Curing and Glass Transition of Epoxy Resins from Ester-Carboxylic Acid Derivatives of Mono- and Disaccharides,and Alcoholysis Lignin

Mono- and disaccharides (SAC) such as glucose (Glc), fructose (Frc) and sucrose (Suc), and also alcoholysis lignin (AL) were dissolved in ethylene glycol and each of the obtained mixtures was reacted with succinic anhydride to form a mixture of ester-carboxylic acid derivatives such as SAC-polyacid, SACPA, and AL-polyacid, ALPA. Ethylene glycol-polyacid (EGPA) was also prepared from ethylene glycol. Each of the obtained mixtures of ester carboxylic acid derivatives was reacted with ethylene glycol diglycidyl ether in the presence of a catalytic amount of dimethylbenzylamine to form ester-epoxy resins. The molar ratios of epoxy groups to carboxylic acid groups ([EPOXY]/[ACID] ratios, mol mol⁻¹) was maintained at 1.0. The contents of SACPA and ALPA in the mixtures of SACPA/EGPA, and ALPA/EGPA, respectively, were also varied from 0 to 100 %. The curing reaction of SucPA and ALPA was studied by differential scanning calorimetry (DSC). Activation energy of the curing reaction for the SucPA system was 80.5 kJ/mol. Thermal properties of epoxy resins were studied by DSC. Glass transition temperatures (T_g) decreased with increasing numbers of repeating units in ester chains between cross-linking points, suggesting that ester chain lengths between cross-linking points mainly affect the mobility of ester chains in epoxy resin networks.     

Novel Epoxy Resins Derived from Biomass Components

Biomass has received considerable attention because it is renewable and offers the prospect of circulation of carbon in the ecological system. The concept “Biorefinery” has been developed rapidly in order to establish sustainable industries. Recently, new types of epoxy resins with polyester chains, which can be derived from saccharides, lignin and glycerol, have been investigated. In the above studies, the relationship between chemical structure and physical properties was investigated. In the present review, the features of the preparation system and the action of biomass components in epoxy resin polymer networks are described. The glass transition temperatures of the epoxy resins increased with increasing content of biomass components in epoxy resin polymer networks. Thermal decomposition temperatures were almost constant regardless of the content of biomass components contents in epoxy resins. Mass residue at 500 °C increased with increasing contents of biomass components in epoxy resins. It was found that the thermal properties can be controlled by changing the contents of biomass components.     

Properties of oligomer compositions based on vinylox and ethylene glycol with ED-20 epoxy

The effect of the addition of commercial epoxy-diane resin ED-20 on the properties of the deformation strength and adhesion of epoxy polymers based on vinylox and ethylene glycol within a wide range of temperatures and concentrations is studied. The effect of curing is shown to depend on the concentration of ethylene glycol, temperature, and curing time. Concentration regions where strength and rigidity indices surpass analog parameters of individual components of the mixture are revealed.     

Synthesis and characterization of PEO-PCL-PEO triblock copolymers: effects of the PCL chain length on the physical property of W(1)/O/W(2) multiple emulsions

A series of poly(ethylene glycol)-block-poly(epsilon-caprolactone)-block-poly(ethylene glycol) (PEO-PCL-PEO) triblock copolymers were prepared and then used for the investigation of the effects of the ratio of epsilon-caprolactone to poly(ethylene glycol) (i.e., [CL]/[EO]) on the physical properties of water-in-oil-in-water (W(1)/O/W(2)) multiple emulsions containing a model reagent, ascorbic acid-2-glucoside (AA2G). In the synthesis, the [CL]/[EO] was varied from 0.11 to 0.31. The molecular weights and compositions of PEO-PCL-PEO were determined by GPC and (1)H NMR analyses. Thermal behavior and crystal formation were studied by DSC, XRD, FT-IR, and polarized optical microscopy (POM). Aggregate behavior of PEO-PCL-PEO was confirmed by DLS, UV, and (1)H NMR. Morphology and relative stiffness of the W(1)/O/W(2) multiple emulsions in the presence of PEO-PCL-PEO were studied by confocal laser scanning microscopy (CLSM) and rheometer. Variation in the [CL]/[EO] significantly affects the crystalline temperature and spherulite morphology of PEO-PCL-PEO. As the [CL]/[EO] increases, the CMCs of PEO-PCL-PEO decreases and the slope of aggregate size reduction against the copolymer concentration becomes steeper except for the lowest [CL]/[EO] value of PEO-PCL-PEO (i.e., P-222). P-222 significantly increases the viscosity of continuous (W(2)) phase, which implies the copolymer would exist in the W(2) phase. On the other hand, the triblock copolymers with relatively high [CL]/[EO] ratios mainly contribute to the size reduction of multiple emulsions and the formation of a firm wall structure. The particle size of the multiple emulsion decreases and the elastic modulus increased as [CL]/[EO] increases, confirmed by microscopic and rheometric analyses.     

