Organic/inorganic hybrid epoxy nanocomposites based on octa(aminophenyl)silsesquioxane

Octa(aminophenyl)silsesquioxane (OAPS) was used as the curing agent of diglycidyl ether of bisphenol-A (DGEBA) epoxy resin. A study on comparison of DGEBA/OAPS with DGEBA/4,4′-diaminodiphenyl sulfone (DDS) epoxy resins was achieved. Differential scanning calorimetry was used to investigate the curing reaction and its kinetics, and the glass transition of DGEBA/OAPS. Thermogravimetric analysis was used to investigate thermal decomposition of the two kinds of epoxy resins. The reactions between amino groups and epoxy groups were investigated using Fourier transform infrared spectroscopy. Scanning electron microscopy was used to observe morphology of the two epoxy resins. The results indicated that OAPS had very good compatibility with DGEBA in molecular level, and could form a transparent DGEBA/OAPS resin. The curing reaction of the DGEBA/OAPS prepolymer could occur under low temperatures compared with DGEBA/DDS. The DGEBA/OAPS resin didn’t exhibit glass transition, but the DGEBA/DDS did, which meant that the large cage structure of OAPS limited the motion of chains between the cross-linking points. Measurements of the contact angle indicated that the DGEBA/OAPS showed larger angles with water than the DGEBA/DDS resin. Thermogravimetric analysis indicated that the incorporation of OAPS into epoxy system resulted in low mass loss rate and high char yield, but its initial decomposition temperature seemed to be lowered.     

Curing kinetics of bio-based epoxy resin-toughened DGEBA epoxy resin blend

In the present study, TEIA bioresin was blended with the diglycidyl ether bisphenol A (DGEBA) epoxy resin in different ratios (i.e. 10, 20, 30, 40 mass%), cured with methylhexahydrophthalic anhydride curing agent in the presence of 2-methylimidazole catalyst. The optimized composition of DGEBA and TEIA bioresin blends system was employed as an adhesive strength. The adhesive strength of the TEIA-modified DGEBA epoxy resin blend system was increased from 4.14 to 6.31 MPa on an aluminium substrate compared to the DGEBA epoxy resin. The curing kinetics of non-isothermal, DGEBA epoxy resin and its bio-based blend systems were investigated employing differential scanning calorimetry. An increase in the peak temperature and reduction in a heat of curing as well as activation energy in DGEBA epoxy resin were observed with the addition of TEIA bioresin content. The activation energy (E_a) of the DGEBA resin and their bio-based blend system were obtained from Kissinger and Flynn–Wall–Ozawa methods.

     

Studies on the curing behaviour of bismaleimides and epoxy-resin blends

This paper describes the effect of diglycidyl ether of bisphenol A (DGEBA) on the curing behaviour of a chain-extended bismaleimide resin. 4,4'-Bismaleimidophenyl sulfone (BS) resin was treated with 4,4'-diaminodiphenyl ether or 4,4'-diaminodiphenyl methane to yield BS-M and BS-E resins which were then solution-blended with DGEBA containing stoichiometric amounts of amine as hardener. A decrease in the curing temperature of BS-M or BS-E was observed on blending with DGEBA. The thermal stability of the cured resin was reduced on blending.     

Curing behavior and kinetics of epoxy resins cured with liquid crystalline curing agent

This article describes the synthesis of a liquid crystalline curing agent 4,4′-bis-(4-amine-butyloxy)-biphenyl (BABB), and its application as a curing agent for the epoxy resin (DGEBA) in comparison with normal curing agent, 4,4′-diaminobiphenyl (DABP). BABB was investigated with polarized optical microscopy, differential scanning calorimetry, and small-angle X-ray scatting, and the results showed that BABB displayed smectic liquid crystalline phase. The curing behaviors of DGEBA cured with BABB and DABP were studied by using differential scanning calorimetry (DSC), polarized optical microscopy (POM), and dynamic mechanical analysis (DMA). The results indicated that BABB showed a higher chemical reactivity than DABP. The kinetics was studied under isothermal conditions using an isoconversional method, and the isothermal DSC data can be fitted reasonably by an autocatalytic curing model. The nematic droplet texture was observed for the resulting polymer network of DGEBA/BABB system, while the DGEBA/DABP system showed an isotropic state. The storage modulus of DGEBA/BABB system was enhanced in comparison with DGEBA/DABP system because of the formation of LC phase, whereas the glass transition temperatures decreased because of the introduction of flexible spacer group.     

