Kinetic study of low‐temperature imidization of poly(amic acid)s and preparation of colorless,transparent polyimide films

Conventional synthesis of polyimides includes high‐temperature (160–350 °C) imidization of poly(amic acid)s. In the present work, imidization has been carried out at much lower temperatures (40–160 °C). 1,2,4,5,‐cyclohexanetetracarboxylic dianhydride (HPMDA) or pyromellitic dianhydride (PMDA) was polymerized with an aromatic diamine, 4,4′‐diaminodiphenylmethane (DDPM), to give poly(amic acid)s, which were then imidized chemically. Imidization was more than 90% complete even at the very low imidization temperature of 40 °C. It was found that the imidization occurs in two steps: an initial rapid cyclization and a subsequent slower cyclization. The activation energy for the rapid process was determined to be 4.3 kJ/mol, and that of the slower process, 4.8 kJ/mol. As the imidization temperature decreases, the transmittance of the resulting polyimides tends to gradually increase, the cutoff wavelength decreases and the color becomes pale. A partially aliphatic polyimide based on HPMDA and DDPM prepared at 40 °C yielded thin films that were highly transparent and colorless, and had good flexibility, solubility and thermal stability. The polyimide films prepared in this study may be good candidates for flexible, transparent plastic substrates in the display industry. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 1593–1602     

Novel positive‐working and aqueous‐base‐developable photosensitive poly(imide benzoxazole) precursor

A novel positive‐working and aqueous‐base‐developable photosensitive poly(imide benzoxazole) precursor based on a poly(amic acid hydroxyamide) bearing phenolic hydroxyl groups and carboxylic acid groups, a diazonaphthoquinone (DNQ) photosensitive compound, and a solvent was developed. Poly(amic acid hydroxyamide) was prepared through the polymerization of 2,2‐bis(3‐amino‐4‐hydroxyphenyl)hexafluoropropane, trimellitic anhydride chloride, and 4,4′‐oxydibenzoyl chloride. Subsequently, the thermal cyclization of the poly(amic acid hydroxyamide) precursor at 350 °C produced the corresponding poly(imide benzoxazole). The inherent viscosity of the precursor polymer was 0.17 dL/g. The cyclized poly(imide benzoxazole) showed a high glass‐transition temperature of 372 °C and 5% weight loss temperatures of 535 °C in nitrogen and 509 °C in air. The structures of the precursor polymer and the fully cyclized polymer were characterized with Fourier transform infrared and ¹H NMR. The photosensitive polyimide precursor containing 25 wt % DNQ photoactive compound showed a sensitivity of 256 mJ/cm² and a contrast of 1.14 in a 3‐μm film with a 0.6 wt % tetramethylammonium hydroxide developer. A pattern with a resolution of 5 μm was obtained from this composition. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 5990–5998, 2004     

Synthesis and properties of poly(amic acid)s and polyimides based on 2,2′,6,6′‐biphenyltetracarboxylic dianhydride

Poly(amic acid)s (PAAs) having the high solution stability and transmittance at 365 nm for photosensitive polyimides have been developed. PAAs with a twisted conformation in the main chains were prepared from 2,2′,6,6′‐biphenyltetracarboxylic dianhydride (2,2′,6,6′‐BPDA) and aromatic diamines. Imidization of PAAs was achieved by chemical treatment using trifluoroacetic anhydride. Among them, the PAA derived from 2,2′,6,6′‐BPDA and 4,4′‐(1,3‐phenylenedioxy)dianiline was converted to the polyimide by thermal treatment. The heating at 300 °C under nitrogen did not complete thermal imidization of PAAs having glass‐transition temperatures (T_g)s higher than 300 °C to the corresponding PIs. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 6385–6393, 2006     

Synthesis of autophotosensitive hyperbranched polyimides based on 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride and 1,3,5‐tris(4‐aminophenoxy)benzene via end capping of the terminal anhydride groups by ortho‐alkyl aniline

