微波法制备高活性H1-xSr2Nb3-xMoxO10 (x = 0, 0.05, 0.1, 0.15 and 0.2) 光催化剂

通过微波辅助法制备出高活性H1-xSr2Nb3-xMoxO10光催化材料,制备过程和时间均被大大缩短。采用X射线粉末衍射（XRD）、扫描电镜（SEM）、紫外-可见吸收吸收光谱（UV-Vis DRS）等表征其材料性能。考察了催化材料在40W汞灯辐照下催化降解甲基橙的催化性能。实验结果表明,MoO3的掺入量为15%（摩尔分数）时,材料的光催化性能最优。     

Enhanced thermal stability of a sputtered titanium-nitride film as a diffusion barrier for capacitor-bottom electrodes

The effect of a thin RuO_x layer formed on the Ru/TiN/doped poly-Si/Si stack structure was compared with that on the RuO_x/TiN/doped poly-Si/Si stack structure over the post-deposition annealing temperature ranges of 450–600°C. The Ru/TiN/poly-Si/Si contact system exhibited linear behavior at forward bias with a small increase in the total resistance up to 600°C. The RuO_x/TiN/poly-Si/Si contact system exhibited nonlinear characteristics under forward bias at 450°C, which is attributed to no formation of a thin RuO_x layer at the RuO_x surface and porous-amorphous microstructure. In the former case, the addition of oxygen at the surface layer of the Ru film by pre-annealing leads to the formation of a thin RuO_x layer and chemically strong Ru-O bonds. This results from the retardation of oxygen diffusion caused by the discontinuity of diffusion paths. In particular, the RuO_x layer in a nonstoichiometric state is changed to the RuO₂-crystalline phase in a stoichiometric state after post-deposition annealing; this phase can act as an oxygen-capture layer. Therefore, it appears that the electrical properties of the Ru/TiN/poly-Si/Si contact system are better than those of the RuO_x/TiN/poly-Si/Si contact system.     

溅射压力对制备a-GaAs1-xNx 薄膜光学常数的影响

采用反应磁控溅射法在室温条件下制备了a-GaAs_1-xN_x 薄膜。实验测定了薄膜厚度、氮含量、载流子浓度和光学透过率及并研究了其随溅射压的变化。系统研究了溅射压对所制备薄膜的光学带隙、折射率和色散参数的影响。所制备的薄膜为直接带隙材料,利用Cauchy和Wemple模型能够很好地拟合所制备薄膜的折射率色散曲线。     

利用拉曼谱鉴别锗硅合金微结构变化

随着硅浓度的增大,计算的拉曼谱结果表明,Ge-Si模式和Si-Si模式向高波数移动,而Ge-Ge模式向低波数移动,这种拉曼谱的变化强烈的依赖于合金微结构的变化。它的模式频率的线性变化依赖于Ge/Si的力学常熟的变化。这种现象可以用来鉴别合金中Si含量的浓度。可以通过拉曼散射表征这种复杂的微结构变化。     

Sn掺杂对(In0.95-xSnxFe0.05)2O3薄膜的结构、电学及磁特性的影响

我们利用脉冲激光沉积的方法制备了一系列(In0.95-xSnxFe0.05)2O3 (x=0~0.09)薄膜,并在其中发现了室温铁磁性。X射线衍射结果表明锡与铁离子已掺入氧化铟晶格。随着锡的掺入,样品内的载流子浓度得到了很大的提高,但相应的铁磁性却几乎没有变化。我们认为氧空位相关的束缚磁极化子模型能够跟好的解释我们的铁掺杂氧化铟薄膜中的铁磁耦合的机制,而载流子传导的RKKY相互作用则不适用于这一系统。     

