Epoxy resins. III. Application of fourier transform IR to degradation studies of epoxy systems

Three cured epoxy resins were investigated under various degradation conditions by Fourier transform infrared (FTIR) spectroscopy for measurement. The epoxy resins were the diglyadyl ethers of bisphenol A (DGEBA), phenolphthalein (DGEPP), and 9,9-bis(4-hydroxyphenyl)fluorene (DGEBF). The thermal stability order of functional groups that incurred DGEBA was total methyl group ～ total benzene ring > methylene > p-phenylene > ether linkage > isopropylidene. The oxidative thermal and photodegradation processes were found to be related to the classical autocatalytical oxidation of aliphatic hydrocarbon segments. The Wieland rearrangement, Norrish-type reaction, Claisen rearrangement, and other possible degradation mechanisms were suggested by the data.     

Kinetics and thermal properties of epoxy resins based on bisphenol fluorene structure

The fluorene-containing epoxy, diglycidyl ether of 9,9-bis(4-hydroxyphenyl) fluorene (DGEBF) was synthesized by a two-step reaction procedure. In order to investigate the relationship between fluorene structure and material properties, DGEBF and a commonly used diglycidyl ether of bisphenol A (DGEBA) were cured with 4,4-diaminodiphenyl methane (DDM) and 4,4-(9-fluorenylidene)-dianiline (FDA). The curing kinetics, thermal properties and decomposition kinetics of these four systems (DGEBA/DDM, DGEBF/DDM, DGEBA/FDA, and DGEBF/FDA) were studied in detail. The curing reactivity of fluorene epoxy resins was lower, but the thermal stability was higher than bisphenol A resins. The onset decomposition temperature of cured epoxy resins was not significantly affected by fluorene structure, but the char yield and T_g value were increased with that of fluorene content. Our results indicated that the addition of fluorene structure to epoxy resin is an effective method to improve the thermal properties of resins, but excess fluorene ring in the chain backbone can depress the curing efficiency of the resin.     

Styrylpyridine-based epoxy resins: Synthesis and characterization

Polymers containing rigid aromatic structures in the chain backbone usually gave high thermal stability and good flammability resistance. Three glycidyl ethers of epoxy resins were prepared from 2,4-di(p-hydroxystyryl)pyridine (2,4-DGESP), 2,6-di-(p-hydroxystyryl)pyridine (2,6-DGESP), and 2,4,6-tri-(p-hydroxystyryl)pryidine (2,4,6-TGESP) to study the relationships of structure to polymer degradation. To prepare a highly crosslinked material, trimethoxyboroxine (TMB) was used as the curing agent. The relative char yields of the three different resins, as measured by TGA, were 2,4-DGESP ≈ 2,6-DGESP > 2,4,6-TGESP. The char yield of the cured 2,6-DGESP varied with different amounts of the TMB curing agent, and was higher than the uncured 2,6-DGESP. The oxygen index increased as a function of thermal curing time for the 2,6-DGESP epoxy resin. An intermolecular Diels–Alder reaction with 2,6-DGESP is proposed as a primary reaction during thermal curing.     

Evaluation of furfurylamines as curing agents for epoxy resins

Epoxy resin adhesives are widely used because of their strength, versatility, and ability to bond a variety of substrates. Furfurylamines represent a potential, new class of epoxy curing agents. Furfuryl amine (FA), tetrahydrofurfuryl amine (THFA), and 5,5′-methylenebis-2-furanmethanamine (DFA) were studied as possible epoxy curing agents. The utility of FA and THFA are limited by their volatility at the temperatures needed to effect cure of diglycidyl-ether of bisphenol A (DGEBA) based epoxy resins. DFA is a very effective epoxy curing agent with the ability to cure DGEBA at rates similar to that of standard epoxy curing agents such as liethylenetriamine.     

