单轴应变Si(001)任意晶向电子电导有效质量模型

单轴应变Si材料电子电导有效质量是理解其电子迁移率增强的关键因素之一, 对其深入研究具有重要的理论意义和实用价值. 本文从Schrödinger方程出发, 将应力场考虑进来, 建立了单轴应变Si材料导带E-k解析模型. 并在此基础上, 最终建立了单轴应变Si(001)任意晶向电子电导率有效质量与应力强度和应力类型的关系模型. 本文的研究结果表明: 1) 单轴应力致电子迁移率增强的应力类型应选择张应力. 2) 单轴张应力情况下, 仅从电子电导有效质量角度考虑, [110]/(001)晶向与[100]/(001)晶向均可. 但考虑到态密度有效质量的因素, 应选择[110]/(001)晶向. 3) 沿(001)晶面上[110]晶向施加单轴张应力时, 若想进一步提高电子迁移率, 应选取[100]晶向为器件沟道方向. 以上结论可为应变Si nMOS器件性能增强的研究及导电沟道的应力与晶向设计提供重要理论依据. 关键词： 单轴应变 E-k关系')" href="#">E-k关系 电导有效质量     

应变Si/(001)S1－xGex本征载流子浓度模型

利用应变Si CMOS技术提高载流子迁移率是当前研究发展的重点,本征载流子浓度是应变Si材料的重要物理参数,也是决定应变Si器件电学特性的重要参量.本文基于K.P理论框架,从分析应变Si/（001）Si_1-xGe_x材料能带结构出发,详细推导建立了300K时与Ge组分（x）相关的本征载流子浓度模型.该数据量化模型可为Si基应变器件物理的理解及器件的研究设计提供有价值的参考. 关键词： 应变Si 有效态密度 本征载流子浓度     

不同晶系应变Si状态密度研究

应变Si技术是当前微电子领域研究发展重点,态密度是其材料的重要物理参量.本文基于应力相关KP理论,建立了(001),(101)和(111)晶面施加双轴应力形成的四方、单斜及三角晶系应变Si导带、价带态密度模型.结果表明,除单斜和三角晶系导带底态密度外,应力对其余各态密度均有显著影响.本文所得模型数据量化,可为应变Si材料物理的理解及其他物理参数模型的建立奠定重要理论基础. 关键词： 应变Si KP 态密度     

单轴、双轴应变Si拉曼谱应力模型

本文依据拉曼光谱原理, 基于Secular方程及拉曼选择定则分别获得了单轴、 双轴(001), (101), (111)应变Si材料应变张量与拉曼谱线移动的定量关系, 并在此基础上, 基于广义胡克定律最终建立了单轴、双轴(001), (101), (111)应变Si材料拉曼谱峰与应力的理论关系模型. 该模型建立过程详细、系统, 所得结果全面、量化, 可为应变Si材料应力的测试分析提供重要理论参考.     

应变Si1—xGex层本征载流子浓度和有效态密度的温度特性分析

本计算了应变Ｓｉ１－ｘＧｅｘ层的本征载流子浓度及导带和价带有效态密度。首次用解析的方法研究了它们与Ｇｅ组份ｘ和温度Ｔ的依赖关系。我们发现，随Ｇｅ组份ｘ的增加，由于Ｓｉ１－ｘＧｅｘ层中应力的影响，导带和价带有效态密度随之快速减少，而本征载流子浓度却随之而近乎指数式地增加。而且，温度Ｔ越低，导带和价带有效态密度随Ｇｅ组份ｘ的增加而减少得越快，而本征载流子浓度上升得越快。同时，我们还发现，具有大Ｇｅ组     

单轴应变Si NMOSFET热载流子栅电流模型

热载流子效应产生的栅电流是影响器件功耗及可靠性的重要因素之一,本文基于热载流子形成的物理过程,建立了单轴应变硅NMOSFET热载流子栅电流模型,并对热载流子栅电流与应力强度、沟道掺杂浓度、栅源电压、漏源电压等的关系,以及TDDB(经时击穿)寿命与栅源电压的关系进行了分析研究.结果表明,与体硅器件相比,单轴应变硅MOS器件不仅具有较小的热载流子栅电流,而且可靠性也获得提高.同时模型仿真结果与单轴应变硅NMOSFET的实验结果符合较好,验证了该模型的可行性.     

