新型宽温区高热稳定性微波功率SiGe 异质结双极晶体管

宽温区大电流下的热不稳定性严重制约着功率SiGe 异质结双极晶体管 (HBT) 在射频和微波电路中的应用.为改善器件的热不稳定性, 本文利用SILVACO TCAD建立的多指功率SiGe HBT模型, 分析了器件纵向结构中基区Ge组分分布对微波功率SiGe HBT电学特性和热学特性的影响. 研究表明, 对于基区Ge组分为阶梯分布的HBT, 由于Ge组分缓变引入了少子加速电场, 使它与均匀基区Ge组分HBT相比, 具有更高的特征频率f_T, 且电流增益β和f_T随温度变化变弱, 这有利于防止器件在宽温区工作时电学特性的漂移.同时, 器件整体温度有所降低, 但器件各指温度分布均匀性较差.考虑多指HBT各发射极指散热能力存在差异, 在器件纵向结构设计为基区Ge组分阶梯分布的同时, 对其横向版图进行发射极指间距渐变结构设计, 用于改善器件各指温度分布的均匀性, 进而提高HBT的热稳定性.结果表明, 与基区Ge组分为均匀分布的等发射极指间距结构HBT相比, 新器件各指温度分布均匀性明显改善, f_T保持了较高的值, 且β和f_T 随温度变化不敏感, 热不稳定性得到显著改善, 显示了新器件在宽温区大电流下工作的优越性. 关键词： SiGe 异质结双极晶体管 Ge组分分布 发射极指间距渐变技术 热稳定性     

重离子导致的锗硅异质结双极晶体管单粒子效应电荷收集三维数值模拟

针对国产锗硅异质结双极晶体管(SiGe HBTs), 采用半导体器件模拟工具, 建立SiGe HBT单粒子效应三维损伤模型, 研究影响SiGe HBT单粒子效应电荷收集的关键因素. 分析比较重离子在不同位置入射器件时, 各电极的电流变化和感生电荷收集情况, 确定SiGe HBT电荷收集的敏感区域. 结果表明, 集电极/衬底结内及附近区域为集电极和衬底收集电荷的敏感区域, 浅槽隔离内的区域为基极收集电荷的敏感区域, 发射极收集的电荷可以忽略. 此项工作的开展为下一步采用设计加固的方法提高器件的抗辐射性能打下了良好的基础. 关键词： 锗硅异质结双极晶体管 单粒子效应 电荷收集 三维数值仿真     

能带工程对射频功率SiGe异质结双极晶体管热性能的改善

众所周知,基区"能带工程"可以改善Si_1-xGe _{x 基区异质结双极晶体管(HBT)的直流、频率和噪声等特性,但"能带工程"对HBT热学特性的影响的研究还很少。本文基于三维热电反馈模型,分析了"能带工程"对射频功率SiGe HBT热性能的影响。考虑到电流增益随温度的变化以及发射结电压负温度系数,给出了器件热稳定所需最小镇流电阻(REmin)的表达式,在此基础上给出了非均匀镇流电阻的设计,进一步提高了SiGe HBT的热稳定性 关键词： SiGe HBT Ge组分 热电反馈 镇流电阻}     

异质结界面电荷对突变InP/InGaAs异质结双极晶体管热场发射影响研究

异质结界面电荷的存在改变了异质结的内建势, 这引起了界面势垒尖峰高度和形状的扰动, 从而使异质结界面载流子的输运产生相应的变化, 最终导致异质结双极晶体管 (HBT) 性能的改变. 基于热场发射-扩散模型, 对异质结界面电荷对InP/InGaAs HBT性能的改变做了研究, 得到结论是正极性的界面电荷有利于InP/InGaAs HBT的直流和高频特性的改善, 而负极性的界面电荷则使器件的直流和高频特性变差. 关键词： InP/InGaAs异质结双极晶体管 界面电荷 内建势 热场发射     

半导体量子器件物理讲座第三讲 异质结双极晶体管（HBT）

文章首先给出了同质结双极晶体管和异质结双极晶体管（HBT）在材料结构参数上的差异,这种差异表明,在器件的材料结构设计上已从掺杂设计步到了能带工程设计,和同质结双极晶体管相比,HBT具有更优越的性能,接着介绍了HBT的工作原理,典型的材料结构及器件的制作。     

Ge组分分布对基区杂质非均匀分布的SiGe HBT温度特性的影响

众所周知, 双极型晶体管的设计主要是基区的设计. 一般而言, 基区的杂质分布是非均匀的. 本文首先研究了非均匀的杂质高斯分布对器件温度分布、增益和截止频率的温度特性的影响, 发现增益和截止频率具有正温度系数, 体内温度较高. 随后研究了基区Ge组分分布对这些器件参数的影响. 均匀Ge组分分布和梯形Ge组分分布的SiGe 异质结双极型晶体管增益和截止频率具有负温度系数, 具有较好的体内温度分布. 进一步的研究表明, 具有梯形Ge组分分布的SiGe 异质结双极型晶体管, 由于Ge组分缓变引入了少子加速电场, 不但使它的增益和截止频率具有较高的值, 而且保持了较弱的温度敏感性, 在增益、特征频率大小及其温度敏感性、体内温度分布达到了很好的折中.     