Organic/inorganic hybrid epoxy nanocomposites based on octa(aminophenyl)silsesquioxane

Octa(aminophenyl)silsesquioxane (OAPS) was used as the curing agent of diglycidyl ether of bisphenol-A (DGEBA) epoxy resin. A study on comparison of DGEBA/OAPS with DGEBA/4,4′-diaminodiphenyl sulfone (DDS) epoxy resins was achieved. Differential scanning calorimetry was used to investigate the curing reaction and its kinetics, and the glass transition of DGEBA/OAPS. Thermogravimetric analysis was used to investigate thermal decomposition of the two kinds of epoxy resins. The reactions between amino groups and epoxy groups were investigated using Fourier transform infrared spectroscopy. Scanning electron microscopy was used to observe morphology of the two epoxy resins. The results indicated that OAPS had very good compatibility with DGEBA in molecular level, and could form a transparent DGEBA/OAPS resin. The curing reaction of the DGEBA/OAPS prepolymer could occur under low temperatures compared with DGEBA/DDS. The DGEBA/OAPS resin didn’t exhibit glass transition, but the DGEBA/DDS did, which meant that the large cage structure of OAPS limited the motion of chains between the cross-linking points. Measurements of the contact angle indicated that the DGEBA/OAPS showed larger angles with water than the DGEBA/DDS resin. Thermogravimetric analysis indicated that the incorporation of OAPS into epoxy system resulted in low mass loss rate and high char yield, but its initial decomposition temperature seemed to be lowered.     

Benzoxazine modified diglycidyl ether of bisphenol-a/silicon/siliconized epoxy hybrid polymer matrices: Mechanical,thermal, electrical and morphological properties

Benzoxazines modified epoxy hybrid polymer matrices were developed using benzoxazines (CB_DDM and BMPB_DDM) and epoxy resins (DGEBA, SE and EP-HTPDMS) to make them suitable for high performance applications. The benzoxazine-epoxy hybrid polymer matrices were prepared via in-situ polymerization and were investigated for their thermal, thermo-mechanical, mechanical, electrical and morphological properties. Two types of skeletal modified benzoxazines namely 1,1-bis(3-methyl-4-hydroxyphenyl)cyclohexane benzoxazine (CB_DDM) and bis(4-maleimidophenyl) benzoxazine (BMPB_DDM) were synthesized by reacting paraformaldehyde and 4,4′-diaminodiphenylmethane with 1,1-bis (3-methyl-4-hydroxyphenyl)cyclohexane and N-(4-hydroxyphenyl)maleimide respectively. Epoxy resins viz., diglycidyl ether of bisphenol-A (DGEBA), silicon incorporated epoxy (SE) and siliconized epoxy resin (EP-HTPDMS) were modified with 5, 10 and 15 wt% of benzoxazines using 4,4′-diaminodiphenylmethane as a curing agent at appropriate conditions. The chemical reaction of benzoxazines with the epoxy resin was carried out thermally and the resulting product was analyzed by FT-IR spectra. The glass transition temperature, curing behavior, thermal stability, char yield and flame resistance of the hybrid polymers were analysed by means of DSC, TGA and DMA. Mechanical properties were studied as per ASTM standards. The benzoxazines modified epoxy resin systems exhibited lower values of dielectric constant and dielectric loss with an enhanced values of of arc resistance, glass transition temperatures, degradation temperatures, thermal stability, char yield, storage modulus, tensile strength, flexural strength and impact strength.     

Curing behavior and kinetics of epoxy resins cured with liquid crystalline curing agent

This article describes the synthesis of a liquid crystalline curing agent 4,4′-bis-(4-amine-butyloxy)-biphenyl (BABB), and its application as a curing agent for the epoxy resin (DGEBA) in comparison with normal curing agent, 4,4′-diaminobiphenyl (DABP). BABB was investigated with polarized optical microscopy, differential scanning calorimetry, and small-angle X-ray scatting, and the results showed that BABB displayed smectic liquid crystalline phase. The curing behaviors of DGEBA cured with BABB and DABP were studied by using differential scanning calorimetry (DSC), polarized optical microscopy (POM), and dynamic mechanical analysis (DMA). The results indicated that BABB showed a higher chemical reactivity than DABP. The kinetics was studied under isothermal conditions using an isoconversional method, and the isothermal DSC data can be fitted reasonably by an autocatalytic curing model. The nematic droplet texture was observed for the resulting polymer network of DGEBA/BABB system, while the DGEBA/DABP system showed an isotropic state. The storage modulus of DGEBA/BABB system was enhanced in comparison with DGEBA/DABP system because of the formation of LC phase, whereas the glass transition temperatures decreased because of the introduction of flexible spacer group.     