Copolymerization of diglycidyl ether of bisphenol A with γ‐butyrolactone catalyzed by ytterbium triflate: Shrinkage during curing

Diglycidyl ether of bisphenol A (DGEBA) was cured with γ‐butyrolactone (γ‐BL) with ytterbium triflate as a catalyst. The curing was studied with differential scanning calorimetry, Fourier transform infrared (FTIR), and thermomechanical analysis. FTIR studies confirmed that four elemental reactions took place during the curing process: the formation of a spiroorthoester (SOE) by the reaction of DGEBA with γ‐BL, the homopolymerization of SOE, the homopolymerization of DGEBA, and the copolymerization of SOE and DGEBA. Moderate proportions of γ‐BL produced materials with higher glass‐transition temperatures, and the curing occurred with lower shrinkage after gelation because of the polymerization of SOE, with near‐zero shrinkage during the final stages of the curing. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2794–2808, 2003     

Epoxy resins. II. The preparation,characterization, and curing of epoxy resins and their copolymers

A polymer with high aromatic ring content in the chain backbone usually has high heat and flame resistance. Three diglycidyl ethers of epoxy resins were prepared from bisphenol A (DGEBA), phenolphthalein (DGEPP), and 9,9-bis(4-hydroxyphenyl)fluorene (DGEBF) in a study of the relation between the cured polymer structure and properties. The epoxy resin prepared from phenolphthalein was separated by liquid chromatography and three fractions were obtained. The fractions had a basic structure of 3,3-disubstituted phthalide and differed only in molecular weight. The DGEPP resin changed color from yellow to red after mixing with trimethoxyboroxine (TMB), the curing agent, and to orange after completing the curing cycle. To prepare a highly crosslinked material with good thermal stability, TMB with three active Lewis sites in a molecule was used as the curing agent. The reactivity of the three different resins toward TMB, measured by differential scanning calorimetry (DSC), was DGEBA > DGEBF > DGEPP. For the same curing conditions the order of crosslink density was DGEBA > DGEPP > DGEBF. To modify the flammability of DGEBA, the conventional epoxy resin, it was copolymerized with DGEPP and DGEBF, the higher-performance epoxy resins. The glass transition temperatures of poly(DGEBA-co-DGEPP) and poly(DGEBA-co-DGEBF) systems deviated from this relationship. The DGEBF copolymers showed an increased char residue (40 wt % at 700°C) at 20 mole % of DGEBF. This deviation may be due to the lower crosslinking density of this system.     

2－乙基－4－甲基咪唑固化环氧树脂的固化反应机理、动力学及其反应活性

本文应用ＤＳＣ和ＦＴＩＲ对２－乙基－４－甲基咪唑固化双酚Ａ二缩水甘油醚型环氧树脂体系的固化反应机理和２－乙基－４－甲基咪唑固化双酚Ａ二缩水甘油醚型、缩水甘油酯与脂环型环氧树脂体系的固化反应特征、动力学及其反应活性进行了研究．结果表明，双酚Ａ二缩水甘油醚型环氧树脂／咪唑体系的固化反应是分两步独立进行的，第一步是加成反应，第二步是催化聚合反应．缩水甘油酯与脂环型环氧树脂（ＴＤＥ－８５）／咪唑体系的固化反应过程也分两步进行，第一阶段反应主要是缩水甘油酯型环氧基进行的加成反应和催化聚合反应，第二阶段主要是脂环型环氧基进行的加成反应．各体系第一阶段的表现反应活化能均低于第二阶段活化能．当ＴＤＥ－８５型环氧树脂中引入缩水甘油醚型环氧树脂后，固化反应速率均较ＴＤＥ－８５环氧树脂单独固化时快．     

Curing and thermomechanical properties of off-stoichiometric anhydride–epoxy thermosets

