The study of hydrogenation effect for the deep levels in GaN epilayers

After the undoped GaN epilayers were grown on (0 0 0 1) sapphire substrates by plasma-assisted molecular beam epitaxy (PAMBE), the photoconductivity (PC) and thermally stimulated current (TSC) measurements have been carried out so as to investigate the hydrogenation and annealing effect of the deep levels. These results indicate that the values of concentrations of the deep levels in the GaN epilayers decrease by the passivation of hydrogenation in both PC and TSC measurements. After hydrogenation, the PC intensity for the hydrogenated GaN epilayer decreased remarkably in comparison with that for the as-grown sample and the TSC peak near 150 K drastically decreased.In the case of PC measurement, the PC intensity for the hydrogenated and annealed GaN epilayer was approximately half that for the hydrogenated only GaN epilayer when the hydrogenated epilayer was annealed at 700°C. This result reveals that the passivation of the deep levels due to the hydrogenation is still effective at the annealing temperature of 700°C. In the case of TSC measurement, the deep levels changed slightly in comparison with that of hydrogenated GaN epilayer when the hydrogenated GaN epilayer was annealed at 600°C for 30 s. This result also shows that the passivation of deep levels due to the hydrogenation is still effective at the annealing temperature of 600°C for 30 s. In considering the above circumstances, these TSC results are in reasonable agreement with the PC results.     

Improved light extraction efficiency of GaN-based LEDs with patterned sapphire substrate and patterned ITO

To improve the light extraction efficiency of GaN-based light-emitting diodes (LEDs), periodic semisphere patterns with 3.5 μm width, 1.2 μm height, and 0.8 μm spacing were formed on sapphire substrate by dry etching using BCl₃/Cl₂ gas chemistry. The indium tin oxide (ITO) transparent conductive layer was patterned by wet etching to reduce the total internal reflection existing along between p-GaN, ITO, and air. At 350 mA injection current, the high power LED by integrating patterned sapphire substrate with patterned ITO technology exhibited a 36.9% higher light output power than the conventional LEDs.     

Influence of growth parameters on the properties of InGaN/GaN multiple quantum well grown by metalorganic chemical vapor deposition

The effects of growth parameters such as barrier growth time, growth pressure and indium flow rate on the properties of InGaN/GaN multiple quantum wells (MQWs) were investigated by using photoluminescence (PL), high resolution X-ray diffraction (HRXRD), and atomic force microscope (AFM). The InGaN/GaN MQW structures were grown on c-plane sapphire substrate by using metalorganic chemical vapor deposition. With increasing barrier growth time, the PL peak energy is blue-shifted by 18 nm. For InGaN/GaN MQW structures grown at different growth pressures, the PL intensity is maximized in the 300 Torr – grown structure, which could be attributed to the improved structural quality confirmed by HRXRD and AFM results. Also, the optical properties of InGaN/GaN MQW are strongly affected by the indium flow rate.     

全息技术制作二维光子晶体蓝宝石衬底提高发光二极管外量子效率

为了提高GaN基发光二极管(LED)的外量子效率,在蓝宝石衬底制作了二维光子晶体.衬底上的二维光子晶体结构采用激光全息技术和感应耦合等离子体(ICP)干法刻蚀技术制作,然后采用金属氧化物化学气相沉积(MOCVD)技术在图形蓝宝石衬底(PSS)上生长2μm厚的n型GaN层,4层量子阱和200nm厚的p型GaN层,形成LED结构.衬底上制作的二维光子晶体为六角晶格结构,晶格常数为3.8μm,刻蚀深度为800nm.LED器件光强输出测试结果显示,在PSS上制作的LED(PSS-LED)的发光强度普遍高于蓝宝石平 关键词： 全息 发光二极管 图形蓝宝石衬底 外量子效率     

Chemical etchant dependence of surface structure and morphology on GaN(0001) substrates

We studied the procedure of cleaning GaN(0001) substrate surfaces by wet etching and subsequent annealing in ultrahigh vacuum for two different types of freestanding GaN wafers: hydride vapor phase epitaxy (HVPE) crystal and Na flux liquid phase epitaxy (LPE) crystal wafers. A flat surface containing GaN(0001)2 × 2 reconstruction was successfully achieved on both HVPE and LPE surfaces by etching in HF and subsequent annealing at ～ 550 °C but was not achieved by etching in HCl, NaOH, and HNO₃.     