改进碲镉汞液相外延方法原位生长正组分梯度薄膜材料

研究了液相外延生长条件对碲镉汞薄膜材料组分梯度的影响,建立了指导液相外延生长的理论模型。通过改变水平推舟液相外延工艺的汞损失速率,生长出具有正组分梯度的碲镉汞薄膜材料。针对这种特定条件下生长的碲镉汞外延薄膜,通过腐蚀减薄光谱测试与二次离子质谱测试证实了材料具有正组分梯度结构。与传统方法生长的具有负组分梯度的碲镉汞薄膜相比,这种薄膜材料具有相近的表面形貌与红外透射光谱曲线;且具有较高的晶体质量,其X射线衍射双晶摇摆曲线半峰宽达到28.8 arcsec。     

Reducing Cu diffusion in SiCOH low-k films by O2 plasma treatment

This work investigates the Cu diffusion in SiCOH low dielectric constant films treated by O₂ plasma. By capacitance–voltage and current-voltage measurement, and thermal stress analysis, it is found that the O₂ plasma surface treatment of SiCOH films can lead to the decrease of flatband voltage shift ΔV_FB, the increase of activation energy E_a, and the decrease of leakage current. The small ΔV_FB and lower leakage current indicate the weak Cu diffusion. The increase of active energy means the reducing of fast Cu ions surface diffusion through the interconnected pores structure of the film. Hence, the Cu diffusion in SiCOH films can be reduced by O₂ plasma treatment. By FTIR and AFM analysis on the bonding configuration and microstructure, the reduce of Cu diffusion is related to the increase of Si-O cages and networks, which makes more open pores sealed at the surface of SiCOH films.     

Hybrid functional calculations on the band gap bowing parameters of InxGa1-xN

The electronic band structures and band gap bowing parameters of In_xGa_1-xN are studied by the firstprinciples method based on the density functional theory. Calculations by employing both the Heyd-ScuseriaErnzerh of hybrid functional（HSE06） and the Perdew-Burke-Ernzerhof（PBE） one are performed. We found that the theoretical band gap bowing parameter is dependent significantly on the calculation method, especially on the exchange-correlation functional employed in the DFT calculations. The band gap of In_xGa_1-xN alloy decreases considerably when the In constituent x increases. It is the interactions of s–s and p–p orbitals between anions and cations that play significant roles in formatting the band gaps bowing. In general, the HSE06 hybrid functional could provide a good alternative to the PBE functional in calculating the band gap bowing parameters.     

In掺杂CdMnTe晶体的Te气氛退火研究

Thermal annealing in Te vapor atmosphere was adopted to improve the properties of indium-doped Cd_1-xMn_xTe（x=0.2,CdMnTe） wafers grown by the vertical Bridgman method.The wafers before and after annealing were characterized by measuring the Te inclusions,etch pit density（EPD）,Mn composition,resistivity, and impurity.IR transmission microscopy and EPD measurements revealed that the densities of Te inclusions reduced from（5-9）×10⁴ cm^-3 to（2-4）×10⁴ cm^-3 and EPD from 10⁵ cm^-2 to 10⁴ cm^-2 after annealing. NIR transmission spectroscopy showed that the Mn composition increased by 0.002-0.005 mole fractions during the annealing.The resistivity of the wafers improved from（2.0-4.5）×10⁸Ω·cm to（1.7-3.8）×10⁹Ω·cm,which suggested that the deep-level donor of Te antisites was successfully introduced after annealing.Inductively coupled plasma-mass spectrometry（ICP-MS） revealed that the concentrations of impurities in the wafer decreased,which indicated the purifying effects of Te vapor annealing on the wafers.All the results demonstrate that the Te vapor annealing of the indium-doped CdMnTe crystal has positive effects on the crystallinity,resistivity and purity of CdMnTe wafers.     