Mechanical properties and inhomogeneous nanostructures of dicyandiamide-cured epoxy resins

Dicyandiamide (DICY)-cured epoxy resins are important materials for structural adhesives and matrix resins for fiber reinforced prepregs. The objective of this study was to examine the mechanical and physical properties as well as the gel structures of the cured resins and discuss the relationships among them. Diglycidyl ether of bisphenol-A (DGEBA) oligomers were chosen as the common chemical structure of the epoxy resins. Four kinds of resin mixtures were formulated using the seven types of DGEBA oligomers having different molecular weight distributions. Three resin formulations having bimodal-type molecular weight distributions were designed to have almost identical rubbery plateau values of the storage modulus in dynamic mechanical analyses after curing, means that they had almost equivalent average crosslink density and basic chemical structure. However, the toughness, ductility, and environmental (heat and solvent) resistance of these three formulations were different. Atomic force microscopy revealed the existence of inhomogeneous nanoscale gel structures in these cured resins. The morphological differences in the gel structures in terms of their size, the connectivity, and the relative magnitude of the heterogeneity would cause the difference in several properties of the DICY-cured epoxy resins. © 2007 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 45: 1425–1434, 2007     

Curing kinetics of bio-based epoxy resin-toughened DGEBA epoxy resin blend

In the present study, TEIA bioresin was blended with the diglycidyl ether bisphenol A (DGEBA) epoxy resin in different ratios (i.e. 10, 20, 30, 40 mass%), cured with methylhexahydrophthalic anhydride curing agent in the presence of 2-methylimidazole catalyst. The optimized composition of DGEBA and TEIA bioresin blends system was employed as an adhesive strength. The adhesive strength of the TEIA-modified DGEBA epoxy resin blend system was increased from 4.14 to 6.31 MPa on an aluminium substrate compared to the DGEBA epoxy resin. The curing kinetics of non-isothermal, DGEBA epoxy resin and its bio-based blend systems were investigated employing differential scanning calorimetry. An increase in the peak temperature and reduction in a heat of curing as well as activation energy in DGEBA epoxy resin were observed with the addition of TEIA bioresin content. The activation energy (E_a) of the DGEBA resin and their bio-based blend system were obtained from Kissinger and Flynn–Wall–Ozawa methods.

     

Synthesis and thermal characterization of phosphorus containing siliconized epoxy resins

Siliconized epoxy matrix resin was developed by reacting diglycidyl ethers of bisphenol A (DGEBA) type epoxy resin with hydroxyl terminated polydimethylsiloxane (silicone) modifier, using γ-aminopropyltriethoxysilane crosslinker and dibutyltindilaurate catalyst. The siliconized epoxy resin was cured with 4, 4-diaminodiphenylmethane (DDM), 1,6-hexanediamine (HDA), and bis (4-aminophenyl) phenylphosphate (BAPP). The BAPP cured epoxy and siliconized epoxy resins exhibit better flame-retardant behaviour than DDM and HDA cured resins. The thermal stability and flame-retardant property of the cured epoxy resins were studied by thermal gravimetric analysis (TGA) and limiting oxygen index (LOI). The glass transition temperatures (T_g) were measured by differential scanning calorimetry (DSC) and the surface morphology was studied by scanning electron microscopy (SEM). The heat deflection temperature (HDT) and moisture absorption studies were carried out as per standard testing procedure. The thermal stability and flame-retardant properties of the cured epoxy resins were improved by the incorporation of both silicone and phosphorus moieties. The synergistic effect of silicone and phosphorus enhanced the limiting oxygen index values, which was observed for siliconized epoxy resins cured with phosphorus containing diamine compound.     

