A study of atmospheric-pressure CHF3/Ar plasma treatment on dielectric characteristics of polyimide films

In this work, the influence of atmospheric-pressure CHF(3)/Ar plasma treatment on surface dielectric properties of polyimide films was investigated using X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM), and contact angle measurements. The dielectric characteristics of the films were studied using a dielectric spectrometer. From the results, it was found that the plasma treatment introduced fluorine functional groups onto the polyimide surfaces. F 1s/C 1s ratios of the polyimides were enhanced with the increase of plasma treatment time. Consequently, the fluorine groups led to a decrease of the surface free energy and dielectric constant of the polyimide films, which can largely be attributed to the decrease of the deformation polarizability or London dispersive component of surface free energy of the solid surface studied.     

Direct Patterning of Copper on Polyimide by Site‐Selective Surface Modification via a Screen‐Printing Process

We demonstrate a simple route to fabricating copper circuit patterns on the surface of polyimide film. The copper pattern can be obtained in three steps: 1) Formation of partially potassium hydroxide modified pattern via a screen‐printing process, 2) formation of macromolecular metal complex with copper, and 3) copper metallization by DMAB reduction. The morphologies of these copper patterns are determined by cross‐sectional transmission electronic microscopy (TEM), scanning electronic microscopy (SEM), and atomic force microscopy (AFM). Furthermore, the growing process of the metallic copper film is investigated. The direct patterning of copper patterns onto polyimide substrates is promising for use in electronics industry as a large‐area and low‐cost processing technique.     

Surface modification of poly(tetrafluoroethylene) films by plasma polymerization of glycidyl methacrylate and its relevance to the electroless deposition of copper

Surface modification of poly(tetrafluoroethylene) films by plasma polymerization and deposition of glycidyl methacrylate (GMA) was carried out. The effects of glow‐discharge conditions on the chemical structure and composition of the deposited GMA polymer were analyzed by X‐ray photoelectron spectroscopy (XPS) and Fourier transform infrared (FTIR) spectroscopy. XPS and FTIR results revealed that the epoxide groups in the plasma‐polymerized GMA (pp‐GMA) layer had been preserved to various extents, depending on the plasma deposition conditions. The morphology of the modified PTFE surface was investigated by atomic force microscopy (AFM). The pp‐GMA film with well‐preserved epoxide groups was used as an adhesion promotion layer to enhance the adhesion of the electrolessly deposited copper on the PTFE film. The T‐peel adhesion test results showed that the adhesion strength between the electrolessly deposited copper and the pp‐GMA‐modified PTFE (pp‐GMA‐PTFE) film was much higher than that between the electrolessly deposited copper and the pristine or the Ar plasma‐treated PTFE film. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 3498–3509, 2000     

Nitrogen plasma modification on polyimide films for copper metallization on microelectronic flex substrates

Surface modification of polyimide films Kapton E(N) and Upilex S by nitrogen plasmas were investigated for their enhanced adhesion strength with sputtered coppers. Peel tests demonstrate this improvement, with peel strengths of 7 and 12 N/m for unmodified Kapton E(N) and Upilex S, and 1522 and 1401 N/m for nitrogen plasma‐modified Kapton E(N) and Upilex S at certain plasma conditions. Atomic force microscopy (AFM) and the sessile drop method indicated the surface roughness, and the surface energy of polyimide films were highly increased by nitrogen plasmas. This study shows the enhanced adhesion strengths of polyimide films with sputtered coppers by nitrogen plasmas, and these nitrogen plasmas were strongly affected by the surface characteristics of polyimide films. Electron spectroscopy for chemical analysis (ESCA) observed the increased surface energy on polyimide films by nitrogen plasmas was due to the increased surface composition of O and the increased chemical bond of C? O. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 2023–2038, 2005     

Preparation and Study of New Metal-Containing Polymer Compositions Based on an Alicyclic Polyimide

New film-forming metal-containing polymer compositions based on an alicyclic polyimide and on arylalicyclic copolyimides synthesized from tricyclodecene-, oxydiphenyl-, and benzophenonetetracarboxylic dianhydrides and oxydianiline in the presence of cobalt, nickel, iron, and copper salts in amide solvents were prepared, and their main properties were studied. Optimum synthesis conditions and compositions of metalcontaining composites with improved thermal, electrical, and other characteristics were found. The possibility of using the modified alicyclic polyimide films for fabricating integrated circuits by magnetron sputtering was examined. The samples prepared by sputtering of metals onto SPI-1 polyimide films with a chromium sublayer are characterized by high adhesion of the metal to the film surface.     

