铟锌氧化物薄膜晶体管局域态分布的提取方法

本文针对铟锌氧化物薄膜晶体管(IZO TFT)的低频噪声特性与变频电容-电压特性展开试验研究,基于上述特性对有源层内局域态密度及其在禁带中的分布进行参数提取.首先,基于IZO TFT的亚阈区I-V特性提取器件表面势随栅源电压的变化关系.基于载流子数随机涨落模型,在考虑有源层内缺陷态俘获/释放载流子效应基础上,通过γ因子提取深能态陷阱的特征温度;基于沟道电流噪声功率谱密度及平带电压噪声功率谱密度的测量,提取IZO TFT有源层内局域态密度及其分布.试验结果表明,带尾态缺陷在禁带内随能量呈e指数变化趋势,其导带底密度N1TA约为3.42×10~(20)cm~(-3)·eV-,特征温度TTA约为135 K.随后,将C-V特性与线性区I-V特性相结合,对栅端寄生电阻、漏端寄生电阻、源端寄生电阻进行提取与分离.在考虑有源层内局域态所俘获电荷与自由载流子的情况下,基于变频C-V特性对IZO TFT有源层内局域态分布进行参数提取.试验结果表明,深能态与带尾态在禁带内随能量均呈e指数变化趋势,深能态在导带底密度NDA约为5.4×10~(15)cm~(-3)·eV~(-1),特征温度TDA约为711 K,而带尾态在导带底密度NTA约为1.99×10~(20)cm~(-3)·eV~(-1),特征温度TTA约为183 K.最后,对以上两种局域态提取方法进行对比与分析.     

溶胶凝胶法制备透明IZO薄膜晶体管

采用溶胶凝胶法制备了非晶铟锌氧化物(a-IZO)薄膜,并作为薄膜晶体管(TFT)的有源层制备了a-IZO TFT。研究了IZO薄膜中铟锌比对薄膜性质及a-IZO TFT器件性能的影响。结果表明:溶胶凝胶法制备的IZO薄膜经低温(300℃)退火后为非晶结构,薄膜表面均匀平整、致密,颗粒大小为20 nm左右,并具有高透过率(>85%)。IZO薄膜中的铟锌比对薄膜的电学性能和TFT器件特性影响显著,增加In含量有利于提高薄膜和器件的迁移率。当铟锌比为3∶2时,所获得的薄膜适合于作为薄膜晶体管的有源层,制备的IZO-TFT经过相对低温(300℃)退火处理具有较好的器件性能,阈值电压为1.3 V,载流子饱和迁移率为0.24 cm2·V-1·s-1,开关比(Ion∶Ioff)为105。     

铜-钼源漏电极对非晶氧化铟镓锌薄膜晶体管性能的改善

在铜(Cu)和非晶铟镓锌氧化物(a-IGZO)之间插入30 nm厚的钼(Mo)接触层, 制备了具有Cu-Mo源漏电极的a-IGZO薄膜晶体管(TFT). Mo接触层不仅能够抑制Cu与a-IGZO有源层之间的扩散, 而且提高了Cu电极与玻璃基底以及栅极绝缘层的结合强度. 制备的Cu-Mo结构TFT与纯Cu 结构TFT相比, 具有较高的迁移率(～9.26 cm²·V^-1·s^-1)、更短的电流传输长度(～0.2 μm)、更低的接触电阻(～1072 Ω)和有效接触电阻率(～1×10^-4Ω·cm²), 能够满足TFT 阵列高导互联的要求.     

