New cholesteric liquid‐crystal epoxy resins derived from 6‐hydroxy‐2‐naphthoic acid

Liquid‐crystalline epoxy resins were synthesized from 6‐hydroxy‐2‐naphthoic acid, which was used as a mesogenic component, with phenylhydroquinone or isosorbide and via a further reaction with (6‐bromo‐1‐hexyl)glycidylether, which was used as a flexible spacer. In this way, phenylhydroquinone‐bis‐6‐[6‐(glycidyloxy)hexyloxy]2‐naphthoate (Gly A) and isosorbide‐bis‐6‐[6‐(glycidyloxy)hexyloxy]2‐naphthoate (Gly B) were obtained. Nematic elastomers were obtained by the crosslinking of Gly A with 2,4‐diaminotoluene (DAT) and 1,10‐decanedicarboxylic acid (SA). The liquid‐crystalline behavior was investigated with differential scanning calorimetry, polarizing light microscopy, and X‐ray diffractometry. Cholesteric mesophases were produced by the blending of different ratios of Gly A and Gly B, and these blends were then crosslinked with SA to produce nematic mesophases. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 39: 2847–2858, 2001     

Synthesis and thermal properties of epoxy resins from ester-carboxylic acid derivative of alcoholysis lignin

Alcoholysis lignin (AL) was dissolved in ethylene glycol and the obtained mixture was reacted with succinic anhydride to form a mixture of ester-carboxylic acid derivatives (AL-polyacid, ALPA). Ethylene glycol-polyacid (EGPA) was also prepared from ethylene glycol. The obtained mixture of ester carboxylic acid derivatives was treated with ethylene glycol diglycidyl ether in the presence of catalytic amount of dimethylbenzylamine to form ester-epoxy resins. The curing reaction was analyzed by Ozawa's method using differential scanning calorimetry. The activation energy of curing reaction in the initial step was found to be ca. 84 kJ mol⁻¹. The molar ratios of epoxy groups to carboxylic acid groups ([EPOXY]/[AA] ratios) were varied from 0.8 to 1.3. The contents of ALPA in the mixture of ALPA and EGPA were also varied from 0 to 100%. Thermal properties of epoxy resins were studied by DSC and thermogravimetry. Glass transition temperatures of epoxy resins showed a maximum value of −11.5 °C when [EPOXY]/[AA] ratio was 1.1. T_g increased with increasing ALPA contents suggesting that lignin acts as a hard segment in epoxy resin networks. Thermal degradation temperatures of epoxy resins slightly decreased with increasing ALPA contents.     

Syntheses and characterizations of thermally reworkable epoxy resins. Part I

To meet the need for reworkable epoxy resins, a series of cycloaliphatic diepoxides containing thermally cleavable carbamate linkages were synthesized and characterized. These materials were shown to undergo curing reactions with cyclic anhydride in a similar fashion as a commercial cycloaliphatic epoxide, except that the carbamate group within the diepoxides can act as the internal catalyst. Furthermore, cured samples of the formulations from these diepoxides started to decompose at lower temperatures, i.e., between 200–300°C as compared with 350°C for the cured sample of the commercial cycloaliphatic epoxide, which showed their potential to be used as reworkable underfill encapsulants in the electronic packaging area. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 2991–3001, 1999     

Layered silicate/epoxy nanocomposites: synthesis,characterization and properties

Novel epoxy‐clay nanocomposites have been prepared by epoxy and organoclays. Polyoxypropylene triamine (Jeffamine T‐403), primary polyethertriamine (Jeffamine T‐5000) and three types of polyoxypropylene diamine (Jeffamine D‐230, D‐400, D‐2000) with different molecular weight were used to treat Na‐montmorillonite (MMT) to form organoclays. The preparation involves the ion exchange of Na⁺ in MMT with the organic ammonium group in Jeffamine compounds. X‐ray diffraction (XRD) confirms the intercalation of these organic moieties to form Jeffamine‐MMT intercalates. Jeffamine D‐230 was used as a swelling agent for the organoclay and curing agent. It was established that the d₀₀₁ spacing of MMT in epoxy‐clay nanocomposites depends on the silicate modification. Although XRD data did not show any apparent order of the clay layers in the T5000‐MMT/epoxy nanocomposite, transmission electron microscopy (TEM) revealed the presence of multiplets with an average size of 5 nm and the average spacing between multiplets falls in the range of 100 Å. The multiplets clustered into mineral rich domains with an average size of 140 nm. Scanning electron microscopy (SEM) reveals the absence of mineral aggregate. Nanocomposites exhibit significant increase in thermal stability in comparison to the original epoxy. The effect of the organoclay on the hardness and toughness properties of crosslinked polymer matrix was studied. The hardness of all the resulting materials was enhanced with the inclusion of organoclay. A three‐fold increase in the energy required for breaking the test specimen was found for T5000‐MMT/epoxy containing 7 wt% of organoclay as compared to that of pure epoxy. Copyright © 2004 John Wiley & Sons, Ltd.     