Synthesis and properties of novel fluorinated epoxy resins based on 1,1-bis(4-glycidylesterphenyl)-1-(3′-trifluoromethylphenyl)-2,2,2-trifluoroethane

A novel fluorinated epoxy resin, 1,1-bis(4-glycidylesterphenyl)-1-(3′-trifluoromethylphenyl)-2,2,2-trifluoroethane (BGTF), was synthesized through a four-step procedure, which was then cured with hexahydro-4-methylphthalic anhydride (HMPA) and 4,4′-diaminodiphenyl-methane (DDM). As comparison, a commercial available epoxy resin, bisphenol A diglycidyl ether (BADGE), cured with the same curing agents was also investigated. We found that the BGTF gave the exothermic starting temperature lower than BADGE no mater what kind of curing agents applied, implying the reactivity of the former is higher than the latter. The fully cured fluorinated BGTF epoxy resins have good thermal stability with glass transition temperature of 170-175 °C and thermal decomposition temperature at 5% weight loss of 370-382 °C in nitrogen. The fluorinated BGTF epoxy resins also showed the mechanical properties as good as the commercial BADGE epoxy resins. The cured BGTF epoxy resins exhibited improved dielectric properties as compared with the BADGE epoxy resins with the dielectric constants and the dissipation factors lower than 3.3 and dissipation 2.8 × 10⁻³, respectively, which is related to the low polarizability of the C-F bond and the large free volume of CF₃ groups in the polymer. The BGTF epoxy resins also gave low water absorption because of the existence of hydrophobic fluorine atom.     

Synthesis,characterization, thermal,and flame retardant properties of phosphate-based epoxy resins

A new phosphorus-containing oxirane bis-glycidyl phenylphosphate (BGPP), and a diamine, bis(4-aminophenyl)phenylphosphate (BAPP), were synthesized. Both of these two phosphorus-containing compounds lead to phosphate-containing epoxy resin via curing reaction. The kinetics of the curing reaction of BGPP with various curing agents, including BAPP, were studied. The introduction of electron-withdrawing group into the compounds increases the BGPP and decreases the BAPP reactivity in the curing reaction. The thermal and the weight loss behavior of the cured epoxy resins were studied by TGA. High char yields (32–52%) as well as high limiting oxygen index (LOI) values (34–49) of these phosphorylated resins were found, confirming the usefulness of these phosphorus-containing epoxy resins as flame retardants. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35: 565–574, 1997.     

Preparation, characterization and curing properties of epoxy-terminated poly(alkyl-phenylene oxide)s

A series of dihydroxyl telechelic poly(alkyl-phenylene oxide)s (1) have been synthesized by oxidative polymerization of alkylphenols with various aromatic diols using manganese or copper amine catalysts. The novel telechelic derivatives (1) were epoxidized with epichlorohydrin yielding a series of new epoxidized poly(alkyl-phenylene oxide)s (EPPO, 2) and the structures, properties were studied by nuclear magnetic resonance spectroscopy (NMR), differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA) and gel permeation chromatography (GPC). The 1:1 blends of diglycidyl ether of bisphenol-A (DGEBA) with EPPO resins were cured with three curing agents and the effects of chemical structure change on thermal property of the curing matrixes were discussed. Incorporation of EPPOs to DGEBA epoxy system resulted in a significant increase in its glass transition temperature (T_g), thermal stability and flame resistance. The T_g values and char yields arising from a DDM-cured epoxy resin are usually higher than those of dicyandiamide (DICY) or 2-methylimidazole (2-MI) analogues and the reactivity of epoxy blends with three curing agents presents an increase in the order of 2-MI, DDM and DICY. In general, the tetramethylbisphenol-A (TMBPA)-derived polymer exhibits the lowest T_g, char yield and dielectric constant among PPO derivatives whereas the biphenol polymers usually results in higher T_g and char yield due to its rigid rod structure.     