室温下溅射法制备高迁移率氧化锌薄膜晶体管

为降低氧化锌薄膜晶体管(ZnO TFT)的工作电压,提高迁移率,采用磁控溅射法在氧化铟锡(ITO)导电玻璃基底上室温下依次沉积NbLaO栅介质层和ZnO半导体有源层,制备出ZnO TFT,对器件的电特性进行了表征。该ZnO TFT呈现出优异的器件性能:当栅电压为5 V、漏源电压为10 V时,器件的饱和漏电流高达2.2 m A;有效场效应饱和迁移率高达107 cm~2/(V·s),是目前所报道的室温下溅射法制备ZnO TFT的最高值,亚阈值摆幅为0.28 V/decade,开关电流比大于107。利用原子力显微镜(AFM)对NbLaO和ZnO薄膜的表面形貌进行了分析,分析了器件的低频噪声特性,对器件呈现高迁移率、低亚阈值摆幅以及迟滞现象的机理进行了讨论。     

非晶铟镓锌氧薄膜晶体管钼/铜源漏电极的研究

针对非晶铟镓锌氧薄膜晶体管（a-IGZO TFT）的钼/铜源漏电极开展研究。实验证明,单层Mo源漏电极与栅绝缘层之间的粘附性好、表面粗糙度较小、电阻率较大,而单层Cu源漏电极与栅绝缘层之间的结合性差且Cu原子扩散问题严重、表面粗糙度较大、电阻率较小。为了实现优势互补,我们设计了双层Mo（20 nm）/Cu（80 nm）源漏电极,并采用优化工艺制备了包含该电极结构的a-IGZO TFT。器件具有良好的电学特性,场效应迁移率为 8.33 cm²·V^-1·s^-1, 阈值电压为6.0 V,亚阈值摆幅为2.0 V/dec,开关比为 1.3×10⁷,证明了双层Mo/Cu源漏电极的可行性和实用性。     

InGaZnO薄膜晶体管背板的层间Cu互连静电保护研究

InGaZnO薄膜晶体管(InGaZnO thin film transistor, IGZO TFT)与Cu互连组合的驱动背板,在生产线机台上的抗静电放电(electrostatic discharge, ESD)耐压能力比传统a-Si TFT背板低将近一个数量级电压,数据线和扫描线层间Mo/Cu互连抗击穿电压只有传统a-SiTFT背板层间Mo/Al/Mo互连的60%左右.层间Cu互连的ESD破坏成为影响IGZO TFT超高清面板正常显示的一个重要因素.本文建立了扫描线层Cu金属扩散进入SiNx/SiO2绝缘层和数据线层Cu金属在爬坡拐角处扩散进入SiO2绝缘层,诱发层间Cu互连ESD破坏的机理模型.提出了Cu互连周边ESD保护电路架构三种基本结构的选型条件,以及保证层间Cu互连抗ESD击穿能力的ESD保护电路设计方法.利用本文提出的方法,有效降低了IGZO TFT背板的层间Cu互连ESD破坏风险.     

氢化非晶硅薄膜晶体管的低频噪声特性

针对氢化非晶硅薄膜晶体管(hydrogenated amorphous silicon thin film transistor,a-Si:H TFT)的低频噪声特性展开实验研究.由测量结果可知,a-Si:H TFT的低频噪声特性遵循1/f~γ(f为频率,γ≈0.92)的变化规律,主要受迁移率随机涨落效应的影响.基于与迁移率涨落相关的载流子数随机涨落模型(?N-?μ模型),在考虑源漏接触电阻、局域态俘获及释放载流子效应等情况时,对器件低频噪声特性随沟道电流的变化进行分析与拟合.基于a-Si:H TFT的亚阈区电流-电压特性提取器件表面能带弯曲量与栅源电压之间的关系,通过沟道电流噪声功率谱密度提取a-Si:H TFT有源层内局域态密度及其分布.实验结果表明:局域态在禁带内随能量呈e指数变化,两种缺陷态在导带底密度分别约为6.31×10~(18)和1.26×10~(18)cm~(-3)·eV~(-1),特征温度分别约为192和290 K,这符合非晶硅层内带尾态密度及其分布特征.最后提取器件的平均Hooge因子,为评价非晶硅材料及其稳定性提供参考.     