Large signal and noise properties of heterojunction AlxGa1-xAs/GaAs DDRIMPATTs

Simulation studies are carried out on the large signal and noise properties of heterojunction (HT) Al_xGa_1-xAs/GaAs double drift region (DDR) IMPATT devices at V-band (60 GHz). The dependence of Al mole fraction on the aforementioned properties of the device has been investigated. A full simulation software package has been indigenously developed for this purpose. The large signal simulation is based on a non-sinusoidal voltage excitation model. Three mole fractions of Al and two complementary HT DDR structures for each mole fraction i.e., six DDR structures are considered in this study. The purpose is to discover the most suitable structure and corresponding mole fraction at which high power, high efficiency and low noise are obtained from the device. The noise spectral density and noise measure of all six HT DDR structures are obtained from a noise model and simulation method. Similar studies are carried out on homojunction (HM) DDR GaAs IMPATTs at 60 GHz to compare their RF properties with those of HT DDR devices. The results show that the HT DDR device based on N-Al_xGa_1-xAs/p-GaAs with 30% mole fraction of Al is the best one so far as large signal power output, DC to RF conversion efficiency and noise level are concerned.     

采用杂化函数方法研究BxGa1-xN合金中的能带弯曲和交叉

采用Perdewe-Burkee–Ernzerhof的广义梯度近似（GGA-PBE）及Heyd-Scuseria-Ernzerhof屏蔽杂化函数方法(HSE06)对比研究了闪锌矿结构BxGa1-xN合金的电子结构性质。HSE06计算方法给出更接近实验结果的基态性质。采用两种计算方法得到的直接带隙的能带弯曲系数b? 都很大且依赖于成分；由两种方法得到的由直接带隙向间接带隙转变的合金成分非常相近。当向GaN中掺入小于55.7%的硼时，可以得到带隙值比GaN大的直接带隙BxGa1-xN 合金。     

Zinc-doped CdS nanoparticles synthesized by microwave-assisted deposition

Cd_1-xZn_xS nanoparticles were grown on pre-cleaned glass substrates using microwave-assisted chemical bath deposition technique. Nanoparticles obtained by this method were smooth, uniform, good adherent, brownish yellow in color where the brightness of the yellow color nature decreases with increasing Zn²⁺ content. The elemental composition analysis confirmed that the nanoparticles comprise of Cd²⁺, Zn²⁺and S^2-. Scanning electron microscope images confirmed the surface uniformity of the Cd_1-xZn_xS nanoparticles devoid of any void, pinhole or cracks and covered the substrate well. The particle size also decreases with increasing Zn ion content. X-ray diffraction (XRD) indicates the hexagonal structure (002) without phase transition. The grain size decreases from 36.45 to 9.60 nm, dislocation density increases from 0.000745 to 0.01085 Line²/m² and lattice parameter decreased from 6.868 to 6.155 nm with increasing Zn²⁺ content. The best transmittance of about 95% was achieved for x=1.0. The nanoparticles showed reduction in the absorbance as Zn ion content increased. Four point probe revealed that the electrical resistivity increased from 1.51×10¹⁰ to 6.67×10¹⁰ Ω ·cm while electrical conductivity decreases from 6.62×10^-11 to 1.49×10^-11 (Ω ·cm)^-1 with increasing Zn²⁺ content. The other electrical properties such as sheet resistance increased from 1.52×10⁸ to 1.58×10⁸Ω, charge carrier mobility decreased from 0.777 to 0.0105 cm²/(V·s) and charge carrier density increased from 1.06×10¹² to 3.95×10¹² cm^-3.     

Amorphous Ta-nanocrystalline RuOx diffusion barrier for lower electrode of high density memory devices