Studies on the Cure Reaction and Relationship between Network Structure/Thermal Properties of Styrene Copolymers Based on Adypic/Sebacic Acid Modified Unsaturated (Epoxy) Polyesters

The studies on the relationship between network structure/thermal properties of styrene copolymers based on adypic/sebacic acid modified unsaturated (epoxy) polyesters cured using different hardeners as well as the course of the cure reaction of polyesters with styrene have been presented. The adypic/sebacic acid modified unsaturated polyesters (UP) prepared from 4-cyclohexene-1,2-dicarboxylic anhydride (THPA), maleic anhydride (MA), adypic acid (AA) or sebacic acid (SA) and ethylene glycol (EG) and their epoxy derivatives: adypic/sebacic acid modified unsaturated epoxy polyesters (UEP) were subjected to the cure process with styrene using diacyl peroxide: benzoyl peroxide (BPO) or the mixture of BPO/suitable acid anhydride: 4-cyclohexene-1,2-dicarboxylic anhydride (THPA) or glutaric anhydride (GA). Thermal properties were evaluated by means of DSC, TG and DMA analyses. It was proved that studied properties were significantly depended on polyester's structure and the type of applied curing system. Generally, higher values of E'_20°C, tgδ_max, E”, ν_e, IDT, T_k for styrene copolymers based on UEP were obtained. It was connected with more cross-linked polymer network structure due to the possible copolymerization reaction of carbon-carbon double bonds of polyester with styrene and additional polyaddition of epoxy to anhydride groups or thermal curing of epoxy groups. The additional connections between polyester's chains led to obtain more stiff and thermal stable polymeric materials. Moreover, the increase of saturated aliphatic acid's chain length in polyester backbone caused the decrease of E'_20°C, tgδ_max, E”, ν_e, IDT, T_k values of styrene copolymers. It suggested that copolymers based on polyesters prepared from acid containing more methylene groups in their structure were characterized by more flexible polymer network due to the “laxity” effect of aliphatic chains.     

Network build-up and structure in curing of epoxy resins

The available branching theories and their application to curing of epoxy resins are reviewed. Special attention is paid to theoretical treatment and experimental results of curing with polyamines, polyetherification, and to curing with poly(carboxylic acid)s and cyclic anhydrides.     

Flame‐retardant epoxy resins with high glass‐transition temperatures from a novel trifunctional curing agent: Dopotriol

A novel phosphorus‐containing trifunctional novolac (dopotriol) was synthesized through the addition reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide and rosolic acid. The structure of dopotriol was confirmed with NMR spectroscopy and elemental analyses. The dopotriol was blended with phenol novolac in the ratios of 10/0, 8/2, 6/4, 4/6, 2/8, and 0/10 to serve as a curing agent for diglycidyl ether of bisphenol A. Thermal properties, such as the glass‐transition temperature, thermal decomposition temperature, and flame retardancy, moisture absorption, and dielectric properties of the cured epoxy resins were evaluated. The activity and activation energy of curing were studied with the methods of Kissinger and Ozawa by dynamic differential scanning calorimetry scans. The glass‐transition temperatures of the cured epoxy resins were 138–159 °C, increasing with the phosphorus content. This is rarely seen in the literature after the addition of a flame‐retardant element. The flame retardancy increased with the phosphorus content, and a UL‐94 V‐0 grade was achieved with a phosphorus content of 1.87%. Similar dielectric properties and moisture absorption were observed for these phosphorus‐containing epoxy resins, and this implied that the addition of phosphorus to epoxy did not affect the dielectric properties and moisture absorption. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 2862–2873, 2005     

Curing of epoxy oligomers by the eutectic mixture of aromatic amines

Kinetics of curing of structurally different epoxy oligomers (ED-20 and PDI-3AK resins) in a mixture with other low-molecular-weight epoxy oligomers and plasticizers by the eutectic mixture of aromatic amines UP-0638/1 is studied by the DSC method. The activation energy and the heats of curing reactions are determined. It is established that crosslinked epoxy polymers cured at moderate temperatures (40–80°C) are strong moisture-resistant compositions with different mechanical characteristics. Plasicized elastomers based on PDI-3AK resin with glass transition temperatures of ?78 and ?95°C are freeze-and heat-resistant materials.     

