调制掺杂高迁移率晶体管

为了提高场效应晶体管的响应速度,在设计中希望采用迁移率高的材料.材料迁移率的大小决定于载流子的散射.一般在高温下,载流子主要被晶格振动所散射,即声子散射; 而在低温下电离杂质的散射起主导作用.对于高掺杂的样品,即使降低温度也不能使迁移率提高.掺杂浓度为 1017- 1018cm-3的 n型GaAs 中的电子迁移率大约是 3000—4000 cm2/V·s左右.而P型GaAs中的空穴迁移率将更低.掺杂浓度降低会使迁移率升高.当掺杂浓度为 1013-1014cm-3时,GaAs中的电子迁移率按照 Brooks-Herring-Dingle理论的计算,在300K时约为104cm2/V·s[1,2].而在十分高…     

应变Si/(001)Si1-xGex电子迁移率

依据离化杂质散射、声学声子散射和谷间散射的散射模型,在考虑电子谷间占有率的基础上,通过求解玻尔兹曼方程计算了不同锗组分下,不同杂质浓度时应变Si/(001)Si_1-xGe_x的电子迁移率.结果表明:当锗组分达到0.2时,电子几乎全部占据Δ₂能谷;低掺杂时,锗组分为0.4的应变Si电子迁移率与体硅相比增加约64%;对于张应变Si NMOS器件,从电子迁移率角度来考虑不适合做垂直沟道.选择相应的参数,该方 关键词： 电子谷间占有率 散射模型 锗组分 电子迁移率     

晶格匹配InAlN/GaN和InAlN/AlN/GaN材料二维电子气输运特性研究

文章研究了InAlN/GaN和引入AlN界面插入层形成的InAlN/AlN/GaN材料的输运性质. 样品均在蓝宝石上以脉冲金属有机物化学气相淀积法生长,霍尔迁移率变温特性具有典型的二维电子气(2DEG)特征. 综合各种散射机理包括声学形变势散射、压电散射、极性光学声子散射、位错散射、合金无序散射和界面粗糙度散射,理论分析了温度对迁移率的影响,发现室温下两种材料中2DEG支配性的散射机理都是极性光学波散射和界面粗糙度散射;AlN插入层对InAlN/GaN材料迁移率的改善作用一方面是免除2DEG的合金无序散射,另外还显著改善异质界面,抑制了界面粗糙度散射. 考虑到2DEG密度也是影响其迁移率的重要因素,结合实验数据给出了晶格匹配InAlN/GaN和InAlN/AlN/GaN材料的2DEG迁移率随电子密度变化的理论上限. 关键词： InAlN/GaN 二维电子气 迁移率     

利用霍尔效应研究热退火对黑硅材料电学性质的影响

利用霍尔效应测量了不同温度热退火后的黑硅的霍尔系数、载流子浓度、载流子迁移率和电导率.随着热退火温度的升高,黑硅内载流子的浓度缓慢下降,载流子迁移率却同步增加,这说明黑硅内载流子散射的主要形式是电离杂质散射.     

AlGaN/GaN高电子迁移率晶体管中二维电子气的极化光学声子散射

Al Ga N/Ga N界面处的二维电子气迁移率是描述高电子迁移率晶体管特性的一个重要参数,极化光学声子散射是高温时限制二维电子气迁移率的主要散射机制.本文对极化光学声子散射进行计算,结果表明在二维电子气浓度为6×10~(11)—1×10~(13) cm~(–2),温度为200—400 K范围内,极化光学声子散射因素决定的迁移率随温度的变化近似为μPO=AT-α(α=3.5);由于Ga N中光学声子能量较大,吸收声子对迁移率的影响远大于发射声子的影响.进一步讨论了极化光学声子散射因素决定的迁移率随光学声子能量变化的趋势,表明增加极化光学声子能量可提高二维电子气的室温迁移率.     

