Low dielectric thermoset. II. Synthesis and properties of novel 2,6‐dimethyl phenol–dipentene epoxy

A 2,6‐dimethyl phenol–dipentene adduct was synthesized from dipentene (DP) and 2,6‐dimethyl phenol, and then a 2,6‐dimethyl phenol–DP epoxy was synthesized from the reaction of the resultant 2,6‐dimethyl phenol–DP adduct and epichlorohydrin. The proposed structures were confirmed by Fourier transform infrared, elemental analysis, mass spectra, NMR spectra, and epoxy equivalent weight titration. The synthesized 2,6‐dimethyl phenol–DP adduct was cured with 4,4‐diamino diphenyl methane, phenol novolac, 4,4‐diamino diphenyl sulfone, and 4,4‐diamino diphenyl ether. The thermal properties of the cured epoxy resins were studied with differential scanning calorimetry, dynamic mechanical analysis, dielectric analysis, and thermogravimetric analysis. These data were compared with those for the bisphenol A epoxy system. The cured 2,6‐dimethyl phenol–DP epoxy exhibited a lower dielectric constant (ca. 3.1), a lower dissipation factor (ca. 0.065), a lower modulus, lower thermal stability (5% degradation temperature = 366–424 °C), and lower moisture absorption (1.21–2.18%) than the bisphenol A system but a higher glass‐transition temperature (ca. 173–222 °C) than that of bisphenol A system. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 4084–4097, 2002     

Effect of ortho‐methylation on a bis(4‐cyanatocumyl)benezene low‐dielectric resin

A synthesis procedure for and characterization of a tetra‐ortho‐methyl substituted three‐ringed cyanate ester monomer, 4,4′‐[1,3‐phenylenebis(1‐methylethylidene)]bis[2,6‐dimethyl]phenylcyanato, and the corresponding cured resin are described with comparative characterization of the resin analogue without the ortho‐methyl substitutents. The othro‐methylation lowered the dielectric from 2.64 to 2.59 at 1 GHz and from 2.64 to 2.48 GHz at 15 GHz, whereas the tan δ was not significantly affected. Other physical properties also affected included a 40 °C decrease in the glass‐transition temperature, an increase in the thermal‐expansion coefficients, and a reduction in thermogravimetric stability. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 60–67, 2003     

Low dielectric thermoset. IV. Synthesis and properties of a dipentene‐containing cyanate ester and its copolymerization with bisphenol A dicyanate ester

A 2,6‐dimethylphenol‐dipentene dicyanate ester ( DPCY ) was synthesized from the reaction of 2,6‐dimethylphenol‐dipentene adduct and cyanogen bromide. The proposed structure was confirmed by Fourier transform infrared (FTIR), elemental analysis, mass, and nuclear magnetic resonance (NMR) spectra. DPCY was then cured by itself or cured with bisphenol A dicyanate ester ( BADCY ). Thermal properties of cured epoxy resins were studied using differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), dielectric analysis (DEA), and thermogravimetric analysis (TGA). These data are compared with those of BADCY . The cured DPCY exhibits a lower dielectric constant (2.61 at 1 MHz), dissipation factor (29.3 mU at 1 MHz), thermal stability (5% degradation temperature and char yield are 429 °C and 17.64%, respectively), glass transition temperature (246 °C by TMA and 258 °C by DMA), coefficient of thermal expansion (33.6 ppm before Tg and 134.1 ppm after Tg), and moisture absorption (0.95% at 48 h) than those of BADCY , but higher moduli (5.12 GPa at 150 °C and 4.60 GPa at 150 °C) than those of the bisphenol A system. The properties of cured cocyanate esters lie between cured BADCY and DPCY , except for moduli. Moduli of some cocyanate esters are even higher than those of cured BADCY and DPCY . A positive deviation from the Fox equation was observed for cocyanate esters. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3986–3995, 2004     

Flame‐retardant epoxy resins from o‐cresol novolac epoxy cured with a phosphorus‐containing aralkyl novolac