超结硅锗碳异质结双极晶体管机理研究与特性分析优化

提出一种超结硅锗碳异质结双极晶体管(SiGeC HBT)新结构.详细分析了新结构中SiGeC基区和超结结构的引入对器件性能的影响,并对其电流输运机制进行研究.基于SiGeC/Si异质结技术,新结构器件的高频特性优良;同时超结结构的存在,在集电区内部水平方向和垂直方向都建立了电场,二维方向上的电场分布相互作用大大提高了新结构器件的耐压能力.结果表明:超结SiGeC HBT与普通结构SiGeC HBT相比,击穿电压提高了48.8%;更重要的是SiGeC HBT器件中超结结构的引入,不会改变器件高电流增益、高频率特性的优点;新结构器件与相同结构参数的Si双极晶体管相比,电流增益提高了10.7倍,截止频率和最高震荡频率也得到了大幅度改善,很好地实现了高电流增益、高频率特性和高击穿电压三者之间的折中.对超结区域的柱区层数和宽度进行优化设计,随着柱区层数的增多,击穿电压显著增大,电流增益有所提高,截止频率和最高震荡频率减低,但幅度很小.综合考虑认为超结区域采用pnpn四层结构是合理的.     

锗硅异质结双极晶体管单粒子效应加固设计与仿真

本文设计了一种通过在版图布局中引入伪集电极的方法来提高锗硅异质结双极晶体管(SiGe HBT)抗单粒子性能的方法. 利用半导体器件模拟工具, 针对加固前后的SiGe HBT开展了单粒子效应仿真模拟, 分析了伪集电极对SiGe HBT电荷收集机理的影响. 结果表明, 引入的伪集电极形成的新的集电极-衬底结具有较大的反偏能力, 加固后SiGe HBT伪集电极通过扩散机理, 大量收集单粒子效应产生的电荷, 有效地减少了实际集电极的电荷收集量, 发射极、基极电荷收集量也有不同程度的降低, 加固设计后SiGe HBT 的单粒子效应敏感区域缩小, 有效的提高了SiGe HBT 器件抗单粒子效应辐射性能. 此项工作的开展为SiGe HBT电路级单粒子效应抗辐射加固设计打下良好的基础.     

沟槽型发射极SiGe异质结双极化晶体管新结构研究

提出了一种沟槽型发射极SiGe异质结双极化晶体管新结构. 详细分析了新结构中沟槽型发射极的引入对器件性能的影响,并对其机理进行研究. 新型发射极结构通过改变发射极电流路径使电阻分区并联,在不增大结电容的前提下,有效减小发射极电阻,提高器件的频率特性. 结果表明,新结构器件的截止频率和最大振荡频率分别增加至100.2 GHz和134.4 GHz,更重要的是沟槽型发射极结构的引入,在提高器件频率特性的同时,不会降低器件的电流增益,也不会增加结电容,很好实现了频率特性、电流增益和结电容之间的折中. 对沟槽型发射极进行优化设计,改变侧墙高度和侧墙宽度. 沟槽型发射极电阻不受侧墙高度改变的影响,频率性能不变;侧墙宽度增加,频率性能降低. 关键词： SiGe 异质结双极化晶体管 沟槽型发射极 发射极电阻     

渐变耦合脊波导晶体管探测器光响应分析

为提高InP基光探测器的吸收效率和工作速度,设计了一种渐变耦合脊波导单载流子传输异质结光敏晶体管探测器。采用有效折射率法和光束传播法,分析渐变耦合脊波导的光传输模式,优化后波导宽度和波导长度分别为2.6μm和250μm,可实现单模传输和高的光吸收效率。由于渐变耦合脊波导单载流子传输异质结光敏晶体管光传输方向与载流子运动方向垂直,分别优化光敏晶体管的吸收效率和速度,器件输出光电流和特征频率均得到改善。渐变耦合脊波导单载流子传输异质结光敏晶体管的响应度为33.83A/W,饱和输出光电流为90mA,最高特征频率达到87GHz,其饱和输出电流和特征频率相比于台面单载流子传输异质结光敏晶体管分别提高了20%和24%。但渐变耦合脊波导单载流子传输异质结光敏晶体管吸收体积大,获得饱和电流时的光功率也比较大,因此渐变耦合脊波导单载流子传输异质结光敏晶体管的响应度略小于台面的单载流子传输异质结光敏晶体管的响应度。     

Thermal stability improvement of a multiple finger power SiGe heterojunction bipolar transistor under different power dissipations using non-uniform finger spacing

A method of non-uniform finger spacing is proposed to enhance thermal stability of a multiple finger power SiGe heterojunction bipolar transistor under different power dissipations. Temperature distribution on the emitter fingers of a multi-finger SiGe heterojunction bipolar transistor is studied using a numerical electro-thermal model. The results show that the SiGe heterojunction bipolar transistor with non-uniform finger spacing has a small temperature difference between fingers compared with a traditional uniform finger spacing heterojunction bipolar transistor at the same power dissipation. What is most important is that the ability to improve temperature non-uniformity is not weakened as power dissipation increases. So the method of non-uniform finger spacing is very effective in enhancing the thermal stability and the power handing capability of power device. Experimental results verify our conclusions.     

