Synthesis, characterization, and cure properties of phosphorus-containing epoxy resins for flame retardance

An organophosphorus compound, 10-(2,5-dihydroxyl phenyl)-9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DHPDOPO), was synthesized through the reaction of 9,10-dihydro-9-oxa-10-phosphaphnanthrene-10-oxide (DOPO) and p-benzoquinone, and characterized by elemental analysis, Fourier transform infrared spectrum (FTIR), and ¹H-NMR and ³¹P-NMR spectroscopes. Consequently, the phosphorus-containing epoxy resins with phosphorus content of 1 and 2 wt.% were prepared via the reaction of diglycidyl ether of bisphenol-A with DHPDOPO and bisphenol-A, and confirmed with FTIR and gel permeation chromatography (GPC). Phenolic melamine, novolak, and dicyanodiamide (DICY) were used as curing agents to prepare the thermosetted resins with the control and the phosphorus-containing epoxy resins. Thermal properties and thermal degradation behaviors of these the thermosetted resins were investigated by using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). Phenolic melamine-cured resins exhibited higher glass transition temperatures than the other cured resins due to the high rigidity of their molecular chain. TGA studies demonstrated that the decomposition temperatures of the novolak-cured resins were higher than those of the others. A synergistic effect from the combination of the phosphorus-containing epoxy resin and the nitrogen-containing curing agent can result in a great improvement of the flame retardance for their thermosetted resins.     

A phosphate-based epoxy resin for flame retardance: synthesis, characterization, and cure properties

A phosphorus-containing oligomer, bis(3-hydroxyphenyl) phenyl phosphate (BHPP), was synthesized through the reaction of phenyl dichlorophosphate and 1,3-dihydroxybenzene, and characterized by elemental analysis, Fourier transform IR spectroscopy, and ¹H NMR and ³¹P NMR spectroscopy. Consequently, the phosphate-based epoxy resins with a phosphorus content of 1 and 2 wt % were prepared via the reaction of diglycidyl ether of bisphenol-A with BHPP and bisphenol-A, and were confirmed with Fourier transform IR spectroscopy and gel permeation chromatography. Phenolic melamine, Novolak, and dicyanodiamide were used as curing agents to prepare the thermoset resins with the control and the phosphate-based epoxy resins. Thermal properties and thermal degradation behavior of these thermoset resins were investigated by using differential scanning calorimetry and thermogravimetric analysis. The thermoset resins cured with phenolic melamine exhibited higher glass-transition temperatures than the other cured resins owing to the high rigidity of their molecular chain. Thermogravimetric analysis studies demonstrated that the decomposition temperatures of the thermoset resins cured with Novolak were higher than those of the others. A synergistic effect from the combination of the phosphate-based epoxy resin and the nitrogen-containing curing agent can result in a great improvement of the flame retardance for their thermoset resins.     

Phase separation,porous structure,and cure kinetics in aliphatic epoxy resin containing hyperbranched polyester

Thermosetting blends of an aliphatic epoxy resin and a hydroxyl‐functionalized hyperbranched polymer (HBP), aliphatic hyperbranched polyester Boltorn H40, were prepared using 4,4′‐diaminodiphenylmethane (DDM) as the curing agent. The phase behavior and morphology of the DDM‐cured epoxy/HBP blends with HBP content up to 40 wt % were investigated by differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), and scanning electron microscopy (SEM). The cured epoxy/HBP blends are immiscible and exhibit two separate glass transitions, as revealed by DMA. The SEM observation showed that there exist two phases in the cured blends, which is an epoxy‐rich phase and an HBP‐rich phase, which is responsible for the two separate glass transitions. The phase morphology was observed to be dependent on the blend composition. For the blends with HBP content up to 10 wt %, discrete HBP domains are dispersed in the continuous cured epoxy matrix, whereas the cured blend with 40 wt % HBP exhibits a combined morphology of connected globules and bicontinuous phase structure. Porous epoxy thermosets with continuous open structures on the order of 100–300 nm were formed after the HBP‐rich phase was extracted with solvent from the cured blend with 40 wt % HBP. The DSC study showed that the curing rate is not obviously affected in the epoxy/HBP blends with HBP content up to 40 wt %. The activation energy values obtained are not remarkably changed in the blends; the addition of HBP to epoxy resin thus does not change the mechanism of cure reaction of epoxy resin with DDM. © 2006 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 889–899, 2006     

Raman spectroscopic studies of the cure of dicyclopentadiene (DCPD)