新型磷钨酸基固体酸催化油酸酯化合成生物柴油

利用磷钨酸（PTA）与1,2,3-三氮唑-4,5-二羧酸（TDA）在水溶液中的反应,合成了一种新的固体酸TDA-PTA,采用X射线粉末衍射（XRD）、扫描电镜（SEM）、红外光谱（FT-IR）、热重（TG）以及电位滴定等方法对其进行了表征,并以油酸与甲醇的酯化反应为探针反应,考察了其催化性能,探讨了催化剂用量、醇酸物质的量比、反应时间、反应温度以及催化剂重复利用次数等对产物收率的影响。结果表明,TDA-PTA不仅保留有磷钨酸典型的Keggin结构,而且具有较强的酸强度;经修饰后,催化剂具有规整的球形形貌,比表面积明显大于磷钨酸;TDA-PTA在油酸与甲醇的酯化反应中表现出了优良的催化活性,尤其显示出好的重复利用性,六次使用后,仍得到86.8%的油酸甲酯产率,催化剂的物相以及Keggin结构没有明显变化。     

Syntheses and characterizations of thermally reworkable epoxy resins II

Flip‐chip technology is a face‐down attachment of the active side of the silicon device onto the substrate. It is the ultimate packaging solution to integrated circuit devices used in 21st century electronic systems to meet the requirements of small size, high performance, and low cost. Underfill technology enhances the flip chip on board cycle fatigue life and thus dramatically extends the application of flip‐chip technology in electronics from high‐end to cost‐sensitive commodity products. Reworkable underfill is the key to addressing the nonreworkability of the underfill, so it is very important to electronic packaging. To meet the need for reworkable epoxy resins, four cycloaliphatic epoxides containing thermally cleavable carbonate linkages have been synthesized and characterized. These materials are shown to undergo curing reactions with cyclic anhydride similarly to a commercial cycloaliphatic diepoxide. Furthermore, these cured epoxides start to decompose at temperatures lower than 350 °C, the decomposition temperature for the cured sample of the commercial cycloaliphatic diepoxide. Two formulations based on two carbonate‐containing diepoxides start network breakdown around 220 °C, which is the targeted rework temperature. Moreover, these two formulations have similar properties, including the glass‐transition temperature, coefficient of thermal expansion, storage modulus, viscosity, and adhesion, compared to the standard commercial diepoxide formulation. As such, these two formulations are potential candidates for a successful reworkable underfill. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 3771–3782, 2000     

Preparation and properties of biocomposites composed of bio‐based epoxy resin,tannic acid,and microfibrillated cellulose

As new bio‐based epoxy resin systems, glycerol polyglycidyl ether (GPE) and sorbitol polyglycidyl ether (SPE) were cured with tannic acid (TA) at various conditions. When the curing conditions were optimized for the improvement of thermal and mechanical properties, the most balanced properties were obtained for the GPE/TA and SPE/TA cured at 160 °C for 2–3 h at the epoxy/hydroxyl ratio of 1/1. The cured SPE/TA had a higher glass transition temperature (T_g) and tensile strength than the cured GPE/TA. Next, biocomposites of GPE/TA and SPE/TA with microfibrillated cellulose (MFC) were prepared by mixing aqueous solution of the epoxy/curing reagent with MFC, and subsequent drying and curing at the optimized condition. For both the GPE/TA/MFC and SPE/TA/MFC biocomposites, T_g and the storage modulus at rubbery plateau region increased with increasing MFC content over the studied range of 3–15 wt %. The tensile strength at 25 °C for GPE/TA/MFC biocomposite with MFC content 10 wt % was 76% higher than that of control GPE/TA, while the tensile modulus was little improved. On the other hand, the tensile strength and modulus of SPE/TA/MFC biocomposite with MFC content 10 wt % were 30 and 55% higher than those of control SPE/TA, respectively. © 2010 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 48: 425–433, 2010     

