Air-gap embedding GaN template for enhanced emission from light-emitting diodes

Selective growth by metal-organic chemical vapor deposition (MOCVD), and electrochemical etching of a heavily Si-doped GaN (n⁺-GaN) interlayer were employed to obtain air-gaps embedded in a u-GaN layer. As confirmed by Raman spectroscopy, the introduction of an n⁺-GaN, which was later etched to obtain air-gaps, also enhanced the strain-compliance of GaN epilayer on sapphire substrate. An enhanced electroluminescence emission was observed from the light-emitting diodes (LEDs) fabricated on the air-gap embedding template. Using theoretical LED simulation, it was discerned that the increase in optical emission from the LED was caused predominantly by the redirection of photons at GaN/air-gap interface. Finite-difference time domain (FDTD) simulation method was employed to understand the mechanism of optical emission enhancement and its spatial variation over the LED surface.     

采用银纳米圆盘阵列提高LED发光特性的研究

为了提高GaN基蓝光LED的发光效率,设计了在LED有源层上方引入银纳米圆盘阵列的模型。利用时域有限差分方法计算了银纳米圆盘阵列不同结构参数情况下LED有源层自发辐射率的变化情况及光提取效率值。通过对有源区的近场分布和LED远场方向性的分析,理论上解释了利用该金属纳米结构生成的表面等离激元对LED性能增强的影响,利用该模型可使得表面等离激元与有源层有效耦合,从而增强有源层的自发辐射率。此外,银纳米粒子组成的阵列结构所生成的栅格矢量可以补偿表面等离激元的波矢量,从而可将局域化表面等离激元转为辐射性表面等离激元,显著提高LED顶端光提取效率。结果表明,当银纳米圆盘颗粒满足直径为120nm,厚度为30nm时,含该结构的GaN基蓝光LED自发辐射率比普通LED增强了3.6倍。在此基础上,当其按照晶格常数为220nm的三角晶格排列时,顶端光提取效率增强为2.5倍。这些结果为实际的高性能GaN基LED的设计与优化提供了一定的参考。     

Large-scale SiO2 photonic crystal for high efficiency GaN LEDs by nanospherical-lens lithography

Wafer-scale SiO2 photonic crystal （PhC） patterns （SiO2 air-hole PhC, SiO2-pillar PhC） on indium tin oxide （ITO） layer of GaN-based light-emitting diode （LED） are fabricated via novel nanospherical-lens lithography. Nanoscale polystyrene spheres are self-assembled into a hexagonal closed-packed monolayer array acting as convex lens for expo- sure using conventional lithography instrument. The light output power is enhanced by as great as 40.5% and 61% over those of as-grown LEDs, for SiO2-hole PhC and SiO2-pillar PhC LEDs, respectively. No degradation to LED electrical properties is found due to the fact that SiO2 PhC structures are fabricated on ITO current spreading electrode. For SiO2- pillar PhC LEDs, which have the largest light output power in all LEDs, no dry etching, which would introduce etching damage, was involved. Our method is demonstrated to be a simple, low cost, and high-yield technique for fabricating the PhC LEDs. Furthermore, the finite difference time domain simulation is also performed to further reveal the emission characteristics of LEDs with PhC structures.     

Effect of low-energy electron irradiation on the cathodoluminescence of multiple quantum well (MQW) InGaN/GaN structures

The effect of low-energy electron-beam (e-beam) irradiation on the InGaN-related cathodoluminescence in multiple quantum well (MQW) InGaN/GaN light-emitting diode (LED) structures has been studied. It is shown that the e-beam exposure leads to an increase of emission intensity and to a formation of new blue-shifted emission bands. The changes observed were explained by the enhancement of In diffusion stimulated by excess carrier recombination.     

Comparison of nitride-based dual-wavelength light- emitting diodes with an InAlN electron-blocking layer and with p-type doped barriers

The advantages of nitride-based dual-wavelength light-emitting diodes (LEDs) with an InAlN electron blocking layer (EBL) are studied. The emission spectra,carrier concentration in the quantum wells (QWs),energy band and internal quantum efficiency (IQE) are investigated. The simulation results indicate that an LED with an InAlN EBL performs better over a conventional LED with an AlGaN EBL and an LED with p-type-doped QW barriers. All of the advantages are due to the enhancement of carrier confinement and the lower electron leakage current. The simulation results also show that the efficiency droop is markedly improved and the luminous intensity is greatly enhanced when an InAlN EBL is used.     