The cure of polydicyclopentadiene conducted by ring-opening metathesis polymerisation in the presence of a Grubbs catalyst was studied using non-invasive Raman spectroscopy. The spectra of the monomer precursor and polymerised product were fully characterised and all stages of polymerisation monitored. Because of the monomer's high reactivity, the cure process is adaptable to reaction injection moulding and reactive rotational moulding. The viscosity of the dicyclopentadiene undergoes a rapid change at the beginning of the polymerisation process and it is critical that the induction time of the viscosity increase is determined and controlled for successful manufacturing. The results from this work show non-invasive Raman spectroscopic monitoring to be an effective method for monitoring the degree of cure, paving the way for possible implementation of the technique as a method of real-time analysis for control and optimisation during reactive processing. Agreement is shown between Raman measurements and ultrasonic time of flight data acquired during the initial induction period of the curing process.     

DSC study of cure kinetics of DGEBA-based epoxy resin with poly(oxypropylene) diamine

Summary A kinetic study of cure kinetics of epoxy resin based on a diglycidyl ether of bisphenol A (DGEBA), with poly(oxypropylene) diamine (Jeffamine D230) as a curing agent, was performed by means of differential scanning calorimetry (DSC). Isothermal and dynamic DSC characterizations of stoichiometric and sub-stoichiometric mixtures were performed. The kinetics of cure was described successfully by empirical models in wide temperature range. System with sub-stoichiometric content of amine showed evidence of two separate reactions, second of which was presumed to be etherification reaction. Catalytic influence of hydroxyl groups formed by epoxy-amine addition was determined.     

Investigation of the curing reactions of some multifunctional epoxy resins using differential scanning calorimetry

Curing reaction of three tetrafunctional epoxy resins in the presence of tetraethylene tetramine was examined by differential scanning calorimetry at different heating rates. The kinetic parameters of the curing reaction were determined using various computational methods (Barrett, Borchardt–Daniels and Kissinger). The heating rate shows a great influence on the curing process. The activation energy varied in the range 43–80 kJ/mol, and the order of the curing reaction is observed to be ≈1.0 with slight variations.     

Influence of fillers and additives on the cure kinetics of an epoxy/anhydride resin

The cure kinetics of a cycloaliphatic epoxy resin with and without additives and cured with an anhydride hardener was investigated by isothermal and nonisothermal differential scanning calorimetry (DSC).Dynamic measurements were used to predict the total heat of reaction of the epoxy resin as well as its activation energy based on the methods of Kissinger and Ozawa. With these methods the inhibition and acceleration effects of additives and fillers on the kinetics have been demonstrated. Additives for advanced processing and property upgrade were added in less than 2 wt.%, whereas fillers on base of SiO₂ were incorporated in more than 50 wt.%. The effect of SiO₂ surface treatment was also objective of this study.To describe the dependence of the conversion on time and temperature, isothermal DSC data were fitted to an autocatalytic model developed by Kamal and extended with a diffusion factor. The results show a very good agreement within the whole conversion range. Also the highly-filled system could be described very well by the phenomenological Kamal model.     

Cure kinetics of epoxy resin and thermoplastic polymer

The cure kinetics and morphology of diglycidyl ether of bisphenol A (DGEBA) modified with polyvinyl acetate (PVAc) using diaminodiphenylmethane (DDM) as hardener were investigated through differential scanning calorimetry (DSC) and environmental scanning electron microscopy (ESEM). Isothermal curing measurements were carried out at 150, 120 and 80°C. The kinetic parameters were obtained using the general autocatalytic chemically controlled model. The comparison of the kinetic data indicates that the presence of PVAc does not change the autocatalytic nature of the cure reaction. Two T _g’s were observed in the fully cured samples of the modified systems. ESEM micrographies confirm the biphasic morphology.     