SiC电子输运特性的Monte Carlo数值模拟

利用系综MonteCarlo法研究了2H ,4H和6HSiC的电子输运特性.在模拟中考虑了对其输运过程有着重要影响的声学声子形变势散射、极化光学声子散射、谷间声子散射、电离杂质散射以及中性杂质散射.通过计算,获得了低场下这几种不同SiC多型电子迁移率同温度的关系,并以4H SiC为例,重点分析了中性杂质散射的影响.最后对高场下电子漂移速度的稳态和瞬态变化规律进行了研究.将模拟结果同已有的实验数据进行了比较,发现当阶跃电场强度为10×106V·cm-1时,4H Sic电子横向瞬态速度峰值接近33×107cm·s^-1,6H Sic接近30×107cm·s^-1.     

AlxGa1-xN/GaN调制掺杂异质结构的子带性质研究

通过低温和强磁场下的磁输运测量研究了Al0.22Ga0.78N/GaN调制掺杂异质结构中2DEG的子带占据性质和子带输运性质.在该异质结构的磁阻振荡中观察到了双子带占据现象,并发现2DEG的总浓度随第二子带浓度的变化呈线性关系.得到了该异质结构中第二子带被2DEG占据的阈值电子浓度为7.3×1012cm-2.采用迁移率谱技术得到了不同样品的分别对应于第一和第二子带的输运迁移率.发现当样品产生应变弛豫时第一子带的电子迁移率骤然下降,而且第二子带的电子迁移率远大于第一子带的电子迁移率.用电子波函数分布和应变弛豫时的失配位错散射解释了上述现象.同时进一步说明了界面粗糙散射和合金无序散射是决定AlxGa1-xN/GaN异质结构中2DEG迁移率的主要散射机理.     

Ag偏离化学计量比Ag1-xPb18SbTe20材料的热电传输性能

采用熔融-淬火-放电等离子体烧结制备了Ag偏离化学计量比Ag1-xPb18SbTe20(x=0,0.25,0.50,0.75)样品,研究了Ag含量对样品热电传输性能的影响.结果表明,随Ag含量降低,样品中出现少量第二相Sb2Te3,样品载流子浓度增加到5×1018cm-3后不再增加.样品载流子迁移率随Ag含量降低先降低后增加,随着温度增加,载流子散射机理由电离杂质散射转变为声学波散射.随Ag含量降低,样品电导率增加而Seebeck系数降低,热导率增加.     

SiC/SiO2界面粗糙散射对沟道迁移率影响的Monte Carlo研究

提出了一种SiC反型层表面粗糙散射的指数模型,并对6H-SiC反型层迁移率进行了单电子的Monte Carlo模拟,模拟中考虑了沟道区的量子化效应.模拟结果表明,采用表面粗糙散射的指数模型能够使SiC反型层迁移率的模拟结果和实验值符合得更好.模拟结果还反映出有效横向电场较高时表面粗糙散射的作用会变得更显著,电子的屏蔽效应降低了粗糙散射对沟道迁移率的影响,温度升高会引起沟道迁移率降低. 关键词： 6H-SiC 反型层迁移率 表面粗糙散射 指数模型     

SiC/SiO_2界面粗糙散射对沟道迁移率影响的Monte Carlo研究

提出了一种SiC反型层表面粗糙散射的指数模型 ,并对 6H SiC反型层迁移率进行了单电子的MonteCarlo模拟 ,模拟中考虑了沟道区的量子化效应 .模拟结果表明 ,采用表面粗糙散射的指数模型能够使SiC反型层迁移率的模拟结果和实验值符合得更好 .模拟结果还反映出有效横向电场较高时表面粗糙散射的作用会变得更显著 ,电子的屏蔽效应降低了粗糙散射对沟道迁移率的影响 ,温度升高会引起沟道迁移率降低 .     

