Hot-electron InGaAs/InP heterostructure bipolar transistors withfT of 110 GHz

A hot-electron InGaAs/InP heterostructure bipolar transistor (HBT) is discussed. A unity-current-gain cutoff frequency of 110 GHz and a maximum frequency of oscillation of 58 GHz are realized in transistors with 3.2×3.2-μm² emitter size. Nonequilibrium electron transport, with an average electron velocity approaching 4×10⁷ cm/s through the thin (650 Å) heavily doped (p=5×10¹⁹ cm^-3) InGaAs base and 3000-Å-wide collector space-charge region, results in a transit delay of 0.5 ps corresponding to an intrinsic cutoff frequency of 318 GHz     

Effect of reduced temperature on the fT ofAlGaAs/GaAs heterojunction bipolar transistors

The high-frequency and DC performances of single-heterojunction Al _0.25Ga_0.75As/GaAs heterojunction bipolar transistors (HBTs) have been measured at temperatures between 300 and 110 K. It is found that the maximum unity-current-gain cutoff frequency increases from 26 GHz at 300 K to 34 GHz at 110 K. It is shown that electron diffusion as determined from the majority-carrier mobility does not accurately estimate the base transit time, at least until corrections for degeneracy and minority-carrier mobility enhancement are included. Reasonable agreement is obtained assuming that base transport is limited by the thermal velocity of electrons at reduced temperatures     

Improved current gain and fT through dopingprofile selection in linearly graded heterojunction bipolar transistors

Analytical and experimental results are used to show that extension of a thin p-doped layer of base doping into the graded-gap region, close to the base, of an n-p-n AlGaAs/GaAs heterojunction bipolar transistor and removing n-type dopant from the rest of the linearly graded AlGaAs region improves current gain β and unity gain cutoff frequency f_T. Current gain is significantly improved by reducing recombination near the metallurgical interface and using the effective electric field from the grading to accelerate electrons as they are injected into the p-base. The doping profile also inhibits the formation of a potential minimum in which electrons can be stored in close proximity to the base. This greatly improves f_T, and does not hamper the current injection or increase the turn-on voltage. Space-charge recombination current is also reduced, due to the carrier density reduction associated with the effective electric field due to the graded gap     

89-GHz fT room-temperature silicon MOSFETs

The authors report the implementation of deep-submicrometer Si MOSFETs that at room temperature have a unity-current-gain cutoff frequency (f_T) of 89 GHz, for a drain-to-source bias of 1.5 V, a gate-to-source bias of 1 V, a gate oxide thickness of 40 Å, and a channel length of 0.15 μm. The fabrication procedure is mostly conventional, except for the e-beam defined gates. The speed performance is achieved through an intrinsic transit time of only 1.8 ps across the active device region     

75-GHz fT SiGe-base heterojunction bipolartransistors

The fabrication of silicon heterojunction bipolar transistors which have a record unity-current-gain cutoff frequency (f_T) of 75 GHz for a collector-base bias of 1 V, an intrinsic base sheet resistance (R_bi) of 17 kΩ/□, and an emitter width of 0.9 μm is discussed. This performance level, which represents an increase by almost a factor of 2 in the speed of a Si bipolar transistor, was achieved in a poly-emitter bipolar process by using SiGe for the base material. The germanium was graded in the 45-nm base to create a drift field of approximately 20 kV/cm, resulting in an intrinsic transit time of only 1.9 ps     

MBE-grown Si/SiGe HBTs with high β, fT,and fmax

Si/SiGe heterojunction bipolar transistors (HBTs) were fabricated by growing the complete layer structure with molecular beam epitaxy (MBE). The typical base doping of 2×10¹⁹ cm^-3 largely exceeded the emitter impurity level and led to sheet resistances of about 1 kΩ/□. The devices exhibited a 500-V Early voltage and a maximum room-temperature current gain of 550, rising to 13000 at 77 K. Devices built on buried-layer substrates had an f_max of 40 GHz. The transit frequency reached 42 GHz     

Importance of source and drain resistance to the maximum fT of millimeter-wave MODFETs

The usual approximate expression for measured f_T =[g_m/2π (C_gs+C _gd)] is inadequate. At low drain voltages just beyond the knee of the DC I-V curves, where intrinsic f _t is a maximum for millimeter-wave MODFETs, the high values of C_gd and G_ds combine with the high g_m to make terms involving the source and drain resistance significant. It is shown that these resistances can degrade the measured f_T of a 0.30-μm GaAs-AlGaAs MODFET from an intrinsic maximum f_T value of 73 GHz to a measured maximum value of 59 GHz. The correct extraction of maximum f_T is essential for determining electron velocity and optimizing low-noise performance     

Si/a-Si:H heterojunction microwave bipolar transistors with cut-offfrequencies ft above 5 GHz