Frontal cationic curing of epoxy resins

We studied the frontal curing of trimethylolpropane triglycidyl ether (TMPTGE) using two BF₃‐amine initiators and two fillers, kaolin and fumed silica. In the case of kaolin, the range of concentrations allowing for frontal polymerization to propagate was dependent on its heat absorption effect whereas in the case of silica it was a consequence of the rheological features of this additive. However, for both systems the velocity and front temperature show the same trends; in all cases front velocities were on the order of 1 cm/min with front temperatures about 200 °C. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 48: 2000–2005, 2010     

Time evolution of dielectric parameters during the crosslink of epoxy resins

The d.c. conductivity and the dielectric constant of an epoxy resin cured with a diamine were examined in a frequency interval extended up to 10¹⁰ Hz. The analysis of the dielectric behavior has permitted gaining a better knowledge of the relationships between dielectric parameters and the physical and chemical modifications of the systems. The results indicate that the chemical kinetics of the crosslink process is closely paralleled by the change in time of the dielectric parameters so that dielectrometry provides valuable information on conversion, relaxation times, glass transition temperature and gelation.     

The Role of inclusion size in toughening of epoxy resins by spherical micelles

We report our finding of an optimal length scale for toughening of epoxies using spherical micelles formed by block copolymers. The amphiphilic diblock copolymer poly(hexylene oxide)‐poly(ethylene oxide) (PHO‐PEO) with 30 wt % PEO self‐assembled to form spherical micelles in a bisphenol A epoxy resin with a phenol novolac hardener. We systematically increased the size of the spherical micelles from 20–30 nm to 0.5–10 μm by swelling their PHO core using PHO homopolymer. Although all the blends were tougher than the unmodified epoxy, the largest enhancement of fracture resistance was measured in blends containing 0.1–1 μm spherical inclusions. This enhanced toughness was correlated with plastic deformation by shear banding in tensile test and greater roughness of the fracture surface. Smaller micelles neither induced plastic deformation nor contributed to surface roughness significantly whereas larger micelles acted as local defects resulting in early failure. These findings provide a framework in assessing the toughening effects of blended block copolymers on epoxy resins. © 2009 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 47: 1125–1129, 2009     

Curing of liquid crystalline epoxy resins with a biguanide

This work extends the authors' investigations on liquid crystalline epoxy resins prepared from diglycidyl ether of 4,4′-dihydroxybiphenyl (DGE-DHBP) and aliphatic dicarboxylic compounds (ADC) or difunctional aromatic compounds. Syntheses and properties of these liquid crystalline epoxy resins are described elsewhere. In this paper a study on the curing reaction of the above mentioned liquid crystalline epoxy resins is presented. Ortho-tolylbiguanide was applied as the curing agent. The curing reactions were investigated by differential scanning calorimetry, microscopic observations and IR spectroscopy. Depending upon the temperature program of curing, it was possible to obtain polymeric networks with liquid crystalline order. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35 : 2739–2745, 1997     

Thermoplastic toughening of epoxy resins: a critical review

Thermoplastic toughening of epoxy resins has been actively studied since the early 1980s with considerable progress in property improvement and understanding having been made since then. The main advantage in using thermoplastics to toughen epoxy resins is that their incorporation need not result in significant decreases in desirable properties such as modulus and yield strengths as is generally the case when rubbers are used as toughening agents. However, the predominant criteria for achieving optimum toughness enhancement in the thermoplastic toughening of epoxy resins are still not all that clear from the literature. This review has focused upon the importance of the thermoplastic endgroups, the material's morphology, the ductility of the matrix and the chemical structure of the thermoplastic, it summarizes what the authors believe are the important requirements for good thermoplastic toughening. © 1998 John Wiley & Sons, Ltd.     