应变Si_（1－x）Ge_x层本征载流子浓度和有效态密度的温度特性分析

本文计算了应变Ｓｉ１－ｘＧｅｘ层的本征载流子浓度及导带和价带有效态密度．首次用解析的方法研究了它们与Ｇｅ组份ｘ和温度Ｔ的依赖关系．我们发现，随Ｇｅ组份ｘ的增加，由于Ｓｉ１－ｘＧｅｘ层中应力的影响，导带和价带有效态密度随之快速减少，而本征载流子浓度却随之而近乎指数式地增加．而且，温度Ｔ越低，导带和价带有效态密度随Ｇｅ组份ｘ的增加而减少得越快，而本征载流子浓度上升得越快．同时，我们还发现，具有大Ｇｅ组份ｘ的应变Ｓｉ１－ｘＧｅｘ层，其用Ｓｉ的相应参数归一化的导带和价带有效态密度及它们的积与温度Ｔ的依赖关系弱，而具有小Ｇｅ组份ｘ的应变Ｓｉ１－ｘＧｅｘ层，上述归一化参数与温度Ｔ的依赖关系强，这和目前仅有的文献［８］中它们于温度依赖关系的定性研究结果相一致．本文得到的定量结果对探索应变ＳｉＧｅ层的物理性质、对应变ＳｉＧｅ层基器件的设计、模拟及对低温ＳｉＧｅ器件物理的理解有重要意义．     

单轴应变硅N沟道金属氧化物半导体场效应晶体管电容特性模型

电容特性模型是单轴应变硅金属氧化物半导体场效应晶体管(Si MOSFET)和电路进行瞬态分析、交流小信号分析、噪声分析等的重要基础. 本文首先建立了单轴应变Si NMOSFET 的16 个微分电容模型, 并将微分电容的仿真结果与实验结果进行了比较, 验证了所建模型的正确性. 同时对其中的关键性栅电容C_gg 与应力强度、偏置电压、沟道长度、栅极掺杂浓度等的关系进行了分析研究. 结果表明, 与体硅器件相比, 应变的引入使得单轴应变Si NMOSFET器件的栅电容增大, 随偏置电压、沟道长度、栅极掺杂浓度的变化趋势保持不变.     

应变(001)p型金属氧化物半导体反型层空穴量子化与电导率有效质量

基于k·p微扰理论框架,研究建立了单轴张/压应变Si,Si基双轴应变p型金属氧化物半导体(PMOS)反型层空穴量子化有效质量与空穴面内电导率有效质量模型.结果表明:对于单轴应力PMOS,选择单轴压应力可有效增强器件的性能;同等增强PMOS空穴迁移率,需要施加的单轴力强度小于双轴力的强度;在选择双轴应力增强器件性能时,应优先选择应变Si1-x Ge x作为沟道材料.所获得的量化理论结论可为Si基及其他应变器件的物理理解及设计提供重要理论参考.     

单轴应变SiNMOSFET源漏电流特性模型

本文在建立单轴应变Si NMOSFET迁移率模型和阈值电压模型的基础上, 基于器件不同的工作区域, 从基本的漂移扩散方程出发, 分别建立了单轴应变Si NMOSFET源漏电流模型. 其中将应力的影响显式地体现在迁移率和阈值电压模型中, 使得所建立的模型能直观地反映出源漏电流特性与应力强度的关系. 并且对于亚阈区电流模型, 基于亚阈区反型电荷, 而不是采用常用的有效沟道厚度近似的概念, 从而提高了模型的精度. 同时将所建模型的仿真结果与实验结果进行了比较, 验证了模型的可行性. 该模型已经被嵌入进电路仿真器中, 实现了对单轴应变Si MOSFET 器件和电路的模拟仿真.     

(001)面任意方向单轴应变硅材料能带结构

首先计算了(001)晶面单轴应变张量,在此基础上采用结合形变势理论的K ·P微扰法建立了在(001)晶面内受任意方向的单轴压/张应力作用时,应变硅材料的能带结构与应力(类型、大小)及晶向的关系模型,进而分析了不同单轴应力(类型、大小)及晶向对应变硅材料导带带边、价带带边、导带分裂能、价带分裂能、禁带宽度的影响.研究结果可为单轴应变硅器件应力及晶向的选择设计提供理论依据. 关键词： 单轴应变硅 K ·P法 能带结构     

Anisotropy of Long-term Resistivity Relaxations Induced in p -(0 0 1)GaAs/Al 0.5 Ga 0.5 As by Uniaxial Stress