Benzophenone‐containing, anhydride‐terminated hyperbranched poly(amic acid)s were end‐capped by ortho‐alkyl aniline in situ and then chemically imidized, yielding autophotosensitive hyperbranched polyimides. The polyimides were soluble in strong polar solvents, such as N‐methyl‐2‐pyrrolidone, N‐dimethylformamide, dimethylacetamide, and dimethyl sulfoxide. Thermogravimetric analysis revealed their excellent thermal stability, with a 5 wt % thermal loss temperature in the range of 527–548 °C and a10 wt % thermal loss temperature in the range of 562–583 °C. The strong absorption of the polyimide films in ultraviolet–visible spectra at 365 nm indicated that the hyperbranched polyimides were patternable. Highly resolved images with a line width of 6 μm were developed by ultraviolet exposure of the polymer films. A well‐defined image with lines as thin as 3 μm was also patterned, but the lines were rounded at the edges. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2026–2035, 2003     

Synthesis of semiaromatic polyimides from aromatic diamines containing adamantyl units and alicyclic dianhydrides

We prepared new semiaromatic polyimides from alicyclic dianhydrides and aromatic diamines containing adamantyl and biadamantyl units. Polycondensations were performed in 1‐methyl‐2‐pyrrolidinone at room temperature for 7 h and then 80 °C for 23 h, giving poly(amic acid)s with inherent viscosities up to 0.58 dL/g. Poly(amic acid)s were converted to corresponding poly(imide)s by thermal treatment. Poly(imide)s showed relatively high thermal stability (5% weight loss around 450 °C) and low dielectric constants (2.69–2.79). © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 144–150, 2004     

Synthesis and properties of new aromatic polyimides based on 2,5‐bis(4‐amino‐2‐trifluoromethylphenoxy)‐tert‐butylbenzene and various aromatic dianhydrides

A novel, fluorinated diamine monomer, 2,5‐bis(4‐amino‐2‐ trifluoromethylphenoxy)‐tert‐butylbenzene ( II ) was synthesized through the nucleophilic substitution reaction of tert‐butylhydroquinone (t‐BHQ) and 2‐chloro‐5‐nitrobenzotrifluoride in the presence of potassium carbonate to yield the intermediate dinitro compound I , followed by catalytic reduction with hydrazine and Pd/C to afford diamine II . A series of fluorinated polyimides V were prepared from II with various aromatic dianhydrides ( III _a–f ) via the thermal imidization of poly(amic acid). Most of V _a–f could be soluble in amide‐type solvents and even in less polar solvents. These polyimide films showed tensile strengths up to 106 MPa, elongation at break up to 21%, and initial modulus up to 2.1 GPa. The glass‐transition temperature of V was recorded at 245–304 °C, the 10% weight loss temperatures were above 488 °C, and left more than 41% residue even at 800 °C in nitrogen. Low dielectric constants, low moisture absorptions, and higher and light‐colored transmittances were also observed. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 5424–5438, 2004     

Synthesis and properties of new adamantane‐based poly(ether imide)s

A new adamantane‐based bis(ether anhydride), 2,2‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]adamantane dianhydride, was prepared in three steps starting from nitrodisplacement of 4‐nitrophthalonitrile with the potassium phenolate of 2,2‐bis(4‐hydroxyphenyl)adamantane. A series of adamantane‐containing poly(ether imide)s were prepared from the adamantane‐based bis(ether anhydride) and aromatic diamines by a conventional two‐stage synthesis in which the poly(ether amic acid)s obtained in the first stage were heated stage‐by‐stage at 150–270°C to give the poly(ether imide)s. The intermediate poly(ether amic acid)s had inherent viscosities between 0.56 and 1.92 dL/g. Except for those from p‐phenylenediamine, m‐phenylenediamine, and benzidine, all the poly(ether amic acid) films could be thermally converted into transparent, flexible, and tough poly(ether imide) films. All the poly(ether imide)s showed limited solubility in organic solvents, although they were amorphous in nature as evidenced by X‐ray diffractograms. Glass transition temperatures of these poly(ether imide)s were recorded in the range of 242–317°C by differential scanning calorimetry and of 270–322°C by dynamic mechanical analysis. They exhibited high resistance to thermal degrdation, with 10% weight loss temperatures being recorded between 514–538°C in nitrogen and 511–527°C in air. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 1619–1628, 1999     