A novel phosphorus‐containing aralkyl novolac (Ar‐DOPO‐N) was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) first with terephthaldicarboxaldehyde and subsequently with phenol. The chemical structures of the synthesized compounds were characterized with Fourier transform infrared, ¹H and ³¹P NMR, and elemental analysis. Ar‐DOPO‐N blended with phenol formaldehyde novolac was used as a curing agent for o‐cresol formaldehyde novolac epoxy, resulting in cured epoxy resins with various phosphorus contents. The epoxy resins exhibited high glass‐transition temperatures (159–177 °C), good thermal stability (>320 °C), and retardation on thermal degradation rates. High char yields and high limited oxygen indices (26–32.5) were observed, indicating the resins' good flame retardance. Using a melamine‐modified phenol formaldehyde novolac to replace phenol formaldehyde novolac in the curing composition further enhanced the cured epoxy resins' glass‐transition temperatures (160–186 °C) and limited oxygen index values (28–33.5). © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2329–2339, 2002     

Synthesis and characterization of novel low‐dielectric cyanate esters

For the purpose of increasing the mobility of residual bisphenol A dicyanate ester (BADCY) during the final stage of curing and achieving a complete reaction of cyanate groups, a small quantity of monofunctional phenol was added to BADCY to form an imidocarbonate, or a small quantity of monofunctional cyanate esters was added to form cyanate ester copolymers. The proposed structures were confirmed with Fourier transform infrared, elemental analysis, mass spectrometry, and NMR spectroscopy. The thermal properties of the cured cyanate esters were measured with dynamic mechanical analysis, thermogravimetric analysis, and dielectric analysis. These data were compared with those for the cured BADCY resin. The cured modified cyanate esters exhibited a lower dielectric constant, a lower dissipation factor, and lower moisture absorption than the cured BADCY system. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 2589–2600, 2004     

Flame‐retardant epoxy resins with high glass‐transition temperatures from a novel trifunctional curing agent: Dopotriol

A novel phosphorus‐containing trifunctional novolac (dopotriol) was synthesized through the addition reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide and rosolic acid. The structure of dopotriol was confirmed with NMR spectroscopy and elemental analyses. The dopotriol was blended with phenol novolac in the ratios of 10/0, 8/2, 6/4, 4/6, 2/8, and 0/10 to serve as a curing agent for diglycidyl ether of bisphenol A. Thermal properties, such as the glass‐transition temperature, thermal decomposition temperature, and flame retardancy, moisture absorption, and dielectric properties of the cured epoxy resins were evaluated. The activity and activation energy of curing were studied with the methods of Kissinger and Ozawa by dynamic differential scanning calorimetry scans. The glass‐transition temperatures of the cured epoxy resins were 138–159 °C, increasing with the phosphorus content. This is rarely seen in the literature after the addition of a flame‐retardant element. The flame retardancy increased with the phosphorus content, and a UL‐94 V‐0 grade was achieved with a phosphorus content of 1.87%. Similar dielectric properties and moisture absorption were observed for these phosphorus‐containing epoxy resins, and this implied that the addition of phosphorus to epoxy did not affect the dielectric properties and moisture absorption. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 2862–2873, 2005     

Flame retardant polycyanurate thermosets from the cyanate esters of triphenylphosphine oxide

Three cyanate esters containing phosphorus are synthesized in good overall yields starting from bromoanisoles. Di‐ and tricyanates with meta configuration are most stable while para is less so. The para dicyanate ester isomer is particularly affected by water from the atmosphere. The meta dicyanate ester 2 has good thermal properties with glass transition at 268 °C and char yield of 65% in air at 600 °C. All three phosphorus‐containing cyanate esters are low flammability in an open flame. They make highly combustible cyanate esters resins less flammable simply by blending. Mixing 10 wt% dicyanate ester 2 into bisphenol A or E dicyanate esters makes them rate V‐0. Published 2018.^† J. Polym. Sci., Part A: Polym. Chem. 2018 , 56, 1100–1110     

Novel flame‐retardant thermosets: Diglycidyl ether of bisphenol A as a curing agent of boron‐containing phenolic resins

Boron‐containing novolac resins were synthesized by the modification of a commercial novolac resin with different contents of bis(benzo‐1,3,2‐dioxaborolanyl)oxide. These novolac resins were crosslinked with diglycidyl ether of bisphenol A (DGEBA), and their thermal, thermodynamomechanical, and flame‐retardant properties were evaluated. The boron‐containing novolac resins were less thermally stable than the unmodified novolac resin. Their modification degree and DGEBA content were related to the crosslinking density of the materials. The boron‐containing novolac resins generated boric acid at high temperatures and gave an intumescent char that slowed down the degradation and prevented it from being total. They also showed good flame‐retardant properties. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 1701–1710, 2006     

High performance toughened cyanate ester resin with low injection temperature for RTM process