GaN-based light-emitting diodes directly grown on sapphire substrate with holographically generated two-dimensional photonic crystal patterns

As an approach to enhance light extraction from GaN-based light-emitting diodes (LEDs), we inserted a submicron period photonic crystal (PC) pattern at the interface between GaN epilayer and sapphire substrate. A two-dimensional square-lattice pillar array of 600-nm period was produced directly onto the sapphire substrate by a combination of laser holography and inductively-coupled-plasma etching. A standard GaN LED heterostructure was grown on top of the nano-patterned substrate, which was then processed to conventional bottom-emitting LED chips. At the drive current of 20 mA, the PC-LED produced surface-normal output power about 40% higher than that of the reference LED (with no PC integrated). Temperature-dependent photoluminescence measurement indicated that the emission enhancement was solely a structural effect by the integrated PC pattern.     

A white-lighting LED system with a highly efficient thin luminous film

In this work, a highly effective white light-emitting diode (LED) system is realized by a combination of an LED and a photonic crystal (PC-) structured luminous film. The emission intensity of the PC-structured luminous film emission is enhanced by a factor of ca. 10.6 compared with that of the planar film. The light from the system can give rise to an intense white emission with CIE coordinates (0.33, 0.38). The total emission intensity is over twice greater than that of the usual LED system. Additionally, the emission of the PC-structured films can be switched flexibly. The strategy proposes an efficient and facile method for high excitation and extraction of the luminous film, and it shows great potential for a bright white lighting with excellent colour matching.     

Enhanced output power for InGaAlP LEDs by contact-transferred and mask-embedded lithography

The authors applied a simple, low-cost, mass-producible contact-transferred and mask-embedded lithography (CMEL) to texture p-GaP window layer for the fabrication of InGaAlP light-emitting diodes (LEDs) emitting at 612 nm. Under 20 mA current injection, it was found that forward voltages were 2.25, 2.24 and 2.25 V for CMEL-400 nm LED, CMEL-2 μm LED and the conventional LED without CMEL, respectively. It was also found that the 20 mA output powers were 1.43, 1.28 and 1.16 mW for CMEL-400 nm LED, CMEL-2 μm LED and the conventional LED without CMEL, respectively.     

纳米柱高度对GaN基绿光LED光致发光谱的影响

纳米柱结构是释放高In组分InGaN/GaN绿光LED量子阱层应变的有效方法。本文采用自组装的聚苯乙烯微球掩模、感应耦合等离子体干法刻蚀和KOH溶液的湿法腐蚀,在GaN基绿光LED外延片上制备了3种高度的纳米柱结构,通过扫描电子显微镜观察纳米柱结构的形貌,并测试了常温和10 K低温时的光致发光谱(PL)。结果表明:应变释放对压电场的影响显著,使得纳米柱结构样品的内量子效率(IQE)提高,PL谱峰值波长蓝移;应变在量子阱中的不均匀分布还使得PL谱半高全宽(FWHM)展宽。与普通平面结构相比,高度为747 nm的纳米柱结构可使得IQE提升917%,PL谱峰值波长蓝移18 nm、FWHM展宽7 nm。另外,纳米柱结构样品的有源区有效面积减小可使得PL谱FWHM减小。     

纳米集成光路中的光源、光波导和光增强

使用近场光学显微术(scanning near-field optical microscopy, SNOM)研究了ZnO亚微米线端面出射性质，不同空间形貌Ⅱ-Ⅵ族半导体荧光器件光波导特性，二维光子晶体、准晶光子晶体对LED的出射增强作用以及表面等离激元(surface plasmon polariton, SPP)与半导体纳米荧光器件的相互作用，对纳米集成光路中的光源、光波导、光增强三个重要问题做了实验和理论上的分析.研究发现半导体微纳米线端面出射光束的质量与样品的直径有密切关系.通过合理地设计其直径和     