Effect of oxygen plasma treatment and gold sputtering on morphological and local mechanical properties of copolyimide/gold micropatterned structures

Atomic force microscopy (AFM) was used to analyze rectangular 3‐dimensional patterned microstructures with different functionalities induced on copolyimide containing alicyclic sequences film surfaces by means of oxygen plasma treatment. The plasma power was ranged to be big enough to accelerate the plasma species towards the copolyimide surface, and the exposure time was not very small to generate a roughness that still can be monitored by AFM. To create the rectangular pattern, transmission electron microscopy grid masks were placed on the samples before treatment. Plasma‐induced micropatterning with alternating hydrophilic and hydrophobic surface chemistries was evaluated by measuring the adhesion forces between the gold‐covered AFM tip and the copolyimide surfaces. To fabricate 3‐dimensional metallic microstructures arranged in well‐defined areas, thin metal layers were sputtered on these pretreated copolyimide films. The AFM morphological aspects of the obtained metallic structures were correlated with the surface modifications induced by plasma treatment conditions. Functional indexes and functional volume parameters were also calculate to characterize the functional behavior of the surface, such as wear, lubrication, and contact. The AFM data were compared with those obtained using the small‐angle X‐ray scattering measurements.     

Characterization of polymer materials exposed at the Mir orbital space station

The results of studies of polyimide and fluoropolymer films after a prolonged exposure at the Mir orbital space station are reported. The weight loss of external polyimide films was ～40–60%; the weight of FEP-100A fluoropolymer films remained unchanged, and the weight of F-4MB films increased by ～50%. The external and internal surfaces of polyimide films were hydrophilized. The external surface of a polyimide film acquired anisotropic properties, which manifested themselves as the shape anisotropy of liquid drops, the surface tension and the work of adhesion, the light scattering circular diagrams, and in the formation of spatially oriented fractal structures. The appearance of anisotropic properties is a consequence of the arrangement of a film on the station surface at an angle to the flow of atomic oxygen. The possible reactions of fast and scattered oxygen atoms, which are responsible for the chemical and structural transformations of polyimide, are discussed.     

The surface and interfacial chemistry of polyimide films

The surfaces of polyimide films and the structure just below the surfaces have been extensively studied as people have sought to improve and understand the key factors controlling adhesion. Treatments of all types from primers to plasma etching to sand blasting have been evaluated with varying efforts depending on the application. In recent years, the emphasis has been on understanding the chemical and morphological changes effected by these treatments and then correlating chemistry and morphology with adhesion. The picture that emerges is that surface energy alone, as is the case with most polymers, usually is insufficient to predict adhesion to polyimides. Instead, initial bond strength and bond durability, whether with adhesives or metals directly deposited on the film, depend on chemical bonding, diffusion between deposited layers and the polyimide, formation of a micro composite region controlled in part by topography and the viscoelastic properties of the polymer below the surface. Poor viscoelastic behavior frequently is characterized as a weak boundary layer. Recent work has shown that small amounts of organometallics that diffuse to the surface during the film forming process can significantly affect bondability both to adhesives and to vacuum deposited metals. The possible effect of these additives on bond formation, viscoelastic properties, diffusion and topography is under investigation and will be discussed along with an over view of the primary film forming steps that might affect surface chemistry and structure.     

The role of conditioning film formation and surface chemical changes on Xylella fastidiosa adhesion and biofilm evolution

Biofilms are complex microbial communities with important biological functions including enhanced resistance against external factors like antimicrobial agents. The formation of a biofilm is known to be strongly dependent on substrate properties including hydrophobicity/hydrophilicity, structure, and roughness. The adsorption of (macro)molecules on the substrate, also known as conditioning film, changes the physicochemical properties of the surface and affects the bacterial adhesion. In this study, we investigate the physicochemical changes caused by Periwinkle wilt (PW) culture medium conditioning film formation on different surfaces (glass and silicon) and their effect on X. fastidiosa biofilm formation. Contact angle measurements have shown that the film formation decreases the surface hydrophilicity degree of both glass and silicon after few hours. Atomic force microscopy (AFM) images show the glass surface roughness is drastically reduced with conditioning film formation. First-layer X. fastidiosa biofilm on glass was observed in the AFM liquid cell after a period of time similar to that determined for the hydrophilicity changes. In addition, attenuation total reflection-Fourier transform infrared (ATR-FTIR) spectroscopy supports the AFM observation, since the PW absorption spectra increases with time showing a stronger contribution from the phosphate groups. Although hydrophobic and rough surfaces are commonly considered to increase bacteria cell attachment, our results suggest that these properties are not as important as the surface functional groups resulting from PW conditioning film formation for X. fastidiosa adhesion and biofilm development.     