Synthesis and characterization of itaconic‐based epoxy resins

A trifunctional epoxy resin from itaconic acid (TEIA) was synthesized from a renewable resource‐based itaconic acid by allylation of itaconic acid to form diallyl itaconate by using m‐chloroperoxybenzoic acid as oxidizing agents followed by epoxidation of allylic C═C bond of diallyl itaconate methylhexahydropthalic anhydride as curing agent in the presence of 2‐methyl imidazole as a catalyst. The chemical structure of the synthesized resins was confirmed by Fourier transform infrared and nuclear magnetic resonance (¹H‐NMR and ¹³C‐NMR) spectroscopy analysis. The mechanical, thermal, and rheological performances of the TEIA were also investigated and compared with diglycidyl ether of bisphenol A and a plant‐based epoxidized soybean oil bioresin cured with the same curing agent. The higher epoxy value of 1.02, lower viscosity (0.96 Pa s at 25°C), higher mechanical, and higher curing reactivity toward methylhexahydropthalic anhydride of TEIA as compared with epoxidized soybean oil and comparable with diglycidyl ether of bisphenol A demonstrated significant evidence to design and develop a novel bio‐based epoxy resin with high performance to substitute the petroleum‐based epoxy resin.     

Improvement in fracture behaviors of epoxy resins toughened with sulfonated poly(ether sulfone)

The sulfonated poly(ether sulfone) (SPES) was successfully prepared using chlorosulfonic acid as a sulfonating agent. Diglycidylether of bisphenol-A (DGEBA) epoxy resins were modified with different contents of SPES, and the thermal and mechanical interfacial properties of DGEBA/SPES blends were investigated. As a result, the surface free energy of the blends was increased by the addition of SPES. DSC measurements revealed that the curing reaction was delayed with the increase of SPES content. Whereas, the thermal stabilities of the blends were slightly decreased as the SPES content increased. Meanwhile, the glass transition temperature and fracture toughness of the blends were increased with increasing SPES content, due to the improved intermolecular interactions, such as hydrogen bonding, between the hydroxyl group of DGEBA and the sulfonic group of SPES in the blends. The agreement could be observed by SEM which revealed phase separated morphology of DGEBA/SPES blends.     

Synthesis and properties of biobased epoxy resins. part 1. Glycidylation of flavonoids by epichlorohydrin

Biobased epoxy resins were synthesized from a catechin molecule, one of the repetitive units in natural flavonoid biopolymers also named condensed tannins. The reactivity of catechin toward epichlorohydrin to form glycidyl ether derivatives was studied using two model compounds, resorcinol and 4‐methylcatechol, which represent the A and B rings of catechin, respectively. These model molecules clearly showed differences in reactivity upon glycidylation, explaining the results found with catechin monomer. The reaction products were characterized by both FTIR and NMR spectroscopy and chemical assay. The glycidyl ether of catechin (GEC) was successfully cured in various epoxy resin formulations. The GECs thermal properties showed that these new synthesized epoxy resins displayed interesting properties compared to the commercial diglycidyl ether of bisphenol A (DGEBA). For instance, when incorporated up to 50% into the DGEBA resin, GEC did not modify the glass‐transition temperature. Epoxy resins formulated with GEC had slightly lower storage moduli but induced a decrease of the swelling percentage, suggesting that GEC‐enhanced crosslinking in the epoxy resin networks. © 2011 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2011     

The effect of nanoparticles on structural morphology, thermal and flammability properties of two epoxy resins with different functionalities

The effect of layered silicate nanoclays, nano-silica and double-walled carbon nanotubes (DWNTs) on the thermal stability and fire reaction properties of two aerospace grade epoxy resins (a high temperature curing tetra-functional and a low temperature curing bi-functional resin) has been investigated using thermal analysis, cone calorimetry, LOI and UL-94 techniques. The morphology of the polymer-clay nanocomposites, determined by X-ray diffraction and transmission electron microscopy indicated intercalated structures. The addition of nanoclays (5-wt%) to both resins had a thermal destabilisation effect in the low temperature regime (<400 °C), but led to higher char yield at higher temperatures. The inclusion of nano-silica at 30-wt% significantly improved the thermal stability of the resins while DWNTs had an adverse effect due to their poor dispersion in the matrix. The nanoclays and carbon nanotubes significantly increased the fire resistance of the tetra-functional epoxy resin while a minimal effect was observed for the bi-functional resin.     