A high‐performance modified cyanate resin system with low injection temperature for fabricating advanced composites via resin transfer molding (RTM) was developed, which was made of bisphenol A dicyanate ester (BADCy) and diallyl phthalate (DAP). The processing characteristics, mechanical, and thermal properties of the resin were studied, and the effect of the content of DAP on the processing and performance parameters was discussed. The results show that the processing properties of the modified cyanate system are dependent on the content of DAP. All the formulations studied in this paper have good processing characteristics; their injection temperatures are between 30 and 40°C and the pot life is about 20 hr at 50°C. The cured resins exhibited good thermal stability, excellent toughness, and good hot–wet resistance, suggesting that the toughened cyanate resin is a potential high‐performance RTM matrix for advanced composites. Copyright © 2008 John Wiley & Sons, Ltd.     

Synthesis and properties of phosphorus-containing epoxy resins by novel method

Novel phosphorus-containing epoxy resins (1–3% phosphorus content) were synthesized by the reaction of 9,10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide (DOPO) and the diglycidyl ether of bisphenol A and then cured with 4,4′-diaminodiphenyl sulfone or phenol novolac. Differential scanning calorimetry, high performance liquid chromatography, and epoxide equivalent weight titration were used to trace the reaction between the DOPO and the epoxy. The thermal stability and flame retardancy were checked by thermal gravimetric analysis, the limiting oxygen index, and the UL-94 vertical test. The glass transitions were measured by dynamic mechanical analysis. The relation between these properties (thermal stability, flame retardancy, and glass transition) and the DOPO contents (phosphorus content) were discussed. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 3903–3909, 1999     

NCOCH2(CF2)6CH2OCN cyanate ester resin. A detailed study

The NCOCH₂(CF₂)₆CH₂OCN fluoromethylene cyanate ester monomer and resin are synthesized and characterized. The monomer is prepared by a large‐scale bench‐top synthesis, characterized by differential scanning calorimetry, infrared, ¹H‐, ¹³C‐, ¹⁵N‐, and ¹⁹F‐NMR spectroscopies and analyzed for catalytically active impurities. Conversion of the monomer to prepolymer and cured resin is characterized by IR and NMR spectroscopies and kinetically analyzed. Resin properties characterization includes thermal, tensile, dynamic mechanical, dielectric, refractive index, thermodielectric and thermogravimetric stabilities, and water absorption. Relevant property comparisons with the commercial AroCy F cyanate ester resin (6F bisphenol A dycyanate) and a Jeffamine‐bisphenol diglycidyl ether epoxy are made. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 135–150, 1999     

酚醛型氰酸酯与双酚A型环氧共固化反应的FTIR研究

在恒温固化条件下,通过FTIR跟踪方法,研究了酚醛型氰酸酯与双酚A型环氧共固化反应的路径及其反应机理.共固化体系的反应过程包括在150℃及其以下温度,主要发生的是氰酸酯的三嗪环化固化反应,其中三嗪环化固化反应由于环氧的加入,反应速率被极大地提高了;同时,酚醛型氰酸酯中的氨基甲酸酯类杂质与环氧发生开环聚合反应,引起环氧官能团产生弱而持续的消耗.但在此阶段,酚醛型氰酸酯与环氧之间没有化学反应发生;在180℃及其以上温度,三嗪环和环氧发生反应,异构为异氰脲酸环结构,并进一步反应生成唑啉酮环结构,由于该反应的发生,促进了环氧官能团的消耗速度,在环氧官能团的转化率-时间图中,出现倒S曲线;在三嗪环的转化率图中,出现一个极大值后再降落的曲线.反应温度的提高有利于促进酚醛型氰酸酯与环氧之间的共固化反应,特别是当反应温度为220℃时,氰酸酯官能团和环氧官能团的消耗、三嗪环和唑啉酮环的生成均以较快的速率进行,—OCN生成三嗪环的转化率可以较容易地达到1,而唑啉酮环的转化率不超过0.5.     