Adhesion of an aromatic thermosetting copolyester with copper foils

Copper foils have been widely used in microelectronic devices. Adequate adhesion between copper foils to various substrates, such as Si, SiO₂, polyimide, is crucial to high performance of these devices. The adhesion between a new high temperature adhesive, aromatic thermosetting copolyester (ATSP), and various copper foils, namely, zinc(Zn)‐coated copper foil, copper foil and nickel (Ni)‐coated copper foil was characterized by a 90° peel strength test. It was found that the peel strength of Zn‐coated copper foil to ATSP was 1050 N/m, which was more than three times higher than copper foil and five times that of Ni‐coated copper foil. Scanning electron microscopy (SEM), atomic force microscopy (AFM) and X‐ray photoelectron spectroscopy (XPS) studies indicated that this higher adhesion results from the stronger mechanical interlocking due to the rougher surface of Zn‐coated copper foil, and from chemical reactions at the interface which occur during the curing process of ATSP on the Zn‐coated copper surface. In contract to the adhesive failure at the ATSP/Cu and ATSP/Ni interfaces, the failure mechanism of ATSP/Zn is both cohesive and adhesive. Copyright © 2004 John Wiley & Sons, Ltd.     

Study of the properties and structure of polyimide and bilayer fluoropolyimide films after space exposure on the Mir space station

Results of examination of bilayer polyimide and fluorinated polyimide films after their exposure to outer space on the Mir space station are reported. The polyimide films were screened by quartz plates during exposure. An increase in the surface energy and the work of adhesion indicate substantial hydrophilization of the open surface, as well as slight hydrophilization of the screened film surface. A difference in values of the surface energy and work of adhesion depending on the orientation of a sample relative to the direction of motion of the space station indicates that the surface properties of the outer surface of the unscreened film became anisotropic in character, with the anisotropy axis being aligned with the direction of motion of the spacecraft. The fact that the outer surface of the film has acquired anisotropic properties is corroborated by the results of study of scanning electron microscopic images and polar plots of brightness. The hydrophilization of the films indicates an increase in the concentration of polar groups. In the space environment, the degradation of the fluoropolymer surface layer and its removal under high-vacuum conditions take place. For the quartz-shielded polyimide films, the surface energy and the work of adhesion remained practically the same as for the unexposed films. It was concluded that solar radiation (μ > 200 nm) does not cause a significant decline in the properties of the polyimide film.     

A study of the adhesion of copper to polyimide foils using surface analytical techniques

Summary The adhesion of chemically and electrochemically deposited copper films on commercial polyimide foils has been studied using scanning electron microscopy, photoelectron spectroscopy, EDX and IR reflection-absorption spectroscopy. Experiments have been carried out on the bare surface and the deposited layers as well as on surfaces prepared by peeling off the deposits. The results show that, at least for the case considered here, poor adhesion is caused by cohesion failure in the foil itself, and that a thin surface layer of the polyimide foil is important for the interface bond. IR spectroscopy was used to study the molecular nature of this surface layer.

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Untersuchung der Adhäsion von Kupfer an Polyimidfolien mit Hilfe von oberflächenanalytischen Verfahren

     

Plasma polymerization and deposition of glycidyl methacrylate on Si(100) surface for adhesion improvement with polyimide

