Phosphonyl/hydroxyl hydrogen bonding–induced miscibility of poly(arylene ether phosphine oxide/sulfone) statistical copolymers with poly(hydroxy ether) (phenoxy resin): Synthesis and characterization

High molecular weight bisphenol A or hydroquinone‐based poly(arylene ether phosphine oxide/sulfone) homopolymer or statistical copolymers were synthesized and characterized by thermal analysis, gel permeation chromatography, and intrinsic viscosity. Miscibility studies of blends of these copolymers with a (bisphenol A)‐epichlorohydrin based poly(hydroxy ether), termed phenoxy resin, were conducted by infrared spectroscopy, dynamic mechanical analysis, and differential scanning calorimetry. All of the data are consistent with strong hydrogen bonding between the phosphonyl groups of the copolymers and the pendent hydroxyl groups of the phenoxy resin as the miscibility‐inducing mechanism. Complete miscibility at all blend compositions was achieved with as little as 20 mol % of phosphine oxide units in the bisphenol A poly(arylene ether phosphine oxide/sulfone) copolymer. Single glass transition temperatures (T_g) from about 100 to 200°C were achieved. Replacement of bisphenol A by hydroquinone in the copolymer synthesis did not significantly affect blend miscibilities. Examination of the data within the framework of four existing blend T_g composition equations revealed T_g elevation attributable to phosphonyl/hydroxyl hydrogen bonding interactions. Because of the structural similarities of phenoxy, epoxy, and vinylester resins, the new poly(arylene ether phosphine oxide/sulfone) copolymers should find many applications as impact‐improving and interphase materials in thermoplastics and thermoset composite blend compositions. © 1999 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 37: 1849–1862, 1999     

Miscibility and morphologies of poly(arylene ether phenyl phosphine oxide/sulfone) copolymer/vinyl ester resin mixtures and their cured networks

Nonreactive bisphenol A‐based poly(arylene ether triphenyl phosphine oxide/diphenyl sulfone) statistical copolymers and a poly(arylene ether triphenyl phosphine oxide) homopolymer, each having a number‐average molecular weight of about 20 kg/mol, were synthesized and solution‐blended with a commercial dimethacrylate vinyl ester resin. Free‐radical cured systems produced morphologies that were a function of both the amount of phosphonyl groups and the weight percentage of the copolymers. For example, highly hydrogen‐bonded poly(arylene ether phenyl phosphine oxide) homopolymer/vinyl ester resin mixtures were homogeneous in all proportions both before and after the formation of networks. Copolymers containing low amounts (≤30 mol %) of the phosphonyl groups displayed phase separation either before or during cure. The phase‐separated cured materials generally had phase‐inverted morphologies, such as a continuous thermoplastic copolymer phase and a particulate, discontinuous vinyl ester network phase, except for systems containing a very low copolymer content. The resin modified with a copolymer containing 30 mol % phosphine oxide comonomer showed improved fracture toughness, suggesting the importance of both phase separation and good adhesion between the thermoplastic polymer and the crosslinked vinyl ester filler phase. The results suggested that the copolymers with high amounts of phosphine oxide should be good candidates for interphase sizing materials between a vinyl ester matrix and high‐modulus carbon fibers for advanced composite systems. Copolymers with low amounts of phosphonyl groups can produce tough, vinyl ester‐reinforced plastics. The char yield increases with the concentration of bisphenol A poly(arylene ether phosphine oxide) content, suggesting enhanced fire resistance. The incorporation of thermoplastic copolymers sustains a high glass‐transition temperature but does not significantly affect the thermal degradation onset temperature. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 2409–2421, 2000     

Flame retardant epoxy resins based on diglycidyl ether of (2,5-dihydroxyphenyl)diphenyl phosphine oxide

Phosphine oxide-containing epoxy resins were prepared from diglycidyl ether of (2,5-dihydroxyphenyl)diphenyl phosphine oxide and diglycidyl ether of bisphenol A by crosslinking with 4,4′-diaminodiphenylmethane. Several (2,5-dihydroxyphenyl)diphenyl phosphine oxide/diglycidyl ether of bisphenol A molar ratios were used to obtain materials with different phosphorus content. The properties of the thermosetting materials were evaluated by differential scanning calorimetry, dynamic mechanical analysis, thermogravimetric analysis, and limiting oxygen index and related to the phosphorus content. Thermal and thermooxidative degradation was studied by GC/MS, ³¹P MAS NMR spectroscopy, and scanning electron microscopy. Limiting oxygen index values indicate good flame retardant properties that are related to the formation of a protective phosphorus-rich layer that slowed down the degradation and prevented it from being total. © 2007 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 45: 2142–2151, 2007     

