Evaluation of the substrate effect on indentation behavior of film/substrate system

A method to evaluate the substrate effect quantitatively in film indentation is proposed. For the thin film deposited on the substrate, the power function relationship is used to describe the loading curve of the film indentation behavior. The loading curve exponent of the power function which is the fitting parameter can reflect the substrate effect quantitatively. The finite element method is used to simulate the nanoindentation process of the film/substrate system. The loading curve exponent can be obtained from the simulation results. A substrate effect factor based on the loading curve exponent is defined to characterize the effect of the substrate on film indentation. Meanwhile, the dimensionless function of the loading curve exponent related with the material properties and indentation depth is obtained. The results can be helpful to the measurement of the mechanical properties of thin films by means of nanoindentation.     

Analysis of the substrate effects of strain-hardening thin films on silicon under nanoindentation

Mechanical properties of thin films on substrates can be evaluated directly through nanoindentation. For a comprehensive study, thin films should be characterized via Young’s modulus, yield stress and strain-hardening exponent at constant temperature. In this paper, we evaluate these effects of thin films on silicon substrate through finite element analysis. Thin films, from soft to hard relative to the silicon substrate, are investigated in three categories: soft films on hard substrates, soft to hard films on no elastic mismatch substrates, and hard films on soft substrates. In addition to examining the load-displacement curve, the normalized hardness versus normalized indentation depth is checked as well to characterize its substrate effect. We found that the intrinsic film hardness can be acquired with indentation depths of less than 12% and 20% of their film thickness for soft films on hard substrates and for soft to hard films on no elastic mismatch substrates, respectively. Nevertheless, nanoindentation of hard films on soft substrates cannot determine the intrinsic film hardness due to the fact that a soft substrate cannot support a hard film. By examining the von Mises stresses, we discovered a significant bending phenomenon in the hard film on the soft substrate. PACS 61.43.Bn; 62.20.-x; 68.03.Hj; 68.05.Cf; 68.08.De     

Molecular dynamic simulations of nanoindentation in aluminum thin film on silicon substrate

In the present work, the nanoindentation of aluminum thin film on silicon substrate is investigated by three-dimensional molecular dynamic (MD) simulation. The film/substrate system is modeled by taking Lennard-Jones (LJ) potential to describe the interaction at the film-substrate interface. Different loading rate from 50 to 250 m/s is carried out in the simulation. The results showed that the hardness of the film increased with the loading rate. In order to study the effect of substrate on the mechanical properties of thin film, nanoindentation process on monolithic Al material is also simulated. The simulation results revealed that indentation pile-up in the aluminum film is significantly enhanced by the substrate. The substrate also affects the loading force during the nanoindentation. At the beginning of the indentation, the loading force is not affected by the substrate. Then, it is getting smaller caused by the interface. As the film is penetrated, the loading force increased rapidly caused by the hard substrate. These results were coincident with the previous reported experiments.     

Picosecond time scale imaging of mechanical contacts

By means of an ultrafast opto-acoustic technique we study the nanoindentation of thin chromium films on sapphire substrates using a ceramic ball bearing. Acoustic pulses at ∼40 GHz returning from the film-indenter interface allow the film indentation profiles to be probed to sub-nanometer resolution over contact areas ∼25 μm in radius. The deformation of the films during loading is thereby revealed. Furthermore, thermal wave imaging of the contact at megahertz frequencies is simultaneously achieved.     

Mechanical and tribological properties of Ni/Al multilayers—A molecular dynamics study

Mechanical and tribological properties of multilayers with nanometer thickness are strongly affected by interfaces formed due to mismatch of lattice parameters. In this study, molecular dynamics (MD) simulations of nanoindentation and following nanoscratching processes are performed to investigate the mechanical and tribological properties of Ni/Al multilayers with semi-coherent interface. The results show that the indentation hardness of Ni/Al multilayers is larger than pure Ni thin film, and the significant strength of Ni/Al multilayers is caused by the semi-coherent interface which acts as a barrier to glide of dislocations during nanoindentation process. The confinement of plastic deformation by the interface during nanoscratching on Ni/Al multilayers leads to smaller friction coefficient than pure Ni thin film. Dislocation evolution, interaction between gliding dislocations and interface, variations of indentation hardness and friction coefficient are studied.     