纳米集成光路中的光源、光波导和光增强

使用近场光学显微术(scanning near-field optical microscopy, SNOM)研究了ZnO亚微米线端面出射性质,不同空间形貌Ⅱ-Ⅵ族半导体荧光器件光波导特性,二维光子晶体、准晶光子晶体对LED的出射增强作用以及表面等离激元(surface plasmon polariton, SPP)与半导体纳米荧光器件的相互作用,对纳米集成光路中的光源、光波导、光增强三个重要问题做了实验和理论上的分析.研究发现半导体微纳米线端面出射光束的质量与样品的直径有密切关系.通过合理地设计其直径和 关键词： 纳米集成光路 扫描近场光学显微术 光波导 光增强     

纳米压印技术制备表面光子晶体LED的研究

利用表面光子晶体能大幅提高发光二极管(LED)的外量子效率, 但如何制备大面积的纳米光子晶体是该研究方向的主要难点之一. 本文基于纳米压印技术在氮化镓基发光二极管(GaN-LED)表面制作孔状二维光子晶体. 通过以金属和聚合物双层掩膜干法刻蚀法, 得到了很好的光子晶体图形转移效果. 最终在LED的p-GaN层表面获得了大面积光子晶体, 周期为450 nm, 纳米孔直径为240 nm. 器件测试结果显示, 有表面光子晶体的LED比没有光子晶体的LED, 光致发光强度峰值提高到了7.2倍.     

Improved light extraction of GaN-based light-emitting diodes with surface-patterned ITO

The surface patterning of the indium tin oxide (ITO) transparent current layer has been investigated to improve the light extraction efficiency of GaN-based light-emitting diodes (LEDs). LEDs with periodic micro-hexagon patterned ITO have been fabricated utilizing standard lithography techniques and inductively coupled plasma (ICP) technology. The luminance intensity of the LED chips with patterned ITO following 160 s ICP etching was enhanced by about 50% compared to the LED chips with unpatterned ITO. Detailed processing parameters are provided. scanning electron microscopy (SEM) and atomic force microscopy (AFM) are used to examine the micro-structures. The results indicate that the surface-patterned ITO technique could have potential applications in high-power GaN-based LEDs.     

2D planar field emission devices based on individual ZnO nanowires

2D planar field emission devices based on individual ZnO nanowires were achieved on Si/SiO₂ substrate via a standard e-beam lithography method. The anode, cathode and ZnO nanowires were on the same substrate; so the electron field emission is changed to 2D. Using e-beam lithography, the emitter (cathode) to anode distance could be precisely controlled. Real time, in situ observation of the planar field emission was realized in a scanning electron microscope. For individual ZnO nanowires, an onset voltage of 200 V was obtained at 1 nA. This innovative approach provides a viable and practical methodology to directly implement into the integrated field emission electrical devices for achieving “on-chip” fabrication.     

Heterojunction light emitting diodes fabricated with different n-layer oxide structures on p-GaN layers by magnetron sputtering

We grew heterojunction light emitting diode (LED) structures with various n-type semiconducting layers by magnetron sputtering on p-type GaN at high temperature. Because the undoped ZnO used as an active layer was grown under oxygen rich atmosphere, all LED devices showed the EL characteristics corresponding to orange-red wavelength due to high density of oxygen interstitial, which was coincident with the deep level photoluminescence emission of undoped ZnO. The use of the Ga doped layers as a top layer provided the sufficient electron carriers to active region and resulted in the intense EL emission. The LED sample with small quantity of Mg incorporated in MgZnO as an n-type top layer showed more intense emission than the LED with ZnO, in spite of the deteriorated electrical and structural properties of the MgZnO film. This might be due to the improvement of output extraction efficiency induced by rough surface.     

白光LED用硅酸盐基质发光粉的制备及其封装特性

在还原气氛下采用高温固相法合成了Eu²⁺激活的硅酸盐基质白光LED用发光粉,运用扫描电子显微镜和荧光分光光度计分别对发光粉的形貌和激发、发射光谱进行了表征,并对其与YAG发光粉的封装特性进行了对比研究。结果表明,合成的硅酸盐基质白光LED用发光粉其激发光谱覆盖范围宽。采用不同波段的LED芯片进行封装时,和YAG发光粉相比,其色坐标、显色指数和流明效率波动不大,尤其是流明效率波动仅在8%左右,而且其老化性能也和YAG发光粉差别不大。对其和YAG LED的相对发射光谱研究表明,硅酸盐更适合暖白光LED的封装,硅酸盐发光粉粒径与封装流明效率规律变化的研究结果表明,较大粒径的硅酸盐发光粉有可能在大功率LED上有潜在的应用前景。     