Optical properties,luminescence quenching mechanism and radiation hardness of Eu-doped GaN red powder phosphor

We report on the luminescence quenching mechanism of Eu-doped GaN powder phosphor produced with a low-cost, high yield rapid-ammonothermal method. We have studied as-synthesized and acid rinsed Eu-doped GaN powders with the Eu concentration of ～0.5 at.%. The Eu-doped GaN photoluminescence (PL) was investigated with 325 nm excitation wavelength at hydrostatic pressures up to 7.7 GPa in temperature range between 12 K and 300 K. The room temperature integrated Eu³⁺ ion PL intensity from acid rinsed material is a few times stronger than from the as-synthesized material. The temperature dependent PL studies revealed that the thermal quenching of the dominant Eu³⁺ ion transition (⁵D₀ → ⁷F₂) at 622 nm is stronger in the chemically modified phosphor indicating more efficient coupling between the Eu³⁺ ion and passivated GaN powder grains. Furthermore, it was found that thermal quenching of Eu³⁺ ion emission intensity can be completely suppressed in studied materials by applied pressure. This is due to stronger localization of bound exciton on Eu³⁺ ion trap induced by hydrostatic pressure. Furthermore, the effect of 2 MeV oxygen irradiation on the PL properties has been investigated for highly efficient Eu-doped GaN phosphor embedded in KBr–GaN:Eu³⁺ composite. Fairly good radiation damage resistance was obtained for 1.7 × 10¹² to 5 × 10¹³ cm^?2 oxygen fluence. Preliminary data indicate that Eu-doped GaN powder phosphor can be considered for devices in a radiation environment.     

Passivation of GaAs(001) surface by the growth of high quality c-GaN ultra-thin film using low power glow discharge nitrogen plasma source

The benefits of using a low power glow discharge nitrogen plasma source to create high quality GaN layers on GaAs(001) surface are first highlighted. This uncommon type of plasma source has the particularity of working at a low power (3–10 W) and a low pressure (10^? 1 Pa) which induce creation of a small quantity of active nitrogen species. We put in evidence that this distinctiveness allows the growth of a stoichiometric and As-free GaN ultra-thin film on a GaAs(001) substrate by the mean of the inter-diffusion of As and N atoms. XPS, EELS, AFM are used to monitor surface composition and structure changes and to estimate the GaN thickness. A near saturation of the nitride layer thickness versus plasma exposure time is found. Furthermore, the possibility to crystallize the amorphous GaN layer by an annealing at 620 °C in a cubic structure with a lattice parameter close to that of c-GaN is put in evidence by means of TEM and LEED measurements. These measurements also show the homogeneity of the GaN thickness. In addition, the passivating effect of the GaN ultra-thin film to protect the GaAs surface is proved with the monitoring by XPS of the surface oxidation during several days of air exposure.     

The effect of SixNy interlayer on the quality of GaN epitaxial layers grown on Si(1 1 1) substrates by MOCVD

