化过程中加入氢等离子体生长出的外延膜其X射线衍射(XRD)半高宽(FWHM)可以最高降低40%以上.原子力显微镜(AFM)观察表明:在N2-H2混合等离子中氮化过的衬底上外延的缓冲层表面变得更为平滑,晶粒也变得粗大.最后,我们提出了一个化学模型对上述结果进行了分析和解释..     

N2-Ar��Ƶ�ŵ���浪���ĵ�����������ģ��

N2-Ar射频放电等离子体广泛应用于微电子工业的刻蚀、氮化物薄膜的制备及金属表面氮化等技术领域。开发了N2-Ar混合气体容性耦合射频放电PIC/MC自洽模型,模型主要描述了e-,N2+,N+,Ar+等主要带电粒子的行为分布。等离子体的碰撞过程分别考虑了带电粒子(e-,N2+,N+,Ar+)与基态中性N2分子和Ar原子的21种碰撞反应过程。模拟结果表明,在纯N2及N2-Ar混合气体容性耦合射频放电中,各种带电粒子的数密度都在等离子体区达到最大值,且氮分子离子为主要粒子;在N2容性耦合射频放电中,加入10%氩气时,N+平均能量有所增加,在射频电极处两种氮离子(N2+,N+)高能粒子所占比例增加。本研究对认识N2-Ar射频放电等离子体过程微观机理具重要意义。     

偏压对空心阴极放电等离子体溅射制备氮化碳薄膜的影响

利用空心阴极放电等离子体源在Si（100）单晶衬底上沉积了氮化碳薄膜．薄膜的表面形貌表明所得的薄膜非常的均匀光滑，用X光电子能谱、拉曼和红外吸收光谱对薄膜的结构、成分和化学键等进行了研究．在拉曼光谱中可以看到典型的G，D和C=N键的峰．当偏压为250V时．薄膜拉曼光谱中的D峰完全消失，此时薄膜的N／C比达到了0．81．通过对薄膜的XPS分析也表明薄膜中C—C，sp^2 CN和sp^3 CN键的组分也发生了明显的变化．当偏压为250V时薄膜的sp^3 CN相的含量达到了最大值为40％，同时氮含量也达到了最大值．实验结果给出了直接的证据：薄膜的结构模式可以通过改变偏压来得到控制．     

大气压冷等离子体喷枪气体温度的比较研究

采用介质阻挡放电等离子体喷枪装置,在大气压下流动气体(氩气和痕量氮气)中产生了稳定的喷射等离子体.通过拍摄喷枪发光照片,研究了喷射等离子体长度随气体流量的变化关系.利用高分辨率光谱仪采集等离子体羽处的发射光谱,通过对发射光谱中N+2的第一负系(B 2Σ+u→X 2Σ+g,390～391.6 nm)谱线拟合得到了射流等离...     

Carbon Nitride Thin Films Deposited by Plasma Assisted Nd∶YAG Laser Ablation of Graphite in N2+H2 Atmosphere

Carbon nitride thin films are deposited on silicon wafers by 532 nm Nd∶YAG laser ablation of graphite in the N2+H2 atmosphere assisted by a dc glow discharge plasma at a higher gas pressure of about 4.0 kPa. The properties of the thin films are investigated by scanning electron microscopy (SEM), energy-dispersive X-ray (EDX) and X-ray diffraction (XRD). The results show that the deposited films are composed of α-C3N4, β-C3N4 phase and have the N/C atomic ratio of 2.01. The optical emission spectroscopy (OES) studies indicate that the introduction of a dc glow discharge and the adoption of a higher gas pressure during the film deposition are favorable to the net generation of the atomic N, CN radicals and N+2 in B2Σ+u excited state in the plasma, which are considered to play a major role in the synthesis of carbon nitride.     

Carbon Nitride Thin Films Deposited by Plasma Assisted Nd:YAG Laser Ablation of Graphite in N2+H2 Atmosphere

Carbon nitride thin films are deposited on silicon wafers by 532 nm Nd:YAG laser ablation of graphite in the N2+H2 atmosphere assisted by a dc glow discharge plasma at a higher gas pressure of about 4.0 kPa. The properties of the thin films are investigated by scanning electron microscopy (SEM), energy-dispersive X-ray (EDX) and X-ray diffraction (XRD). The results show that the deposited films are composed of α-C3N4, β-C3N4 phase and have the N/C atomic ratio of 2.01. The optical emission spectroscopy (OES) studies indicate that the introduction of a dc glow discharge and the adoption of a higher gas pressure during the film deposition are favorable to the net generation of the atomic N, CN radicals and N+2 in B2Σ+u excited state in the plasma, which are considered to play a major role in the synthesis of carbon nitride.     

Gas pressure effects on the structure of CNx thin films deposited by laser ablation

Carbon nitride thin films with different nitrogen concentration have been deposited at different N₂ and N₂/Ar mixed partial pressures. Time-integrated optical emission spectroscopy measurements have been performed to gather information on the nature of the chemical species present in the plasma. Both the CN and C₂ molecular species have been observed. Fast photography imaging of the expanding plume revealed the change of the dynamics from a free expansion at low pressure to a shock wave formation followed then by the plume stopping upon increasing the gas pressure values. Raman and XPS spectroscopy measurements performed on the deposited thin films revealed that the films, structure strongly depends on the dynamics of the expansion plasma regime rather than on the partial pressure at which the deposition takes place.     