Quasi-homoepitaxial GaN-based blue light emitting diode on thick GaN template

The high power GaN-based blue light emitting diode (LED) on an 80-μ-thick GaN template is proposed and even realized by several technical methods like metal organic chemical vapor deposition (MOCVD), hydride vapor-phase epitaxial (HVPE), and laser lift-off (LLO). Its advantages are demonstrated from material quality and chip processing. It is investigated by high resolution X-ray diffraction (XRD), high resolution transmission electron microscope (HRTEM), Rutherford back-scattering (RBS), photoluminescence, current-voltage and light output-current measurements. The width of (0002) reflection in XRD rocking curve, which reaches 173" for the thick GaN template LED, is less than that for the conventional one, which reaches 258". The HRTEM images show that the multiple quantum wells (MQWs) in 80-μm-thick GaN template LED have a generally higher crystal quality. The light output at 350 mA from the thick GaN template LED is doubled compared to traditional LEDs and the forward bias is also substantially reduced. The high performance of 80-μm-thick GaN template LED depends on the high crystal quality. However, although the intensity of MQWs emission in PL spectra is doubled, both the wavelength and the width of the emission from thick GaN template LED are increased. This is due to the strain relaxation on the surface of 80-μm-thick GaN template, which changes the strain in InGaN QWs and leads to InGaN phase separation.     

条形叉指n阱和p衬底结的硅LED设计及分析

采用0.35μm双栅标准CMOS工艺最新设计和制备了叉指型SiLED发光器件。器件结构采用n阱和p衬底结,n阱为叉指结构,嵌入到p衬底中而结合成Sipn结LED。观察了SiLED发光显微图形及实际器件的版图,并在对器件进行了正、反向I-V特性测试、光功率及光谱特性的测量。SiLED的正向偏置时开启电压为0.9V,反向偏置时在15V左右可观察到发光。器件在室温下反向偏置时,10V,100mA电流下所得输出光功率为12.6nW,发光峰值在758nm处。     

全息技术制作二维光子晶体蓝宝石衬底提高发光二极管外量子效率

为了提高GaN基发光二极管(LED)的外量子效率,在蓝宝石衬底制作了二维光子晶体.衬底上的二维光子晶体结构采用激光全息技术和感应耦合等离子体(ICP)干法刻蚀技术制作,然后采用金属氧化物化学气相沉积(MOCVD)技术在图形蓝宝石衬底(PSS)上生长2μm厚的n型GaN层,4层量子阱和200nm厚的p型GaN层,形成LED结构.衬底上制作的二维光子晶体为六角晶格结构,晶格常数为3.8μm,刻蚀深度为800nm.LED器件光强输出测试结果显示,在PSS上制作的LED(PSS-LED)的发光强度普遍高于蓝宝石平 关键词： 全息 发光二极管 图形蓝宝石衬底 外量子效率     

白光LED衰减的光谱分析

为了研究白光LED衰减的机理,通过试验跟踪并分析了采用YAG荧光粉、荧光粉晶片、RGB三合一方式封装的PLCC-4型白光LED,以及采用YAG荧光粉封装的大功率白光LED的发射光谱老化衰减曲线。试验在相同的环境下,对上述四种类型的白光LED进行了通电老化,同一类型白光LED老化电流及时间相同,老化完成后测试其光谱分布。通过分析光谱分布曲线的变化来研究白光中各色光的衰减情况,通过对比各色光的衰减情况来推断白光LED的衰减原因。分析表明白光LED的衰减主要是由蓝光LED的衰减及荧光粉的猝灭引起:采用YAG荧光粉、采用荧光粉晶片及RGBLED封装的白光LED衰减特性基本相同,白光的衰减主要是由蓝光的衰减引起;大功率白光LED与PLCC-4型白光LED衰减特性稍有不同,白光的衰减除了因蓝光的衰减外,还有荧光粉的衰减所引起的白光衰减,而蓝光的衰减所占比例至少不低于80%。通过上述分析可以进一步推断:在散热条件足够理想的情况下,白光LED的衰减主要由蓝光的衰减引起,而随着系统温度的提升,荧光粉的衰减将加剧白光LED的衰减。所得结果将为白光LED的应用及进一步对白光LED衰减原因的研究提供了参考。