In the present paper, the effects of nitridation on the quality of GaN epitaxial films grown on Si(1 1 1) substrates by metal–organic chemical vapor phase deposition (MOCVD) are discussed. A series of GaN layers were grown on Si(1 1 1) under various conditions and characterized by Nomarski microscopy (NM), atomic force microscopy (AFM), high resolution X-ray diffraction (HRXRD), and room temperature (RT) photoluminescence (PL) measurements. Firstly, we optimized LT-AlN/HT-AlN/Si(1 1 1) templates and graded AlGaN intermediate layers thicknesses. In order to prevent stress relaxation, step-graded AlGaN layers were introduced along with a crack-free GaN layer of thickness exceeding 2.2 μm. Secondly, the effect of in situ substrate nitridation and the insertion of an Si_xN_y intermediate layer on the GaN crystalline quality was investigated. Our measurements show that the nitridation position greatly influences the surface morphology and PL and XRD spectra of GaN grown atop the Si_xN_y layer. The X-ray diffraction and PL measurements results confirmed that the single-crystalline wurtzite GaN was successfully grown in samples A (without Si_xN_y layer) and B (with Si_xN_y layer on Si(1 1 1)). The resulting GaN film surfaces were flat, mirror-like, and crack-free. The full-width-at-half maximum (FWHM) of the X-ray rocking curve for (0 0 0 2) diffraction from the GaN epilayer of the sample B in ω-scan was 492 arcsec. The PL spectrum at room temperature showed that the GaN epilayer had a light emission at a wavelength of 365 nm with a FWHM of 6.6 nm (33.2 meV). In sample B, the insertion of a Si_xN_y intermediate layer significantly improved the optical and structural properties. In sample C (with Si_xN_y layer on Al_0.11Ga_0.89N interlayer). The in situ depositing of the, however, we did not obtain any improvements in the optical or structural properties.     

Fabrication of InGaN/GaN stripe structure on (1 1 1)Si and stimulated emission under photo-excitation

InGaN/GaN QW laser structure was investigated on a GaN trapezoid grown on (1 1 1)Si substrate by selective MOVPE. The dislocation density in the active layer was reduced by a two-step growth method adopting facet controlled epitaxial lateral overgrowth (FACELO). A sample with 350 μm long cavity length showed narrowing of the spectral peak under optical excitation. The compositional non-uniformity originating from the ridge growth on the trapezoid is removed by adopting re-evaporation phenomenon under heat treatment during the growth process.     

CMOS monolithic optoelectronic integrated circuit for on-chip optical interconnection

A monolithic silicon CMOS optoelectronic integrated circuit (OEIC) is designed and fabricated using standard 0.35-μm CMOS technology. This OEIC monolithically integrates light emitting diode (LED), silicon dioxide waveguide, photodetector and receiver circuit on a single silicon chip. The silicon LED operates in reverse breakdown mode and can emit light at 8.5 V. The output optical power is 31.2 nW under 9.8 V reverse bias. The measured spectrum of LED showed two peaks at 760 nm and 810 nm, respectively. The waveguide is composed of silicon dioxide/metal multiple layers. The responsivity of the n-well/p-substrate diode photodetector is 0.42 A/W and the dark current is 7.8 pA. The LED-emitted light transmits through the waveguide and can be detected by the photodetector. Experimental results show that on-chip optical interconnects are achieved by standard CMOS technology successfully.     

Effects of growth temperature modulated by HCl flow rate on the surface and crystal qualities of thick GaN by HVPE

We studied the influence of the growth temperature and HCl flow rate on the morphological evolution of crack-free thick GaN films by using a home-made horizontal hydride vapor phase epitaxy on sapphire substrates. Optical difference microscopy, scanning electron microscopy (SEM), atomic force microscopy (AFM), and cathodoluminescence (CL) were carried out to reveal the surface property of the GaN epilayer. It was found that the higher growth temperature is a key factor to obtain mirror, colorless and flat GaN surface. However, this key effect of temperature was modulated by HCl flow rate (HCl > 15 sccm). The surface RMS roughness was reduced from 206 to 2.51 nm for 10 μm × 10 μm scan area when GaN was grown at 1070 °C with HCl flow rate up to 30 sccm. These samples also reduced their (0 0 0 2) FWHM result from 1000 to 300 arcsec and showed a strong near-band-edge peak in CL spectra. Results indicated that growth temperature influence growth velocities on different crystalline planes, which will lead to the different morphologies obtained. High growth temperature can improve the lateral growth rate of vertical {1 1 ? 2 0} facets and reduce the vertical growth rate of top {0 0 0 1} facet combined with higher HCl flow rate, which leads to completely coalescence of surface.     