Determination of the LO phonon energy by using electronic and optical methods in AlGaN/GaN

The longitudinal optical (LO) phonon energy in AlGaN/GaN heterostructures is determined from temperature-dependent Hall effect measurements and also from Infrared (IR) spectroscopy and Raman spectroscopy. The Hall effect measurements on AlGaN/GaN heterostructures grown by MOCVD have been carried out as a function of temperature in the range 1.8-275 K at a fixed magnetic field. The IR and Raman spectroscopy measurements have been carried out at room temperature. The experimental data for the temperature dependence of the Hall mobility were compared with the calculated electron mobility. In the calculations of electron mobility, polar optical phonon scattering, ionized impurity scattering, background impurity scattering, interface roughness, piezoelectric scattering, acoustic phonon scattering and dislocation scattering were taken into account at all temperatures. The result is that at low temperatures interface roughness scattering is the dominant scattering mechanism and at high temperatures polar optical phonon scattering is dominant.     

Influence of temperature on strain-induced polarization Coulomb field scattering in AlN/GaN heterostructure field-effect transistors

Electron mobility scattering mechanism in AlN/GaN heterostuctures is investigated by temperature-dependent Hall measurement, and it is found that longitudinal optical phonon scattering dominates electron mobility near room temperature while the interface roughness scattering becomes the dominant carrier scattering mechanism at low temperatures(～100 K).Based on measured current–voltage characteristics of prepared rectangular AlN/GaN heterostructure field-effect transistor under different temperatures, the temperature-dependent variation of electron mobility under different gate biases is investigated. The polarization Coulomb field(PCF) scattering is found to become an important carrier scattering mechanism after device processing under different temperatures. Moreover, it is found that the PCF scattering is not generated from the thermal stresses, but from the piezoelectric contribution induced by the electrical field in the thin AlN barrier layer. This is attributed to the large lattice mismatch between the extreme thinner AlN barrier layer and GaN, giving rise to a stronger converse piezoelectric effect.     

Mobility limited by cluster scattering in ternary alloy quantum wires

The mobility limited by cluster scattering in ternary alloy semiconductor quantum wire(QWR) is theoretically investigated under Born approximation. We calculate the screened mobility due to clusters(high indium composition InGaN) scattering in the InxGa1 xN QWR structure. The characteristics of the cluster scattering mechanism are discussed in terms of the indium composition of clusters, the one-dimensional electron gas(1DEG) concentration, and the radius of QWR. We find that the density, breadth of cluster, and the correlation length have a strong effect on the electron mobility due to cluster scattering. Finally, a comparison of the cluster scattering is made with the alloy-disorder scattering. It is found that the cluster scattering acts as a significant scattering event to impact the resultant electron mobility in ternary alloy QWR.     

高灵敏度Sb基量子阱2DEG的霍尔器件

用分子束外延技术将高灵敏度的InAs/AlSb量子阱结构的Hall器件赝配生长在GaAs衬底上。设计了由双δ掺杂构成的Hall器件的新结构,有效地提高了器件的面电子浓度。与传统的没有掺杂的InAs/AlSb量子阱结构的Hall器件相比,室温下器件电子迁移率从15 000 cm²·V^-1·s^-1 提高到16 000 cm²·V^-1·s^-1。AFM测试表明材料有好的表面形态和结晶质量。从77 K 到300 K对Hall器件进行霍尔测试,结果显示器件不同温度范围有不同散射机构。双δ掺杂结构形成高灵敏度、高二维电子气（2DEG）浓度的InAs/AlSb异质结Hall器件具有广阔的应用前景。     

Analysis of electron mobility versus temperature after photoexcitation in Si-doped AlxGa1−xAs

The low-temperature Hall mobility of photoexcited electrons has been measured in Si-doped MBE AlGaAs samples and compared with calculated data using the background acceptor density and the alloy scattering potential as free parameters. The possibility of discriminating between negative- or positive-U electron correlation energy for the DX centre has been investigated through a careful analysis of mobility versus temperature curves relating to different photoexcited electron densities. A crucial role of the acceptor density to explain the experimental data within the positive-U model has been evidenced.     