A phosphate-based epoxy resin for flame retardance: synthesis, characterization, and cure properties

A phosphorus-containing oligomer, bis(3-hydroxyphenyl) phenyl phosphate (BHPP), was synthesized through the reaction of phenyl dichlorophosphate and 1,3-dihydroxybenzene, and characterized by elemental analysis, Fourier transform IR spectroscopy, and ¹H NMR and ³¹P NMR spectroscopy. Consequently, the phosphate-based epoxy resins with a phosphorus content of 1 and 2 wt % were prepared via the reaction of diglycidyl ether of bisphenol-A with BHPP and bisphenol-A, and were confirmed with Fourier transform IR spectroscopy and gel permeation chromatography. Phenolic melamine, Novolak, and dicyanodiamide were used as curing agents to prepare the thermoset resins with the control and the phosphate-based epoxy resins. Thermal properties and thermal degradation behavior of these thermoset resins were investigated by using differential scanning calorimetry and thermogravimetric analysis. The thermoset resins cured with phenolic melamine exhibited higher glass-transition temperatures than the other cured resins owing to the high rigidity of their molecular chain. Thermogravimetric analysis studies demonstrated that the decomposition temperatures of the thermoset resins cured with Novolak were higher than those of the others. A synergistic effect from the combination of the phosphate-based epoxy resin and the nitrogen-containing curing agent can result in a great improvement of the flame retardance for their thermoset resins.     

Synthesis, characterization, and cure properties of phosphorus-containing epoxy resins for flame retardance

An organophosphorus compound, 10-(2,5-dihydroxyl phenyl)-9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DHPDOPO), was synthesized through the reaction of 9,10-dihydro-9-oxa-10-phosphaphnanthrene-10-oxide (DOPO) and p-benzoquinone, and characterized by elemental analysis, Fourier transform infrared spectrum (FTIR), and ¹H-NMR and ³¹P-NMR spectroscopes. Consequently, the phosphorus-containing epoxy resins with phosphorus content of 1 and 2 wt.% were prepared via the reaction of diglycidyl ether of bisphenol-A with DHPDOPO and bisphenol-A, and confirmed with FTIR and gel permeation chromatography (GPC). Phenolic melamine, novolak, and dicyanodiamide (DICY) were used as curing agents to prepare the thermosetted resins with the control and the phosphorus-containing epoxy resins. Thermal properties and thermal degradation behaviors of these the thermosetted resins were investigated by using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). Phenolic melamine-cured resins exhibited higher glass transition temperatures than the other cured resins due to the high rigidity of their molecular chain. TGA studies demonstrated that the decomposition temperatures of the novolak-cured resins were higher than those of the others. A synergistic effect from the combination of the phosphorus-containing epoxy resin and the nitrogen-containing curing agent can result in a great improvement of the flame retardance for their thermosetted resins.     

Liquid crystalline epoxy resins by polyaddition of aliphatic diepoxides with 4,4′-dihydroxybiphenyl

Liquid crystalline epoxy resins were synthesized from 4,4′-dihydroxybiphenyl (DHB), which was used as a mesogenic component, and diglycidyl ethers of aliphatic glycols (ethylene glycol and 1,6-hexanediol) which were used as flexible spacers. The synthesis was carried out by the catalytic polyaddition in the melt. Triphenylphosphine was used as the catalyst. The course of the polyaddition was investigated at various molecular ratios of the reactants. It was found that both linear and branched structures were formed in the course of the synthesis. The rates of the formation of the structures were calculated. The epoxy oligomers were investigated by DSC, polarizing microscope, and x-ray and IR spectroscopy. The molecular weight distribution was determined by GPC. The dependence of liquid crystalline properties of the obtained epoxy resins on the molecular weight and on the chain length of the flexible spacer was investigated. The molecular weight of the epoxy oligomers and the length of flexible spacer influence the phase transition temperatures. © 1995 John Wiley & Sons, Inc.     