The effects of the amount of RuO₂ added in the Ta film on the electrical properties of a Ta-RuO₂ diffusion barrier were investigated using n⁺⁺-poly-Si substrate at a temperature range of 650–800°C. For the Ta layer prepared without RuO₂ addition, Ta₂O₅ phase formed after annealing at 650°C by reaction between Ta and external oxygen, leading to a higher total resistance and a non-linear I-V curve. Meanwhile, in the case of the Ta film being deposited with RuO₂ incorporation, not only a lower total resistance and ohmic characteristics exhibited, but also the bottom electrode structure was retained up to 800°C, attributing to the formation of a conductive RuO₂ crystalline phase in the barrier film by reaction with the indiffused oxygen because of a Ta amorphous structure formed by chemially strong Ta-O or Ta-Ru-O bonds and a large amount of conductive RuO₂ added. Since a kinetic barrier for nucleation in formation of the crystalline Ta₂O₅ phase from an amorphous Ta(O) phase is much higher than that of crystalline RuO₂ phase from nanocrystalline RuO_x phase, the formation of the RuO₂ phase by reaction between the indiffused oxygen and the RuO_x nanocrystallites is kinetically more favorable than that of Ta₂O₅ phase.     

Impurity-induced disordering of AlxGa1−xAs-GaAs quantum well heterostructures with (Si2)x(GaAs)1−x barriers

Recent work indicates that the alloy (Si₂)_x(GaAs)_1−x can be formed within the GaAs quantum well of an Al_xGa_1−xAs-GaAs quantum well heterostructure (QWH) and results in a shift of laser operation to higher energy. In this paper we show, by SIMS and EDS measurements, that the Si concentration in the (Si₂)_x(GaAs)_1−x layer far exceeds typical “doping” levels. The stability of these QWHs has been investigated with respect to thermal annealing and Zn impurity-induced layer disordering (Zn-IILD). Data are presented showing that the (Si₂)_x(GaAs)_1−x alloy is stable against thermal annealing unless a rich source of Ga vacancies is provided, and that relatively low temperature Zn diffusion greatly enhances the disordering process of the alloy layer.     

Comparative study on the influence of Al component at GaAlAs layer for GaAs/AlGaAs photocathode

We designed two transmission-mode GaAs/AlGaAs photocathodes with different AlxGa_1-xAs layers, one has an Al_xGa_1-xAs layer with the Al component ranging from 0.9 to 0, and the other has a fixed Al component 0.7. Using the first-principle method, we calculated the electronic structure and absorption spectrum of Al_xGa_1-xAs at x=0, 0.25, 0.5, 0.75 and 1, calculation results suggest that with the increase of the Al component, the band gap of Al_xGa_1-xAs increases. Then we activated the two samples, and obtained the spectral response curves and quantum efficiency curves; it is found that sample 1 has a better shortwave response and higher quantum efficiency at short wavelengths. Combined with the band structure diagram of the transmission-mode GaAs/AlGaAs photocathode and the fitted performance parameters, we analyze the phenomenon. It is found that the transmission-mode GaAs/AlGaAs photocathode with variable Al component and various doping structure can form a two-stage built-in electric field, which improves the probability of shortwave response photoelectrons escaping to the vacuum. In conclusion, such a structure reduces the influence of back-interface recombination, improves the shortwave response of the transmission-mode photocathode.     

Electrodepositing ZnxMnyOz alloys from zinc oxide to manganese oxide

Electrodeposition has emerged as a practical and simple method to synthesise semiconductor materials under different forms, thin films or nanostructured layers. This work reports on the cathodic electrodeposition of ZnMnO thin layers using both zinc and manganese chlorides as precursors. The composition of thin films can be varied from binary zinc oxide to manganese oxide varying the Mn/(Mn+Zn) ratio between 0 and 1. The composition of Zn_xMn_yO_z films was obtained by energy dispersive spectroscopy. Zn_1−xMn_xO films with Mn/Zn ratio less than 10% exhibit a crystalline wurtzite structure typical of ZnO fully oriented in the (0 0 2) direction. Higher Mn content leads to deformation of the ZnO lattice and the wurtzite structure is no longer maintained. X-ray photoelectron spectroscopy points out that Mn₃O₄ tends to be deposited when a high Mn/Zn ratio is used in the starting solution. Magnetic measurements on films with Mn/(Zn+Mn) ratio near 1 reveal magnetic characteristics similar to Mn₃O₄ compounds. The transmission spectra of Zn_xMn_yO_z show the typical absorption edge of crystalline ZnO while the wurtzite structure is maintained and it shifts to higher wavelengths when Mn content increases.     

