Electroless plating of copper on Si(100) surfaces modified by surface‐initiated atom‐transfer radical polymerization of 4‐vinylpyridine

Surface‐initiated atom‐transfer radical polymerization (ATRP) of 4‐vinylpyridine (4VP) on a pretreated Si(100) surface was carried out. The composition and topography of the Si(100) surface modified by poly(4‐vinylpyridine) (P4VP) were characterized by XPS and atomic force microscopy (AFM), respectively. The P4VP layer on the Si(100) surface was used not only as chemisorption sites for the palladium complexes without prior sensitization by SnCl₂ solution during the electroless plating, but also as an adhesion promotion layer for the electrolessly deposited copper. The electrolessly deposited copper on the Si–P4VP surface exhibited a 180° peel adhesion strength above 6 N/cm. The adhesion strength was much higher than that of the electrolessly deposited copper to the pristine silicon surface. Copyright © 2008 John Wiley & Sons, Ltd.     

Reflective and conductive surface‐silvered polyimide films prepared by surface graft copolymerization and electroless plating

Argon plasma‐pretreated polyimide (PI) films were subjected to UV‐induced surface graft copolymerization with 4‐vinylpyridine(4VP) under atmospheric conditions. Electroless plating of silver was carried out effectively on the 4VP graft copolymerized PI (PI‐g‐P4VP) surface after PdCl₂ activation and in the absence of SnCl₂ sensitization (the Sn‐free process). The surface compositions of the modified PI films were studied by X‐ray photoelectron spectroscopy (XPS). XPS results showed that the PI‐g‐P4VP surface is ready for electroless deposition of silver via the Sn‐free process. The grafted 4VP layer with well‐preserved pyridine groups was used not only as the chemisorption sites for the palladium complexes (without the need for prior sensitization by SnCl₂) during the electroless plating of silver, but also as an adhesion promotion layer for the electrolessly deposited silver. The silver metallized PI films show high reflectivity and conductivity with a surface resistance of 1.5 Ω and a reflectivity of 91.3%, respectively. Copyright © 2007 John Wiley & Sons, Ltd.     

Electroless deposition of nickel on fluoropolymers modified by surface graft copolymerization

Surface modification of Ar plasma-pretreated poly(tetrafluoroethylene) (PTFE) and poly(vinylidene fluoride) (PVDF) films via UV-induced graft copolymerization with 4-vinylpyridine (4VP), 2-vinylpyridine (2VP) or 1-vinylimidazole (VIDz) was carried out. Electroless deposition of nickel could be carried out on these graft-modified fluoropolymer surfaces after PdCl₂ activation. The surface compositions of the graft-modified films were studied by X-ray photoelectron spectroscopy. The adhesion strength between the surface graft-copolymerized fluoropolymer film and the electrolessly deposited nickel was affected by the type of monomers used for graft copolymerization and the graft concentration. The optimum T-peel adhesion strengths of the electrolessly deposited Ni on the 4VP graft-copolymerized PTFE and PVDF surfaces were about 7 and 13 N/cm, respectively. The metal/fluoropolymer assemblies delaminated by cohesive failure inside the fluoropolymer substrates. The enhanced adhesion between the electrolessly deposited Ni and the surface-modified fluoropolymers is attributable to the interfacial charge transfer interactions between the grafted polymer chains and the deposited metals (Pd and Ni), the spatial distribution of the graft chains into the metal matrix and the covalent tethering of the graft chains on the fluoropolymer surface.     

Electropolymerization of DBSA‐doped polypyrrole films on PTFE via an electroless copper interlayer

We report on the electroless deposition of thin films of copper on poly(tetrafluoroethylene) (PTFE) and their use as substrates for electropolymerization of polypyrrole. Argon plasma‐treated PTFE films were modified by silanization using N‐[3(trimethoxysilyl)propyl]diethylenetriamine (TMS). The TMS‐modified PTFE films were subsequently activated by PdCl₂ for the electroless deposition of copper. The omission of the commonly used SnCl₂ sensitization step represents a significant process enhancement with environmental and cost benefits. The surface composition of the substrate (before and after surface treatments) and overlayer films was studied using high‐resolution x‐ray photoelectron spectroscopy. A combination of time‐of‐flight secondary ion mass spectrometry and water contact‐angle measurements was also used to study the PTFE surface after argon plasma treatment. The Cu/PTFE films were used as substrates for subsequent pyrrole electropolymerization in aqueous dodecylbenzene sulphonic acid (DBSA) solution. The DBSA‐doped polypyrrole overlayers were successfully deposited on the Cu/PTFE surface using a constant applied potential of 1.5 V. The resulting material exhibited a doping level of 39%, determined using chemical component analysis of the N 1s photoelectron peak. Copyright © 2003 John Wiley & Sons, Ltd.     