Theoretical study on nanoindentation hardness measurement of a particle embedded in a matrix

The finite element method was used to simulate indentation tests on a particle embedded in a matrix, to investigate the influence of the properties of the particle and the matrix, and the indentation depth on the measured hardness. The particle’s work-hardening exponent and the mismatch in particle and matrix yield strength have a significant influence on the measured hardness. A particle-dominated indentation depth was identified, within which the measured nanoindentation hardness agrees very well with the true hardness of the particle material. Numerical results from the simulations of a wide range of material properties determined that the measured hardness is within 5% difference of the particle’s true hardness when the indentation depth is less than 13.5% of the particle’s radius. The results can be used in practice as a guideline to measure the hardness of a particle embedded in a matrix and provides the theoretical basis to develop a particle-embedded method to measure the hardness of individual particles.     

MD simulation of the effect of contact area and tip radius on nanoindentation

Nanoindentation,namelydepth-sensingindentation(DSI),involvesforcingarigidindenterwithknowngeometryintothesurfaceofamaterialwhilecontinuouslymonitoringtheloadontheindenter,thedisplacementoftheindenterintothesurface,andthetimeoftheexperiment.Thedepthisthenusedtocalculatetheprojectedareaofcontactforthepurposeofcalculatingthehardnessandelasticmodulus.Infact,variouserrorsareassociatedwiththisprocedure.Oneofthemcomesfromthemeasurementofthepenetrationdepth.Ideally,thepenetrationdepthshouldbecalcula…     

Mechanical properties of sol-gel derived lead zirconate titanate thin films by nanoindentation

Lead zirconate titanate (PZT) thin films are deposited on platinized silicon substrate by sol-gel process. The crystal structure and surface morphology of PZT thin films are characterized by X-ray diffraction and atomic force microscopy. Depth-sensing nanoindentation system is used to measure mechanical characteristics of PZT thin films. X-ray diffraction analyses confirm the single-phase perovskite structures of all PZT thin films. Nanoindentation measurements reveal that the indentation modulus and hardness of PZT thin films are related with the grain size and crystalline orientation. The increases of the indentation modulus and hardness with grain size are observed, indicating the reverse Hall-Petch effect. Furthermore, the indentation modulus of (1 1 1)-oriented PZT thin film is higher than those of (1 0 0)- and random-oriented films. The consistency between experimental data and numerical results of the effective indentation moduli for fiber-textured PZT thin films using Voigt-Reuss-Hill model is obtained.     

Calibrating a nanoindenter for very shallow depth indentation using equivalent contact radius

Nanoindenter tips are usually modelled as axisymmetric cones, with calibration involving finding a fitting function that relates contact area to contact depth. For accurate calibration of shallow depth indentation, this is not ideal because it means that deeper indents tend to dominate the fitting function. For an axisymmetric object, it is always possible to define an equivalent contact radius (which, in the case, of nanoindentation is linearly related to the reduced modulus) and to obtain a fitting function that relates this equivalent contact radius to indentation depth. The equivalent contact radius approach is used here to provide shallow depth calibration of a nanoindenter tip at three separate times. The advantage of the equivalent contact radius methodology is that it provides a clearer physical interpretation of the changes in tip shape than a conventional area-based fit. We also show that the minimum depth for a reliable hardness measurement is obtainable and increases as the tip blunts with age but that consistent measurements of very near surface elastic moduli can be made if the blunting of the tip over time is fully accounted for in the tip area function calibration.     

Effect of sample tilt on nanoindentation behaviour of materials

Analysis of nanoindentation is based on the elastic solution of a rigid indenter perpendicularly penetrating a flat contact surface. In reality, nanoindentation is often performed on a tilt sample surface due to sample tilt mounting or the existing roughness of a polished or raw surface. In this study, finite element simulations as well as nanoindentation experiments on a fused-quartz sample with different tilt angles were carried out to investigate the influence of sample tilt on nanoindentation behaviour of materials. It was found that sample tilt results in increases in the indentation load, contact area and contact stiffness at the same penetration depth. The contact area increase caused by sample tilt cannot be accounted for by Sneddon's equation, commonly used in nanoindentation analysis. This results in a significant underestimation of indentation projected contact area, which in turn leads to an overestimation of the mechanical properties measured by nanoindentation.     

Measurement of Residual Stresses Using Nanoindentation Method

Instrumented indentation, which is also known as nanoindentation or depth-sensing indentation, is increasingly being used to probe the residual stresses of materials including bulk solids, thin films, and coatings. The residual stresses are proved to have significant effects on various nanoindentation parameters such as hardness, loading curve, unloading curve, pile-up amount around indentation, and true contact area. By analyzing these parameters, numerous methods are developed to evaluate the residual stresses of materials in recent years. This article reviews six commonly used models which determine residual stresses from analyzing load-depth curves, as well as indentation fracture technique which is based on the classical fracture mechanics. Emphasis is placed on the principle, application and limitation of each nanoindentation method.     