使用铜源漏电极的非晶氧化铟锌薄膜晶体管的研究

为了实现氧化物薄膜晶体管(TFT)的低电阻布线,采用Cu作为氧化物TFT的源漏电极。通过优化成膜工艺制备了电阻率低至2.0μΩ·cm的Cu膜,分析了Cu膜的晶体结构、粘附性及其与a-IZO薄膜的界面,制备了以a-IZO为有源层和Cu膜的粘附层的TFT器件。结果表明:所制备的Cu膜呈多晶结构;引入a-IZO粘附层增强了Cu膜与衬底的粘附性;同时,Cu在a-IZO中的扩散得到了抑制。所制备的TFT的迁移率、亚阈值摆幅和阈值电压分别为12.9 cm2/(V·s)、0.28 V/dec和-0.6 V。     

基于有机异质结C60/ZnPc的绿色磷光TOLED

以有机异质结C_(60)/ZnPc作为电荷产生层,制备结构为ITO/TPBi(40nm)/C_(60)(xnm)/ZnPc(x nm)/NPB(40nm)/Al(120nm)和ITO/TPBi(40nm)/LiF(ynm)/Al(2nm)/C_(60)(5nm)/ZnPc(5nm)/MoO_3(3nm)/NPB(40nm)/Al(120nm)的非发光倒置器件,其中x的值为0、5、10和15,y的值为0、0.5、1.0和1.5.实验证明,有机异质结C_(60)/ZnPc可在外电场下实现电荷分离,加入LiF/Al和MoO_3可更有效地提高电荷产生层的电荷分离和注入能力.基于LiF/Al/C_(60)/ZnPc/MoO_3结构,制备绿色磷光叠层有机发光二极管,进一步研究该电荷产生层对叠层器件的光电性能影响.结果表明,电荷产生层的电荷分离和注入可影响叠层器件内部的电荷注入平衡,进而对器件性能产生影响.当LiF、Al、C_(60)、ZnPc和MoO_3结构厚度分别为0.5nm、1nm、5nm、5nm和3nm时,电荷产生层产生的电荷与两侧电极注入的电荷达到匹配,使叠层器件具有最佳光电性能,获得了高效绿色磷光叠层器件,其驱动电压明显低于单层器件2倍,最大亮度、电流效率和功率效率分别达84 660cd·m~(-2)、94.7cd·A~(-1)和43lm·W~(-1).     

顶发射白光OLED器件制备及其色坐标漂移机制研究

采用了高反射率金属Al和电化学性能稳定的金属Mo,在硅基底上制备了多层结构的 Al/Mo/MoO₃阳极,并研究了不同MoO₃厚度下多层阳极的反射率。在此基础上,通过发光层共掺杂制备了顶部发光OLED器件,并对器件发光机制进行了系统研究和分析。实验结果表明：采用发光层共掺杂制备的顶部发光OLED器件的色坐标,随电流密度或电压的增加而发生漂移;OLED器件色坐标漂移的原因是三基色发光强度随电流密度的增加,逐渐偏离了形成白光(0.33, 0.33)所需三基色强度比例值,导致了OLED器件的色坐标发生了漂移,其机制是发光层中主-客之间能量转移和陷阱共同作用的结果。进一步研究发现,在不同电压下,红光发光强度随驱动电压(或电流密度)增大而线性地减小。     

A study of electrical enhancement of polycrystalline MgZnO/ZnO bi-layer thin film transistors dependence on the thickness of ZnO layer

A polycrystalline MgZnO/ZnO bi-layer was deposited by using a RF co-magnetron sputtering method and the MgZnO/ZnO bi-layer TFTs were fabricated on the thermally oxidized silicon substrate. The performances with varying the thickness of ZnO layer were investigated. In this result, the MgZnO/ZnO bi-layer TFTs which the content of Mg is about 2.5 at % have shown the enhancement characteristics of high mobility (6.77–7.56 cm² V⁻¹ s⁻¹) and low sub-threshold swing (0.57–0.69 V decade⁻¹) compare of the ZnO single layer TFT (μ_FE = 5.38 cm² V⁻¹ s⁻¹; S.S. = 0.86 V decade⁻¹). Moreover, in the results of the positive bias stress, the ΔV_on shift (4.8 V) of MgZnO/ZnO bi-layer is the 2 V lower than ZnO single layer TFT (ΔV_on = 6.1 V). It reveals that the stability of the MgZnO/ZnO bi-layer TFT enhanced compared to that of the ZnO single layer TFT.     