Electroless deposition of copper on polyimide films modified by surface graft copolymerization with nitrogen-containing vinyl monomers

Surface modification of Ar-plasma-pretreated polyimide (PI) films (Kapton® HN films) via UV-induced graft copolymerization with 1-vinylimidazole (VIDz), 4-vinylpyridine (4VP), and 2-vinylpyridine (2VP) under atmospheric conditions was carried out to improve their adhesion with the electrolessly deposited Cu. The surface compositions of the graft-copolymerized PI films were characterized by X-ray photoelectron spectroscopy. The adhesion strength of the electrolessly deposited Cu on the surface-graft-copolymerized PI film was affected by the type of monomers used for graft copolymerization and the graft concentration. T-peel adhesion strengths of about 15, 10, and 6?N/cm were obtained for the Cu/graft-modified PI assemblies involving, respectively, the VIDz, 4VP, and 2VP graft-copolymerized PI films. These adhesion strengths are much higher than those obtained for assemblies involving electrolessly deposited Cu on pristine or on Ar-plasma-treated PI films. The adhesion strengths involving the VIDz and 4VP surface-graft-copolymerized PI films are also higher than those involving PI films modified by chemical etching. The cohesive failure inside the PI substrate of the Cu/graft-modified PI assemblies during delamination suggested that not only were the grafted polymer chains covalently tethered on the PI film, they were also incorporated into the metal matrix during the electroless plating process.     

Surface modification of poly(tetrafluoroethylene) films by plasma polymerization of glycidyl methacrylate and its relevance to the electroless deposition of copper

Surface modification of poly(tetrafluoroethylene) films by plasma polymerization and deposition of glycidyl methacrylate (GMA) was carried out. The effects of glow‐discharge conditions on the chemical structure and composition of the deposited GMA polymer were analyzed by X‐ray photoelectron spectroscopy (XPS) and Fourier transform infrared (FTIR) spectroscopy. XPS and FTIR results revealed that the epoxide groups in the plasma‐polymerized GMA (pp‐GMA) layer had been preserved to various extents, depending on the plasma deposition conditions. The morphology of the modified PTFE surface was investigated by atomic force microscopy (AFM). The pp‐GMA film with well‐preserved epoxide groups was used as an adhesion promotion layer to enhance the adhesion of the electrolessly deposited copper on the PTFE film. The T‐peel adhesion test results showed that the adhesion strength between the electrolessly deposited copper and the pp‐GMA‐modified PTFE (pp‐GMA‐PTFE) film was much higher than that between the electrolessly deposited copper and the pristine or the Ar plasma‐treated PTFE film. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 3498–3509, 2000     

Reactive coupling of 4-vinylaniline with hydrogen-terminated Si(100) surfaces for electroless metal and "synthetic metal" deposition

Pristine and resist-patterned Si(100) substrates were etched by aqueous HF to produce hydrogen-terminated silicon (H-Si(100)) surfaces. The H-Si(100) surface was then subjected to UV-induced reactive coupling of 4-vinylaniline (VAn) to produce the VAn monolayer-modified silicon (VAn-Si) surface. The VAn-Si surface was first functionalized with a "synthetic metal" by oxidative graft polymerization of aniline with the aniline moieties of the coupled VAn molecules. The composition and topography of the VAn-Si and polyaniline (PAn)-grafted VAn-Si (PAn-VAn-Si) surfaces were characterized by X-ray photoelectron spectroscopy and atomic force microscopy, respectively. The doping-undoping (protonation-deprotonation) and redox-coupling (metal reduction) behavior, as well as the electrical conductivity, of the surface-grafted PAn were found to be similar to those of the aniline homopolymer. The VAn-Si surface was also funtionalized by the electroless plating of copper. Not only did the VAn layer provide chemisorption sites for the palladium catalyst, in the absence of prior sensitization by SnCl2, during the electroless plating process, it also served as an adhesion promotion layer and a low-temperature diffusion barrier for the electrolessly deposited copper. Finally, micropatterning of the grafted PAn and of the electrolessly deposited copper were demonstrated on the resist-patterned VAn-Si surfaces.     