Novel organosoluble and colorless poly(ether imide)s based on 3,3‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]phthalide dianhydride and aromatic bis(ether amine)s bearing pendent trifluoromethyl groups

A novel series of colorless and highly organosoluble poly(ether imide)s were prepared from 3,3‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]phthalide dianhydride with various fluorinated aromatic bis(ether amine)s via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s followed by cyclodehydration to produce the polymer films. The poly(ether imide)s showed excellent solubility, with most of them dissoluble at a concentration of 10 wt % in amide polar solvents, in ether‐type solvents, and even in chlorinated solvents. Their films had a cutoff wavelength between 358 and 373 nm, and the yellowness index ranged from 3.1 to 9.5. The glass‐transition temperatures of the poly(ether imide) series were recorded between 237 and 297 °C, the decomposition temperatures at 10% weight loss were all above 494 °C, and the residue was more than 54% at 800 °C in nitrogen. These films showed high tensile strength and also were characterized by higher solubility, lighter color, and lower dielectric constants and moisture absorption than an analogous nonfluorinated polyimide series. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 3140–3152, 2006     

Polyimides with alicyclic diamines. I. Syntheses and thermal properties

The polyaddition reactions of alicyclic diamines such as 1,4-diaminocyclohexane (1,4-CHDA) or 4,4′-diaminodicyclohexylmethane (DCHM) and configurational isomers of 1,4-CHDA or DCHM with tetracarboxylic aromatic anhydrides in aprotic solvents were carried out to prepare high molecular weight poly(amic acid)s. Through the thermal imidization of poly(amic acid)s, several flexible polyimide films were prepared. Because of the stiffness of the alicyclic moieties in diamines, the resulting polyimides exhibit high glass transition temperatures (220–340°C) almost similar to those for corresponding aromatic polyimides which have phenylene groups in place of cyclohexyl groups, and show good thermal stability. The partial crystallization was observed for polyimides with trans-cyclohexyl moiety during the heating in differential scanning calorimetry and ascertained by wide-angle x-ray diffraction. Thus, the inhibition of the occurrence of charge transfer in polyimides is accomplished by introducing alicyclic diamines in place of aromatic diamines without reducing their thermal stability. © 1993 John Wiley & Sons, Inc.     

Synthesis and characterization of new fluorene‐based poly(ether imide)s

A novel bis(ether anhydride) monomer, 9,9‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]fluorene dianhydride (4), was synthesized from the nitrodisplacement of 4‐nitrophthalonitrile by the bisphenoxide ion of 9,9‐bis(4‐hydroxyphenyl)fluorene (1), followed by alkaline hydrolysis of the intermediate tetranitrile and dehydration of the resulting tetracarboxylic acid. A series of poly(ether imide)s bearing the fluorenylidene group were prepared from the bis(ether anhydride) 4 with various aromatic diamines 5a–i via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s 6a–i followed by thermal cyclodehydration to the polyimides 7a–i. The intermediate poly(amic acid)s had inherent viscosities in the range of 0.39–1.57 dL/g and afforded flexible and tough films by solution‐casting. Except for those derived from p‐phenylenediamine, m‐phenylenediamine, and benzidine, all other poly(amic acid) films could be thermally transformed into flexible and tough polyimide films. The glass transition temperatures (T_g) of these poly(ether imide)s were recorded between 238–306°C with the help of differential scanning calorimetry (DSC), and the softening temperatures (T_s) determined by thermomechanical analysis (TMA) stayed in the range of 231–301°C. Decomposition temperatures for 10% weight loss all occurred above 540°C in an air or a nitrogen atmosphere. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 1403–1412, 1999     

Characterization of a thermally imidized soluble polyimide film

A soluble aromatic poly (amic acid) film was converted to a soluble polyimide by staging at 25°C intervals to 325°C and characterized at each interval by several analytical methods. The behavior observed was consistent with an interpretation that a reduction occurred in molecular weight of the poly (amic acid) during the initial stages of cure before the ultimate molecular weight was achieved as a polyimide. This interpretation was supported by the results of solution viscosity, gel permeation chromatography, low angle laser light scattering photometry, and infrared spectroscopy analyses. The results of this study serve to increase our fundamental understanding of how polyimides are thermally formed from poly (amic acid)s.     