Optimization towards reduction of efficiency droop in blue GaN/InGaN based light emitting diodes

Light emitting diodes (LEDs) based on GaN/InGaN material suffer from efficiency droop at high current injection levels. We propose multiple quantum well (MQW) GaN/InGaN LEDs by optimizing the barrier thickness and high–low–high indium composition to reduce the efficiency droop. The simulation results reflect a significant improvement in the efficiency droop by using barrier width of 10 nm and high–low–high indium composition in MQW LED.     

The electronic structures of commensurate Ru(0001)–(3 × 3)–4Kr and Ru(0001)–(5 × 5)–Kr using density functional theory

We have calculated the minimum energies for each of three positionings of the adatom unit cells for Ru(0001)–(3 × 3)–4Kr (high Kr coverage) and for Ru(0001)–(5 × 5)–Kr (low Kr coverage). The differences between the results for the low and high-coverage cases may clarify puzzles posed by the experimental results of Narloch and Menzel. The low-coverage solution converges to a structure having Kr in the top site at a height of 3.09 Å above the substrate with the adsorption energy 185 meV. In the high-coverage case, adatom unit cells with a corner Kr at top, fcc hollow, and hcp hollow locations are found to have nearly the same adsorption energy of 175 meV. The height of the corner atom above the substrate is found to be 3.35, 3.54, and 3.50 Å for the top, fcc hollow and hcp hollow sites, respectively. These results are explained by demonstrating that there is an enhancement of the substrate electronic density of states at krypton orbital energies in the low-coverage case.     

Effect of the substrate pretreatment on the epitaxial growth of indium nitride

The influence of the substrate pretreatment on crystallinity of indium nitride films grown on (1 1 1)GaAs by radio frequency sputtering were investigated. It was shown that the crystalline quality of InN layers grown on GaAs can be improved by presputtering the substrate in nitrogen plasma prior to the growth. By Auger electron spectroscopy and atomic force microscopy analysis we revealed that GaN islands form on the surface of GaAs substrate due to the presputtering. The optimum presputtering time for growing InN single crystal was assessed to be the time at which GaN islands cover the substrate surface entirely.     

Epitaxial ZnO thin films grown by pulsed electron beam deposition

In this work, the pulsed electron beam deposition method (PED) is evaluated by studying the properties of ZnO thin films grown on c-cut sapphire substrates. The film composition, structure and surface morphology were investigated by means of Rutherford backscattering spectrometry, X-ray diffraction and atomic force microscopy. Optical absorption, resistivity and Hall effect measurements were performed in order to obtain the optical and electronic properties of the ZnO films. By a fine tuning of the deposition conditions, smooth, dense, stoichiometric and textured hexagonal ZnO films were epitaxially grown on (0001) sapphire at 700 °C with a 30° rotation of the ZnO basal plane with respect to the sapphire substrate. The average transmittance of the films reaches 90% in the visible range with an optical band gap of 3.28 eV. Electrical characterization reveals a high density of charge carrier of 3.4 × 10¹⁹ cm^?3 along with a mobility of 11.53 cm²/Vs. The electrical and optical properties are discussed and compared to ZnO thin films prepared by the similar and most well-known pulsed laser deposition method.     

Structural,optical and dispersion characteristics of nanocrystalline GaN films prepared by MOVPE

In this work, nanocrystalline GaN film was grown on a c-plane sapphire substrate by metal-organic vapor phase epitaxy (MOVPE). The structural and optical properties of the nanocrystalline GaN thin film were studied. The morphological and structural properties of GaN film were studied by scanning electron microscopy (SEM) and X-ray diffraction (XRD), respectively. According to the X-ray diffraction spectrum, a GaN film was formed with a wurtzite structure, which is the stable phase. The optical parameters were determined using spectrophotometric measurements of transmittance and reflectance in the wavelength range 200–2500 nm. The analysis of the spectral behavior of the absorption coefficient in the intrinsic absorption region reveals a direct allowed transition with a band gap of 3.34 eV. The dispersion of the refractive index is discussed in terms of the single oscillator Wemple–Didomenico (WD) model. The single oscillator energy (E_o), the dispersion energy (E_d), the high frequency dielectric constant (ε_∞), the lattice dielectric constant (ε_L) and the free charge carrier concentration (N) were estimated. From the optical dielectric analysis, the optical conductivity, volume and surface energy loss functions were calculated. Moreover, the third-order nonlinear optical susceptibility χ⁽³⁾ was also considered.     