Synthesis of photosensitive and thermosetting poly(phenylene ether) based on poly[2,6‐di(3‐methyl‐2‐butenyl)phenol‐co‐2,6‐dimethyl‐phenol] and a photoacid generator

A chemically amplified photosensitive and thermosetting polymer based on poly[2,6‐di(3‐methyl‐2‐butenyl)phenol (15 mol %)‐co‐2,6‐dimethylphenol (85 mol %)] ( 3c ) and a photoacid generator [(5‐propylsulfonyloxyimino‐5H‐thiophen‐2‐ylidene)‐(2‐methylphenyl)acetonitrile] was developed. Poly[2,6‐bis(3‐methyl‐2‐butenyl)phenol]‐co‐2,6‐dimethylphenol)] ( 3 ) with high molecular weights (number‐average molecular weight ～ 24,000) was prepared by the oxidative coupling copolymerization of 2,6‐di(3‐methyl‐2‐butenyl)phenol with 2,6‐dimethylphenol in the presence of copper(I) chloride and pyridine as the catalyst under a stream of oxygen. The structures of 3 were characterized with IR, ¹H NMR, and ¹³C NMR spectroscopy. 3 was crosslinked by a thermal treatment at 300 °C for 1 h under N₂. The 5% weight loss temperatures and glass‐transition temperatures of the cured copolymers reached around 420 °C in nitrogen and 300 °C, respectively. The average refractive index of the cured copolymer ( 3c ) film was 1.5452, from which the dielectric constant at 1 MHz was estimated to be 2.6. The resist showed a sensitivity of 35 mJ cm^?2 and a contrast of 1.6 when it was exposed to 436‐nm light, postexposure‐baked at 145 °C for 5 min, and developed with toluene at 25 °C. A fine negative image featuring 8‐μm line‐and‐space patterns was obtained on a film exposed to 100 mJ cm^?2 with 436‐nm light in the contact‐printed mode. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 149–156, 2005     

Phenolic resins bearing maleimide groups: Synthesis and characterization

Novel phenolic novolac resins, bearing maleimide groups and capable of undergoing curing principally through the addition polymerization of these groups, were synthesized by the polymerization of a mixture of phenol and N‐(4‐hydroxy phenyl)maleimide (HPM) with formaldehyde in the presence of an acid catalyst. The polymerization conditions were optimized to get gel‐free resins. The resins were characterized by chemical, spectral, and thermal analyses. Differential scanning calorimetry and dynamic mechanical analysis revealed an unexpected two‐stage curing for these systems. Although the cure at around 275°C was attributable to the addition polymerization reaction of the maleimide groups, the exotherm at around 150 to 170°C was ascribed to the condensation reaction of the methylol groups formed in minor quantities on the phenyl ring of HPM. Polymerization studies of non‐hydroxy‐functional N‐phenyl maleimides revealed that the phenyl groups of these molecules were activated toward an electrophilic substitution reaction by the protonated methylol intermediates formed by the acid‐catalyzed reaction of phenol and formaldehyde. On a comparative scale, HPM was less reactive than phenol toward formaldehyde. The presence of the phenolic group on N‐phenyl maleimide was not needed for its copolymerization with phenol and formaldehyde. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 641–652, 2000     

Preparation of phosphinated bisphenol from acid‐fragmentation of 1,1,1‐tris(4‐hydroxyphenyl)ethane and its application in high‐performance cyanate esters

We reveal a route for the preparation of phosphinated bisphenol, 1,1‐bis(4‐hydroxyphenyl)‐1‐(6‐oxido‐6H‐dibenz <c,e> <1,2> oxaphosphorin‐6‐yl)ethane (2) , via a one‐pot reaction of 1,1,1‐tris(4‐hydroxyphenyl)ethane and 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide (DOPO) in the catalysis of p‐toluenesulfonic acid. A two‐step reaction mechanism, acid‐fragmentation of 1,1,1‐tris(4‐hydroxyphenyl)ethane followed by nucleophilic addition of DOPO, is proposed for the synthesis. Based on (2) , a dicyanate ester derivative, 1,1‐bis(4‐cyanatophenyl)‐1‐(6‐oxido‐6H‐dibenz <c,e> <1,2> oxaphosphorin‐6‐yl)ethane (3) was prepared and co‐cured with a commercially available dicyanate ester, the dicyanate ester of bisphenol A (BACY). Experimental data show that incorporating (3) into BACY enhances the flame retardancy and dielectric properties with little penalty to the thermal properties. A thermoset with T_g 274 °C, coefficient of thermal expansion (CTE) 49 ppm/°C, D_k 3.04 (1 GHz), T_d (5%,) N₂: 435 °C, air: 424 °C, and UL‐94 V‐0 rating can be achieved via this approach. © 2011 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2011.     