Synthesis and characterization of arylene ether imide reactive oligomers and polymers containing diaryl alkyl phosphine oxide groups

The diamine monomer bis(m-aminophenyl) methyl phosphine oxide (DAMPO) was synthesized via nitration and reduction of diphenyl methyl phosphine oxide. Rigorous purification of this monomer enabled its utilization in the synthesis of high molecular weight poly(ether imide)s. Both thermoplastic materials and thermosetting systems, endcapped with either phthalic or phenylethynylphthalic anhydride, respectively, have been produced. Major emphasis has been placed on polyimides derived from 2,2′-bis(4-(3,4-dicarboxyphenoxy) phenyl) propane dian- hydride, also known as bisphenol-A dianhydride, or BPADA. High molecular weight homo- and copolyimides based on BPADA/DAMPO had glass transition temperature values in the range of 215–223°C, and were totally amorphous. They displayed higher modulus and tensile strength values than the polyetherimide control based on meta-phenylene diamine and also generated high TGA char yields in air. Phenylethynyl crosslinkable materials were effectively cured at 380°C to produce networks that are ductile, very solvent resistant and also generate high char yields, which suggest their possible utilization in fire resistant matrix systems. © 1998 John Wiley & Sons, Ltd.     

Advanced flame‐retardant epoxy resins from phosphorus‐containing diol

Phosphorus‐containing epoxy systems were prepared from isobutylbis(hydroxypropyl)phosphine oxide (IHPO) and diglycidyl ether of bisphenol A (DGEBA). Diethyl‐N,N‐bis(2‐hydroxyethyl) aminomethyl phosphonate (Fyrol 6) could not be incorporated into the epoxy backbone by a reaction with either epichlorohydrin or DGEBA because intramolecular cyclization took place. The curing behavior of the IHPO–DGEBA prepolymer with two primary amines was studied, and materials with moderate glass‐transition temperatures were obtained. V‐0 materials were obtained when the resins were tested for ignition resistance with the UL‐94 test. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 3510–3515, 2005     

Miscibility and intermolecular specific interactions in thermosetting blends of bisphenol S epoxy resin with poly(ethylene oxide)

Thermosetting blends composed of phloroglucinol‐cured bisphenol S epoxy resin and poly(ethylene oxide) (PEO) were prepared via the in situ curing reaction of epoxy in the presence of PEO, which started from initially homogeneous mixtures of diglycidyl ether of bisphenol S, phloroglucinol, and PEO. The miscibility of the blends after and before the curing reaction was established on the basis of thermal analysis (differential scanning calorimetry). Single and composition‐dependent glass‐transition temperatures (T_g's) were observed for all the blend compositions after and before curing. The experimental T_g's could be explained well by the Gordon–Taylor equation. Fourier transform infrared spectroscopy indicated that there were competitive hydrogen‐bonding interactions in the binary thermosetting blends upon the addition of PEO to the system, which was involved with the intramolecular and intermolecular hydrogen‐bonding interactions, that is, OH···O?S, OH···OH, and OH, versus ether oxygen atoms of PEO between crosslinked epoxy and PEO. On the basis of infrared spectroscopy results, it was judged that from weak to strong the strength of the hydrogen‐bonding interactions was in the following order: OH···O?S, OH···OH, and OH versus ether oxygen atoms of PEO. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 359–367, 2005     

Hydrolytically stable thermoplastic and thermosetting poly(arylene phosphine oxide) material systems

Several thermoplastic and thermosetting polymeric materials containing the phenyl phosphine oxide group were prepared and characterized by physical methods. High molecular weight poly(arylene ether)s and polyimides containing the hydrolytically stable bulky phosphine oxide unit were synthesized and found to be soluble materials with moderately high glass transition temperatures. The phenyl phosphine oxide moiety was further incorporated into epoxy and bismaleimide type crosslinked systems. Phosphorus promoted char formation in air was displayed by both the linear and crosslinked macromolecules, leading to improved self-extinguishability relative to the non-phosphorus containing analogous polymeric systems.     