Mo/B4C软X射线多层膜结构特性研究

在6.7<λ<10.0nm波段选择Mo/B₄C作为多层膜材料,并采用磁控溅射法制备出多层膜样品.这些多层膜样品的周期结构为3.35nm～5.52nm.采用X射线衍射仪和透射电镜(TEM)对样品的微观结构进行研究.结构表明,这些多层膜样品的结构质量很高,并有很好的热稳定性.     

Phase transition and pitting corrosion behaviour for Mo—implanted aluminium

Molybdenum ions are implanted into aluminium with high ion flux and high dose at elevated temperatures of 200℃, 400℃ and 500℃. Due to the high temperature and high flux of vacancies and interstitial atoms, the atom diffusion and chemical effects are enhanced during the ion implantation. The effects increase with increasing ion flux and dose, so that new phase formation and phase transition emerge noticeably. X-ray diffraction analysis shows that when the aluminium is implanted with Mo ions at a low ion flux (25μA/cm²), the Al₅Mo alloy is formed. The atomic ratio of Mo/Al of the Al₅Mo phase is close to 20%. When the aluminium is implanted with Mo ions at a high ion flux (50μA/cm²), the phase transition from Al₅Mo to Al₁₂Mo appears, and the latter is dominant, which is determined to be the final phase. The ratio of Mo/Al in Al₁₂Mo is 7.7%. Rutherford backscattering spectroscopy indicates also that the Mo/Al atom ratio is ～7% to ～8% in Mo-implanted aluminium. The atomic ratios of the constituents in Al₅Mo and Al₁₂Mo are of stoichiometric composition for these alloys. The thicknesses of the Al₁₂Mo alloy layers for Mo-implanted Al with ion doses of 3×10¹⁷/cm² and 1×10¹⁸/cm² are 550nm and 2000nm, respectively. The pitting corrosion potential V_p increases obviously. It is clear that due to the formation of Al₁₂Mo alloy layer, the pitting corrosion resistance is enhanced.     

Investigation of the electrical properties and stability of HfInZnO thin-film transistors

In this study, amorphous HfInZnO (a-HIZO) thin films and related thin-film transistors (TFTs) were fabricated using the RF-sputtering method. The effects of the sputtering power (50–200 W) on the structural, surface, electrical, and optical properties of the a-HIZO films and the performance and NBIS stability of the a-HIZO TFTs were investigated. The films’ N_e increased and resistivity decreased as the sputtering power increased. The 100 W deposited a-HIZO film exhibited good optical and electrical properties compared with other sputtering powers. Optimization of the 100 W deposited a-HIZO TFT demonstrated good device performance, including a desirable μ_FE of 19.5 cm²/Vs, low SS of 0.32 V/decade, low V_th of 0.8 V, and high I_on/I_off of 10⁷, respectively. The 100 W deposited a-HIZO TFT with Al₂O₃ PVL also exhibited the best stability, with small V_th shifts of -2.2 V during NBIS testing. These high-performance a-HIZO thin films and TFTs with Al₂O₃ PVL have practical applications in thin-film electronics.     

Preparation and characterization of transparent conducting Zn−Sn−O films deposited on organic substrates at low temperature

Transparent conducting Zn−Sn−O films were deposited on Polypropylene adipate thin-film substrates at low temperature by r. f. magnetron sputtering. The structural, electrical and optical properties of the deposited films were investigated. All the obtained films are of amorphous structure and have a very good adhesion to the substrates. The resistivity, carrier concentration and Hall mobility of the film are 1.3×10⁻² Ω·cm, 4.1×10¹⁹ cm⁻³ and 12.4 cm²· V⁻¹· s⁻¹, respectively. The transmittance of the film reaches 82%.     