Studies on the curing kinetics of epoxy resins using silicon containing amide-amines

Curing kinetics of diglycidyl ether of bisphenol-A (DGEBA) in the presence of novel silicon containing amide-amines were investigated by the dynamic differential scanning calorimetry. Silicon containing amide-amines were prepared by reacting 2.5 moles of 4,4'-diaminodiphenyl ether (E)/4,4'-diaminodiphenyl methane (M)/3,3'-diaminodiphenyl sulfone (mS)/bis(m-aminophenyl) methyl phosphine oxide (B) with one mole of bis(4-chlorobenzoyl) dimethyl silane. The multiple heating rate method (5, 10, 15 and 20°C min^-1) was used to study the curing kinetics of epoxy resins in the presence of stoichiometric amounts of amide-amines having molecular masses in the range of 660 to 760 g mol^-1. The peak exotherm temperature depends on the heating rate as well as on the structure of amide-amines. Activation energy of curing reaction as determined in accordance to the Ozawa's method was found to be dependent on the structure of amine. The thermal stability of the isothermally cured resins was also evaluated using dynamic thermogravimetry in a nitrogen atmosphere. The char yield was the highest in case of resins cured with amide-amines having both phosphorus and silicon atoms. This revised version was published online in July 2006 with corrections to the Cover Date.     

Direct diazotization of graphite nanoplatelets with melamine and their favorable application in epoxy resins

The ease of undesirable agglomeration and a low efficiency are two problems that restrict the application of graphite nanoplatelets (GNPs) in epoxy resins (EP). Herein, a new strategy with melamine (MEL) as the precursor to functionalize GNPs chemically, which form a bonding layer that is compatible with epoxy matrix, is reported. The MEL fragments with secondary amine groups were grafted uniformly on the GNPs surface by covalent junctions to exploit the diazonium chemistry. This behavior led to a better dispersion and a stronger interaction with the epoxy matrix and resulted in an enhanced glass transition temperature and bending strength, compared with the pure EP. When only 1 wt% functionalized GNPs (f‐GNPs) was used, the Tg of the modified EP raised of about 15°C compared with pure EP, and the bending strength increased by approximately 39%. The dielectric constant of the EP with f‐GNPs was impacted slightly, and the dielectric loss decreased. At 10⁵ Hz, the dielectric loss of the EP with 1 wt% f‐GNPs decreased by approximately 11% compared with pure EP. Therefore, diazotization modification of the GNPs is a useful approach to improve the compatibility in nanoparticle networks.     

Thermal and electrical behavior of hybrid thermosets based on epoxy and maleimide resins cured with p-aminobenzoic acid

Two thermoset systems based on maleimides and diglycidyl ether of bisphenol A (DGEBA) cured with p-aminobenzoic acid were characterized in terms of thermal and electrical behavior. Thermal characterization has been undertaken by means of thermogravimetric analysis in nitrogen atmosphere up to 600°C using simultaneous thermogravimetric/Fourier transform infrared/mass spectrometry (TG/FT-IR/MS) analysis. In the first stage of thermal degradation, the global kinetic parameters [activation energy (E_a) and preexponential factor (log A₁ (s⁻¹))] were calculated using the isoconversional method of Friedman. The energies variation as well as the shape of the differential thermal analysis curves suggests that the thermal decomposition process occurred in multiple stages. The evolved gases analysis was conducted by simultaneous TG/FT-IR/MS coupled techniques. Dielectric relaxation spectroscopy characterization was also made.     

Liquid crystalline epoxy resins by polyaddition of aliphatic diepoxides with 4,4′-dihydroxybiphenyl

Liquid crystalline epoxy resins were synthesized from 4,4′-dihydroxybiphenyl (DHB), which was used as a mesogenic component, and diglycidyl ethers of aliphatic glycols (ethylene glycol and 1,6-hexanediol) which were used as flexible spacers. The synthesis was carried out by the catalytic polyaddition in the melt. Triphenylphosphine was used as the catalyst. The course of the polyaddition was investigated at various molecular ratios of the reactants. It was found that both linear and branched structures were formed in the course of the synthesis. The rates of the formation of the structures were calculated. The epoxy oligomers were investigated by DSC, polarizing microscope, and x-ray and IR spectroscopy. The molecular weight distribution was determined by GPC. The dependence of liquid crystalline properties of the obtained epoxy resins on the molecular weight and on the chain length of the flexible spacer was investigated. The molecular weight of the epoxy oligomers and the length of flexible spacer influence the phase transition temperatures. © 1995 John Wiley & Sons, Inc.     