Nanoscale-confined crystallization in epoxy resin and polyethylene-block-poly(ethylene oxide) diblock copolymer blends

In this paper, the nanoscale-confined crystallization behavior and crystallization kinetics in blends of double-crystalline polyethylene-block-poly(ethylene oxide) (PE-b-PEO) diblock copolymer with diglycidyl ether of bisphenol A epoxy resin were investigated. The results showed that there appeared three crystallization regimes related to the crystallization of the PE block within three different microenvironments in the epoxy resin/PE-b-PEO blends. The Avrami index n is around 1.8–2.4, suggesting PE block of the copolymer in the blends exhibited nanoscale-confined crystallization behavior by homogeneous nucleation. The PE block nanoscale-confined crystallization is ascribed to the formation of the strong intermolecular hydrogen bonding interaction between hydroxyl groups of amine-cured epoxy and ether oxygen atoms of PEO, as seen from Fourier transform infrared spectroscopy spectra.     

Toward microphase separation in epoxy systems containing PEO–PPO–PEO block copolymers by controlling cure conditions and molar ratios between blocks

Nanostructuring of thermosetting systems using the concept of templating and taking advantage of the self-assembling capability of block copolymers is an exciting way for designing new materials for nanotechnological applications. In this first part of the work, reactive blends based on stoichiometric amounts of a diglycidylether of bisphenol-A epoxy resin and 4,4′-diaminodiphenylmethane cure agent modified with three poly(ethylene oxide)-co-poly(propylene oxide)-co-poly(ethylene oxide) block copolymers were studied. Cure advancement of these systems was analyzed by differential scanning calorimetry. The experimental results show a delay of cure rate, which increases as copolymer content and PEO molar ratio in the block copolymer rise. Infrared spectroscopy shows that PEO block is mainly responsible of physical interactions between the hydroxyl groups of growing epoxy thermoset and ether bonds of block copolymer. These interactions are mainly responsible for the delaying of cure kinetics. The molar ratio between blocks also has a critical influence on the delaying of the cure rate. A mechanistic approach of cure kinetics allows us to relate the delay of cure as a consequence of block copolymer adding to physical interactions between components.     

A polymer of bisphenol A and bisphenol A diglycidyl ether and its blends with poly(styrene‐co‐acrylonitrile): In situ polymerization preparation,morphology, and mechanical properties

The poly(hydroxy ether of bisphenol A)‐based blends containing poly(acrylontrile‐co‐styrene) (SAN) were prepared through in situ polymerization, i.e., the melt polymerization between the diglycidy ether of bisphenol A (DGEBA) and bisphenol A in the presence of poly(acrylontrile‐co‐styrene) (SAN). The polymerization reaction started from the initial homogeneous ternary mixture of SAN/DGEBA/bisphenol A, and the phenoxy/SAN blends with SAN content up to 20 wt % were obtained. Both the solubility behavior and Fourier transform infrared (FTIR) spectroscopy studies demonstrate that no intercomponent reaction occurred in the reactive blend system. Differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), and scanning electronic microscopy (SEM) were employed to characterize the phase structure of the as‐polymerized blends. All the blends display the separate glass transition temperatures (T_g's); i.e., the blends were phase‐separated. The morphological observation showed that all the blends exhibited well‐distributed phase‐separated morphology. For the blends with SAN content less than 15 wt %, very fine SAN spherical particles (1–3 μmm in diameter) were uniformly dispersed in a continuous matrix of phenoxy and the fine morphology was formed through phase separation induced by polymerization. Mechanical tests show that the blends containing 5–15 wt % SAN displayed a substantial improvement of tensile properties and Izod impact strength, which were in marked contrast to those of the materials prepared via conventional methods. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 525–532, 1999     

Relationships between the morphology and thermoresponsive behavior in micro/nanostructured thermosetting matrixes containing a 4'-(hexyloxy)-4-biphenylcarbonitrile liquid crystal

Meso/nanostructured thermoresponsive thermosetting materials based on an epoxy resin modified with two different molecular weight amphiphilic poly(styrene- block-ethylene oxide) block copolymers (PSEO) and a low molecular weight liquid crystal, 4'-(hexyloxy)-4-biphenylcarbonitrile (HOBC), were investigated. A strong influence of the addition of PSEO on the morphology generated in HOBC--(diglicydyl ether of bisphenol A epoxy resin/ m-xylylenediamine) was detected, especially in the case of the addition of PSEO block copolymers with a higher PEO-block content and a lower molecular weight. The morphologies generated in the ternary systems also influenced the thermoresponsive behavior of the HOBC separated phase provoked by applying an external field, such as a temperature gradient and an electrical field. Thermal analysis of the investigated materials allowed for a better understanding of the relationships between generated morphology/thermo-optical properties/PSEO:HOBC ratio, and HOBC content. Controlling the relationship between the morphology and thermoresponsive behavior in micro/nanostructured thermosetting materials based on a 4'-(hexyloxy)-4-biphenylcarbonitrile liquid crystal allows the development of materials which can find application in thermo- and in some cases electroresponsive devices, with a high contrast ratio between transparent and opaque states.     