Low temperature diffusion and trapping of muons in aluminium: New experiments and comparison with theory

The low-temperature diffusion experiments in aluminium have been extended to measurements onAlSi,AlGe andAlGa. The systematic study of Al with various impurities now shows that the trapping rate at temperatures below 2 K (described by a T^−0.7 law) is directly related to the elastic distortion caused by each specific doping element. The overall diffusion behaviour in Al from 0.05 to 200 K can be described by the Kondo theory, only by assuming a low Debye frequency parameter, and if an additional T¹ diffusion rate is included in the intermediate temperature range.     

Investigation of thin film all-solid-state lithium ion battery materials

All-solid-state thin film batteries are feasible by employing Al as anode and LiPON as electrolyte which are subsequently deposited by sputtering. The lithium ion conductivity of ∼ 10⁻⁶ S/cm for the thin film LiPON is in agreement with data reported for bulk material. The high voltage cathode Li₂CoMn₃O₈ could be prepared by forming the compound by the combustion method andsubsequent e-beam evaporation of this material with the addition of 20 wt.-% LiNO₃ at an oxygen partial pressure of 10⁻⁵ mbar. The thin film cells could be operated between 3 and 5 V vs. Al, LiAl. The chemical diffusion coefficient was found to be in the range from 10⁻¹³ to 10⁻¹² cm²/s at room temperature by employing the GIT-technique for the composition x of Li_2-xCoMn₃O₈ in the range from 0.1 to 1.6. Impedance studies of the complete battery system revealed a charge transfer resistance of 290 Θ, a double layer capacity of ∼ 45–70 μF for an electrode area of 6.7 cm² and a rate determining chemical diffusion coefficient in the range from 10⁻¹² to 10⁻¹¹ cm²/s. Paper presented at the 9th EuroConference on Ionics, Ixia, Rhodes, Greece, Sept. 15–21, 2002.     

High Temperature Diffusion of 6Li Adsorbed on a Ru(001) Single Crystal Surface as Seen by Pulse NMR

Diffusion measurements on lithium atoms adsorbed on a ruthenium single crystal were performed in the high temperature regime (1100–1200 K). Pulsed NMR techniques were utilized to produce and observe the decay of magnetization patterns from which the diffusion coefficient was extracted. The observed temperature dependence could be described by D = (10 ± 7) cm²/s · exp (−(0.46 ± 0.07) eV/kT). The extremely high diffusion coefficient and prefactor are understood by a gas like adsorbate behavior. The electric field gradient has been measured with ⁷Li: V _zz = −5.0 ± 0.1 10¹⁵ V/cm² with an inhomogeneity of less then 1% as judged by the width of the satellite transitions.     

Optimized Performances of Thick Film Organic Lighting-Emitting Diodes

The performance of organic light-emitting diodes (OLEDs) with thick film is optimized. The alternative vanadium oxide (V₂O₅) and N,N'-di(naphthalene-1-yl)-N,N'-diphenyl-benzidine (NPB) layers are used to enhance holes in the emissive region, and 4,7-dipheny-1,10-phenanthroline (Bphen) doped 8-tris-hydroxyquinoline aluminium (Alq₃) is used to enhance electrons in the emissive region, thus ITO/V₂O₅ (8nm)/NPB (52nm)/V₂O₅ (8nm)/NPB (52nm)/Alq₃ (30 and 45nm)/Alq₃:Bphen (30wt%, 30 and 45nm)/LiF (1nm)/Al (120nm) devices are fabricated. The thick-film devices show the turn-on voltage of about 3V and the maximal power efficiency of 4.5lm/W, which is 1.46 times higher than the conventional thin-film OLEDs.     

Diffusion study of <Superscript>15</Superscript>N implanted into α-Ti using the nuclear resonance technique

The diffusion of ¹⁵N in α-Ti was studied in the 673–1023 K temperature range by using the ion implantation and nuclear resonance techniques. The measurements show that the diffusion coefficients follow an Arrhenius behavior D(T)=D₀ ^-Q/RT, where D₀=(1.1±0.8)×10^-7 m² s^-1 and Q=(183±2) kJ/mol. A comparison with previous results is also given. PACS 66.30.Jt; 85.40.Ry