共查询到18条相似文献,搜索用时 78 毫秒
1.
2.
咪唑固化不同类型环氧树脂的固化特征、固化动力学及其反应活性 总被引:2,自引:0,他引:2
以咪唑为固化剂,对缩水甘油醚型、缩水甘油酯型环氧树脂(简称链型环氧树脂)及脂环环氧树脂的固化特征、固化动力学及反应活性进行了研究.DSC实验结果表明,固化过程均分两阶段进行,链型环氧树脂固化反应表观活化能低于脂环环氧树脂.各树脂第一阶段的表观反应活化能均低于第二阶段活化能.当脂环环氧树脂中混入不同比例的链型环氧树脂后,固化反应速率均较脂环环氧树脂单独固化时快,当链型环氧树脂量大于50%时,更为明显. 相似文献
3.
4.
5.
6.
7.
制备了氨酯键扩链改性的669稀释剂UE6M,考察了加入不同用量的UE6M对环氧树脂进行稀释后环氧树脂混合体系的粘度变化。使用氰乙基化三乙烯四胺作为固化剂对环氧树脂混合体系进行固化,研究了UE6M的用量对环氧树脂混合体系固化物性能的影响。研究结果表明,UE6M对E51环氧树脂具有较好的稀释效果,且混合体系固化产物的韧性较纯环氧树脂固化物明显增强:UE6M用量为30%和40%的混合体系粘度仅为纯E51环氧树脂粘度的6.35%和1.43%,但其固化物的拉伸强度均在60MPa以上,分别为纯E51环氧树脂固化物的87.9%和80.9%。断裂伸长率均为纯环氧树脂固化物的8倍以上,弯曲应变为纯环氧树脂固化物2倍以上,弯曲强度及弯曲模量等未出现大幅下降,UE6M稀释剂加入环氧树脂后固化产物的韧性得到明显增强。 相似文献
8.
9.
10.
11.
用线性酚醛树脂(PN)和4-氨基苯基氨基砜(SAA)作为固化剂, 与刚性棒状环氧树脂联苯环氧(DGEBP)、四甲基联苯环氧(DGETMBP)和传统双酚A环氧树脂(DGEBA)分别进行固化. 研究了固化剂和环氧树脂化学结构的改变对热固网络相行为和热力学性能的影响. 结果表明, 刚性环氧网络比传统的DGEBA具有更好的热力学性能. DGEBP可形成不同类型的取向网络, 而取向态的类型也直接影响了热固网络的热力学性能. 用扫描电镜(SEM)观察不同网络体系的断裂面结构, 发现取向的刚性棒状环氧网络的断裂面呈韧性断裂, 而其它无定形环氧网络则呈典型的脆性断裂. 相似文献
12.
磷系阻燃环氧树脂研究 总被引:2,自引:0,他引:2
本文对近年来国内外9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物(DOPO)衍生物的合成及其应用于阻燃环氧树脂的方法进行介绍,并对所显示的阻燃性、热性能等作了概述和比较。将反应型磷系阻燃剂DOPO衍生物引入环氧树脂基体结构中形成阻燃持久、无卤、低烟、无毒、热稳定性好的新型含磷环氧树脂。 相似文献
13.
The curing agents of epoxy resin, trimethylsilyl ethers of phenol novolak (TMSPN) and cresol novolak (TMSCN) were prepared
by refluxing phenol novolak and cresol novolak respectively, with the mixture of hexamethyldisilazane and chlorotrimethylsilane
in THF. The curing reaction of epoxy resin with these curing agents and the thermal properties of cured resins were examined.
The Tg values of epoxy resins cured with TMSPN were a little higher than those cured with TMSCN. The maximum of Tg is 118°C
for TMSPN-cured epoxy resin against 112°C for TMSPN-cured epoxy resin. The water absorption of hydrophobic epoxy resins cured
with TMSPN was a little lower than those cured with TMSCN. The clear decrease of water absorption is attributed to the difficulty
of the micro-void formation caused by the more tight primary structures of TMSPN. The water absorption at 25°C containing
trimethylsilyl groups is about one-tenth of that of epoxy resins cured with conventional curing agents and even one-half of
that of the epoxy resins cured with active esters. The low water absorption is attributed to the presence of trimethylsilyl
groups, which are more hydrophobic than ester groups, and to the absence of hydroxyl groups of the cured resins.