InP-based InxGa1-xAs metamorphic buffers with different mismatch grading rates

Linearly graded In_xGa_1-xAs metamorphic buffers with different mismatch grading rates were grown on InP substrate by gas source molecular beam epitaxy.Room temperature photoluminescence spectra show that the sample with lower mismatch grading rate in the buffer has stronger photoluminescence signal,indicating the improved optical property.Atomic force microscope images show that the lower mismatch grading rate in the buffer leads to a slightly rougher surface.The relaxation procedure with two steps in the buffer layers has been observed by X-ray diffraction reciprocal space mapping.The measurements of X-ray diffraction also reveal that the lower mismatch grading rate in the buffer is beneficial for the lattice relaxation and release of residual strain.To further increase the relaxation degree,a lower mismatch grading rate and composition "overshoot" are suggested.     

Thermoelectric Properties of Na<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>CoO<Subscript>2</Subscript> and Prospects for Other Oxide Thermoelectrics

We discuss the thermoelectric properties of Na _x CoO₂ using the electronic structure, as determined in first principles calculations, and Boltzmann kinetic transport theory. The Fermi energy lies near the top of a manifold of Co t _2g bands. These t _2g bands are separated by a large gap from the higher-lying e _g states. Although the large crystal-field splitting implies substantial Co–O hybridization, the bands are narrow. Application of standard Boltzmann transport theory to such a narrow band structure yields high thermopowers in accord with experimental observations, even for high metallic carrier densities. The high thermopowers observed for Na _x CoO₂ can therefore be explained by standard band theory and do not rely on low dimensionality or correlation effects specific to Co. We also present results for the cubic spinel structure ZnRh₂O₄. Like Na _x CoO₂, this compound has very narrow valence bands. We find that if it could be doped with mobile carriers, it would also have a high thermopower, comparable with that of Na _x CoO₂.     

Effects of annealing conditions on the properties of tantalum oxide films on silicon substrates

The formation of a SiO₂ layer at the Ta₂O₅/Si interface is observed by annealing in dry O₂ or N₂ and the thickness of this layer increases with an increase in annealing temperature. Leakage current of thin (less than 40 nm thick) Ta₂O₅ films decreases as the annealing temperature increases when annealed in dry O₂ or N₂. The dielectric constant vs annealing temperature curve shows a maximum peak at 750 or 800° C resulting from the crystallization of Ta₂O₅. The effect is larger in thicker Ta₂O₅ films. But the dielectric constant decreases when annealed at higher temperature due to the formation and growth of a SiO₂ layer at the interface. The flat band voltage and gate voltage instability as a function of annealing temperature can be explained in terms of the growth of interfacial SiO₂. The electrical properties of Ta₂O₅ as a function of annealing conditions do not depend on the fabrication method of Ta₂O₅ but strongly depend on the thickness of Ta₂O₅ layer.     

Formation of nickel-manganese oxide thermistors studied by XRD,SEM and auger spectroscopy

This paper describes the formation of nickel-manganeses oxide thermistor bodies at 1000–1340° C, employing analytical techniques of XRD, SEM/EPMA and AES. The micro-structural studies revealed that the main phase of nickel manganite coexists with a solid solution of NiO in Mn₃O₄ in the final product. The optimum firing conditions to achieve the necessary electrical properties as well as the development of the desired microstructure could be selected around 1200° C, for 4 hrs in an ambient atmosphere. Above this temperature, the density begins to decrease while the resistivity increases. These anomalous electrical resistivity variations could be partly attributed to the trapped oxygen which was evolved from the decomposition of the unreacted α-Mn₂O₃. At-lower temperatures, unreacted nickel oxide residuals as well as a high porosity of the samples would yield specimens with high resistivity.