Epoxy resin/poly(ϵ‐caprolactone) blends cured with 2,2‐bis[4‐(4‐aminophenoxy)phenyl]propane. I. Miscibility and crystallization kinetics

Crystalline thermosetting blends composed of 2,2′‐bis[4‐(4‐aminophenoxy)phenyl]propane (BAPP)‐cured epoxy resin (ER) and poly(?‐caprolactone) (PCL) were prepared via the in situ curing reaction of epoxy monomers in the presence of PCL, which started from initially homogeneous mixtures of diglycidyl ether of bisphenol A (DGEBA), BAPP, and PCL. The miscibility of the blends after and before the curing reaction was established with differential scanning calorimetry and dynamic mechanical analysis. Single and composition‐dependent glass‐transition temperatures (T_g's) were observed in the entire blend composition after and before the crosslinking reaction. The experimental T_g's were in good agreement with the prediction by the Fox and Gordon–Taylor equations. The curing reaction caused a considerable increase in the overall crystallization rate and dramatically influenced the mechanism of nucleation and the growth of the PCL crystals. The equilibrium melting point depression was observed for the blends. An analysis of the kinetic data according to the Hoffman–Lauritzen crystallization kinetic theory showed that with an increasing amorphous content, the surface energy of the extremity surfaces increased dramatically for DGEBA/PCL blends but decreased for ER/PCL blends. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 1085–1098, 2003     

Bismaleimide and bispropargyl ether blends: Curing kinetics—Model free approach

Two structurally different bismaleimides, namely 2,2-bis[4-(4-maleimidophenoxy-phenyl)]propane (BMIX) and 5(6)-maleimide-1(4′-maleimidophenyl)-1,3,3′-trimethyl indane (BMII) and bispropargyl ether of bisphenol A (BPEBPA) were prepared. The two bismaleimides were separately blended with BPEBPA in different mole ratios [BMIX/BMII: BPEBPA = 100: 0, 75: 25, 50: 50, 25: 75, 0: 100%] and the materials were thermally polymerized at 230°C. The curing studies of the monomers and blends reveal that the blending of BMIX and BMII with BPEBPA decreases the curing temperature window. Blending of 25% of either BMIX or BMII with BPEBPA drastically reduces the curing enthalpy and was nearly half the value of pure BPEBPA. The FTIR spectra of the cured materials show that the chromene ring stretching frequency of BPEBPA decreases as the bismaleimide content increases and new absorption peaks corresponding to cyclopentane (941 cm^?1) and cyclohexane (1018 cm^?1) appeared. The curing kinetics of the monomers and blends were studied using three model free kinetic methods. The trend noted for the variation of apparent activation energies for curing of 25% BMIX + 75% BPEBPA blend is different compared to the monomers and other blends.     

A series of new high‐performance materials based on poly[4′‐fluorophenyl‐bis(4‐phenyl)phosphine oxide]

A new series of high‐performance poly(arylene phosphine oxide) (PAPO) materials were synthesized postpolymerization from fluorinated poly(arylene phosphine oxide) (f‐PAPO). The new materials had increased solubility and film‐forming ability over the parent f‐PAPO. With the careful choice of the nucleophile, the thermal stability was also increased. The parent polymer f‐PAPO was synthesized via Ni(0) coupling from aromatic chloride and mesylate monomers. Both monomers were polymerized successfully to create polymers with intrinsic viscosities of 0.235 and 0.123 dL/g, respectively. The higher molecular weight f‐PAPO gave a glass transition of 320 °C and a char yield of 54% at 650 °C in air. The substitution of f‐PAPO via nucleophilic aromatic substitution produced PAPO thermoplastics with significant changes in the properties. The largest increase in the thermal stability relative to f‐PAPO was from 563 to 600 °C 10% weight‐loss values in nitrogen after the displacement of fluoride by 4‐aminophenol, which yielded poly[4‐(4‐aminopheonxyphenyl)bis(4′‐phenyl)phosphine oxide]. Additionally, the char yield increased from 54 to 71% in air at 650 °C. The solubility of the parent polymer was improved after substitution with 3‐tert‐butylphenol, n‐nonylamine, and poly(ethylene glycol)monomethyl ether. All of these became soluble in chloroform, N,N‐dimethylacetamide, and dimethyl sulfoxide. Copolymers were synthesized with 2,5‐dichloro‐4′‐fluorobenzophenone to improve the solubility of f‐PAPO without the loss of thermal stability. These copolymers also underwent nucleophilic aromatic substitution to create an epoxy cure agent that was used with the DEN 431 resin. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2277–2287, 2003     