Adhesives and coatings based on phenolic/epoxy resins

Low molecular weight epoxy resin based on bis (4‐hydroxy phenyl) 1,1 cyclohexane was prepared and modified with various types of the prepared phenolic resins. Phenol–, cresol–, resorcinol–and salicylic acid–formaldehyde resins were used. The optimum conditions of formulation and curing process were studied to obtain modified wood adhesives characterized by high tensile shear strength values. This study indicated that the more suitable conditions are 1:2 weight ratio of phenol–or cresol–formaldehyde to epoxy resin in the presence of phthalic anhydride (20 wt%) of the resin content as a curing agent at 150°C for 80 min. Resorcinol–or salicylic acid–formaldehyde/epoxy resins formulated at 1:2 weight ratio were cured in the presence of paraformaldehyde (20 wt%) at 150°C for 60 min. The effect of the structure of phenolic resins on the tensile shear strength values of formulated resin samples, when mixed with the epoxy resins and cured under the previously mentioned optimum conditions for different times, was investigated. Metallic and glass coatings from the previous resins were also prepared and evaluated as varnishes or paints. Copyright © 1999 John Wiley & Sons, Ltd.     

2－乙基－4－甲基咪唑固化环氧树脂的固化反应机理、动力学及其反应活性

本文应用ＤＳＣ和ＦＴＩＲ对２－乙基－４－甲基咪唑固化双酚Ａ二缩水甘油醚型环氧树脂体系的固化反应机理和２－乙基－４－甲基咪唑固化双酚Ａ二缩水甘油醚型、缩水甘油酯与脂环型环氧树脂体系的固化反应特征、动力学及其反应活性进行了研究．结果表明，双酚Ａ二缩水甘油醚型环氧树脂／咪唑体系的固化反应是分两步独立进行的，第一步是加成反应，第二步是催化聚合反应．缩水甘油酯与脂环型环氧树脂（ＴＤＥ－８５）／咪唑体系的固化反应过程也分两步进行，第一阶段反应主要是缩水甘油酯型环氧基进行的加成反应和催化聚合反应，第二阶段主要是脂环型环氧基进行的加成反应．各体系第一阶段的表现反应活化能均低于第二阶段活化能．当ＴＤＥ－８５型环氧树脂中引入缩水甘油醚型环氧树脂后，固化反应速率均较ＴＤＥ－８５环氧树脂单独固化时快．     

Correlation between chain segment and ion mobility in an epoxy resin system. A free volume analysis

Steady shear viscosity and ionic conductivity have been measured for nine commercial diglycidyl ether of bisphenol-A (DGEBA) epoxy resins with molecular weights ranging from 340 to 14,200. The temperature dependence of viscosity and ionic conductivity was modeled using free volume viscosity and ionic conductivity relationships, which correlate the fractional free volume required for polymer chain segment motion (B) and the fractional free volume required for ion motion (B′) with polymer structure. The fractional free volume required for polymer chain segment mobility was observed to increase systematically with the molecular weight of the resins. The fractional free volume required for ion mobility did not vary for the resin series. A stoichiometric mixture of a low molecular weight DGEBA resin and a 4,4′-diaminodiphenyl sulfone cross-linker was partially polymerized to extents of reaction ranging from 0% to 49%. The fractional free volume required for polymer segment mobility for these partially polymerized samples was consistent with results for the neat resins. © 1993 John Wiley & Sons, Inc.