Thin polymer films were deposited on Si(100) surfaces by plasma polymerization of glycidyl methacrylate (GMA) under different glow discharge conditions. The FT‐IR, X‐ray photoelectron spectroscopy (XPS), and amine treatment results suggested that the epoxide functional groups of the deposited films had been preserved to various extents, depending on the plasma deposition conditions. The use of a low radio frequency power (～ 5 W) and a relatively high system pressure (100–400 Pa) readily resulted in the deposition of thin films having nearly the same composition of the epoxide functional groups as that of the GMA homopolymer. The plasma‐polymerized GMA (PP‐GMA) thin films deposited on the Ar plasma‐pretreated Si(100) surfaces were retained to a large extent after acetone extraction, suggesting the presence of covalent bonding between the PP‐GMA layer and the Si surface. Thermal imidization of the poly(amic acid) precursor of polyimide on the GMA plasma‐polymerized Si(100) surface resulted in a strongly adhered polyimide film. The adhesion results further suggested that the GMA polymer had been grafted on the Si(100) surface and the epoxide functional groups had undergone reactive interaction (curing) with the carboxylic and amine groups of the poly(amic acid) during thermal imidization. Copyright © 2001 John Wiley & Sons, Ltd.     

Thin film platinum cuff electrodes for neurostimulation: in vitro approach of safe neurostimulation parameters

Thin film technology takes more and more importance in the development of biomedical devices dedicated to functional neurostimulation. Our research about the design of implant neurostimulating electrode is oriented toward thin film cuff electrodes based on a polyimide substrate covered by a chromium/gold/Pt film. The chromium/gold sputtered film serves as adhesion layer and current collector whereas platinum acts as an electrochemical actuator. The electrode surface has been designed to obey safe stimulation criteria (i.e. chemically inert noble metal, low electrode-electrolyte impedance, high electrochemical reversibility, high corrosion stability). The electrochemical behaviour of such platinum electrodes has been assessed and compared to a foil of platinum. Extensive in vitro characterisations of the both electrode types were carried out using AFM, SEM and electrochemical techniques. The role of enhanced surface roughness enabling high double layer capacitances to be achieved was clearly highlighted. The obtained results are discussed, with particular reference to thin film electrodes stability under in vitro electrical stimulation in NaCl 0.9% (physiological serum). Therefore, these thin film devices showed reversible PtOH formation and decomposition making them potentially attractive for the fabrication of implant stimulation cuff electrodes.     

Surface plasma treatment effects on the molecular structure at polyimide/air and buried polyimide/epoxy interfaces

Polyimides are widely used as chip passivation layers and organic substrates in microelectronic packaging. Plasma treatment has been used to enhance the interfacial properties of polyimides, but its molecularmechanism is not clear. In this research, the effects of polyimide surface plasma treatment on the molecular structures at corresponding polyimide/air and buried polyimide/epoxy interfaces were investigated in situ using sum frequency generation (SFG) vibrational spectroscopy. SFG results show that the polyimide backbone molecular structure was different at polyimide/air and polyimide/epoxy interfaces before and after plasma treatment. The different molecular structures at each interface indicate that structural reordering of the polyimide backbone occurred as a result of plasma treatment and contact with the epoxy adhesive. Furthermore, quantitative orientation analysis indicated that plasma treatment of polyimide surfaces altered the twist angle of the polyimide backbone at corresponding buried polyimide/epoxy interfaces. These SFG results indicate that plasma treatment of polymer surfaces can alter the molecular structure at corresponding polymer/air and buried polymer interfaces.     

Influence of Plasma Treatment on the Electroless Deposition of Copper on Carbon Fibers

Air and nitrogen glow discharge were used to replace chromic acid pretreatment to deposit copper film on carbon fiber surfaces from an CuSO₄‐HCHO electroless system. A greater copper uptake and a more uniformly coated copper film were obtained for plasma‐treated carbon fibers. The adhesion between the copper film and the carbon fibers was also improved. An orthogonal table L₉(3⁴) was used to study the effects of discharge pressure, discharge power, time and gas type on the copper uptake. Scanning electron microscopy (SEM), reflection absorption infrared spectroscopy (RAIR) and X‐ray photoelectron spectroscopy (XPS) at different depths were applied to characterize the physical and chemical changes of the surface of the carbon fibers. The results showed that after plasma treatment, the carbon fiber surface became rough and several types of polar oxygen groups, such as carboxylic acid COOH, esters COOC, quinones Ph?O, etc., were introduced into the carbon fiber surface. A mechanism of plasma treatment effects on copper electroless deposition on the carbon fiber surface is also suggested.     