Anisotropy of the piezoresistance relaxations has been observed in p -(0 0 1)GaAs/Al 0.5 Ga 0.5 As heterostructures. The character of relaxation process depends on the direction of the applied uniaxial compression: after loading along [1 m 1 0] direction the specimen resistance relaxes down to the lower magnitude while after loading along [1 1 0] direction it relaxes up to the higher magnitude. Shubnikov-de Haas oscillations and Hall effect measurements indicate that variation of the carrier concentration j N in the quantum well during relaxation processes has different signs for uniaxial compression along [1 m 1 0] and [1 1 0] directions and correlates with the corresponding change of the resistance. The piezoelectric field that in GaAs can reach the magnitude E =1.152 2 10 6 V/m at uniaxial stress P =1 kbar along d 1 1 0 ¢ directions is supposed to be responsible for the metastable state after loading (unloading) and redistribution of carriers during the relaxation process.     

Electron states in Ge and Si under uniaxial stress

The electron states in Ge and Si under uniaxial stress in the (100) direction are computed with the pseudopotential method. The theoretical results are compared with optical measurements of the indirect absorption edge in Si and Ge under uniaxial stress and with the polarization dependence and the splittings of donor levels.     

Pressure coefficients for band gaps in silicon

We have calculated the pressure coefficients of the main gaps in Si, using the Empirical Pseudopotential Method (EPM). We find a trend toward metallization at high hydrostatic pressures. The deformation potential at the top of the valence band for uniaxial stress along the (0, 0, 1) direction is also obtained. All of the calculated pressure coefficients are in good agreement with experiment.     

Hole mobility enhancement in uniaxial stressed Ge dependence on stress and transport direction

Utilizing a six-band k.p valence band calculations that considered a strained perturbation Hamiltonian, uniaxial stress-induced valence band structure parameters for Ge such as band edge energy shift, split, and effective mass were quantitatively evaluated. Based on these valence band parameters, the dependence of hole mobility on uniaxial stress (direction, type, and magnitude) and hole transport direction was theoretical studied. The results show that the hole mobility had a strong dependence on the transport direction and uniaxial stress. The hole mobility enhancement can be found for all transport directions and uniaxial stess configurations, and the hole transport along the [110] direction under the uniaxial [110] compressive stress had the highest mobility compared to other transport directions and stress configurations.     

(100)Si基应变p型金属氧化物半导体[110]晶向电导率有效质量双椭球模型

利用应变技术和沟道晶向工程技术,均可有效增强Si基金属氧化物半导体器件的性能.本文提出了(100)Si p型金属氧化物半导体(PMOS)[110]晶向电导率有效质量双椭球模型,从理论上解释了Si PMOS[100]晶向沟道空穴迁移率为[110]晶向沟道空穴迁移率1.15倍的原因.基于(100)Si基应变PMOS反型层E-k关系,拓展应用该模型,首先获得了(100)Si基应变PMOS反型层价带第一子带等能图,然后给出了(100)Si基应变PMOS器件反型层[110]晶向空穴电导率有效质量模型.本文的模型方案合理可行,可为Si基应变PMOS器件的研究与设计提供有价值的参考.     

Conductivity of heavily doped Si:P under uniaxial stress

Barely insulating, uncompensated Si:P samples have been tuned through the metal‐insulator transition applying uniaxial stress along the [100] direction. We find a critical exponent μ ≈︂ 1 of the electrical conductivity extrapolated to temperature T = 0, i.e. σ(T → 0,S) ∼ |S — S_c|^μ, in disagreement with earlier stress tuning studies along [123‐] where μ ≈︂ 0.5 was reported. Varying the stress or the concentration leads to a different T dependence of σ(T). Our stress‐tuning measurements obey finite‐T scaling with a dynamic exponent z = 3.     

Magnetic properties of ultrathin Co films on Si (111)

Ultrathin cobalt films on clean (7×7) and Au covered Si (111) substrates were prepared by molecular beam epitaxy. The structure was studied by using scanning tunnelling microscopy and low energy electron diffraction. Magnetic properties were determined with the magneto-optic Kerr effect. It was found that Co nucleates in grains that prefer to grow along the bunched step edges of the Si substrate ([112?] direction), which induces a strong in-plane uniaxial anisotropy. By introducing Au buffer layers, the magnetic characteristics were improved by preventing the silicide reaction between Si and Co. Moreover, the tendency for step decoration disappears gradually results in the in-plane uniaxial anisotropy reduction.