In the present work, we report the preparation and characterization of a new family of thermosets based on off-stoichiometric anhydride–epoxy formulations in the presence of an anionic initiator. Diglycidyl ether of bisphenol A (DGEBA) and hexahydro-4-methylphthalic anhydride (HHMPA) have been used as epoxy and anhydride comonomers, respectively, and 1-methylimidazole (1MI) has been used as anionic initiator. The isothermal curing kinetics and the thermal properties of the stoichiometric and the off-stoichiometric systems have been compared. The kinetics of the isothermal curing has been analyzed by differential scanning calorimetry (DSC) using an isoconversional method and the ?esták–Berggren equation to determine the activation energy, the frequency factor and the reaction orders. The materials obtained were characterized by DSC and dynamic mechanical analysis. Gelation during epoxy–anhydride condensation was determined by thermomechanical analysis. At the same curing temperature, the reaction is faster in the system with excess of epoxy groups. However, the glass transition temperatures of the partially cured stoichiometric system are greater. The gelation time of the off-stoichiometric system is shorter than that of the stoichiometric one. The results indicate that the dual-curing character of off-stoichiometric DGEBA/HHMPA thermosets with 1MI as anionic initiator makes them suitable for multistage curing processes with easy control of degree of cure and material properties in the intermediate stage and enhanced final material properties.

     

Novel urethane/epoxy resin hybrid materials using a moisture‐curing system

Novel curing systems of a urethane/epoxy resin [diglycidyl ether of bisphenol A (DGEBA)] alloy using the moisture‐latent hardener ketimine (K‐systems) were investigated on the DGEBA‐rich side and were compared with aromatic diamine curing systems (A‐systems). Almost all the added DGEBA was separated from the polyurethane matrix and dispersed as 2–10‐μm‐diameter particles after curing in the A‐systems. Therefore, DGEBA did not act as a reinforcing agent for the polyurethane matrix. However, 50% of the added DGEBA was dispersed as particles with a diameter of 1–4 μm, and the other 50% was incorporated into the polyurethane matrix in the novel K‐systems. Therefore, the polyurethane matrix in the K‐systems should be reinforced effectively by both incorporated and finely dispersed DGEBA and should result in significant improvements in the stress–strain properties. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 1137–1144, 2004     

Controlled shrinkage polymers: Characterization of epoxy resins cured with spirobislactones

The diglycidyl ether of bisphenol A (DGEBA) was cured with either an aliphatic or an aromatic spirobislactone using a tertiary amine catalyst. The products were characterized by FTIR, TGA, DSC, dilatometry, and single-fiber adhesion measurements, and their performance was compared to that of DGEBA cured with acid anhydrides. Both aliphatic and aromatic bislactones are effective curing agents for DGEBA. FTIR and dilatometry confirm that both lactone rings open early in the curing reaction and initially offset shrinkage caused by polymerization. After the bislactone has been consumed, oxirane reactions proceed in a normal fashion. The final shrinkage of cured DGEBA polymers, with or without addition of bislactones, is 3.0–3.5%. Bislactone-modified materials possess superior thermal properties, when compared to those of anhydride-cured materials.     

Crosslinking of mixtures of DGEBA with 1,6-dioxaspiro[4.4]nonan-2,7-dione initiated by tertiary amines, Part II: Thermo-mechanical properties and reworkability

The copolymerization of a DGEBA epoxy resin and a bislactone was studied using different anionic initiators. In the previous work, the kinetics of the process was studied and the differences were observed which could affect the thermal and mechanical properties of the materials. In the present work, the thermo-mechanical properties of these materials have been investigated. An important influence of the final curing temperature on the thermal properties of the materials was detected. The addition of bislactone improved the thermal degradation of the materials due to the introduction of ester groups into the network, which in turn allowed partial or complete recovery and reworkability of the coated material via hydrolysis of the thermoset. In addition, the materials exhibited superior flexibility and toughness, in comparison to the pure DGEBA material.     

Superposition of dynamic mechanical properties in the glassy state

Superposition of the loss tangent curves could be achieved for the β-transition of a series of homologous epoxy resins. It was found that both a vertical and horizontal shift were necessary to achieve superposition when the curves were plotted as the logarithm of the loss tangent versus reciprocal absolute temperature. Resins from the diglycidyl ether of bisphenol A (DGEBA) were prepared with five different curing agents and their loss tangent curves measured on a free-oscillation torsion pendulum (ca. 1 cps). The β transition is caused by DGEBA, which was found via molecular models to contain a mobile group. The intensity of the loss for three of the resins was found to be proportional to the concentration of DGEBA, molecular models revealing that no additional mobile groups were introduced by these curatives. The remaining two curing agents introduced mobile groups into their systems and for these two, no separate transitions were identified but the intensity of the DGEBA β transition was increased. This may be caused by a coupling of the DGEBA mobile groups through the flexibility of the curative-introduced mobile groups.     