Studies on the curing kinetics of epoxy resins using silicon containing amide-amines

Curing kinetics of diglycidyl ether of bisphenol-A (DGEBA) in the presence of novel silicon containing amide-amines were investigated by the dynamic differential scanning calorimetry. Silicon containing amide-amines were prepared by reacting 2.5 moles of 4,4'-diaminodiphenyl ether (E)/4,4'-diaminodiphenyl methane (M)/3,3'-diaminodiphenyl sulfone (mS)/bis(m-aminophenyl) methyl phosphine oxide (B) with one mole of bis(4-chlorobenzoyl) dimethyl silane. The multiple heating rate method (5, 10, 15 and 20°C min^-1) was used to study the curing kinetics of epoxy resins in the presence of stoichiometric amounts of amide-amines having molecular masses in the range of 660 to 760 g mol^-1. The peak exotherm temperature depends on the heating rate as well as on the structure of amide-amines. Activation energy of curing reaction as determined in accordance to the Ozawa's method was found to be dependent on the structure of amine. The thermal stability of the isothermally cured resins was also evaluated using dynamic thermogravimetry in a nitrogen atmosphere. The char yield was the highest in case of resins cured with amide-amines having both phosphorus and silicon atoms. This revised version was published online in July 2006 with corrections to the Cover Date.     

Comparison of the effectiveness of epoxy cure accelerators using a fluorescent molecular probe

A simple optical method for quantitative comparison of the effectiveness of epoxy cure accelerators, used for speeding up the crosslinking process of epoxy resins with cyclic anhydrides, is described. Fluorescent molecular probes and a miniature fiber optic spectrometer have been applied for measurement of the cure kinetics of a model epoxy resin/anhydride composition in the presence of various cure accelerators. A quantitative index of accelerator performance has been determined for several of the most common accelerators.     

Thermal degradation and stability of epoxy nanocomposites: Influence of montmorillonite content and cure temperature

The thermal behaviour and stability of epoxy nanocomposites were studied by thermogravimetric analysis (TGA). The nanocomposites consisted of a trifunctional epoxy resin, a hardener containing reactive primary amine groups and clay nanoparticles (i.e. montmorillonite), previously treated with octadecyl ammonium. Three levels of nanoclay content (0, 5 and 10%) and three temperature levels (120, 150 and 200 °C) were used. The exfoliation of nanoparticles within the material was analyzed by X-ray diffraction (XRD). The cure conversion was determined by Fourier transform infrared (FTIR) spectroscopy by selecting the suitable band for epoxide functional groups. The study demonstrated that the nanoclay greatly accelerates the cure, at the different cure temperatures studied. Finally, the thermal stability of the various nanocomposites was established by calculating various characteristic temperatures from thermograms as well as conversion and conversion derivative at maximum decomposition rate. The collisions between resin molecules, which are trapped within the nanoclay galleries, were less effective because they were protected against thermal degradation by the galleries. However, once the collision was effective, the thermal activation occurred more readily.     

Rheological study on the cure kinetics of two-component addition cured silicone rubber

The cure kinetics for two-component silicone rubber formed by addition reaction was studied by the rheological method. The influence of reaction temperature (T) on the cure kinetics was explored in detail. It was observed that the data of gel time (t _gel, i.e. the time when the reaction reaches the gel point) or a specific reaction time (t _nc) (defined as the reaction time before which time the influence of confinement of network on the diffusion of reaction components can be neglected) versus T obey certain functional relationship, which was well explained by the cure kinetics model of thermoset network. The cure kinetics for the two-component silicone rubber can be well fitted by the Kamal-Sourour(autocatalyst) reaction model rather than Kissinger model. When the reaction time was before or equal to t _nc, the reaction order obtained by the Kamal-Sourour reaction model was 2, which was consistent with the reaction order inferred from the two components chemical reaction when the diffusion of reaction components was not influenced by the formed cross-linked polymer network. When the reaction time was larger than t _nc, such as to the end of reaction (t _e), the influence of confinement of network on the diffusion of reaction components cannot be neglected, and the reaction order obtained by the Kamal-Sourour reaction model was larger than 2. It was concluded that the confinement effect of network had a greater influence on the cure kinetics of the silicone rubber. The reaction rate constants (k _r) under different temperatures were also determined by Kamal-Sourour reaction model. The activation energy (E) for the two-component silicone rubber was also calculated from the results of lnt _gel, lnt _nc, and lnk _r versus 1/T, respectively. The three values of E were close, which indicated that above analyses were self-consistent.     