Conductive thin film formation onto radiation grafted polymeric surfaces using electroless plating technique

Surface modification of polypropylene films (PP) was carried out via radiation induced graft copolymerization of 4‐vinyl pyridine (4VP) and acrylamide (AAm) to enhance the adhesion ability of the PP surface for electroless deposition of copper. Factors affecting the grafting process such as suitable solvent, comonomer composition and concentration and irradiation dose were optimized. The grafted films produced were characterized by studying their Fourier‐transform infrared (FTIR) spectra and thermal stability. The grafted films were copper‐plated by electroless deposition using Pd as the catalyst to initiate the redox reaction. The influence of catalytic activation method parameters on the plating rate were studied. Scanning electron microscopy revealed a dense and void‐free copper deposited film. The adhesion of the deposited copper film to the modified PP films was determined by measuring the tensile strength of the copper plated films. The electrical characteristics of the copper plated films in comparison with grafted films were studied. The results showed the high adhesion of the deposited copper film to the grafted PP film as well as the high electrical conductivity. Copyright © 2008 John Wiley & Sons, Ltd.     

Surface Modification of Poly(tetrafluoroethylene) Films by Plasma Pre-Activation and Plasma Polymerization of Glycidyl Methacrylate

Surface modification of poly(tetrafuoroethylene) (PTFE) film by plasma polymerzation and deposition of glycidyl methacrylate (GMA), in the presence and absence of Ar or O₂ plasma pre-activation, was carried out to enhance the adhesion with polyimides (PI) film in the presence of an epoxy adhesive. For deposition carried out at low RF power, a high epoxide concentration was preserved in the plasma-polymerized GMA (pp-GMA) layer on PTFE (pp-GMA-PTFE). However, high adhesion strength of the PI/pp-GMA-PTFE laminate was obtained only in the presence of O₂ plasma pre-activation of the PTFE substrates prior to plasma polymerization and deposition of GMA. In the absence of any plasma pre-activation or in the presence of Ar plasma pre-activation, the deposited pp-GMA layer on the PTFE surface could be readily removed by solvent extraction. The adhesion enhancement of the PI/pp-GMA-PTFE laminates in the presence of O₂ plasma pre-activation was attributed to the preservation of the epoxide functional groups in the pp-GMA layer, the curing of the GMA chains into the matrix of the epoxy adhesive, and the covalent bonding of the pp-GMA layer on the PTFE surface.     

Ag活化的p型硅(111)表面化学镀Ag膜表面形貌研究

A method of electroless silver deposition on silver activated p-type silicon（111） wafer was proposed. The silver seed layer was deposited firstly on the wafer in the solution of 0.005 mol/L AgNO3 ＋0.06 mol/L HE Then the silver film was electrolessly deposited on the seed layer in the electroless bath of AgNO3＋NH3＋acetic acid＋NH2NH2 （pH 10.2）. The morphology of the seed layer and the silver films prepared under the condition of the different bath composition was compared by atomic force microscopy. The reflectance of the silver films with different thickness was characterized by Fourier transform infrared spectrometry. The experimental results indicate that the seed layer possesses excellent catalytic activity toward electroless silver deposition and rotating of the silicon wafer during the electroless silver deposition could lead to formation of the smoother silver film.     

A New Approach on the Active Treatment for Electroless Copper Plating on Glass

A new method is described for the electroless deposition of copper onto glass.Commercially available glass slide was modified with γ-aminopropyltrimethoxysilane to form self-assembled monolayer (SAM) on it .Then it was dipped directly into PdCl2 solution instead of the conventional SnCl2 sensitization followed by PdCl2 activation.Experimental results showed that the Pd^2 ions from PdCl2 solution were coordinated to the amino groups on the glass surface resulting in the formation of N-Pd complex.In an electroless copper bath containin a formaldehyde reducing agent,the N-Pd complexes were reduced to Pd^0 atoms,which then acted as catalysts and initiated the deposition of copper metal.Although the copper deposition rate on SAM-modified glass was slow at the beginning,it reached to that of conventional method in about 5min.     

Electroless plating of copper on fly ash cenospheres using polyaniline‐Pd activation

The polyaniline of different intrinsic oxidation states, viz., the emeraldine (EM) and the leucoemeraldine (LM) states, were coated on 3‐aminopropyltriethoxy silane modified fly ash cenospheres. Without prior sensitization by SnCl₂ solution, Pd activation by PdCl₂ solution was carried out on EM and LM laden cenospheres, followed by electroless plating of copper (Cu). The topography and composition of the composites were characterized by scanning electron microscopy, X‐ray diffraction, and X‐ray photoelectron spectroscopy, etc. The results indicate that the oxidation state of the LM layer showed a much bigger increase than that of the EM layer in the Pd activation process, while coupled Pd reduction underwent to a more extent on the LM layer. The metallic Pd atoms on the LM and EM layers surface initiated the subsequent electroless plating of Cu, and the coated Cu on LM laden cenospheres had a much more uniform and compact morphology than that on EM laden cenospheres. Copyright © 2012 John Wiley & Sons, Ltd.     