Synthesis, characterization, and cure properties of phosphorus-containing epoxy resins for flame retardance

An organophosphorus compound, 10-(2,5-dihydroxyl phenyl)-9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DHPDOPO), was synthesized through the reaction of 9,10-dihydro-9-oxa-10-phosphaphnanthrene-10-oxide (DOPO) and p-benzoquinone, and characterized by elemental analysis, Fourier transform infrared spectrum (FTIR), and ¹H-NMR and ³¹P-NMR spectroscopes. Consequently, the phosphorus-containing epoxy resins with phosphorus content of 1 and 2 wt.% were prepared via the reaction of diglycidyl ether of bisphenol-A with DHPDOPO and bisphenol-A, and confirmed with FTIR and gel permeation chromatography (GPC). Phenolic melamine, novolak, and dicyanodiamide (DICY) were used as curing agents to prepare the thermosetted resins with the control and the phosphorus-containing epoxy resins. Thermal properties and thermal degradation behaviors of these the thermosetted resins were investigated by using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). Phenolic melamine-cured resins exhibited higher glass transition temperatures than the other cured resins due to the high rigidity of their molecular chain. TGA studies demonstrated that the decomposition temperatures of the novolak-cured resins were higher than those of the others. A synergistic effect from the combination of the phosphorus-containing epoxy resin and the nitrogen-containing curing agent can result in a great improvement of the flame retardance for their thermosetted resins.     

Recent advances in epoxy resins and composites derived from lignin and related bio-oils

This short critical review gives an insight on the potential that lignin and its bio-oils present towards the production of thermosetting epoxy polymers and composites. Green and sustainable ways of producing monomers and polymers from renewable sources are critical and lignin, as an underutilized bio-based waste material, presents a high exploitation potential. Due to its versatile and highly functional phenolic structure, the utilization of lignin or its depolymerized fractions (bio-oils) has been investigated in the last years as alternative for fossil-based epoxy resin pre-polymers and crosslinkers. Lignin can in fact be considered as a crosslinker for epoxy resins, especially after appropriate functionalization with amine groups or with additional hydroxyl groups, or it can be modified with epoxide groups towards the replacement of toxic BPA-based epoxy prepolymers. Furthermore, lignin derived pyrolysis or hydrogenolysis bio-oils may offer highly reactive soluble oligomers that after appropriate functionalization could be utilized as bio-based epoxy prepolymers. The lignin-based epoxy resins and composites exhibit similar or even better and novel properties, compared to those of pristine epoxy polymers, thus rendering lignin a highly valuable feedstock for further utilization in the thermoset polymer industry.     

Phosphorylated cellulose/Fe3+ complex: A novel flame retardant for epoxy resins

A novel flame retardant containing cellulose, phosphorus and ferrum complex (Cell‐P‐Fe) was successfully synthesized and then it was used as flame retardants in epoxy resins (EP). Due to the present of acid sources and carbon sources, the Cell‐P‐Fe exhibits improved thermal stability and flame retardant properties. The EP/Cell‐P‐Fe composites with 10 wt% of Cell‐P‐Fe show remarkably improved LOI and UL‐94 values compared with the flame retardants without ferrum. At the loading of 10.0 wt% flame retardants, the char yield for EP/Cell‐P‐Fe composites increased to 29.1 wt%, indicating the improved thermal stability at high temperature. Moreover, thermogravimetric analysis, morphology of char residues and FTIR results demonstrate that stable char layers are formed on the surface of the composites during the combustion, attributing to the catalytic carbonization effect of Fe and phosphorus and the present of cellulose as carbon source. The stable char layers, which can protect the underlying materials from heat and oxygen, play an important role in the flame retardancy enhancement.