高分子基导电复合材料气敏响应机理研究

高分子基气敏导电材料是近年来发展起来的一种新型功能高分子复合材料.本文介绍了以炭黑(CB)为导电填充剂的复合传感材料的气敏响应机理的体积膨胀模型、结晶模型和氢键模型,并讨论了逾渗阀值、CB及聚合物微观结构与性能、以及CB与聚合物和溶剂三者之间相互作用等因素对该类材料气敏响应性的影响.     

导电聚合物传感器的研究进展

综述了导电聚合材料应用于生物敏、离子敏、气敏、湿敏传感器的研究概况。并对导电聚合物传感器研究动向作了展望。     

导电聚合物传感器的研究进展

导电聚合物因其具有特殊的结构和优异的物理化学性能,而成为构建传感器的一种新材料。综述了近5年来导电聚合物在生物传感器、离子传感器、气敏传感器方面的研究进展,并对导电聚合物的研究动向作了展望。     

导电型高分子/碳纳米管复合材料研究

介绍了作者课题组近年来在导电型高分子/碳纳米管(CNT)复合材料研究中若干有代表性的工作,我们从设计多相多组分体系角度出发,通过向单一高分子/CNT体系中添加包括无机粉体、有机高分子和第二种导电介质等第三组分来调控CNT在体系中的分布状态,以期建立提高复合材料的导电性能的技术方法,并研究了添加第三组分引致材料导电性能提...     

微孔发泡聚合物基导电复合材料的研究进展

概述了用超临界流体作为物理发泡剂对聚合物基导电复合材料进行微孔发泡的基本原理,总结了聚合物基导电复合材料及其微发泡复合材料的几种导电机理,简要介绍了近年来微孔发泡聚合物基导电复合材料电学性能的研究现状。并从微发泡聚合物基导电复合材料的基体特性、所使用的导电填料类型、导电填料的含量、填料在基体中的分散方法及微发泡复合材料的泡孔形态等几个方面,分析了影响微孔发泡聚合物基导电复合材料电学性能的主要因素,并展望了新型微孔发泡聚合物基导电复合材料的研究和发展趋势。     

季铵盐型离子导电聚合物的研究

对聚苯胺呋喃季铵盐的物理性质及导电机制进行了分析讨论。结果表明，所制备的季铵盐最高电导率可达１０＾－４Ｓ·ｃｍ＾－１量级，其导电性随季铵化程度增加而增加，温度、湿度对其导电性有较大的影响；在环境温度、湿度基本恒定的条件下，季铵盐有较好的电导稳定性。此季铵盐是通过离散的阴离子而传导，通过链段运动传输电荷。     

WO3基气敏传感器*

气敏传感器已在生物、化学、航空、军事等领域获得了广泛的应用。鉴于WO₃基气敏传感器是检测H₂S、NO_x、O₃和NH₃等气体最有前景的新型氧化物气敏传感器之一,本文以不同的敏感气体为分类依据系统阐述了近年来WO₃基气敏传感器的研究进展,详细探讨了制备方法及贵金属掺杂对上述各种气体气敏性能的影响,并指出了目前WO₃基气敏传感器在研究过程中存在的问题。     

炭黑/炭纤维/聚甲基丙烯酸丁酯导电复合材料的导电性和气敏性

炭黑;气相生长炭纤维;聚合物基导电复合材料;气敏性     

WO3基气敏材料研究进展

综述了近年来国内外对WO3基气敏材料的研究状况,对制备工艺、防团聚技术、掺杂效应及气敏机理等进行了分析比较,并对今后的研究方向提出了一些看法。     

Multiple Threshold Percolation in Polymer/Filler Composites

Local variations in filler particle concentration and/or shape and orientation in static filler/polymer composites are modelled as distributions of percolation thresholds. The concentration variations can be due to insufficient mixing, formation of semicrystalline voids during cooling from the melt, shrinkage during polymer curing, flow during physical compression or the like. Irregular filler shapes, especially elongated shapes, reduce the percolation threshold; thus natural variations in the shapes and orientations of filler particle aggregates lead to locally varying percolation thresholds. A distribution of percolation thresholds leads to an apparent percolation threshold based on the conductivity below the mean percolation threshold. For filler concentrations above the apparent percolation threshold the dielectric constant continues to increase before reaching a lowered peak value at the mean percolation threshold and then decreasing. Own experimental results on EBA /carbon black composites support the theory.     

