Annealing behaviour of arsenic implants in silicon

Abstract

The annealing behaviour of 80 keV room temperature arsenic implants in silicon below the amorphization dose has been studied by comparing the physical profile and the electrical profiles following different isochronal anneals.

It is shown that the electrically active fraction, which is about 0.4 after 30 min annealing at 600°C, increases continuously until 100% electrical activation of the arsenic ions is reached at about 900°C.

The activation energy for the annealing process has been found equal to 0.4 eV. A tentative interpretation of the mechanism involved is given.

From the analysis of the physical profiles obtained after isochronal annealing, an effective diffusion coefficient at 900°C equal to 5 × 10^?16 cm² s^?1 has been calculated.     

Defect sites in thin films of germanium dioxide irradiated with silicon ions

Optical transmission spectra of GeO₂ films irradiated with silicon ions and subjected to postimplantation annealing in the regime of silicon nanocrystal formation are analyzed. It is shown that point defects form in the films after irradiation with doses D ～ 10²⁰ m^?2: germanium electron centers, neutral oxygen vacancies, and Ge²⁺ centers, which have been annealed at a temperature of 1000°C for an hour. At D ≥ 1 × 10²¹ m^?2, more complex defects arise in the films, which are only partially annealed under the same conditions.     

Obituary

Abstract

The gamma irradiation damage in silicon has been extensively studied by many investigators.^(1–6) However, little has been reported about the effects of radiation on the current-voltage (I–V) characteristics of silicon, particularly of high-resistivity silicon at radiation temperatures other than the room temperature. This paper is a report of some new results on the I–V characteristics of low and high resistivity silicon before and after gamma irradiation at the temperature of 38 °C and ?196 °C.     

Formation of ultrasmall germanium nanoislands with a high density on an atomically clean surface of silicon oxide

The experimental results of an investigation into the initial stages of growth of a germanium film on an atomically clean oxidized silicon surface are reported. It is shown that the growth of the germanium film in this system occurs through the Volmer-Weber mechanism. Elastically strained nanoislands with a lateral size of less than 10 nm and a density of 2 × 10¹² cm^?2 are formed on the oxidized silicon surface. In germanium films with a thickness greater than 5 monolayers (ML), there also arise completely relaxed germanium nanoislands with a lateral size of up to 200 nm and a density of 1.5 × 10⁹ cm^?2.     

Evidence of palladium-defect pairing in intrinsic germanium

Time Differential Perturbed Angular Correlation measurements were performed in intrinsic germanium with the ¹⁰⁰Pd/¹⁰⁰Rh probe. The probe was produced via ⁹²Zr(¹²C, 4n)¹⁰⁰Pd and recoil-implanted into samples. Parallel measurements with the ¹¹¹In/¹¹¹Cd probe confirmed the quality of the germanium studied. The measurements with the ¹⁰⁰Pd/¹⁰⁰Rh probe show a modulation pattern in the ratio function with a quadrupole interaction frequency of 8.3(2) Mrad/s. The pattern depends on sample orientation and it is most pronounced after annealing at 500°C. After annealing at 700°C the effect vanishes due to strong damping of the ratio function. The pattern may be caused, similar to what has been observed for highly doped n-type silicon, by the pairing of the Pd-atom with a vacancy located in the < 111 > direction. The disappearance of the pattern would indicate the dissociation of this pair. Pair formation and dissociation may be relevant to palladium-induced-crystallization processing of germanium.     

Indium-vacancy interaction in laser-annealed silicon

The In-V complex in laser-annealed and proton-bombarded p-type and n-type silicon, doped with radioactive¹¹¹In atoms, was identified by means of perturbed angular correlation measurements. The complex dissociates at 130°C, corresponding with a dissociation energy of 1.0 eV. During the nuclear decay of ¹¹¹In, the complex transforms into Cd-V which manifests itself in three different electronic configurations. Transitions between these configurations were observed to depend on temperature and doping of the sample. It is concluded that P as well as B atoms in silicon trap vacancies at room temperature. It is further concluded that the vacancy concentration in laser-annealed silicon amounts to at least 10¹⁶–10¹⁷ cm^-3, which is an order of magnitude larger than what has been assumed so far.     

