Ar环境气压对纳米Si晶粒成核区范围的影响

为了研究不同环境气压条件下纳米Si晶粒成核区的范围,采用波长为308 nm的 XeCl脉冲准分子激光器,分别在1-200 Pa的Ar气环境下, 烧蚀高阻抗单晶Si靶,在距离烧蚀点正下方2.0 cm处水平放置一系列单晶Si 或玻璃衬底,沉积制备了纳米Si薄膜. Raman谱和X射线衍射谱测量证实了薄膜中纳米Si晶粒已经形成. 扫描电子显微镜的测量结果表明,环境气压的变化影响了衬底上纳米Si晶粒的平均尺寸及其分布范围. 根据成核区位置的确定方法,计算得出随着环境气压的增加纳米Si晶粒成核区的范围先变宽后变窄的规律. 从烧蚀动力学的角度对实验结果进行了分析.     

外加气流对脉冲激光烧蚀制备纳米Si晶粒尺寸分布的影响

提出一种控制脉冲激光烧蚀制备纳米Si晶粒尺寸分布的新方法。在10Pa的Ar环境中,采用脉冲激光烧蚀高阻抗单晶硅靶沉积制备了纳米Si晶薄膜。在羽辉正上方2.0cm,距靶0.3～3.0cm范围内的不同位置引入氩气流,在烧蚀点正下方2.0cm处水平放置单晶Si(111)衬底来收集制备的纳米Si晶粒。利用扫描电子显微镜观察样品表面形貌,并对衬底不同位置上纳米Si晶粒进行统计。结果表明:在不引入气流时,晶粒的尺寸随靶衬间距的增加先增大后减小,晶粒尺寸峰值出现在距靶1.7cm处;引入气流后,晶粒尺寸分布发生变化,在距靶1.7cm引入气流时晶粒尺寸峰值最大,在距靶3.0cm引入气流时晶粒尺寸峰值最小,且出现晶粒尺寸峰值的位置随着引入气流位置的增加而增大。     

脉冲激光烧蚀制备纳米Si晶粒成核气压阈值及动力学研究

采用脉冲激光烧蚀技术,在室温、低压Ar气条件下通过改变气体压强及靶与衬底间距,对纳米Si晶粒成核的气压阈值进行了研究.根据扫描电子显微镜图像、拉曼散射谱和X射线衍射谱对制备样品的表征结果,确定了在室温、激光能量密度为4 J/cm²、靶与衬底间距为3 cm条件下形成纳米Si晶粒的阈值气压为0.6 Pa.结合流体力学模型和成核分区模型,对纳米晶粒的成核动力学过程进行了分析.通过Monte Carlo数值模拟,表明在气相成核过程中,烧蚀Si原子的温度和过饱和密度共同影响着纳米晶粒的成核. 关键词： 脉冲激光烧蚀 成核 气压阈值 Monte Carlo数值模拟     

Ar环境气压对脉冲激光烧蚀制备纳米Si晶粒平均尺寸的影响

采用XeCl脉冲准分子激光器，烧蚀高阻抗单晶Si靶，在1—500 Pa的Ar气环境下沉积制备了纳米Si薄膜. x射线衍射谱测量证实，纳米Si晶粒已经形成.利用扫描电子显微镜观测了所形成纳米Si薄膜的表面形貌，结果表明，随着环境气压的增加，所形成的纳米Si晶粒的平均尺寸增大，气压为100 Pa时达到最大值20 nm，而后开始减小. 从晶粒形成动力学角度，对实验结果进行了定性分析. 关键词： 纳米Si晶粒 脉冲激光烧蚀 表面形貌     

具有窄光致发光谱的纳米Si晶薄膜的激光烧蚀制备

采用XeCl脉冲准分子激光器，在10Pa的Ar气环境下，烧蚀高阻单晶Si靶，分别在距靶3cm的玻璃和单晶Si衬底上制备了纳米Si薄膜. 相应的Raman谱和x射线衍射谱均证实了薄膜中纳米Si晶粒的形成. 扫描电子显微镜图像显示，所形成的薄膜呈均匀的纳米Si晶粒镶嵌结构. 相应的光致发光峰位出现在599nm，峰值半高宽为56nm，与相同参数下以He气为缓冲气体的结果相比，具有较窄的光致发光谱，并显示出谱峰蓝移现象. 关键词： 纳米Si晶粒 脉冲激光烧蚀 薄膜形貌 光致发光     