Isomer‐dependent properties of poly(vinyl pyridine)‐based films grown on copper surfaces

The effect of poly(2‐vinyl pyridine) (P2VP) and poly(4‐vinyl pyridine) (P4VP) isomers on the growth of surface films on copper substrates was studied by electrochemical, spectroscopic, thermogravimentric, and microscopic methods. In acid environment (3% v/v acetic acid) and in the presence of KSCN, electrochemically generated copper cations reacted rapidly with SCN^? and P2VP or P4VP, yielding coordination compounds, which deposited onto copper surfaces as films. The characteristics of such polymer–metal complexes (films) were markedly isomer‐dependent. Cu(I)/P2VP/SCN^? complexes with monovalent cations and sulfur‐coordinated thiocyanate were obtained in the presence of P2VP, whereas the formation of Cu(II)/P4VP/SCN^? complexes with divalent cations and nitrogen‐coordinated thiocyanate was observed in the presence of P4VP. Interestingly, similar physical–chemical properties (electronic structure, stoichiometry, and thermal behavior) were observed for materials synthesized by electrochemical and chemical methods. These results suggest, therefore, that control over the surface properties of copper substrates can be achieved using electrosynthesized films based on different PVP isomers. Besides acting as effective protective barriers against aggressive media and thus reducing the metal dissolution (corrosion) kinetics, these materials are potentially attractive for other applications in which surface properties are paramount, such as in catalysis. © 2008 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 47: 215–225, 2009     

Immobilization of Tris-(8-hydroxyquinoline) aluminum onto P4VP polymer thin films by UV irradiation cross-linking

We report a novel method for the immobilization of Tris-(8-hydroxyquinoline) aluminum (Alq₃) onto poly(4-vinylpyridine) (P4VP) thin polymer films by UV irradiation cross-linking. The polymer films were prepared by spin-coating of P4VP onto cleaned silicon wafer surface followed by UV irradiation. The thicknesses of the polymer thin films were measured by ellipsometry with different irradiation times. The immobilization of Alq₃, orientation and the surface activity were followed using photoluminescence and UV-visible spectroscopy. The surface morphology was investigated by using field emission scanning electron microscopy and atomic force microscopy. Patterning of Alq₃ on P4VP film was obtained using photolithography technique. Our experimental results show that the cross-linked P4VP thin film is a universal surface modifier.     

Comparative study of electrolessly deposited Pd/Ag films onto p-silicon (100)-activated seed layers of Ag and Pd

Pd/Ag films were electrolessly deposited onto p-silicon (100)-activated seed layers of Ag and Pd, respectively, in the solution of 0.005 mol l⁻¹ AgNO₃ + 0.005 mol l⁻¹ PdCl₂ + 4.5 mol l⁻¹ NH₃ + 0.16 mol l⁻¹ Na₂EDTA+0.1 mol l⁻¹ NH₂NH₂ (pH 10.5) at room temperature. The morphology and composition of the films were studied comparatively by using atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS). Cathodic polarization curves for hydrogen evolution were recorded in 0.5-mol l⁻¹ H₂SO₄ without illumination, in which the obtained films served as working electrodes. The experimental results show that the film obtained on the Ag seed layer was rather a pure Ag film and not a Pd/Ag film, and the Ag deposition rate on Pd sites was much faster than that on Ag sites.     

A New Activation Method for Electroless Metal Plating：Palladium Laden via Bonding with Self—Assembly Monolayers

A new activation method has been developed for electroless copper plating on silicon wafer based on palladium chemisorption on SAMs of APTS without SnCl2 sensitization and roughening condition.A closely packed electroless copper film with strong adhesion is successfully formed by AFM observation.XPS study indicates that palladium chemisorption occurred via palladium chloride bonding to the pendant amino group of the SAMs.     