Dechanneling of MeV protons in tungsten

Abstract

A systematic investigation of the dechanneling of protons in tungsten has been completed for the <111> axial direction and also for the (110) plane. Measurements at room temperature have been made at energies of 0.5, 2.0, 3.5, 8.0 and 12.0 MeV; at 2.0 MeV, the effect of target temperature has been investigated over the range 77–873°K. In the axial case, the dechanneling rate increases strongly with the vibrational amplitude _ρ, but not as strongly as the ρ² dependence reported by the Catania group (Refs. 4–7) for silicon and germanium. Also, unlike silicon and germanium, the tungsten axial data exhibit practically no energy dependence and so cannot be fitted by the zρ²/E scaling parameter suggested by the Catania group. On the other hand, the planar dechanneling data in tungsten exhibit the predicted (E ^?1)dependence and relatively littie temperature dependence, in good agreement with previous work.     

Die magnetische Suszeptibilität der Defektelektronen in Silizium und Germanium

For semiconductors it is possible, to determine the contribution of the free carriers to the magnetic susceptibility. Holes in silicon (density 10¹⁸ to 10¹⁹cm^?3) have at 297 and 141° K a small paramagnetic susceptibility. In contrast, one computes from cyclotron mass parameters for 4° K a strong diamagnetic susceptibility. Holes in germanium (density 4 · 10¹⁷ and 4 · 10¹⁹ cm^?3) have a diamagnetic susceptibility, which is much smaller, than one would expect from cyclotron resonance masses. — Neutral boron atoms contribute in small concentration at 141 °K to the susceptibility.     

Structural and optical properties of metastable SiGe/Si films with a low germanium concentration

The properties of metastable Si_{1 ? x} Ge _x /Si (10% < x < 16%) layers grown by molecular beam epitaxy on Si(100) substrates have been investigated using atomic force microscopy, X-ray diffraction, and low-temperature luminescence spectroscopy. It has been shown that ring-like aggregates are formed on the surface of layers grown at temperatures of 500–700°C. The size and shape of these aggregates suggest that their formation is associated with the diffusion instability arising due to the existence of a relationship between the surface diffusion, stresses, and the wetting potential during the growth of the epitaxial film. The existence of deviations from the homogeneous germanium distribution in the layer plane has been confirmed by a detailed analysis of the X-ray rocking curves and two-dimensional diffraction patterns. The structures with severe surface disturbances are characterized by an abnormal change in the decay times of the emission lines of bulk silicon, which indicate the presence of local electric and/or strain fields in subsurface regions. The perturbations of the flat crystallization front are suppressed as the growth temperature of layers decreases to 350°C. Despite the absence of a coating layer of silicon, the photoluminescence spectra of the layers themselves depend weakly on their thickness and growth temperature and remain sensitive only to the technological concentration of germanium. A slowly decaying luminescence associated presumably with the localization of excitons near the SiGe-Si interface has been observed in one of the samples grown at a temperature of 700°C and containing a dense array of ring-like aggregates.     

Hot́ hole anisotropic effect in silicon and germanium

Anisotropic effect of the hole drift velocity in silicon and germanium has been investigated with the time of flight technique by applying the electric field parallel to the <100 and <111 crystallographic axis. The measurements were performed for electric fields ranging from 10 to 3 × 10⁴V/cm and temperatures from 40 to 200°K. The results indicate that the anisotropic effect v_d<100/v_d<111 increases with decreasing temperature and increasing electric field, and reaches a saturation value at high electric fields (? 10⁴V/cm). The maximum anisotropic effect for Ge is 1.25 at 40°K and for Si is 1.2 at 45°K. A qualitative analysis of the experimental data indicates that the anisotropic effect is due to the warped heavy-valence-band shape.     

Influence of ion-irradiation parameters on defect formation in silicon films

It is shown that unlike bulk silicon, for which amorphization is observed at an irradiation dose of 5 × 10¹⁶ ion/cm², thin silicon films on sapphire are amorphized at lower critical doses (10¹⁵ ion/cm²). An undamaged surface layer remains when the silicon films are irradiated with Si⁺ ion beams. Its thickness depends on the current density of the incident beam. Rutherford backscattering studies show that annealing at 950°C improves the crystallinity of the irradiated silicon film. Annealing of the films at 1100°C leads to mixing of the silicon-sapphire interface.     