低压下气流对激光沉积纳米硅晶化及尺寸的影响

纳米硅具有明显的光致发光效应和量子尺寸效应,广泛的应用在现代电子工业和太阳能光伏工业中.尺寸影响着纳米硅的实际用途,因此制备尺寸可控的纳米硅晶粒具有很重要的实际意义.本文采用脉冲激光沉积(PLD)技术,在烧蚀点水平方向、距靶2 cm处引入一束流量为5 sccm的氩(Ar)气流,在0.01-0.5 Pa的Ar气压下烧蚀高阻抗单晶硅(Si)靶.在管口正下方1 cm处水平放置衬底来沉积纳米Si薄膜;并用同一装置,在0.08 Pa的Ar气压下分别引入流量为0,2.5,5,7.5,10 sccm的Ar气流沉积纳米Si薄膜.利用原子力显微镜(AFM)、X射线衍射(XRD)、Raman散射对样品表面形貌和微观结构进行分析表征.结果表明:不引入气流时出现纳米Si晶粒的阈值气压是0.1Pa,引入气流后出现纳米Si晶粒的阈值气压为0.05 Pa.晶粒尺寸随着气流流量的增大而减小.     

电场中不同能量密度激光烧蚀制备纳米硅晶粒分布特性

在室温和10 Pa氩气环境中,引入平行于靶面方向的直流电场,通过改变脉冲激光能量密度烧蚀单晶硅靶,在与羽辉轴线呈不同角度的衬底上沉积纳米硅晶薄膜。利用扫描电子显微镜和拉曼散射谱对沉积样品进行分析,结果表明:随着激光能量密度的增加,位于相同角度衬底上的晶粒尺寸和面密度逐渐变大;在同一激光能量密度下,零度角处衬底上的晶粒尺寸和面密度最大,且靠近接地极板处的值比与之对称角度处略大。通过朗缪尔探针对不同能量密度下烧蚀羽辉中硅离子密度变化的诊断、结合成核区内晶粒成核生长动力学过程,对晶粒分布特性进行了分析。     

脉冲激光沉积纳米硅晶粒流体模型的推广

Yoshida等人提出的惯性流体模型只能解释脉冲激光烧蚀制备纳米硅晶粒平均尺寸随环境气压的变化规律.在此模型基础上,考虑到烧蚀粒子的初始速度分布(Maxwell分布),得到了纳米硅晶粒尺寸分布的解析表达式,数值模拟结果与Yoshida等人在不同环境氦气压下制备样品的晶粒尺寸分布的实验统计数据基本相符.还利用修正后的模型对不同环境气体种类(氦、氖、氩)中制备的纳米Si晶粒尺寸分布进行了模拟,模拟结果与实验数据相符.结论可为实现纳米硅晶粒尺寸的均匀可控提供理论依据. 关键词： 纳米硅晶粒 脉冲激光烧蚀 惯性流体模型 尺寸分布     

Ar环境下脉冲激光烧蚀粒子阻尼系数的空间分布

在10 Pa的Ar环境气体中,采用脉冲激光烧蚀技术,分别在半径为2.0,2.5,3.0,3.5和4.0 cm的半圆环不同角度处的衬底上制备了一系列含有纳米晶粒的Si晶薄膜。使用扫描电子显微镜、X射线衍射仪和拉曼光谱仪对其表面形貌和微观结构进行分析表征。结果表明,纳米Si晶粒的平均尺寸和烧蚀粒子的阻尼系数均相对于羽辉轴向呈对称分布,并随着与羽辉轴向夹角的增大而减小;同时,随着衬底半径的增加,晶粒平均尺寸和阻尼系数均逐渐减小。     