Selective Ni-P electroless plating on photopatterned cationic adsorption films influenced by alkyl chain lengths of polyelectrolyte adsorbates and additive surfactants

We demonstrated that the photopatterned single-layer adsorption film of poly(1-dodecyl-4-pyridinium bromide) on a silica surface was available for a template of nickel-phosphorus (Ni-P) electroless plating through sensitization with a SnCl(2) aqueous solution and activation with a PdCl(2) aqueous solution. Four kinds of poly(1-alkyl-4-vinylpyridinium halide)s bearing methyl, propyl, hexyl, and dodecyl groups were prepared. The cationic polymers were adsorbed by a negatively charged silica surface from their solutions, to form single-layer adsorption films exhibiting desorption-resistance toward deionized water and ethanol. The organic adsorption films could be decomposed completely by exposure to 172 nm deep-UV light. The formation and decomposition of the single-layer films were confirmed by deep-UV absorption spectral measurement and zeta-potential measurement. Ni-P electroless plating was carried out on the photopatterned adsorption films, using three types of SnO(x) colloidal materials without and with cationic or anionic surfactant as catalyst precursors in the sensitization step. In the case of the negatively charged SnO(x) colloids surrounded by anionic surfactant, Ni-deposition took place preferentially on the cationic adsorption films remaining in unexposed regions. The Ni-deposition was accelerated significantly on the cationic adsorption film bearing dodecyl groups. It was obvious by ICP-AES analyses that the hydrophobic long-chain dodecyl groups in the adsorption film could promote the adsorption of the negative SnO(x) colloids on the film surface, followed by much nucleus formation of zerovalent Pd catalysts useful for the electroless plating. The result of our experiment clearly showed that, in addition to electrostatic interaction, van der Waals interaction generating between the hydrophobic long-chain hydrocarbons of the adsorption film and the surfactant improved significantly the adsorption stability of the SnO(x) colloids, resulting in highly selective Ni-deposition in accord with the photopattern shape of the cationic single-layer adsorption film.     

Manipulation of Multicomponent Langmuir-Blodgett Films of Electrically Conductive Polymers: Polypyrrole and Poly(3-Hexylthiophene)

Abstract

Multicomponent Langmuir-Blodgett (LB) films containing poly-pyrrole, 3-octadecanoyl pyrrole, and poly(3-hexylthiophene) were fabricated via a novel in-situ polymerization process. In this process, pyrrole monomer is polymerized at the air-subphase interface in the presence of poly(3-hexylthiophene) by using a subphase containing 1 wt% FeCl₃. The resultant electrically conductive films could be readily deposited onto solid substrates as Z-type films by the vertical lifting method. By using visible absorption, x-ray diffraction, and FTIR measurements, it was found that all three components were present within the transferred films, with the polypyrrole chains assuming a preferential orientation parallel to the film surface. The conductivities of the mixed LB films were as high as 1.0 S/cm, and the stability of the conductivity was very good. Chemical doping of poly(3-hexylthiophene) within the film with strong oxidizing agents such as I₂ further enhanced the conductivity of the film.     

Effect of Poly(amine)s on the Redox Properties of Carboxymethylcellulose and Ferrocene‐modified Poly(amine) Layer‐by‐Layer Films

Multilayer films consisting of carboxymethylcellulose (CMC) and ferrocene‐modified poly(ethyleneimine) (Fc‐PEI) or poly(allylamine hydrochloride) (Fc‐PAH) were successfully prepared on a gold electrode to examine their redox properties. The redox current of (Fc‐PEI/CMC)_n film‐coated electrodes increased with the number of layers, while the (Fc‐PAH/CMC)_n film‐coated electrodes exhibited increased response only for the first eight bilayers. The (Fc‐PEI/CMC)_n and (Fc‐PAH/CMC)_n films deposited on the surface of Fc‐free multilayer film‐coated electrodes also showed a redox response. The (PEI/CMC)₅ film‐coated electrode showed redox responses in Fc‐PEI and Fc‐PAH solutions, confirming the uptake of the Fc‐polymers in the inner film. In contrast, the uptake of the Fc‐polymers in the (PAH/CMC)₅ film was severely suppressed, suggesting that different permeability of (PEI/CMC)₅ and (PAH/CMC)₅ films.     

Surface modification of thermoplastics by atomic layer deposition of Al2O3 and TiO2 thin films

Al₂O₃ and TiO₂ thin films were deposited by atomic layer deposition at 80-250 °C on various polymeric substrates such as polymethylmethacrylate (PMMA), polyetheretherketone (PEEK), polytetrafluoroethylene (PTFE) and ethylenetetrafluoroethylene (ETFE). The films were studied with FESEM, EDX, XRD, contact angle measurements and adhesion tests. The film growth rates on the thermoplastics were close to the corresponding growth rates on Si substrates. The adhesion of the films was good on PEEK and poor on PTFE. All coated surfaces showed lower water contact angles than the uncoated thermoplastics. Furthermore, the water contact angles on all TiO₂-coated surfaces decreased upon UV illumination, most efficiently with crystalline TiO₂ coatings.