Synthesis and blend behavior of high performance homo- and segmented thermoplastic polyimides

New synthetic methodology was developed as part of an effort to increase the processibility of high Tg polyimide homo⁻ and copolymers, suitable as matrix resins and structural adhesives. Molecular weight and end group control together with solution imidization techniques were successfully employed to convert a variety of poly(amic acid) intermediates to fully cyclized polyimides. The solution imidization was conducted in N-methylpyrrolidone (NMP) with o-dichlorobenzene used as the azeotroping agent at 165–190°C. This technique has produced products which are more soluble than polyimides prepared previously by bulk thermal cyclization of poly(amic acids) at temperature of 300°C. They are also more stable than “chemically” imidized materials. In addition, incorporation of the monofunctional reagent phthalic anhydride provides nonreactive phthalimide end groups and controlled molecular weight. This latter feature significantly further improved the melt and solution processibility of the resulting polyimides. In this study thermoplastic, fully cyclized polyimides of 10 000, 20 000, and 30 000 M̄n were prepared which displayed glass transition temperatures ranging from 260–353°C, with the highest T_g observed with phthalimide capped polyimide systems derived from 6F-dianhydride and p-phenylene diamine. Tough, transparent films were prepared from polymers of 20 000 and 30 000 g/mol by casting from NMP solution or by compression molding at 50–70°C above the glass transition temperature. For purposes of molecular weight assessment, t-butyl phthalic anhydride was used as the end blocker. This permitted 400 M-Hertz proton NMR to be used for assessing the concentration of end groups. Comparison of the 18 aliphatic protons at the end of the chain allowed M̄n values to be determined, which agreed well with theory. A series of poly(arylene ether ketone)/aromatic polyimide blends were investigated to determine the influence of structural variation and composition on miscibility. As an extension to the PEEK^TM/Ultem^TM blend system, which has been reported to be miscible over all proportions, this study examined how structural variations in both the poly(arylene ether ether ketone) and the polyimide portions affect miscibility. In particular, replacement of the hydroquinone fraction in PEEK^TM with bisphenol A or sulfonyl diphenol produced an amorphous polymer which was no longer miscible with Ultem^TM. Polyimide structures modified by employing 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) and 4,4′-[1,4-phenylene-bis-(1-methyl ethylidene)] bisaniline (Bis P) diamine to obtain higher glass transition temperatures were also investigated. This system afforded homogeneous blends with PEEK^TM when the (Bis P) diamine was utilized in the synthesis of the polyimide. Furthermore, up to 50 mole percent of hexafluoro-bis-dianhydride (6FDA) could be substituted for BTDA without loss of miscibility. However, when the more polar 3,3′-diaminodiphenylsulfone diamine was employed, immiscible blends resulted. An additional important variant has been to incorporate polyimide siloxane segmented copolymers into the PEEK^TM blend system. The polyimide segment can be designed to be miscible whereas the siloxane portion is homogeneously dispersed into a second phase which, in fact, enriches the surface behavior quite dramatically in siloxane content. The latter could be of some importance in allowing for atomic oxygen resistance and possibly improved flame resistance behavior.     

Nanostructured hybrid polymer networks from in situ self‐assembly of RAFT‐synthesized POSS‐based block copolymers

A series of well‐defined hybrid block copolymers PMACyPOSS‐b‐PMMA and PMAiBuPOSS‐b‐PMMA exhibiting high POSS weight contents have been synthesized by RAFT polymerization and further studied as modifiers for epoxy thermosets based on diglycidyl ether of bisphenol A. The hybrid block copolymers self‐assembled within the epoxy precursors into micelles possessing an inorganic core and a PMMA corona. Thanks to the presence of the PMMA blocks that remain miscible until the end of the reaction, curing of the resulting blends afforded nanostructured hybrid organic/inorganic networks with well‐dispersed inorganic‐rich nanodomains with diameters on the order of 20 nm. © 2011 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2011     