Formation of CNx thin films by reactive pulsed laser deposition assisted by electron cyclotron resonance microwave discharge

Amorphous carbon nitride thin films were synthesized by pulsed laser deposition combined with electron cyclotron resonance (ECR) microwave discharge in nitrogen gas. The ECR discharge supplies active nitrogen species in the deposition environment and to the growing film surface, enhancing the film growth in complex processes accompanied by chemical reaction. The synthesized films were characterized by Rutherford backscattering spectroscopy (RBS), X-ray photoelectron spectroscopy (XPS), Fourier-transform infrared spectroscopy (FTIR), and Raman spectroscopy. The films were determined to consist purely of carbon and nitrogen with a nitrogen concentration of 42%, and have a thickness of 550 nm over which carbon and nitrogen are well distributed. Structural characterizations based on XPS, FTIR and Raman analysis showed that these films appear to contain several bonding configurations between carbon and nitrogen with a small amount of C≡N bonds compared with other bonding states. Received: 31 August 2000 / Accepted: 12 December 2000 / Published online: 23 May 2001     

射频等离子体增强化学气相沉积SiNx薄膜的研究

采用射频等离子体增强化学气相沉积技术,以N2和SiH4作为反应气体,在P型硅基片上进行SiNx薄膜的沉积.使用椭偏仪对薄膜厚度和光学常量进行了测量, 用傅里叶变换红外光谱仪对SiNx薄膜的化学键合结构进行了分析.研究了基片温度、射频功率以及N2和SiH4的气体流量比率等实验工艺参量对薄膜沉积速率和光学常量的影响.结果表明,射频等离子体增强化学气相沉积技术沉积的SiNx薄膜是低含氢量的SiNx薄膜,折射率在1.65~2.15之间,消光系数k在0.2~0.007之间,当SiNx薄膜为富氮时k≤0.01,最高沉积速率高达6.0 nm/min,N2和SiH4气体流量比率等于10是富硅和富氮SiNx薄膜的分界点.     

磁控反应溅射SiNx薄膜的研究

用磁控反应溅射(RF)的方法制备了SiN_x薄膜. 分析了以硅为靶材, 用N₂/Ar做溅射气体条件下不同的气流比率、总气压以及沉积速率对薄膜光学常数和表面结构形态的影响, 得出较低总气压下气流比率对薄膜光学常数的影响是最关键的, 而总气压较大的时候, 水汽影响增大, 气流比率的影响反而不明显. 最后提出了合适的工艺条件来制备符合要求的SiN_x薄膜.     

Surface properties of cubic boron nitride thin films

Studying the surface properties of cubic boron nitride (c-BN) thin films is very important to making it clear that its formation mechanism and application. In this paper, c-BN thin films were deposited on Si substrates by radio frequency sputter. The influence of working gas pressure on the formation of cBN thin film was studied. The surface of c-BN films was analyzed by X-ray photoelectron spectroscopy (XPS), and the results showed that the surface of c-BN thin films contained C and O elements besides B and N. Value of N/B of c-BN thin films that contained cubic phase of boron nitride was very close to 1. The calculation based on XPS showed that the thickness of hexagonal boron nitride (h-BN) on the surface of c-BN films is approximately 0.8 nm.     

氮流量在高氢氛围中对富硅氮化硅薄膜材料结构及其发光特性的影响

采用等离子体增强化学气相沉积技术,以N₂掺入到SiH₄和H₂的沉积方式,分别在玻璃和N型单晶硅片(100)衬底上制备富硅氮化硅薄膜。通过紫外-可见光吸收光谱、傅里叶变换红外吸收光谱(FTIR光谱)、拉曼光谱和光致发光谱(PL谱)分别表征掺氮硅薄膜材料的带隙、结构及其发光特性的变化。结果表明：在氢气的氛围中,随着氮气流量的增加,氢原子能够对薄膜缺陷起到抑制作用,并使较低的SiH₄/N₂流量比下呈现富硅态,但却不利于硅团簇的形成。随着氮原子的掺入,Si—N键的含量增大,带隙增大,薄膜内微结构的无序度也增大,薄膜出现了硅与氮缺陷相关的缺陷态发光;随着氮原子进一步增加,出现了带尾态发光,进一步讨论了发光与结构之间的关联。这些结果有助于采用PECVD制备富硅氮化硅对材料发光与结构特性的优化。     

氮化硼薄膜的红外光谱研究

用磁控溅射法制备六角氮化硼薄膜,在衬底温度、衬底偏压、工作气压等条件一定的情况下改变工作气体(氮气+氩气)中氮气的比例,以制备高质量的六角氮化硼薄膜,薄膜以红外吸收光谱标识。实验结果表明,工作气体中氮气的比例对制得的六角氮化硼薄膜有很大影响,在氮气比例为20%时得到理想的六角氮化硼薄膜。     

氮化碳薄膜的X射线光电子谱

用ＸＰＳ研究射频－直流等离子体增强化学气相沉积获得的氮化碳薄膜的化学结构。Ｃ１ｓ和Ｎ１ｓ芯能级电子谱分析表明：在ＣＮ膜中含有Ｎ－ｓｐ＾３和Ｎ－ｓｐ６２两类化学结构,在高含Ｎ膜中还含有少量的Ｎ－ｓｐ相,且代表Ｎ－ｓｐ＾３结构的原子 比为１．２８,接近４：３,证明此膜中存在类β－Ｃ３Ｎ４相。