硅、锗中氧的低温红外吸收

在6—300K下,利用红外傅里叶光谱仪研究了400—4000cm^-1间的硅、锗中氧的红外吸收。采用高分辨条件时,分辨率可达0.5cm^-1。研究了在低温下利用硅的1106cm^-1吸收峰和锗的855cm^-1吸收峰探测硅和锗氧含量的探测限和误差。若样品厚度为2cm,估计在20K下,硅中氧含量探测限～9.6×10¹⁴氧原子·cm^-3,锗中氧含量探测限～3.0×10¹⁴氧原子·cm^-3。同时,对不同生长条件下直拉锗单晶的氧含量进行了研究,并与用锂沉淀法所求得的锗中氧含量加以比较。对不同氧含量的硅样品的1106cm^-1吸收峰在6—300K的变化进行了观察和讨论。 关键词：     

Investigation of acceptor centers in semiconductors with the diamond crystal structure by the μ − SR method

The residual polarization of negative muons in crystal silicon samples with phosphorus (P: 1.6×10¹³ cm⁻³) and antimony (Sb: 2×10¹⁸ cm⁻³) impurities is investigated. The measurements are made in a 1000 G magnetic field oriented in a direction transverse to the muon spin in the temperature range 4–300 K. The relaxation rate and shift of the precession frequency in the silicon sample with the phosphorus impurity are measured more accurately than previously. It is found that in antimony-doped silicon the acceptor center _μ A1 at temperatures below 30 K can be in both ionized and neutral states. The experimental data are interpreted on the basis of spin-lattice relaxation of the magnetic moment of an acceptor center, formation of acceptor-donor pairs, and recombination of charge carriers at the acceptor. Preliminary measurements showed a nonzero residual polarization of negative muons in germanium. Pis’ma Zh. éksp. Teor. Fiz. 68, No. 1, 61–66 (10 July 1998)     

Dimpling—A new manifestation of ion-produced lattice damage

Abstract

Bombardment of thin (1–10 μ) single crystal targets with energetic ion beams has been found to result in macroscopic distortion of the thin film in the bombarded region. This effect, which has been euphemistically termed a ‘dimple’, is readily observed with the naked eye even at relatively low particle fluence. A useful first-order model has been developed which interprets the dimpling as an expansion of the bombarded region. For very thin samples, this expansion can be accommodated by bowing of the crystal out of the original crystal plane. For this simple model, the fractional expansion is proportional to (δ/d)² where δ is the maximum displacement from the original crystal plane and d is the diameter of the bombarded area. This measurement allows expansioh to be determined with a sensitivity comparable to or better than the most sensitive existing methods.

For silicon about 3 μ thick bombarded by 1.8 MeV He ions, the expansion increases essentially linearly with fluence at the lowest fluence (below about 10¹⁵ to 10¹⁴ cm^?2). In this region about 0.001 atomic volumes are added per incident ion. As the fluence is increased, the apparent expansion begins to increase more rapidly than linearly but approaches a saturation value at the highest fluence (about 10¹⁸ cm^?2). The effect of particle flux, incident energy, and bombardment temperature is discussed as well as some preliminary results on C ion produced dimples in Si and the behavior of Ge samples.

Thirty-minute isochronal annealing of silicon samples irradiated with He ions at room temperature shows reverse annealing for temperatures up to about 200–300°C. The dimple begins to anneal at 300°C and disappears after annealing to 600–700°C.

After irradiation, the dimpled region absorbs light more strongly in the visible and near IR region. This disappears with annealing before the dimple itself completely disappears and is felt to be largely due to scattering from defect clusters.     

Thermal recrystallization of physical vapor deposition based germanium thin films on bulk silicon (100)

We demonstrate a simple, low‐cost, and scalable process for obtaining uniform, smooth surfaced, high quality mono‐crystalline germanium (100) thin films on silicon (100). The germanium thin films were deposited on a silicon substrate using plasma‐assisted sputtering based physical vapor deposition. They were crystallized by annealing at various temperatures ranging from 700 °C to 1100 °C. We report that the best quality germanium thin films are obtained above the melting point of germanium (937 °C), thus offering a method for in‐situ Czochralski process. We show well‐behaved high‐κ /metal gate metal–oxide–semiconductor capacitors (MOSCAPs) using this film. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Flux and fluence dependence of disorder produced during implantation of 11B in silicon

The flux and fluence dependence of disorder produced in silicon during the implantation of ¹¹B has been investigated at room temperature, -50°C. and -120°C. Implantations were carried out with 200 keV ¹¹B ions using current densities in the range from 0.06μA/cm² to 15μA/cm², and the disorder monitored by measuring the energy spectra of backscattered protons which were incident on the sample at 450 keV parallel to a (110) axis. Significant differences in the dependence of the disorder on ¹¹B flux and fluence were observed between the implantations performed at room temperature and those carried out at the two lower temperatures.     