Synthesis and characterization of novel aromatic poly(imide–benzoxazole) copolymers

New poly(imide–benzoxazole) copolymers were prepared directly from a dianhydride, a diacid chloride, and a bis(o‐diaminophenol) monomer in a two‐step method. In the first step, poly(amic acid–hydroxyamide) precursors were synthesized by low‐temperature solution polymerization in an organic solvent. Subsequently, the thermal cyclodehydration of the poly(amic acid–hydroxyamide) precursors at 350 °C produced the corresponding poly(imide–benzoxazole) copolymers. The inherent viscosities of the precursor polymers were around 0.19–0.33 dL/g. The cyclized poly(imide–benzoxazole) copolymers had glass‐transition temperatures in the range of 331–377 °C. The 5% weight loss temperatures ranged from 524 to 535 °C in nitrogen and from 500 to 514 °C in air. The poly(imide–benzoxazole) copolymers were amorphous, as evidenced by the wide‐angle X‐ray diffraction measurements. The structures of the precursor copolymers and the fully cyclized copolymers were characterized by Fourier transform infrared, ¹H NMR, and elemental analysis. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 6020–6027, 2005     

Highly soluble and optically transparent poly (ether imide)s based on 2,6‐ or 2,7‐bis(3,4‐dicarboxyphenoxy)naphthalene dianhydride and aromatic bis(ether amine)s bearing trifluoromethyl groups

Two series of novel fluorinated poly(ether imide)s (coded IIIA and IIIB ) were prepared from 2,6‐bis(3,4‐dicarboxyphenoxy)naphthalene dianhydride and 2,7‐bis(3,4‐dicarboxyphenoxy)naphthalene dianhydride, respectively, with various trifluoromethyl‐substituted aromatic bis(ether amine)s by a standard two‐step process with thermal or chemical imidization of the poly(amic acid) precursors. These fluorinated poly(ether imide)s showed good solubility in many organic solvents and could be solution‐cast into transparent, flexible, and tough films. These films were nearly colorless, with an ultraviolet–visible absorption edge of 364–386 nm. They also showed good thermal stability with glass‐transition temperatures of 221–298 °C, 10% weight loss temperatures in excess of 489 °C, and char yields at 800 °C in nitrogen greater than 50%. The 2,7‐substituted IIIB series also showed better solubility and higher transparency than the isomeric 2,6‐substituted IIIA series. In comparison with nonfluorinated poly (ether imide)s, the fluorinated IIIA and IIIB series showed better solubility, higher transparency, and lower dielectric constants and water absorption. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 5909–5922, 2006     

Synthesis and properties of polyimides derived from 1,6-bis(4-aminophenoxy)naphthalene and aromatic tetracarboxylic dianhydrides

1,6-Bis(4-aminophenoxy)naphthalene ( I ) was used as a monomer with various aromatic tetracarboxylic dianhydrides to synthesize polyimides via a conventional two-stage procedure that included ring-opening polyaddition in a polar solvent such as N,N-dimethylacetamide (DMAc) to give poly(amic acid)s, followed by thermal cyclodehydration to polyimides. The diamine ( I ) was prepared through the nucleophilic displacement of 1,6-dihydroxynaphthal-ene with p-chloronitrobenzene in the presence of K₂CO₃, followed by catalytic reduction. Depending on the dianhydrides used, the poly(amic acid)s obtained had inherent viscosities of 0.73–2.31 dL/g. All the poly(amic acid)s could be solution cast and thermally converted into transparent, flexible, and tough polyimide films. The polyimide films had a tensile modulus range of 1.53–1.84 GPa, a tensile strength range of 95–126 MPa, and an elongation range at break of 9–16%. The polyimide derived from 4,4′-sulfonyldiphthalic anhydride (SDPA) had a better solubility than the other polyimides. These polyimides had glass transition temperatures between 248–286°C (DSC). Thermogravimetric analyses established that these polymers were fairly stable up to 500°C, and the 10% weight loss temperatures were recorded in the range of 549–595°C in nitrogen and 539–590°C in air atmosphere. © 1995 John Wiley & Sons, Inc.     