This revised version was published online in July 2006 with corrections to the Cover Date. 相似文献
14.
Bing Zhang Xiang-luan Liu Ying Huang Center of Molecular Sciences Institute of Chemistry Chinese Academy of Sciences Beijing China 《高分子科学》2000,(2):133-138
Polysiloxane-modified epoxy resins were prepared through the reaction of epoxy resin with polydimethylsiloxanesbearing pendant N-(β-aminoethyl)-γ-aminopropyl groups. The morphology and properties of the cured epoxy resins modifiedby the polysiloxanes were investigated. It was found that the phase structure and properties of the cured epoxy resins dependmainly on the amino group content in the polydimethylsiloxane and the level of the modifier. The change of phase structurein the cured epoxy resin systems was responsible for the dramatic change in their mechanical and surface properties. 相似文献
15.
活性酯固化环氧树脂物性的研究 总被引:1,自引:0,他引:1
主要对活性酯固化环氧树脂的吸水性、高耐湿性、电气特性等方面进行了研究,同时也对其树脂极性、交联结构、分子链运动等方面也进行了研究. 相似文献
16.
Synthesis and thermal characterization of phosphorus containing siliconized epoxy resins 总被引:3,自引:0,他引:3
Siliconized epoxy matrix resin was developed by reacting diglycidyl ethers of bisphenol A (DGEBA) type epoxy resin with hydroxyl terminated polydimethylsiloxane (silicone) modifier, using γ-aminopropyltriethoxysilane crosslinker and dibutyltindilaurate catalyst. The siliconized epoxy resin was cured with 4, 4-diaminodiphenylmethane (DDM), 1,6-hexanediamine (HDA), and bis (4-aminophenyl) phenylphosphate (BAPP). The BAPP cured epoxy and siliconized epoxy resins exhibit better flame-retardant behaviour than DDM and HDA cured resins. The thermal stability and flame-retardant property of the cured epoxy resins were studied by thermal gravimetric analysis (TGA) and limiting oxygen index (LOI). The glass transition temperatures (Tg) were measured by differential scanning calorimetry (DSC) and the surface morphology was studied by scanning electron microscopy (SEM). The heat deflection temperature (HDT) and moisture absorption studies were carried out as per standard testing procedure. The thermal stability and flame-retardant properties of the cured epoxy resins were improved by the incorporation of both silicone and phosphorus moieties. The synergistic effect of silicone and phosphorus enhanced the limiting oxygen index values, which was observed for siliconized epoxy resins cured with phosphorus containing diamine compound. 相似文献
17.
The phthalide-containing epoxy resins are synthesized and characterized in comparison with the bisphenol-A epoxy resins in terms of thermal properties. Although both resins contain comparable amounts of halogens, the resulting flame retardancy is higher in the phthalide-containing resin. The char formation upon pyrolysis is also enhanced by the phthalide functionality. 相似文献
18.
C. Carfagna E. Amendola M. Giamberini A. G. Filippov R. S. Bauer 《Liquid crystals》1993,13(4):571-584
By endcapping mesogenic rigid rod molecules with reactive epoxy groups a novel class of liquid-crystalline thermoset has been obtained. In fact is has been shown that the nematic molecular arrangement is sustained over the crosslinking reaction of liquid-crystalline epoxy resins when the curing reaction is carried out in the thermal stability range of the liquid-crystalline phase. Calorimetric analysis was used in characterizing the isothermal cure. An unsophisticated model is proposed for evaluating the activation energies of the crosslinking reaction. For liquid-crystalline epoxy resins lower activation energies result with respect to the cure reactions for non liquid-crystalline epoxy resins. 相似文献