Effects of water on epoxy cure kinetics and glass transition temperature utilizing molecular dynamics simulations

Effects of water on epoxy cure kinetics are investigated. Experimental tests show that absorbed water in an uncured bisphenol‐F/diethyl‐toluene‐diamine epoxy system causes an increase in cure rate at low degrees of cure and a decrease in cure rate at high degrees of cure. Molecular simulations of the same epoxy system indicate that the initial increase in cure rate is due to an increase in molecular self‐diffusion of the epoxy molecules in the presence of water. Effects of water on the glass transition temperature (T_g) of the crosslinked thermoset are also studied. Both experiments and simulations show that water decreases T_g. Both types of results indicate that T_g effects are small below 1% water by weight, but that T_g depression occurs much quickly with increasing water content above 1%. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2017 , 55, 1150–1159     

Comparative studies on the curing kinetics and thermal stability of tetrafunctional epoxy resins using various amines as curing agents

The curing reactions of the epoxy resins tetraglycidyl diaminodiphenyl methane (TGDDM) and tetraglycidyl methylenebis (o-toluidine) (TGMBT) using diaminodiphenyl sulfone (DDS), diaminodiphenyl methane (DDM) and diethylenetriamine (DETA) as curing agents were studied kinetically by differential scanning calorimetry. The dynamic scans in the temperature range 20°–300°C were analyzed to estimate the activation energy and the order of reaction for the curing process using some empirical relations. The activation energy for the various epoxy systems is observed in the range 71.9–110.2 kJ·mol^–1. The cured epoxy resins were studied for kinetics of thermal degradation by thermogravimetry in a static air atmosphere at a heating rate of 10 deg·min^–1. The thermal degradation reactions were found to proceed in a single step having an activation energy in the range 27.6–51.4 kJ·mol^–1.

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Zusammenfassung Die Vernetzungsreaktionen der Epoxidharze Tetraglycidyl-diamino-diphenyl-methan (TGDDM) und Tetraglycidyl-methylen-bis(o-toluidin) (TGMBT) unter Verwendung von Diaminodiphenylsulfon (DDS), Diaminodiphenylmethan (DDM) und Diethylentriamin (DETA) als Vernetzungsmittel wurden kinetisch mittels DSC untersucht. Die dynamischen Scans im Temperaturbereich 20°–300°C wurden analysiert, um unter Anwendung einiger empirischer Gleichungen die Aktivierungsenergie und die Reaktionsordnung des Vernetzungsprozesses zu ermitteln. Die Aktivierungsenergie der einzelnen Epoxy-Systeme liegt im Bereich 71.9–110.2 kJ·mol^–1. An der ausgehärteten Harze wurde mittels TG in einer statischen Luftatmosphäre un deiner Aufheizgeschwindigkeit von 10 Grad/min die Kinetik des termischen Abbaues untersucht. Man fand, daß die thermiscehn Abbaureaktionen in einem Schritt ablaufen und ihre Aktivierungsenergie im Intervall 27.6–51.4 kJ·mol^–1 liegt.

     

A new ultrasonic measurement system for the cure monitoring of thermosetting resins and composites

Measurements of the ultrasonic sound speed of thermosetting resins and composites can be used as an in-process cure monitoring technique. Ultrasonic measurements have an advantage over other in-process techniques in that ultrasonic sensors do not make contact with the part (thus leaving no imbedded sensor or witness mark) and can make true bulk measurements of the part. A new commercially available ultrasonic cure monitoring system has been developed which easily enables ultrasonic measurements to be made in compression molding, resin transfer molding, and autoclave processes. Advancements in ultrasonic sensor technology enable the sensor to maintain good coupling to the part during thermal cycling to 260C. Data is presented showing the change in ultrasonic sound speed during the compression molding of a graphite-epoxy prepreg. The data shows a good relationship to the ionic conductivity and resistivity data collected via dielectric cure monitoring.This effort was sponsored by the Manufacturing Technology Directorate, Wright Laboratory (WL/MTX), Air Force Material Command, USAF, under cooperative agreement award(s) to NCMS. The U. S. Government is authorized to reproduce and distribute reprints for Governmental purposes notwithstanding any copyright notation thereon. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of Wright Laboratory or the U.S. Government.     

Isothermal cure kinetics of epoxy/phenol‐novolac resin blend system initiated by cationic latent thermal catalyst

The investigation of the cure kinetics of a diglycidyl ether of bisphenol A (DGEBA)/phenol‐novolac blend system with different phenolic contents initiated by a cationic latent thermal catalyst [N‐benzylpyrazinium hexafluoroantimonate (BPH)] was performed by means of the analysis of isothermal experiments using a differential scanning calorimetry (DSC). Latent properties were investigated by measuring the conversion as a function of curing temperature using a dynamic DSC method. The results indicated that the BPH in this system for cure is a significant thermal latent initiator and has good latent thermal properties. The cure reaction of the blend system using BPH as a curing agent was strongly dependent on the cure temperature and proceeded through an autocatalytic kinetic mechanism that was accelerated by the hydroxyl group produced through the reaction between DGEBA and BPH. At a specific conversion region, once vitrification took place, the cure reaction of the epoxy/phenol‐novolac/BPH blend system was controlled by a diffusion‐control cure reaction rather than by an autocatalytic reaction. The kinetic constants k₁ and k₂ and the cure activation energies E₁ and E₂ obtained by the Arrhenius temperature dependence equation of the epoxy/phenol‐novolac/BPH blend system were mainly discussed as increasing the content of the phenol‐novolac resin to the epoxy neat resin. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2945–2956, 2000     