Curing kinetics and thermal stability of diglycidyl ether of bisphenol

Curing kinetics of diglycidyl ether of bisphenol-A (DGEBA) in the presence of varying molar ratios of aromatic imide-amines and 4,4′-diaminodiphenylsulfone (DDS) were investigated by the dynamic differential scanning calorimetry. The imide-amines were prepared by reacting 1 mole of benzophenone 3,3′,4,4′-tetracarboxylic acid dianhydride (B) with 2.5 moles of 4,4′-diaminodiphenyl ether (E)/ or 4,4′-diaminodiphenyl methane (M)/ or 4,4′-diaminodiphenylsulfone (S) and designated as BE/ or BM/ or BS. The mixture of imide-amines and DDS at ratio of 0:1, 0.25:0.75, 0.5:0.5, 0.75:0.25 and 1:0 were used to investigate the curing behaviour of DGEBA. The multiple heating rate method (5, 10, 15 and 20°C min⁻¹) was used to study the curing kinetics of epoxy resins. The peak exotherm temperature was found to be dependent on the heating rate, structure of imide-amines as well as on the ratio of imide-amine: DDS used. A broad exotherm was observed in the temperature range of 180–230°C on curing with mixture of imide-amines and DDS. Curing of DGEBA with mixture of imide-amines and/or DDS resulted in a decrease in characteristic curing temperatures. Activation energy of curing reaction as determined in accordance to the Ozawa’s method was found to be dependent on the structure of amine. The thermal stability of the isothermally cured resins was also evaluated using dynamic thermogravimetry in a nitrogen atmosphere. The char yield was highest in case of resins cured using mixture of DDS: BS (0.25:0.75; EBS-3), DDS: BM (0.5: 0.5; EBM-2) and DDS: BE (0.5: 0.5; EBE-2).     

Silicon-containing flame retardant epoxy resins: Synthesis, characterization and properties

Epoxy resins with different silicon contents were prepared from silicon-containing epoxides or silicon-containing prepolymers by curing with 4,4′-diaminodiphenylmethane. The reactivity of the silicon-based compounds toward amine curing agents was higher than that of the conventional epoxy resins. The T_g of the resulting thermosets was moderate and decreased when the silicon content increased. The onset decomposition temperatures decreased and the char yields increased when the silicon content increased. Epoxy resins had a high LOI value, according to the efficiency of silicon in improving flame retardance.     

Mass spectroscopy of epoxylated novolac resin cured with phthalocyanine tetraamines

Mass spectroscopy was done at different temperatures on epoxylated novolac resin DEN 438 (Dow Chemical Co.) alone, and after curing with various metal(II) phthalocyanine tetraamines (MPTA). Possible modes of fragmentation are given to explain the experimental results. Gas-chromatographic/mass-spectroscopic (GC–MS) analyses of MPTA derivatives indicated the presence of only trace quantities of benzene, aniline, cyanobenzene, and orthodicyanobenzene. The GC–MS studies of the cured DEN 438 epoxy resins indicated that the mechanisms of thermal degradation are qualitatively similar, and some common features were observed in their fragmentation in an electron beam and by thermal degradation. This study is a further assessment of the utility of these phthalocyanine derivatives for curing epoxy resins to produce heat-resistant polymer systems.     

Prediction of Heat Shield Performance in Terms of Epoxy Resin Structure

Abstract

High-strength, readily processable, char-forming, insulative materials are being sought for application in ablative heat shields for re-entry vehicles. Toward this end, the family of epoxy resins has been evaluated. The structure of epoxy resins and curing agents in terms of their functionality, aromaticity, and chemical nature is discussed in relation to its effect on ablative properties. The concept of controlled, constructive thermal degradation is extremely important in ablative epoxide compositions. Bridged Diels-Alder adducts based upon cyclic dienes and maleic anhydride perform well as epoxy resin curing agents in this respect. The mechanism of thermal ablative degradation of these systems is discussed in terms of in situ thermal control and char-forming reactions. The position of attachment of glycidyl groups, as well as the nature and position of other sub-stituents around the aromatic nucleus, has little effect in general upon the ablative properties of epoxy resins. Thermal and ablative data of both benzene and naphthalene derivatives are given. A new epoxy resin based upon 2-nitro resorcinol has been synthesized. This resin gives significant char increases, both quantitatively and qualitatively, over conventional epoxides. The unusual mechanism of polymerization and thermal degradation of this resin is discussed.     

Synthesis,Characterization, Curing and Shape Memory Properties of Epoxy‐Polyether System

Epoxy resins were cured by an amine telechelic poly(tetramethylene oxide) (PTMO). The telechelic amine was synthesized from hydroxy telechelic PTMO and was characterized. The kinetics of curing of epoxy monomer by the polyether amine was studied in detail by differential scanning calorimetry (DSC) and rheology to optimize the cure conditions. The cured epoxy system exhibited shape memory properties where PTMO served as the switching segment. Molar ratios of the epoxy monomer and the amine were varied to get polymers with different compositions. The developed polymers were analyzed by DSC, X‐ray diffraction, and Dynamic Mechanical Thermal (DMTA) analyses. Shape memory property was evaluated by bending tests. As the concentration of epoxy resin increased, the transition temperature (T_trans) increased. The tensile strength and % elongation also increased with epoxy resin‐content. The extent of shape recovery increased with PTMO‐content with a minor penalty in recovery time. The polymer with the maximum PTMO‐content exhibited 99% shape recovery with a recovering time of 12 s.     