Atomistic study of deposition process of Al thin film on Cu substrate

In this paper we report molecular dynamics based atomistic simulations of deposition process of Al atoms onto Cu substrate and following nanoindentation process on that nanostructured material. Effects of incident energy on the morphology of deposited thin film and mechanical property of this nanostructured material are emphasized. The results reveal that the morphology of growing film is layer-by-layer-like at incident energy of 0.1-10 eV. The epitaxy mode of film growth is observed at incident energy below 1 eV, but film-mixing mode commences when incident energy increase to 10 eV accompanying with increased disorder of film structure, which improves quality of deposited thin film. Following indentation studies indicate deposited thin films pose lower stiffness than single crystal Al due to considerable amount of defects existed in them, but Cu substrate is strengthened by the interface generated from lattice mismatch between deposited Al thin film and Cu substrate.     

Atomic-scale simulations of material behaviors and tribology properties for BCC metal film

This work has two main purposes:(i) introducing the basic concepts of molecular dynamics analysis to material scientists and engineers, and(ii) providing a better understanding of instrumented indentation measurements, presenting an example of nanoindentation and scratch test simulations. To reach these purposes, three-dimensional molecular dynamics(MD) simulations of nanoindentation and scratch test technique were carried out for generic thin films that present BCC crystalline structures. Structures were oriented in the plane(100) and placed on FCC diamond substrates. A pair wise potential was employed to simulate the interaction between atoms of each layer and a repulsive radial potential was used to represent a spherical tip indenting the sample. Mechanical properties of this generic material were obtained by varying the indentation depth and dissociation energy. The load-unload curves and coefficient of friction were found for each test; on the other hand, dissociation energy was varied showing a better mechanical response for films that present grater dissociation energy. Structural change evolution was observed presenting vacancies and slips as the depth was varied.     

Nanoindentation study of Cu52Zr37Ti8In3 bulk metallic glass

In this paper, Cu₅₂Zr₃₇Ti₈In₃ bulk metallic glass has been studied by nanoindentation. Three different ways for nanoindentation tests were employed. Load-control nanoindentation was used to investigate the effect of the loading rate on the hardness and Young’s modulus. Young’s modulus of the specimen shows a loading rate dependence. The constant-load indentation creep measurement was performed. The creep data were fitted with the generalized Kelvin model, and the compliance spectrum and retardation spectrum were derived. Furthermore, the storage compliance and loss compliance were also discussed. For characterizing the change of the hardness and Young’s modulus with increasing indentation depth, depth-control nanoindentation analysis was conducted. The results show that both the hardness and Young’s modulus decrease with nanoindentation depth.     

A nanoindentation study of the mechanical properties of ZnO thin films on (0 0 0 1) sapphire

The mechanical properties of epitaxial ZnO thin films grown on (0 0 0 1) sapphire substrate were investigated by nanoindentation with a Berkovich tip and compared with that of bulk ZnO single crystal. In all indents on ZnO film a single discontinuity (‘pop-in’) in the load versus indentation depth data was observed at a specific depth of between 13 and 16 nm. In bulk ZnO, however only 65% of indents showed pop-in event at a specific depth of between 12 and 20 nm. The mechanism responsible for the ‘pop-in’ event in the epitaxial ZnO thin films as well as in bulk ZnO was attributed to the sudden propagation of dislocations, which had been pinned down by pre-existing defects, along the pyramidal and basal {0 0 0 1} planes (cross slip). The elastic modulus and hardness of the epitaxial ZnO thin films were determined to be 154 ± 5 and 8.7 ± 0.2 GPa, respectively, at an indentation depth of 30 nm.     