Synthesis of tri-aryl ether epoxy resin isomers and their cure with diamino diphenyl sulphone

The synthesis of bi- and tetra-functional tri-aryl ether epoxy resin isomers and their subsequent cure with 44 diamino diphenyl sulphone (DDS) is presented here. The effect of varying aromatic substitution and cross-link density on the structure, property, and processing relationships is explored for 1,3 bis(3-glycidyloxyphenoxy)benzene (133 BGOPB), 1,4 bis(4-glycidyloxyphenoxy)benzene (144 BGOPB), N,N,N,N-tetraglycidyl 1,3-bis (3-aminophenoxy) benzene (133 TGAPB), and N,N,N,N-tetraglycidyl 1,4-bis (4-aminophenoxy) benzene (144 TGAPB). Meta substitution to the aromatic ring reduces the rate of reaction, glass transition temperature, yield strain and crosslink density, coefficient of thermal expansion, and side reactions, while increasing strain softening, compressive modulus and strength, and methyl ethyl ketone ingress. Increasing crosslink density increases the glass transition temperature, promotes side reactions during cure, and increases compressive modulus, strength, and yield strain, while reducing coefficients of thermal expansion, methyl ethyl ketone ingress, and density. The results are discussed in terms of packing efficiency of the meta-substituted epoxy resins and the role of short range molecular mobility caused by the lack of an aromatic axis of rotation.     

Effect of nanosilica on the kinetics of cure reaction and thermal degradation of epoxy resin

Nanocomposites from nanoscale silica particles(NS),diglycidylether of bisphenol-A based epoxy(DGEBA),and 3,5-diamino-N-(4-(quinolin-8-yloxy) phenyl) benzamide(DQPB) as curing agent were obtained from direct blending of these materials.The effect of nanosilica(NS) particles as catalyst on the cure reaction of DGEBA/DQPB system was studied by using non-isothermal DSC technique.The activation energy(E_a) was obtained by using Kissinger and Ozawa equations. The E_a value of curing of DGEBA/DQPB/10%NS system showed a decrease of about 10 kJ/mol indicating the catalytic effect of NS particles on the cure reaction.The E_a values of thermal degradation of the cured samples of both systems were 148 kJ/mol and 160 kJ/mol,respectively.The addition of 10%of NS to the curing mixture did not have much effect on the initial decomposition temperature(T_i) but increased the char residues from 20%to 28%at 650℃.     

Effect of thermoplastic toughening agent on glass transition temperature and cure kinetics of an epoxy prepreg

The isothermal time–temperature-transformation (TTT) cure diagram is developed in this article to investigate the effect of thermoplastic toughening agent on glass transition temperature (T _g) and cure kinetics of an epoxy carbon fiber prepreg, Cycom 977-2 unidirectional (UD) tape. The glass transition temperature was measured using differential scanning calorimetry (DSC) over a wide range of isothermal cure temperatures from 140 to 200 °C. Times to gelation and vitrification were measured using shear rheometry. The glass transition temperature master curve was obtained from the experimental data and the corresponding shift factors were used to calculate the activation energy. The kinetic rate model was utilized to construct iso-T _g contours using the calculated activation energy. It was observed that the iso-T _g contours did not follow the behavior of the neat epoxy resin, since they deviated from the gel time curve. This deviation was believed to be the effect of the thermoplastic toughening agent. The behavior of the neat epoxy resin in 977-2 was shown by constructing the iso-T _g contours using the activation energy obtained from gel time modeling.     

The kinetics of the epoxy amine cure reaction from a solvation perspective

This article investigates the role of solvation effects in the autocatalysis reaction of the epoxy–amine cure reaction. A single‐phase three component model was developed encompassing a two‐component reaction mix and a single polymeric product. The reaction was modelled as an S_N2 reaction. Association of the nucleophile with each component in the reaction was defined via a binding constant. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3579–3586, 2004