Negative‐type photosensitive poly(phenylene ether) based on poly(2,6‐dimethyl‐1,4‐phenylene ether), a crosslinker,and a photoacid generator

A negative‐type photosensitive poly(phenylene ether) (PSPPE) based on poly(2,6‐dimethyl‐1,4‐phenylene ether) (PPE), a novel crosslinker 4,4′‐methylene‐bis [2,6‐bis(methoxymethyl)phenol] (MBMP) having good compatibility with PPE, and diphenylidonium 9,10‐dimethoxy anthracene‐2‐sulfonate (DIAS) as a photoacid generator (PAG) has been developed. This resist consisting of PPE (73 wt %), MBMP (20 wt %) and DIAS (7 wt %) showed a high sensitivity (D_0.5) of 58 mJ/cm² and a contrast (γ_0.5) of 9.5 when it was exposed to i‐line (365 nm wavelength light), postexposure baked at 145 °C for 10 min, and developed with toluene at 25 °C. A fine negative image featuring 6 μm line‐and‐space pattern was obtained on the film exposed to 300 mJ/cm² of i‐line by a contact‐printed mode. The resulting polymer film cured at 300 °C for 1 h under nitrogen had a low dielectric constant (ε = 2.46) comparable to that of PPE and a higher T_g than that of PPE. In addition, the cured PSPPE film was pretty low water absorption (<0.05%) as same as PPE. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 4949–4958, 2008     

Thermal and water absorption properties of cyanate ester resins modified by fluoride‐containing and silicone‐containing components

In order to enhance the moisture resistance of cyanate ester resins, modifiers containing silicon or fluorine moieties were introduced. The curing behaviors of the obtained resins, as well as thermal, water absorption, and dielectric properties of all cured polymers, were investigated in detail. Results show that properties of fillers in polymer have great influence on the thermal property and of polymer. In all cases, modifier exhibited percolation threshold at 5 wt%. Compared with pristine cyanate ester resins (CE), when the methyl phenyl silicone resin B filler was added, the cured polymer exhibited water absorption as low as 0.39% and excellent thermal oxygen stability at 300°C. The introduction of silicon H improved thermal oxidative stability at 400°C without significant compromise in processability or mechanical properties.     

Novel flame‐retardant thermosets: Phosphine oxide‐containing diglycidylether as curing agent of phenolic novolac resins

Phosphorus‐containing novolac–epoxy systems were prepared from novolac resins and isobutyl bis(glycidylpropylether) phosphine oxide (IHPOGly) as crosslinking agent. Their curing behavior was studied and the thermal, thermomechanical, and flame‐retardant properties of the cured materials were measured. The T_g and decomposition temperatures of the resulting thermosets are moderate and decrease when the phosphorous content increases. Whereas the phosphorous species decrease the thermal stability, at higher temperatures the degradation rates are lower than the degradation rate of the phosphorous‐free resin. V‐O materials were obtained when the resins were tested for ignition resistance with the UL‐94 test. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3516–3526, 2004     

Preparation and properties of high performance epoxy–silsesquioxane hybrid resins prepared using a maleimide–alkoxysilane compound as a modifier

An alkoxysilane compound possessing maleimide moiety (MSM) was prepared from N‐(4‐hydroxyphenyl)maleimide and 3‐glycidoxypropyltrimethoxysilane and was used as a modifier of epoxy resins. In situ curing epoxy resins with MSM resulted in epoxy resins with good homogeneity. Just 5–10 wt % of MSM is sufficient to yield high glass transition temperature (165 °C), good thermal stability above 360 °C, and high flame retardancy (LOI = 30) to bisphenol‐A‐based epoxy resins. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5787–5798, 2005     

Development of novel flame‐retardant thermosets based on boron‐modified phenol–formaldehyde resins

Boron‐containing novolac resins were prepared through the modification of a commercial novolac resin with different contents of bis(benzo‐1,3,2‐dioxaborolanyl) oxide. Their thermal and flame‐retardant properties were measured. Then, they were crosslinked with hexamethylenetetramine, and their thermal, thermodynamomechanical, and flame‐retardant properties were evaluated. Their modification degree was related to the segmental motion of the materials. The crosslinking of the boron‐modified novolac resins with hexamethylenetetramine was slower and not as extensive as that of commercial novolac resins because the nitrogen from intermediate species coordinated with boron. The thermal degradation of the boron‐containing novolac resins generated boric acid at high temperatures and gave an intumescent char that slowed the degradation and prevented it from being complete. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 3503–3512, 2006