考虑相界效应的Ni基单晶合金纳米压痕模拟

利用分子动力学方法分别模拟金刚石压头压入Ni模型和Ni基单晶合金γ/γ′模型的纳米压痕过程,通过计算得到两种模型[001]晶向的弹性模量及硬度.采用中心对称参数分析不同压入深度时两种模型内部位错形核、长大过程以及Ni基单晶合金γ/γ′(001)相界面错配位错对纳米压痕过程的影响.结果显示:压入深度0.641 nm之前,两种模型的压入载荷-压入深度曲线相似,说明此时相界面处的错配位错对纳米压痕过程的影响很小;压入深度0.995 nm时,在错配位错处发生位错形核,晶体在γ相中沿着{111}面滑移,随即导致Ni基单晶合金γ/γ′模型压入载荷的下降,并在压入深度达到1.487 nm之前低于Ni模型相同压入深度时的压入载荷;压入深度从1.307 nm开始,由于相界面错配位错的阻碍作用,Ni基单晶合金γ/γ′模型压入载荷上升速度较快.     

A molecular dynamics study of phase transformations in mono-crystalline Si under nanoindentation

A molecular dynamics (MD) simulation is adopted to examine the deformation behavior and phase transformation of mono-crystalline Si in nanoindentation with a spherical indenter. The techniques of coordination number and radial distribution function are used to monitor and elucidate the detailed mechanism of the phase transformation throughout the whole process in which the evolution of structural phase change and the relevant distributions of bonding length can be traced and exhibited. In this article, the phases of BC8 and R8, which have the same coordinate number as the phase Si-I and were difficult to distinguish from each other in previous studies, are successfully identified and extracted from the deformed region during unloading. Moreover, the effect of the indenter-radius size on the structural phase transformation of mono-crystalline Si for three different crystallographically oriented surfaces is investigated. It is found that the onset of the plastic deformation tends to take place only as the ratio of the indentation depth to the tip radius is larger than 0.7. Under this condition the structural phase transformation can be easily observed in the residual deformed region after unloading.     

Molecular dynamics study of the mechanical characteristics of Ni/Cu bilayer using nanoindentation

<正>In the present work,a three-dimensional molecular dynamics simulation is carried out to perform the nanoindentation experiment on Ni single crystal.The substrate indenter system is modeled using hybrid interatomic potentials including the many-body potential embedded atom method(EAM),and two-body morse potential.To simulate the indentation process,a spherical indenter(diameter = 80 A,1 A=0.1 nm) is chosen.The results show that the mechanical behaviour of a monolithic Ni is not affected by crystalline orientation.To elucidate the effect of a heterogeneous interface, three bilayer interface systems are constructed,namely Ni(100)/Cu(111),Ni(110)/Cu(111),and Ni(111)/Cu(111).The simulations along these systems clearly describe that mechanical behaviour directly depends on the lattice mismatch. The interface with the smaller mismatch between the specified crystal planes is proved to be harder and vice versa.To describe the relationship between film thickness and interface effect,we choose various values of film thickness ranging from 20 A to 50 A to perform the nanoindentation experiment.It is observed that the interface is significant only for the relatively small thickness of film and the separation between interface and the indenter tip.It is shown that with the increase in film thickness,the mechanical behaviour of the film shifts more toward that of monolithic material.     

Effect of alternating electric current on the nanoindentation of copper

Electromechanical interaction determines the structural reliability of electronic interconnects. Using the nanoindentation technique, the effect of alternating electric current on the indentation deformation of copper strips was studied for the indentation load in a range of 100 to 1600???N at room temperature. During the test, an alternating electric current of the electric current density in a range of 1.25 to 4.88?kA/cm² was passed through the copper strips. The indentation results showed that the reduced contact modulus decreased linearly with increasing the electric current density. The indentation hardness decreased with increasing the indentation deformation, demonstrating the normal indentation size effect. Using the model of strain gradient plasticity, we found that the strain gradient underneath the indentation decreased slightly with increasing the electric current density for the same indentation depth.     

氢化硅薄膜介观力学行为及其与微结构内禀关联特性

使用等离子体增强化学气相沉积系统，在射频和直流负偏压的双重激励下制备了本征和掺杂后的氢化硅薄膜.利用拉曼谱对薄膜进行了微结构分析，用纳米压痕系统研究了薄膜的介观力学行为.研究表明：制备于玻璃衬底上的氢化硅薄膜，由于存在非晶态的过渡缓冲层，弹性模量小于相应的制备于单晶硅衬底的薄膜.对于掺杂的氢化硅薄膜，由于磷的掺入使得薄膜晶粒细化、有序度提高，薄膜的晶态比一般在40％以上.而硼的掺入，薄膜晶态比减小，一般低于40％.同时发现，掺磷、本征和掺硼的氢化硅薄膜分别在晶态比为45％，30％和15％左右处，弹性模量较 关键词： 氢化硅薄膜 拉曼谱 弹性模量 晶态比