The fabrication of a silicon heterojunction microwave bipolar transistor with an n⁺ a-Si:H emitter is discussed, and experimental results are given. The device provides a base sheet resistance of 2 kΩ/□ a base width 0.1 μm, a maximum current gain of 21 (V_CE=6 V, I_c=15 mA), and an emitter Gummel number G _E of about 1.4×10¹⁴ Scm^-4. From the measured S parameters, a cutoff frequency f_t of 5.5 GHz and maximum oscillating frequency f_max of 7.5 GHz at V_CE=10 V, I_c=10 mA are obtained     

High/fmax collector-up AlGaAs/GaAsheterojunction bipolar transistors with a heavily carbon-doped basefabricated using oxygen-ion implantation

AlGaAs/GaAs collector-up heterojunction bipolar transistors (HBTs) with a heavily carbon-doped base layer were fabricated using oxygen-ion implantation and zinc diffusion. The high resistivity of the oxygen-ion-implanted AlGaAs layer in the external emitter region effectively suppressed electron injection from the emitter, allowing collector current densities to reach values above 10⁵ A/cm ². For a transistor with a 2-μm×10-μm collector, f_T was 70 GHz and f_max was as high as 128 GHz. It was demonstrated by on-wafer measurements that the first power performance of collector-up HBTs resulted in a maximum power-added efficiency of as high as 63.4% at 3 GHz     

Bias dependence of fT and fmax in anIn0.52Al0.48As/n+-In0.53Ga0.47As MISFET

Detailed microwave characterization of a recently fabricated In _0.52Al_0.48As/n⁺-In_0.53Ga _0.47As MISFET reveals that high values of current-gain cutoff frequency (f_T) and unilateral-gain cutoff frequency (f_max) are obtained for a broad range of gate bias voltage values. A significant peak in f_T and f _max has also been observed at high gate-source bias values. The peak coincides with the onset of electron accumulation at the heterointerface and is attributed to reduced ionized impurity scattering coupled with reduced drain conductance. This result suggests an improved device structure that optimizes operation in the accumulation regime     

Process and device characterization for a 30-GHz fT submicrometer double poly-Si bipolar technology using BF2-implanted base with rapid thermal process

Process and device parameters are characterized in detail for a 30-GHz f_T submicrometer double poly-Si bipolar technology using a BF₂-implanted base with a rapid thermal annealing (RTA) process. Temperature ramping during the emitter poly-Si film deposition process minimizes interfacial oxide film growth. An emitter RTA process at 1050°C for 30 s is required to achieve an acceptable emitter-base junction leakage current with an emitter resistance of 6.7×10^-7 Ω-cm², while achieving an emitter junction depth of 50 nm with a base width of 82 nm. The primary transistor parameters and the tradeoffs between cutoff frequency and collector-to-emitter breakdown voltage are characterized as functions of base implant dose, pedestal collector implant dose, link-base implant dose, and epitaxial-layer thickness. Transistor geometry dependences of device characteristics are also studied. Based on the characterization results for poly-Si resistors, boron-doped p-type poly-Si resistors show significantly better performance in temperature coefficient and linearity than arsenic-doped n-type poly-Si resistors     

Optical properties of high-Tc superconductors

The present status of optical spectroscopy of high-T_c superconductors is summarized. The optical properties of these materials resemble those of the more common transition metal oxides except for being highly anisotropic in the infrared (IR). This large IR anisotropy and a need to rely solely on reflectance techniques has hindered progress in obtaining accurate IR data and interpreting these data in terms of microscopic mechanisms. However, experimental consistency is now being approached with single-crystal samples, although interpretations of these data remain controversial and an unequivocal demonstration of a superconducting gap structure has not yet been achieved. The mid-IR exhibits an absorption band whose systematics are neither well established nor well understood. The situation in the visible-near-ultraviolet is better, partly because of greatly reduced optical anisotropy and the availability of alternative measurement techniques that are not strongly affected by the lower optical quality of sintered material. As polycrystalline, sintered samples can be prepared relatively easily over wide ranges of composition, doping, and chemical substitution, most work on studying the chemical systematics of these materials has been done in this spectral range and some of the structure that appears here has been positively identified     

0.33-μm gate-length millimeter-wave InP-channel HEMTs with highf1 and fmax

The fabrication of 0.33-μm gate-length AlInAs/InP high electron mobility transistors (HEMTs) is reported. These InP-channel devices have f_t values as high as 76 GHz, f_max values of 146 GHz, and maximum stable gains of 16.8, 14, and 12 dB at 10, 18, and 30 GHz, respectively. The extrinsic DC transconductances are as high as 610 mS/mm; with drain-source breakdown voltages exceeding 10 V. The effective electron velocity in the InP channel is estimated to be at least 1.8×10⁷ cm/s, while the f_tL_g product is 29 GHz-μm. These results are comparable to the best reported results for similar InGaAs-channel devices     