初始溅射粒子密度对烧蚀粒子密度和速度分布的影响

采用蒙特-卡罗(Monte Carlo)模拟方法,研究了初始溅射粒子密度对其传输中的密度和速度分布以及环境气体密度分布的影响.结果表明,随着初始溅射粒子密度增大,烧蚀粒子和环境气体高密度峰的交叠区离开靶的最大距离减小,被衬底反弹后,距靶的最小距离减小,烧蚀粒子的速度分布随初始溅射粒子密度增大而变宽,当初始溅射粒子密度大于8.33×10²⁵ m^-3时,出现速度劈裂现象.所得结论为进一步定量研究纳米晶粒的成核机理提供了基础. 关键词： Monte Carlo模拟 烧蚀粒子 密度分布 速度分布     

Initial study on the structure and photoluminescence properties of SiC films doped with Al

SiC films doped with aluminum (Al) were prepared by the rf-magnetron sputtering technique on p-Si substrates with a composite target of a single crystalline SiC containing several Al pieces on the surface. The as-deposited films were annealed in the temperature range of 400-800 °C under nitrogen ambient. The thin films have been characterized by X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FTIR) and scanning electron microscopy (SEM). The results show that the introduction of Al into films hinders crystalline formation process. And with the increase of annealing temperature, more Si particles are formed in the films, which strongly affect the optical absorption properties. The photoluminescence (PL) spectra of the samples show two peaks at 370 nm and 412 nm. The intensities of the PL peaks are evidently improved after Al doped. We attribute the origin of the two PL peaks to a kind of Si-related defect centres. The obtained results are expected to have important applications in modern optoelectronic devices.     

The structure and photoluminescence properties of Cr-doped SiC films

Cr-doped SiC films are prepared by the RF-magnetron sputtering technique on Si substrates with a composite target of a single-crystalline SiC containing several Cr pieces on the surface. The as-deposited films are annealed in the temperature of 1000 °C under nitrogen ambient. The structure of the samples has been characterized by X-ray diffraction (XRD), scanning electron microscope (SEM), X-ray photoelectron spectroscopy (XPS), and Raman scattering measurement. The results show that the SiC crystal is formed and that majority of Cr doped in the SiC resulted in the formation of the C clusters. Then the photoluminescence (PL) spectra of the samples are observed in the visible range at room temperature. The optical properties of the samples have also been discussed briefly. We attribute the origin of the 412-nm PL band to a kind of C cluster center.     

532nm连续激光晶化非晶硅薄膜的原位拉曼光谱研究

用磁控溅射制备了非晶硅薄膜,用波长为532 nm的连续激光退火和显微Raman光谱原位测试技术和场发射扫描电子显微镜研究了非晶硅薄膜在不同激光功率密度和不同扫描速度下的晶化状态。结果表明,激光照射时间10 s,激光功率密度大于2.929×105W/cm2时,能实现非晶硅薄膜晶化。在激光功率密度为5.093×105W/cm2,扫描速度为10 mm/s时非晶硅开始向多晶硅转化。在5.093×105W/cm2的功率密度下,以1.0 mm/s的扫描速度退火非晶硅薄膜,得到的晶粒直径为740 nm。     

Structural, chemical and optical features of nanocrystalline Si films prepared by PECVD techniques

The nanostructural and chemical features of nanocrystalline Si (nc-Si) films, which were prepared by plasma-enhanced chemical vapor deposition (PECVD), were investigated in terms of various deposition conditions such as reaction gas fractions and substrate temperature. Such features were related with the photoluminescence (PL) phenomena of the nc-Si films. The phase of the nc-Si films prepared at room temperature is somewhere between amorphous and crystalline states, containing about 2 nm size nanocrystallites, which are well passivated by hydrogen. These films exhibit significant PL intensities near blue light region; the PL peaks shift to lower wavelength with decreasing nanocrystallite size.     

Cones with a dual structure formed on Ar+-bombarded Si surfaces

Transmission electron microscopy disclosed that cones formed on crystalline Si surfaces bombarded with a few keV Ar⁺ ions were of a dual structure inexplicable by the existing models of cone formation. The outer region of the cones was composed of unoriented crystallites of Si, whereas the inner region was a single crystal oriented in the 〈111〉 direction. The polycrystalline region was too thick to explain its formation in terms of ion-induced disordering of the monocrystalline phase, suggesting that the redeposition of sputtered Si atoms was deeply concerned in evolving the cones. It is supposed that the present cone evolution involved particle supply processes underlying the growth of Si whiskers from the vapor phase.