交流阻抗谱在聚乙烯/碳黑导电复合材料导电机理研究中的应用

用交流阻抗谱论证了聚乙烯/碳黑(PE/CB)导电复合材料的网络导电机理,分析了热处理过程对复合材料电性能的影响。通过在不同频率和低电压下测定热处理前后及不同长度的导电复合材料样品的导电能力(A)、导电方式(B)和电阻值(Ra Rc),证明了材料内部存在着直通碳链、小间隙的碳链和大间隙的碳链,呈现三维网络导电结构。     

Effect of Polythiophene Content on Thermomechanical Properties of Electroconductive Composites

The thermal, mechanical and electrical properties of polymeric composites combined using polythiophene (PT) dopped by FeCl₃ and polyamide 6 (PA), in the aspect of conductive constructive elements for organic solar cells, depend on the molecular structure and morphology of materials as well as the method of preparing the species. This study was focused on disclosing the impact of the polythiophene content on properties of electrospun fibers. The elements for investigation were prepared using electrospinning applying two substrates. The study revealed the impact of the substrate on the conductive properties of composites. In this study composites exhibited good thermal stability, with T₅ values in the range of 230–268 °C that increased with increasing PT content. The prepared composites exhibited comparable PA T_g values, which indicates their suitability for processing. Instrumental analysis of polymers and composites was carried out using Fourier Transform Infrared spectroscopy (FT-IR), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), dynamic mechanical thermal analysis (DMTA) and scanning electron microscopy (SEM).     

两种碳材料混合填充聚合物复合材料的导电特性及渗流阈值的计算模型

介绍了用碳纳米管与炭黑（或石墨）混合填充的聚合物复合材料的导电特性;阐述了混合填充聚合物体系的导电机理;介绍了基于线性混合规则和已占体积理论的渗流阈值的计算模型;分析了模型计算值与实验值的差异。利用已占体积理论,重新推导了混合填充体系渗流阈值的计算公式,并与文献公式做了比较。新公式表明：混合填充聚合物复合材料的渗流阈值...     

A Novel Method for Preparing Polyurethane Based Conductive Composites with Low Percolation Threshold

A novel method for preparing conductive carbon black filled polymer composites with low percolation threshold from polyurethane emulsion are reported in this paper. The experimental results indicate that with a rise in carbon black concentration the insulator-conductor transition in the emulsion blended composites occurs at 0.8-1.4vol%. In contrast, the solution blended composites exhibit drastic increase in conductivity at conducting filler fraction as high as 12.3-13.3vol%. It is demonstrated that the composites microstructure rather than chemical structure of the matrix polymer predominantly determines the electrical conduction performance of the composites.     

Smart Poly(styrene)/Carbon Black Conductive Polymer Composites Films for Styrene Vapour Sensing

Conductive Polymer Composites (CPC) can be used to elaborate sensing elements able to detect solvent vapours at very low concentrations (some ppm). Our experiments have shown that combining atactic PS or syndiotactic PS to five carbon black of different specific surfaces, allows obtaining a wide range of electrical resistances and surface morphologies. The CPC films have been elaborated from solutions by spraying and spin coating, the former being more adequate to design sensitive films with tuneable electrical properties. The larger electrical responses were obtained with an initial resistance close to 10⁴ Ω. Our sensors gave a response for very low styrene concentration (some ppm) increasing as a function of vapour concentration.     

聚乙烯/碳黑导电复合材料的导电性能

提出并验证了聚乙烯/碳黑(PE/CB)导电复合材料的网络导电性能和产生正温度系数(PTC)特性的原因,分析了加工过程、温度和辐射交联等后处理过程对其导电性能的影响.     

Effect of Different Hybrid Method on Properties of Carbon Nanotubes/Dolomite Hybrid Filled Phenolic Composites

Hybridization of multi wall carbon nanotubes (MWCNTs) with other filler in polymer matrix composites (PMC) is one of the techniques for combining different properties of fillers for making more unique composites. In this work, the hybrid filler (CNTs–dolomite) are prepared via chemical vapour deposition (CVD hybrid) and the milling method (physically hybrid). The effect of different hybrid method on properties of multi wall carbon nanotubes/dolomite hybrid filled phenolic composites were studied. Phenolic/CVD hybrid composites and phenolic/physically hybrid composites with different filler loadings were prepared using hot mounting press. The prepared samples were characterized for their thermal conductivity and hardness. The thermal conductivity was measured using the Transient Plane Source (TPS) method, using a Hot-DiskTM Thermal Constant Analyzer and the hardness was measured using Rockwell micro-hardness. The results showed that at 5% filler loading, the phenolic/CVD hybrid composites were capable of increasing the thermal conductivity and micro-hardness up to 7.22% and 101.6% respectively compared to pure phenolic.