AlGaN插入层对InAlN/AlGaN/GaN异质结散射机制的影响

InAlN/AlN/GaN异质结中,名义上的AlN插入层实为Ga含量很高的AlGaN层, Al, Ga摩尔百分比决定了电子波函数与隧穿几率,因此影响与InAlN/AlGaN势垒层有关的散射机制.本文通过求解薛定谔-泊松方程与输运方程,研究了AlGaN层Al摩尔百分含量对InAlN组分不均匀导致的子带能级波动散射、导带波动散射以及合金无序散射三种散射机制的影响.结果显示:当Al含量由0增大到1,子带能级波动散射强度与合金无序散射强度先增大后减小,导带波动散射强度单调减小;在Al含量为0.1附近的小组分范围内,合金无序散射是限制迁移率的主要散射机制,该组分范围之外,子带能级波动散射是限制迁移率的主要散射机制;当Al摩尔百分含量超过0.52,三种散射机制共同限制的迁移率超过无插入层结构的迁移率, AlGaN层显示出对迁移率的提升作用.     

Phonon Limited Electron Mobility in Germanium FinFETs:Fin Direction Dependence

We investigate the phonon limited electron mobility in germanium(Ge) fin field-effect transistors(FinFETs)with fin rotating within(001),(110),and(111)-oriented wafers. The coupled Schrodinger-Poisson equations are solved self-consistently to calculate the electronic structures for the two-dimensional electron gas, and Fermi's golden rule is used to calculate the phonon scattering rate. It is concluded that the intra-valley acoustic phonon scattering is the dominant mechanism limiting the electron mobility in Ge FinFETs. The phonon limited electron motilities are influenced by wafer orientation, channel direction, in thickness Wfin, and inversion charge density Ninv. With the fixed Wfin, fin directions of(110),(112) and(110) within(001),(110), and(111)-oriented wafers provide the maximum values of electron mobility. The optimized for mobility is also dependent on wafer orientation and channel direction. As Ninv, increases, phonon limited mobility degrades, which is attributed to electron repopulation from a higher mobility valley to a lower mobility valley as Ninv increases.     

Anomalous behaviour of electron mobility in space charge layers

The Hall effect on polar faces of ZnO has been measured at 80 K. Surface excess electron densities between 10⁷ and 10¹³ cm^?2 have been achieved by photolysis, annealing or hydrogen exposure. The surface electron mobility as a function of carrier density shows a modulated structure. Possible scattering mechanism are discussed.     

Investigation of the mobility in poly(vinylidene fluoride) ferroelectric films with different structures

The molecular mobility in two isotropic poly(vinylidene fluoride) samples crystallized in the α phase from the melt with different crystallinities and lattice perfections has been investigated by broadband dielectric spectroscopy. It has been revealed that the local-mobility parameters are insensitive to structural features. The average relaxation times of micro-Brownian motion in the disordered phase are found to be identical in the samples under consideration, which can be associated with the localization of the mobility in the interphase layer at the crystal-amorphous phase interface. The motion in the crystal (α _c transition) has been described using the soliton mechanism of relaxation. It has been found that, as should be expected, the average relaxation time increases with an increase in the longitudinal crystal size; however, in this case, a strict quantitative correlation is absent. According to the small-angle X-ray scattering data, this is caused by different microstructures of interlamellar amorphous regions. It has been demonstrated that the samples with a higher degree of crystallinity are characterized by a larger difference in the electron densities of the crystalline and amorphous phases and a larger size of the amorphous layer. It has been assumed that an increase in the concentration of chemical defects in the interlamellar layers with a simultaneous increase in their length is responsible for the increased probability of attenuation of the solitary wave (conformational defect) in its passage between neighboring lamellar crystals.     

Charged surface states scattering in AlGaN/GaN heterostructures

The electron mobility limited by charged surface states scattering was calculated accurately based on a self-consistent Schrödinger and Poisson equations solver. For a AlGaN thickness less than 5 nm, this new scattering mechanism is the dominated scattering for electron mobility. Moreover, there is a “high electron mobility window” for a certain AlGaN thickness range from 4 to 7 nm, where the electron mobility can be as high as 3000 cm²/Vs at a low temperature, which is consistent with reported experimental data [1] (Cao and Jena, 2007).