Synthesis and characterization of soluble polyimides derived from 2′,5′‐bis(3,4‐dicarboxyphenoxy)‐p‐terphenyl dianhydride

A novel bis(ether anhydride) monomer, 2′,5′‐bis(3,4‐dicarboxyphenoxy)‐p‐terphenyl dianhydride, was synthesized from the nitro displacement of 4‐nitrophthalonitrile by the phenoxide ion of 2′,5′‐dihydroxy‐p‐terphenyl, followed by alkaline hydrolysis of the intermediate bis(ether dinitrile) and cyclodehydration of the resulting bis(ether diacid). A series of new poly(ether imide)s bearing laterally attached p‐terphenyl groups were prepared from the bis(ether anhydride) with various aromatic diamines via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s followed by thermal or chemical imidization to the poly(ether imide)s. The inherent viscosities of the poly(amic acid) precursors were in the range of 0.62–1.26 dL/g. Most of the poly(ether imide)s obtained from both routes were soluble in polar organic solvents, such as N,N‐dimethylacetamide. All the poly(ether imide)s could afford transparent, flexible, and strong films with high tensile strengths. The glass‐transition temperatures of these poly(ether imide)s were recorded as between 214 and 276 °C by DSC. The softening temperatures of all the poly(ether imide) films stayed in the 207–265 °C range according to thermomechanical analysis. For all the polymers significant decomposition did not occur below 500 °C in nitrogen or air atmosphere. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 1008–1017, 2004     

The synthesis and characterization of polyimide homopolymers based on 5(6)‐amino‐1‐(4‐aminophenyl)‐1,3,3‐trimethylindane

The isomeric diamine monomer 5(6)‐amino‐1‐(4‐aminophenyl)‐1,3,3‐trimethylindane (DAPI) was successfully synthesized via the dimerization of α‐methylstyrene followed by nitration and reduction. High molecular weight, soluble polyimides were synthesized via ester–acid solution imidization techniques and had glass‐transition temperature values ranging from 247 to 369 °C. The polymers were soluble in common organic solvents because of the asymmetric and nonplanar nature of DAPI and displayed good short‐term thermal stability by thermogravimetric analysis, as shown by their 5% weight‐loss values above 500 °C in air. The DAPI/(3,4‐dicarboxyphenyl) hexafluoropropane dianhydride (6FDA) polyimide also showed 2‐h thermal stability at 400 °C under nitrogen, despite the partial aliphatic character. Refractive index values as low as 1.571 were observed for DAPI/6FDA, which allows an estimated dielectric constant of 2.47 to be derived. The permeation of O₂ and N₂ was conducted on thin dense films. The bulky, bent, and isomeric nature of DAPI imparted film‐forming membranes that permitted high O₂ permeability. In combination with 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA), DAPI had a good combination of O₂ permeability and O₂/N₂ selectivity values of 2.8 Ba and 7.3, respectively. The polymerization method utilized to facilitate the cyclization of DAPI/BTDA to the polyimide affected the final thermal properties of the resulting polymer. The chemical imidization of DAPI/BTDA generated a polyimide with a glass‐transition temperature value of 311 °C and a 5% weight‐loss value in air of 457 °C. However, thermal and ester–acid imidization routes yielded an increase in the thermal properties. The ester–acid solution imidization of DAPI/BTDA produced a polymer glass‐transition temperature value of 333 °C and a 5% weight‐loss value of 525 °C in air. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2840–2854, 2000     

Structure and properties of polyimide films during a far‐infrared‐induced imidization process