Laser processing of high-Tc superconductingthin films

High-T_c superconducting thin films can be deposited and processed by pulsed and CW lasers, and a respectable materials technology for the Y-Ba-Cu-O superconductor is rapidly emerging. The pulsed laser deposition technique is simple because it produces films with compositions nearly identical to those of the target pellets. A larger variety of substrates can be used, compared to other deposition technologies, because of the relatively low temperature requirements. The laser deposition mechanism has been investigated. As-deposited superconducting films, epitaxial films with smooth surfaces, and multilayer structures with abrupt interfaces have been produced. The electrical transport properties can be changed locally using a focused argon-ion laser by modifying the oxygen stoichiometry. This laser writing can be erased by room-temperature exposure to an oxygen plasma. Other laser patterning methods such as material removal, melt-quench, and direct pattern transfer are being developed     

Reconciliation of methods for estimating fmaxfor microwave heterojunction transistors

An attempt is made to reconcile the various approaches that have recently been used to estimate the maximum frequency of oscillation f_max in high-performance AlGaAs/GaAs HBTs. f_max is computed numerically from the full expression for Mason's invariant gain using y-parameters derived from the different approaches, i.e., the hybrid-π equivalent circuit, the T-equivalent circuit, and the drift-diffusion equations. It is shown that the results for f_max are essentially the same, irrespective of the source of the y-parameters, provided that the phase delays due to transit of carriers across the base and the collector-base depletion region are properly accounted for. It is also shown, for the particular device studied, that the widely used analytical expression for f_max, involving f _T and effective base resistance and collector capacitance, is remarkably accurate for frequencies below those at which transit-time effects become important     

Reduction of ft by nonuniform base bandgapnarrowing

Analytical and simulation results are presented to illustrate qualitatively the effect of doping on base transit time. Nonuniform base bandgap narrowing (BGN) in silicon bipolar transistors can give rise to an electric field that is comparable to and against the built-in field. The base transit time τ is subsequently increased, leading to a deterioration of the cutoff frequency f₁. It is shown that the BGN effectively reduces the impurity profile grading factor K and subsequently the transit-time coefficient η. Physically, the minority carriers can be thought of as moving in a new profile characterized by a reduced η but in the absence of BGN. Unlike earlier investigations which also consider effective BGN dopings but ignore the field effects, this treatment includes their impact on the minority-carrier base transit time. For a steep exponential profile with strong BGN, an increase of η by a factor 3.57 at 300 K is calculated. Device simulations predict a smaller f_t reduction factor of 1.5 for more general profiles     

On 1/f trapping noise in MOSTs

New calculations are given for the 1/f noise in metal-oxide-semiconductor transistors (MOSTs) based on the McWhorter model (number fluctuations). Particular attention is paid to two regions of the drain current-voltage characteristic: weak inversion and near saturation. The results are at variance with previous theories, where some errors have been made. The gravest error was the violation of the physical law whereby the variance of the number of carriers N in the channel is ⩽N. The calculations do not give a divergent noise power at current saturation, as found by other authors. In the ohmic region, the relation between the spectral density of the drain current fluctuations and the number of carriers is determined. The Langevin method and the Klaassen-Prins method for calculating the 1/f noise in MOSTs are discussed and shown to have been used incorrectly when the mobility and the Hooge 1/f noise parameter depend on position in the channel     

Quasi-optical millimeter-wave band-pass filters using high-Tc superconductors

Quasioptical millimeter-wave band-pass filters using YBa₂ Cu₃O₇ high-T_c superconducting films were fabricated on MgO and LaAlO₃ substrates. Transmitted power through the filter was investigated in the 75 GHz to 110 GHz frequency range at temperatures ranging from 15 to 300 K. At 15 K the measured center frequency and the bandwidth of the superconducting filter were 92 GHz and 0.85 GHz, respectively. Measurements of YBa₂Cu₃O₇ filters were compared with similar filters fabricated using gold. At 15 K and 92 GHz, an improvement of 75% in the quality factor of the superconducting filter was obtained compared with a similar gold filter     

Low-frequency magnetic shielding studies on high-Tc superconductor Y-Ba-Cu-O

Low frequency (10-Hz to 100-MHz) magnetic-shielding studies were performed on high-T_c superconductors Y-Ba-Cu-O to investigate the material's shielding behavior. The critical field H_c1 in the superconductor was observed to be ⩽17.8 G. The superconductor shielded down to the background noise level independent of the frequency when the applied field strength was⩽ H_c1. In the vortex state, just above H_c1, the superconductor-type transformer behaved nonlinearly. A semiempirical model for the skin depth was used to fit the nonlinear data. In the high applied field limit, this shielding data was shown to have a square-root frequency dependence similar to ordinary shielding materials. At lower fields above H_C1, data tended toward frequency independence. Noise-limited experimental low-frequency results indicated that the superconductor shielded at least as well as common state-of-the-art materials