Evaluation of furfurylamines as curing agents for epoxy resins

Epoxy resin adhesives are widely used because of their strength, versatility, and ability to bond a variety of substrates. Furfurylamines represent a potential, new class of epoxy curing agents. Furfuryl amine (FA), tetrahydrofurfuryl amine (THFA), and 5,5′-methylenebis-2-furanmethanamine (DFA) were studied as possible epoxy curing agents. The utility of FA and THFA are limited by their volatility at the temperatures needed to effect cure of diglycidyl-ether of bisphenol A (DGEBA) based epoxy resins. DFA is a very effective epoxy curing agent with the ability to cure DGEBA at rates similar to that of standard epoxy curing agents such as liethylenetriamine.     

Novel,environmentally friendly crosslinking system of an epoxy using an amino acid: Tryptophan‐cured diglycidyl ether of bisphenol A epoxy

Tryptophan, an amino acid, has been used as a novel, environmentally friendly curing agent instead of toxic curing agents to crosslink the diglycidyl ether of bisphenol A (DGEBA) epoxy resin. The curing reaction of tryptophan/DGEBA mixtures of different ratios and the effect of the imidazole catalyst on the reaction have been evaluated. The optimum reaction ratio of DGEBA to tryptophan has been determined to be 3:1 with 1 wt % catalyst, and the curing mechanism of the novel reaction system has been studied and elucidated. In situ Fourier transform infrared spectra indicate that with the extraction of a hydrogen from NH₃⁺ in zwitterions from tryptophan, the formed nucleophilic primary amine and carboxylate anions of the tryptophan can readily participate in the ring‐opening reaction with epoxy. The secondary amine, formed from the primary amine, can further participate in the ring‐opening reaction with epoxy and form the crosslinked network. The crosslinked structure exhibits a reasonably high glass‐transition temperature and thermal stability. A catalyst‐initiated chain reaction mechanism is proposed for the curing reaction of the epoxy with zwitterion amino acid hardeners. The replacement of toxic curing agents with this novel, environmentally friendly curing agent is an important step toward a next‐generation green electronics industry. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 45: 181–190, 2007     

Curing and pyrolysis of epoxy resins containing 2-(6-oxido-6<Emphasis Type="Italic">H</Emphasis>-dibenz(<Emphasis Type="Italic">c</Emphasis>,<Emphasis Type="Italic">e</Emphasis>)(1,2)oxaphosphorin-6-yl)-1,4-naphthalenediol or bisphenol S

This work examines the curing kinetics, thermal properties, and decomposition kinetics of diglycidyl ether of bisphenol A (DGEBA) epoxies with three different curing agents, 2-(6-oxido-6H-dibenz(c,e)(1,2)oxaphosphorin-6-yl)-1,4-naphthalenediol (ODOPN), bisphenol A (BPA), and bisphenol S (BPS). The differential scanning calorimetry curing study reveals that the curing kinetics of the DGEBA/ODOPN epoxy is first order, independent of the scan rate. The ODOPN-containing epoxy, unlike the conventional BPA one, includes a phosphorus-containing bulky pendant aromatic group and results in an increase in the glass-transition temperature of 83 K, the char yield increases by a factor of 3, and the limiting oxygen index values increase from 23 to 27. For the BPS system, the glass-transition temperature increased slightly, and both the char yield and the limiting oxygen index value increased insignificantly when the test was conducted in air. Finally, the thermogravimetric analysis decomposition study in N₂ from Ozawa's analysis demonstrates that the DGEBA/BPS epoxy has the highest activation energy, followed by the regular DGEBA/BPA system, and lastly the DGEBA/ODOPN has the lowest activation energy. The low activation energy for the ODOPN system is attributed to the initial decomposition of the phosphorus compound in the formation of an insulating layer.     