Über Zusammenhänge zwischen Elektronenspinresonanz,elektrischer Leitfähigkeit und Photoleitung bei reinem und dotiertem Bor

The conductivity mechanism in pure and doped, β-rhombohedral, polycrystalline boron between 1.5 °K and 900 °K is clarified by measurements of electrical conductivity, photoconductivity, electron paramagnetic resonance and thermoelectric effect. The semiconductor behaviour of boron between 1.5 and 900 °K is similar to that of doped and compensated germanium and silicon at helium temperatures concerning the temperature-independent number of carriers and the thermally activated conduction process at low and high carrier concentrations. The paramagnetic centres are nearly localized electrons at 1.5 °K and nearly free electrons at 900 °K with a continuous transition between these two extreme kinds of behaviour. Mobilities of charge carriers in carbon doped boron over a range from 10¹⁶ cm^?3 to 10²⁰ cm^?3 and 77 °K to 900 °K were measured for the first time and were found to obey an exponential law.     

Effects of deposition temperature and post-annealing on structure and electrical properties in (La<Subscript>0.5</Subscript>Sr<Subscript>0.5</Subscript>)CoO<Subscript>3</Subscript> films grown on silicon substrate

(La_0.5Sr_0.5)CoO₃ (LSCO) thin films have been fabricated on silicon substrate by the pulsed laser deposition method. The effects of substrate temperature and post-annealing condition on the structural and electrical properties are investigated. The samples grown above 650°C are fully crystalline with perovskite structure. The film deposited at 700°C has columnar growth with electrical resistivity of about 1.99×10⁻³ Ω cm. The amorphous films grown at 500°C were post-annealed at different conditions. The sample post-annealed at 700°C and 10⁻⁴ Pa has similar microstructure with the sample in situ grown at 700°C and 25 Pa. However, the electrical resistivity of the post-annealed sample is one magnitude higher than that of the in situ grown sample because of the effect of oxygen vacancy. The temperature dependence of resistivity exhibits semiconductor-like character. It was found that post-annealing by rapid thermal process will result in film cracks due to the thermal stress. The results are referential for the applications of LSCO in microelectronic devices.     

Beam transport

Abstract

Dopant distribution, electrical activity and damage annealing of high-dose (～5 × 10¹⁵ cm²) Ga-implanted silicon samples annealed by conventional thermal annealing have been studied by alpha particle back-scattering, differential Hall effect and ellipsometry measurements. Back-scattering spectra show that there is no long tail of Ga atoms in the as-implanted samples. Upon annealing these samples the damaged amorphous layer recrystallizes at about 570°C by solid phase epitaxy. During the epitaxial regrowth the dopant atom distribution seems to be modified. Further, very high levels of electrical activaton of Ga-atoms (～3 × 10²⁰ cm^?3), much higher than the maximum solubility limit of Ga in Si (4.5 × 10¹⁹ cm^?3), is achieved by thermal annealing of the sample at ～570°C. This is comparable to the doping achieved by laser annealing of the Ga implanted Si. All the above three measurements show that there is residual damage in the high dose (?10¹⁵cm^?2) implanted samples after the recrystallization at about 570°C. This may be related to strain in the lattice at the high concentrations of metastable substitutional Ga atoms. Annealing at higher temperature reduces the electrical activity of Ga atoms, possibly by driving out the metastably high substitutional concentrations of Ga-atoms into electrically inactive clusters or precipitates.     

Hot electron studies of lattice damage created in silicon by implantation of 2.8 MeV protons

Abstract

In this paper we report the results of a study of the annealing properties of the ionized defect density associated with the damage created in the silicon lattice by implantation of 2.8 MeV protons at room temperature. In particular, the annealing of damage created by implanting to a level of 4.43 × 10¹² protons/cm² is reported. The resulting isochronal annealing curve covered the temperature range from 70°C to 460°C. Two major annealing stages are discussed, one a broad stage between 70°C to 200°C and the other an abrupt annealing stage between 440°C to 460°C. Between the temperature range 200°C to 440°C the number of ionized defects remained relatively constant. Above 460°C no detectable effects of the proton implantation remained.