Surface characteristics of a self-polymerized dopamine coating deposited on hydrophobic polymer films

This study aims to explore the fundamental surface characteristics of polydopamine (pDA)-coated hydrophobic polymer films. A poly(vinylidene fluoride) (PVDF) film was surface modified by dip coating in an aqueous solution of dopamine on the basis of its self-polymerization and strong adhesion feature. The self-polymerization and deposition rates of dopamine on film surfaces increased with increasing temperature as evaluated by both spectroscopic ellipsometry and scanning electronic microscopy (SEM). Changes in the surface morphologies of pDA-coated films as well as the size and shape of pDA particles in the solution were also investigated by SEM, atomic force microscopy (AFM), and transmission electron microscopy (TEM). The surface roughness and surface free energy of pDA-modified films were mainly affected by the reaction temperature and showed only a slight dependence on the reaction time and concentration of the dopamine solution. Additionally, three other typical hydrophobic polymer films of polytetrafluoroethylene (PTFE), poly(ethylene terephthalate) (PET), and polyimide (PI) were also modified by the same procedure. The lyophilicity (liquid affinity) and surface free energy of these polymer films were enhanced significantly after being coated with pDA, as were those of PVDF films. It is indicated that the deposition behavior of pDA is not strongly dependent on the nature of the substrates. This information provides us with not only a better understanding of biologically inspired surface chemistry for pDA coatings but also effective strategies for exploiting the properties of dopamine to create novel functional polymer materials.     

Force measurements of bacterial adhesion on metals using a cell probe atomic force microscope

The adhesion of microbial cells to metal surfaces in aqueous media is an important phenomenon in both the natural environment and engineering systems. The adhesion of two anaerobic sulfate-reducing bacteria (Desulfovibrio desulfuricans and a local marine isolate) and an aerobe (Pseudomonas sp.) to four polished metal surfaces (i.e., stainless steel 316, mild steel, aluminum, and copper) was examined using a force spectroscopy technique with an atomic force microscope (AFM). Using a modified bacterial tip, the attraction and repulsion forces (in the nano-Newton range) between the bacterial cell and the metal surface in aqueous media were quantified. Results show that the bacterial adhesion force to aluminum is the highest among the metals investigated, whereas the one to copper is the lowest. The bacterial adhesion forces to metals are influenced by both the electrostatic force and metal surface hydrophobicity. It is also found that the physiological properties of the bacterium, namely the bacterial surface charges and hydrophobicity, also have influence on the bacteria-metal interaction. The adhesion to the metals by Pseudomonas sp. and D. desulfuricans was greater than by the marine SRB isolate. The cell-cell interactions show that there are strong electrostatic repulsion forces between bacterial cells. Cell probe atomic force microscopy has provided some useful insight into the interactions of bacterial cells with the metal surfaces.     

A Metallic Surface Corrosion Study in Aqueous NaCl Solutions Using Atomic Force Microscopy (AFM)

We report an upper-division undergraduate solid-state materials chemistry experiment involving the pit and crevice corrosion of a copper surface caused by an aqueous NaCl solution simulating a seawater environment. Surface corrosion of the copper can be shown quite dramatically using atomic force microscopy (AFM) within only hours of exposure to the saline solution. The copper surfaces can also be treated with an alkanethiol solution to form a self-assembled monolayer (SAM) on the surface. When exposed to the salt-water solution, the SAM layer is shown by AFM to protect the surface from corrosion. We have also shown that several different AFM analysis methods are needed to adequately quantify the surface features including roughness and power spectral density. This experiment enables students to not only see how AFM can be used to observe changes in surface morphology, but also learn to develop an understanding of the analysis techniques used to quantify AFM data.     

Elaboration of nano-structured grafted polymeric surface

The surface grafting of multi-polymeric materials can be achieved by grafting as components such as polymers poly(N-isopropylacrylamide) and/or surfactant molecules (hexatrimethylammonium bromide, polyoxyethylene sorbitan monolaurate). The chosen grafting techniques, i.e. plasma activation followed by coating, allow a large spectrum of functional groups that can be inserted on the surface controlling the surface properties like adhesion, wettability and biocompatibility. The grafted polypropylene surfaces were characterized by contact angle analyses, XPS and AFM analyses. The influence of He plasma activation, of the coating parameters such as concentrations of the various reactive agents are discussed in terms of hydrophilic character, chemical composition and morphologic surface heterogeneity. The plasma pre-activation was shown inevitable for a permanent polymeric grafting. PNIPAM was grafted alone or with a mixture of the surfactant molecules. Depending on the individual proportion of each component, the grafted surfaces are shown homogeneous or composed of small domains of one component leading to a nano-structuration of the grafted surface.