The conversion of poly(amic acid) into polyimide (PI) was achieved with far‐infrared radiation (FIR) and conventional thermal treatments. The structure and properties of PI films during different stages of imidization were studied with Fourier transform infrared spectroscopy, weight‐loss analysis during imidization, tensile property measurements, and dynamic mechanical thermal analysis. The effects of the imidization degree, postimidization, and solvent on the thermal and mechanical properties of PI films were quantitatively investigated. The corresponding structural changes were also examined. The experimental results showed that the imidization process proceeded more quickly and more completely in an FIR oven than in a conventional oven. A prolonged FIR treatment at a lower temperature (25–100 °C) accelerated the imidization process. The tensile stress–strain curves had a fanlike distribution with the development of the FIR imidization process and a fishtail distribution with conventional thermal imidization. During FIR imidization, the best tensile properties were obtained at 340 °C, and thermooxidative degradation occurred at about 420 °C. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 2490–2501, 2004     

Amine–quinone polyimide: A new high‐temperature polymer and its use to protect iron against corrosion

A new diamine monomer was synthesized by the Michael addition of 4,4′‐methylene dianiline with 1,4‐benzoquinone. The monomer was condensed with 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride to give a polyamic acid that was soluble in NMP. The polyamic acid was cast onto iron and thermally imidized to yield the amine–quinone polyimide (AQPI‐2). AQPI‐2 had a thermal decomposition temperature of 540 °C (10% TGA weight loss in N₂) and a glass transition at 292 °C, values typical of polyimides. The degradation of the coating on iron after exposure to 0.1 M NaCl electrolyte was followed by electrochemical impedance spectroscopy. Under these conditions a conventional polyimide failed after 3 days exposure, while AQPI‐2 survived more than 24 days exposure. The adhesive bond between the amine–quinone polyimide and the iron surface was so strong that it could not be broken by the electrolyte. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2893–2899, 2000     

Poly(ether‐imide) and related sepiolite nanocomposites: investigation of physical,thermal, and mechanical properties

Novel poly(ether‐imide) and sepiolite nanocomposites were synthesized based on a unique diamine monomer with the aim of improving physical and mechanical properties of final polyimide films. The diamine was polycondensed with 4,4′‐(hexafluoroisopropylidene) diphthalic anhydride to produce related poly(ether amic acid) prepolymer. Pure poly(ether‐imide) and nanocomposite films were prepared via thermal imidization process of poly(ether amic acid). Coexistence of ether, pyridine, and phenylene functional groups in the diamine chemical structure resulted in flexible polyimide films with significant thermal, physical, and mechanical properties. Thermal stability, glass‐transition temperature, dimensional stability, and tensile properties of polymer and nanocomposites were studied and compared. Morphology of nanocomposites was also investigated using scanning and transmission electron microscopic methods to study the distribution and dispersion behavior of sepiolite nanofibers in the polyimide matrix. By introduction of sepiolite nanoparticles, overall improvement of properties was observed in respect to pure polyimides. Copyright © 2015 John Wiley & Sons, Ltd.     

Synthesis and properties of new hydroxyl‐pendant aromatic polyimides derived from trimethylsilylated 4,4′‐diamino‐3,3′‐dihydroxybiphenyl and aromatic tetracarboxylic dianhydrides

New phenolic hydroxyl‐pendant aromatic polyimides were synthesized with the N‐silylated diamine method in two steps: the ring‐opening polyaddition of tetrakis(trimethylsilyl)‐substituted 4,4′‐diamino‐3,3′‐dihydroxybiphenyl to various aromatic tetracarboxylic dianhydrides, giving trimethylsiloxy‐pendant poly(amic acid) trimethylsilyl esters, and thermal imidization. The hydroxyl‐bearing polyimides were amorphous but insoluble in organic solvents. They had glass‐transition temperatures greater than 370 °C and temperatures of 10% weight loss greater than 415 °C in nitrogen. The hydroxyl‐pendant polypyromellitimide film had a high tensile strength and a high modulus of 310 MPa and 10 GPa, respectively. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 1790–1795, 2002