Modification of adhesive materials based on epoxy oligomers with fluorinated organic compounds

N-Containing perfluoropentanoic acid derivatives were used as modifying additives to commercial epoxy resins. As shown by differential thermal analysis, the fluorinated organic derivatives exhibit catalytic activity in curing of epoxy resins. The following characteristics of the adhesive compounds in the cured state were determined: degree of swelling, gel fraction content, ultimate shear strength of the adhesive joint, adhesion to low-carbon St.3 steel and AMg-6 aluminum-magnesium alloy, and corrosion-protective properties with respect to these materials.     

Preparation and properties of epoxy resins cured with silyl esters of phenol novolak and cresol novolak

The curing agents of epoxy resin, trimethylsilyl ethers of phenol novolak (TMSPN) and cresol novolak (TMSCN) were prepared by refluxing phenol novolak and cresol novolak respectively, with the mixture of hexamethyldisilazane and chlorotrimethylsilane in THF. The curing reaction of epoxy resin with these curing agents and the thermal properties of cured resins were examined. The Tg values of epoxy resins cured with TMSPN were a little higher than those cured with TMSCN. The maximum of Tg is 118°C for TMSPN-cured epoxy resin against 112°C for TMSPN-cured epoxy resin. The water absorption of hydrophobic epoxy resins cured with TMSPN was a little lower than those cured with TMSCN. The clear decrease of water absorption is attributed to the difficulty of the micro-void formation caused by the more tight primary structures of TMSPN. The water absorption at 25°C containing trimethylsilyl groups is about one-tenth of that of epoxy resins cured with conventional curing agents and even one-half of that of the epoxy resins cured with active esters. The low water absorption is attributed to the presence of trimethylsilyl groups, which are more hydrophobic than ester groups, and to the absence of hydroxyl groups of the cured resins. This revised version was published online in July 2006 with corrections to the Cover Date.     

Peroxidase-catalyzed synthesis of lignin–phenol copolymers

Horseradish peroxidase catalyzes the copolymerization of phenols with kraft lignin in aqueous-organic solvent mixtures. Nearly all of the lignin and over one-third of the phenol (either p-cresol or p-phenylphenol) is incorporated into the copolymer which is highly insoluble in dimethylformamide (DMF), presumably because of crosslinking of lignin molecules via polyphenol bridges. The copolymer consists of 80% lignin, by weight. In the absence of a phenol, lignin is polymerized into a noncrosslinked, DMF-soluble material. Thermal analysis shows that the copolymerization of phenols with lignin results in a material with markedly lower glass transition temperatures and higher (and more uniform) curing exotherms. The materials appear to act as thermosets and may have application as replacements of conventional phenolic resins. © 1993 John Wiley & Sons, Inc.     

Curing Kinetics and Thermal Stability of Diglycidyl Ether of Bisphenol‐A Using Mixtures of Heterocyclic Derivatives of Stannanes and 4,4′‐Diaminodiphenylsulfone

Curing kinetics of diglycidyl ether of bisphenol-A (DGEBA) in the presence of varying molar ratios of derivatives of stannanes to 4,4'-diaminodiphenylsulfone (DDS) was investigated by the dynamic differential scanning calorimetry. The derivatives were synthesized by reacting 1 mole of biguanide (B) with 1 mole of phenylethyltindihydride (PETH) or phenylmethyltindihydride (PMTH) or phenylbutyltindihydride (PBTH) and designated as BPETH or BPMTH or BPBTH respectively. These derivatives were characterized by elemental analysis and spectroscopic techniques such as IR, ¹H NMR, ¹³C NMR and ¹¹⁹Sn NMR. The mixtures of these derivatives to DDS at ratios of 0∶1, 0.25∶0.75, 0.5∶0.5, 0.75∶0.25 and 1∶0 were used to investigate the curing behaviour of DGEBA. The multiple heating rate method (5, 10, and 15 and 20 ℃•min^－1) was used to study the curing kinetics of epoxy resins. The thermal stability of the isothermally cured resins was also evaluated using dynamic thermogravimetry in a nitrogen atmosphere.