Curing behavior and toughening performance of epoxy resins containing hyperbranched polyester

The effects of the hyperbranched polyester with hydroxyl end groups (HBPE‐OH) on the curing behavior and toughening performance of a commercial epoxy resin (diglycidyl ether of bisphenol A, DGEBA) were presented. The addition of HBPE‐OH into DGEBA strongly increased its curing rate and conversion of epoxide group due to the catalytic effect of hydroxyl groups in HBPE‐OH and the low viscosity of the blend at curing temperature. The improvements on impact strength and critical stress intensity factor (or fracture toughness, K_1c) were observed with adding HBPE‐OH. The impact strength was 8.04 kJ m^?1 when HBPE‐OH reached 15 wt% and the K_1c value was approximately two times the value of pure epoxy resin when HBPE‐OH content was 20 wt%. The morphology of the blends was also investigated, which indicated that HBPE‐OH particles, as a second phase in the epoxy matrix, combined with each other as the concentration of HBPE‐OH increased. Copyright © 2004 John Wiley & Sons, Ltd.     

The Role of inclusion size in toughening of epoxy resins by spherical micelles

We report our finding of an optimal length scale for toughening of epoxies using spherical micelles formed by block copolymers. The amphiphilic diblock copolymer poly(hexylene oxide)‐poly(ethylene oxide) (PHO‐PEO) with 30 wt % PEO self‐assembled to form spherical micelles in a bisphenol A epoxy resin with a phenol novolac hardener. We systematically increased the size of the spherical micelles from 20–30 nm to 0.5–10 μm by swelling their PHO core using PHO homopolymer. Although all the blends were tougher than the unmodified epoxy, the largest enhancement of fracture resistance was measured in blends containing 0.1–1 μm spherical inclusions. This enhanced toughness was correlated with plastic deformation by shear banding in tensile test and greater roughness of the fracture surface. Smaller micelles neither induced plastic deformation nor contributed to surface roughness significantly whereas larger micelles acted as local defects resulting in early failure. These findings provide a framework in assessing the toughening effects of blended block copolymers on epoxy resins. © 2009 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 47: 1125–1129, 2009     

Synthesis of novel phosphinic acid-containing polymers

Three arylene difluoride monomers containing phosphine oxide ( 1 ), phosphinic acid ( 2 ), or phosphinate ester ( 3 ) groups were prepared and polymerized with bisphenol A to give novel poly-(arylene ether)s ( 4 , 5 , and 6 ). The polymers obtained had moderate molecular weights (η_inh: 0.14–0.30 dL g⁻¹ in N-methylpyrrolidinone) and glass-transition temperatures (T_g: 102–200 °C), depending on the phosphine group in the main chain. Using bis(4-fluorophenyl)sulfone as a comonomer improved the polymerization to give copolymers with higher solution viscosities. The stoichiometric investigation revealed that 7 mol % excess of fluoride monomer gave the highest molecular weight copolymer 8 with η_inh of 0.78 dL g⁻¹, which had a T_g of 176 °C, a T of 432 °C, and formed a hard film by casting from solution. © 2001 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 1854–1859, 2001     

Poly(ether ether ketone)‐bischromenes: Synthesis,characterization, and influence on thermal,mechanical, and thermo mechanical properties of epoxy resin

Poly(ether ether ketone) s with terminal propargyl groups (PEEK‐PR) were synthesized from hydroxyl terminated PEEK (PEEKTOH) and characterized. The heat‐triggered polymerization of PEEK‐PR to poly bischromenes having PEEK backbone was confirmed by Fourier transform infrared spectroscopy and differential scanning calorimetric studies. PEEK‐PR was blended with a bisphenol based epoxy resin‐diamino diphenylsulphone system in different proportions and cured to form PEEK‐bischromene‐interpenetrated‐epoxy‐amine networks. Tensile strength and elongation of the cured blends increased up to 10‐phr loading of PEEK‐PR and then declined. Tensile moduli of all formulations were comparable. Fracture toughness increased by a maximum of 33%, and the fractured surface morphology showed a ductile fracture. The blends exhibited slightly lower glass transition temperature to that of the neat epoxy‐amine system. A reference sample of epoxy‐amine was processed with the optimum loading of the precursor polymer, PEEKTOH, and compared its properties with the PEEK‐PR incorporated epoxy systems. In this way, it is found that the incorporation of addition curable propargylated PEEK increases the strength characteristics with adequate thermal stability and fracture toughness for high‐performance structural applications.