Effect of a hyperbranched polymer over the thermal curing and the photocuring of an epoxy resin

In this study, the authors study by calorimetry the influence of hyperbranched polyester Boltron^®H40 on the thermal curing and the photocuring of a diglycidyl ether of bisphenol epoxy resin (DGEBA) using ytterbium (III) trifluoromethanesulfonate and triarylsulfonium hexafluorantimonate as thermal and photo cationic initiators, respectively. In the dynamic thermal curing at different heating rates, the authors have seen a decelerating effect when H40 is added to DGEBA, the system with 10% of H40 being the slowest. An isoconversional method has been used to determine the apparent activation energy of the thermal curing. In the isothermal photocuring at low temperatures, the authors have also appreciated a decelerating effect on adding H40, obtaining a minimum conversion when the H40 proportion is 15%. However, at high temperatures, the photocuring process can be accelerated at the first part of this process. This behavior is a consequence of the temperature dependence of H40 solubility in DGEBA, the viscosity of the system, and the hydroxyl-induced chain-transfer reaction. The values found of the maximum glass transition temperature in the thermal curing and in the photocuring, show that H40 is not completely solubilized in the reacted system.     

Cure Kinetics of DGEBA with Hyperbranched Poly （3-hydroxyphenyl） Phosphate as Curing Agent Studied by Non-isothermal DSC

IntroductionEpoxy resins are widely used in the fields of coa-tings,adhesives,insulating materials,etc..Diglycidylether of bisphenol A(DGEBA)is the most importantepoxy resin in industry because of its fluidity,physicaland mechanical properties after cure,…     

Epoxy/poly(benzyl methacrylate) blends: miscibility, phase separation on curing and morphology

Diglycidyl ether of bisfenol-A (DGEBA)/polybenzyl methacrylate (PBzMA) blends cured with 4,4’-diaminodiphenylmethane (DDM) were studied. Miscibility, phase separation, cure kinetics and morphology were investigated through differential scanning calorimetry (DSC) and scanning electron microscopy (SEM). Non-reactive DGEBA/PBzMA blends are miscible over the whole composition range. The addition of PBzMA to the reactive (DGEBA+DDM) mixture slows down the curing rate, although the reaction mechanism remains autocatalytic. On curing, initially miscible (DGEBA+DDM)/PBzMA blends phase separate, arising two glass transition temperatures that correspond to a PBzMA-rich phase and to epoxy network. Cured epoxy/PBzMA blends present different morphologies as a function of the PBzMA content.     

Study of cure kinetics of epoxy-silica organic-inorganic hybrid materials

Cure kinetics of organic-inorganic hybrids based on epoxy resin was investigated, using differential scanning calorimetry (DSC). Thermoset hybrid materials were prepared from diglycidyl ether of bisphenol A (DGEBA) as organic precursor, and 3-glycidyloxypropyltrimethoxysilane (GLYMO) as inorganic precursor. Precursors were polymerised simultaneously using poly(oxypropylene)diamine (Jeffamine D230) as a curing agent. Isothermal DSC characterisation of DGEBA/Jeffamine system and two hybrid DGEBA/GLYMO/Jeffamine systems, with DGEBA and GLYMO mixed in mass ratios of 2:1 and 1:1, respectively, was performed at different temperatures. Applicability of empirical models, commonly used to describe the curing kinetics of thermosets, to hybrid systems was investigated, and the resulting parameters were tested on dynamic DSC scans. Additionally, prepared materials were studied by FTIR and the extraction in tetrahydrofuran. The presence of inorganic phase was found to hinder complete cross-linking of organic phase and influence the kinetics of cure.     

Effect of structure on thermal behaviour of epoxy resins

The paper deals with the curing behaviour of diglycidyl ether of bisphenol-A (DGEBA) using three novel multifunctional aromatic amines having phosphine oxide and amide-acid linkages. The amines were prepared by reacting tris(3-aminophenyl)phosphine oxide (TAP) with 1,2,4,5-benzenetetracarboxylic acid anhydride (P)/4,4^′-(hexafluoroisopropylidene)diphthalic acid anhydride (F)/3,3^′,4,4^′-benzophenonetetracarboxylic acid dianhydride (B). Amide-acid linkage in these amines is converted to thermally stable imide linkage during curing reaction. Curing temperatures of DGEBA were higher with phosphorylated amines than the conventional amine 4,4^′-diamino diphenyl sulphone (D). A decrease in initial decomposition temperature and higher char yields were observed when phosphorus containing amide-acid amines were used as curing agents for DGEBA.