Optical properties and structural characteristics of ZnO thin films grown on a-plane sapphire substrates by plasma-assisted molecular beam epitaxy

We investigated structural and optical properties of ZnO thin films grown on (112?0) a-plane sapphire substrates using plasma-assisted molecular beam epitaxy. Negligible biaxial stress in ZnO thin films is due to the use of (112?0) a-plane sapphire substrates and slow substrate cooling. The 14 K photoluminescence spectrum shows a blueshift of energy positions compared with ZnO single crystal. A donor with binding energy of 43 meV and an acceptor with binding energy of ～170 meV are identified by well-resolved photoluminescence spectra. A characteristic emission band at 3.320 eV (so-called A-line) is studied. Based on analysis from photoluminescence spectra, the origin of the A-line, it seems, is more likely an (e, A°) transition, in which defect behaves as an acceptor. The room-temperature photoluminescence is dominated by the FX at 3.307 eV, which is an indication of strongly reduced defect density in ZnO thin films.     

Transparent CdO/n-GaN(0001) heterojunction for optoelectronic applications

Undoped CdO films were prepared by sol–gel method. Transparent heterojunction diodes were fabricated by depositing n-type CdO films on the n-type GaN (0001) substrate. Current–voltage (I–V) measurements of the device were evaluated, and the results indicated a non-ideal rectifying characteristic with I_F/I_R value as high as 1.17×10³ at 2 V, low leakage current of 4.88×10⁻⁶ A and a turn-on voltage of about 0.7 V. From the optical data, the optical band gaps for the CdO film and GaN were calculated to be 2.30 eV and 3.309 eV, respectively. It is evaluated that interband transition in the film is provided by the direct allowed transition. The n-GaN (0001)/CdO heterojunction device has an optical transmission of 50–70% from 500 nm to 800 nm wavelength range.     

Wetting and reaction promoted by ultrasound between sapphire and liquid Al–12Si alloy

Ultrasonic-assisted wetting between sapphire bulks and liquid Al–12Si alloy in an atmospheric environment at 620 °C is carried out in this study. Complete, rather than partial, wetting and joining can be achieved with the aid of ultrasound. Growth of epitaxial alumina on sapphire bulks is promoted dramatically during ultrasonic-assisted wetting comparing to that during hot-dipping without ultrasound. XRD results show that the epitaxial alumina is non-crystalline. This indicates that the temperature on the surface of the sapphire substrate is not more than 1200 °C even though the collapse of acoustic cavitation bubbles could theoretically produce extremely high temperature. The bonding force at the interface between the Al–Si alloy and sapphire is strengthened because of the epitaxial alumina. The interfacial shear strength of sapphire/Al–Si alloy can reach as high as 60–65 MPa. The fracture morphology shows that cracks initiated at the interface between Si grains and the epitaxial alumina on sapphire. This result is especially useful for the joining of metals and ceramics.     

Finite barrier width effects on exciton states and optical properties in wurtzite InGaN/GaN quantum well

Exciton states and optical properties in wurtzite (WZ) InGaN/GaN quantum well (QW) are investigated theoretically, considering finite barrier width and built-in electric field effects. Numerical results show that when the barrier width increases, the ground-state exciton binding energy, the interband transition energy and the integrated absorption probability increase first and then they are insensitive to the variation of the barrier width. For any barrier width, the ground-state exciton binding energy and the integrated absorption probability have a maximum when the well width is 1 nm; moreover, the integrated absorption probability goes to zero when the well width is larger than 6 nm. In addition, the competition effects between the built-in electric field and quantum confinement are also investigated in the WZ InGaN/GaN QW.