Designing power heterojunction bipolar transistors with non-uniform emitter finger lengths to achieve high thermal stability

With the aid of a thermal-electrical model,a practical method for designing multi-finger power heterojunction bipolar transistors with finger lengths divided in groups is proposed.The method can effectively enhance the thermal stability of the devices without sacrificing the design time.Taking a 40-finger heterojunction bipolar transistor for example,the device with non-uniform emitter finger lengths is optimized and fabricated.Both the theoretical and the experimental results show that,for the optimum device,the peak temperature is lowered by 26.19 K and the maximum temperature difference is reduced by 56.67% when compared with the conventional heterojunction bipolar transistor with uniform emitter finger length.Furthermore,the ability to improve the uniformity of the temperature profile and to expand the thermal stable operation range is strengthened as the power level increases,which is ascribed to the improvement of the thermal resistance in the optimum device.A detailed design procedure is also summarized to provide a general guide for designing power heterojunction bipolar transistors with non-uniform finger lengths.     

Thermal resistance matrix representation of thermal effects and thermal design in multi-finger power heterojunction bipolar transistors

The thermal resistance matrix including self-heating thermal resistance and thermal coupling resistance is presented to describe the thermal effects of multi-finger power heterojunction bipolar transistors. The dependence of thermal resistance matrix on finger spacing is also investigated. It is shown that both self-heating thermal resistance and thermal coupling resistance are lowered by increasing the finger spacing, in which the downward dissipated heat path is widened and the heat flow from adjacent fingers is effectively suppressed. The decrease of self-heating thermal resistance and thermal coupling resistance is helpful for improving the thermal stability of power devices. Furthermore, with the aid of the thermal resistance matrix, a 10-finger power heterojunction bipolar transistor (HBT) with non-uniform finger spacing is designed for high thermal stability. The optimized structure can effectively lower the peak temperature while maintaining a uniformity of the temperature profile at various biases and thus the device effectively may operate at a higher power level.     

Comparative study of InGaP/GaAs heterojunction bipolar transistors (HBTs) with different base surface treatments

The interesting InGaP/GaAs heterojunction bipolar transistors (HBTs) with different surface passivations on the base surface are fabricated and studied. Experimentally, the HBT device with sulfur treatment passivation displays the lowest offset voltage. However, the device with a 0.02 μm-thick emitter ledge structure reveals better transistor behaviors such as higher current gain and lower base surface recombination current. In addition, it also exhibits improved thermal stability. For the reliability test, the device with a 0.02 μm-thick emitter ledge structure shows the best performance. Therefore, from experimental results, the HBT device performance could be improved by appropriate base surface treatments, e.g., sulfur passivation and emitter ledge structure.     

Photonic-sensitive InAlGaAs/InP negative-differential-resistance heterojunction bipolar transistor

A novel photonic-sensitive InAlGaAs/InP negative-differential-resistance heterojunction bipolar transistor (NDR-HBT) is fabricated and demonstrated. Due to the appropriately designed narrow base width and the employment of a δ -doped sheet at the emitter–base (E–B ) heterojunction, the base resistance effect results in the significant NDR phenomenon. In addition, the experimental results show that the device studied is very sensitive to the applied light source. The N-shaped NDR phenomena are clearly observed under illumination. This phenomenon is attributed to the base resistance and barrier lowering effect resulting from holes induced by the applied light source.     

Electron self-energy effect on a heterojunction bipolar transistor at T=0

An electron self-energy effect on a graded-gap heterojunction bipolar transistor at T=0 is considered. It is found that two competing mechanisms affect the collector current vs. emitter base bias voltage relations: (I) threshold voltage lowering for electron injection from emitter to base improves it: while (II) a decelerating field on injected minority carriers in the base degrades it. In a sufficiently large built-in field in the graded-gap base, negative transconductance appears as a result of the effect (I).     

Performance enhancement of a heterojunction bipolar transistor (HBT) by two-step passivation

An interesting two-step passivation (with ledge structure and sulphide based chemical treatment) on base surface, for the first time, is demonstrated to study the temperature-dependent DC characteristics and noise performance of an InGaP/GaAs heterojunction bipolar transistor (HBT). Improved transistor behaviors on maximum current gain β_max, offset voltage ΔV_CE, and emitter size effect are obtained by using the two-step passivation. Moreover, the device with the two-step passivation exhibits relatively temperature-independent and improved thermal stable performances as the temperature is increased. Therefore, the two-step passivationed device can be used for high-temperature and low-power electronics applications.