A new criterion for mixed mode fracture initiation based on the crack tip plastic core region

In this work, we propose a new criterion for mixed mode I-II crack initiation angles based on the characteristics of the plastic core region surrounding the crack tip. The shape and size of the plastic core region are thoroughly analyzed under different loading conditions and a new formulation for the non-dimensional variable radius of the core region is presented for mixed mode (K_I−K_II) fracture. The proposed criterion states that the crack extends in the direction of the local or global minimum of the plastic core region boundary depending on the resultant stress state at the crack tip. The results show a well-defined correlation between the plastic core region characteristics and crack extension angles predicted by other criteria. The proposed criterion is formulated for various loading conditions and is compared with other available criteria against the limited available experimental data. It is shown that the proposed criterion provides a better agreement with the experimental data.     

A novel method in determination of dynamic fracture toughness under mixed mode I/II impact loading

The objective of this paper is to propose a novel methodology for determining dynamic fracture toughness (DFT) of materials under mixed mode I/II impact loading. Previous experimental investigations on mixed mode fracture have been largely limited to qusi-static conditions, due to difficulties in the generation of mixed mode dynamic loading and the precise control of mode mixity at crack tip, in absence of sophisticated experimental techniques. In this study, a hybrid experimental–numerical approach is employed to measure mixed mode DFT of 40Cr high strength steel, with the aid of the split Hopkinson tension bar (SHTB) apparatus and finite element analysis (FEA). A fixture device and a series of tensile specimens with an inclined center crack are designed for the tests to generate the components of mode I and mode II dynamic stress intensity factors (DSIF). Through the change of the crack inclination angle β (=90°, 60°, 45°, and 30°), the K_II/K_I ratio is successfully controlled in the range from 0 to 1.14. A mixed mode I/II dynamic fracture plane, which can also exhibit the information of crack inclination angle and loading rate at the same time, is obtained based on the experimental results. A safety zone is determined in this plane according to the characteristic line. Through observation of the fracture surfaces, different fracture mechanisms are found for pure mode I and mixed mode fractures.     

Fracture mechanical assessment of interface cracks with contact zones in piezoelectric bimaterials under thermoelectromechanical loadings: I. Electrically permeable interface cracks

An electrically permeable interface crack with a frictionless contact zone at the right crack tip between two semi-infinite piezoelectric spaces under the action of a remote electromechanical loading and a temperature flux is considered. Assuming that all fields are independent on the coordinate x₂ co-directed with the crack front, the stresses, the electrical and the temperature fluxes as well as the derivatives of the jumps of the displacements, the electrical potential and the temperature at the interface are presented via a set of analytic functions in the (x₁,x₃)-plane with a cut along the crack. Due to this representation firstly an auxiliary problem concerning the direction of the heat flux permitting a transition from a perfect thermal contact to a separation has been solved for a piezoelectric bimaterial. Besides, an inhomogeneous combined Dirichlet–Riemann boundary value problem has been formulated and solved exactly for the above mentioned interface crack. Stress and electrical displacements intensity factors are found in a clear analytical form which is especially easier for a small contact zone length. A simple equation and a closed form analytical formula for the determination of the real contact zone length have been derived and compared with the associated equation of the classical (oscillating) interface crack model defining the zone of crack faces interpenetration. For a numerical illustration of the obtained results a bimaterial cadmium selenium/glass has been used, and the influence of the heat flux upon the contact zone length and the associated stress intensity factor has been shown.     

A statistical model of brittle fracture by transgranular cleavage

A model for brittle fracture by transgranular cleavage cracking is presented based on the application of weakest link statistics to the critical microstructural fracture mechanisms. The model permits prediction of the macroscopic fracture toughness, K_Ic, in single phase microstructures containing a known distribution of particles, and defines the critical distance from the crack tip at which the initial cracking event is most probable. The model is developed for unstable fracture ahead of a sharp crack considering both linear elastic and nonlinear elastic (“elastic/plastic”) crack tip stress fields. Predictions are evaluated by comparison with experimental results on the low temperature flow and fracture behavior of a low carbon mild steel with a simple ferrite/grain boundary carbide microstructure.     

Electrical nonlinear anti-plane shear crack in a functionally graded piezoelectric strip

The electrical nonlinear behavior of an anti-plane shear crack in a functionally graded piezoelectric strip is studied by using the strip saturation model within the framework of linear electroelasticity. The analysis is conducted on the electrically unified crack boundary condition with the introduction of the electric crack condition parameter that can describe all the electric crack boundary condition in accordance with the aspect ratio of an ellipsoidal crack and the permittivity inside the crack, in particular, including traditional permeable and impermeable crack boundary conditions. The resulting mixed boundary value problem is analysed and near tip field is obtained by using the integral transform techniques. Numerical results for the normalized five kinds of energy release rates under the small scale electric saturation condition are presented and compared to show the influences of the electric crack condition parameter with the variation of the ellipsoidal crack parameters, electric loads, functionally graded piezoelectric material gradation, crack length, electromechanical coupling coefficient, and crack location. It reveals that there are considerable differences between the results obtained from the traditional electric crack models and those obtained from the current unified crack model.     

Anti-plane shear crack normal to and terminating at the interface of two bonded piezoelectric ceramics

The electroelastic analysis of two bonded dissimilar piezoelectric ceramics with a crack perpendicular to and terminating at the interface is made. By using Fourier integral transform, the associated boundary value problem is reduced to a singular integral equation with generalized Cauchy kernel, the solution of which is given in closed form. Results are presented for a permeable crack under anti-plane shear loading and in-plane electric loading. Obtained results indicate that the electroelastic field near the crack tip in the homogeneous piezoelectric ceramic is dominated by a traditional inverse square-root singularity, while the electroelastic field near the crack tip at the interface exhibits the singularity of power law r^−α, r being distance from the interface crack tip and α depending on the material constants of a bi-piezoceramic. In particular, electric field has no singularity at the crack tip in a homogeneous solid, whereas it is singular around the interface crack tip. Numerical results are given graphically to show the effects of the material properties on the singularity order and field intensity factors.     

Theoretical and experimental studies in fracture mechanics of crack-like defects under biaxial loading

It is a common point of view in fracture mechanics that, for any geometry of the body with a crack and any boundary conditions for the loading acting in the body plane, the stress and displacement components near the crack tip can be approximated in the framework of the theory of elasticity by a one-parameter or one-term representation, i.e., strictly in terms of the stress intensity coefficients K _I and K _II for an arbitrary failure crack [1, 2]. The authors of [2] specified the Westergaard function of the singular solution for a central crack under the biaxial loading of a plate. This approximate two-component solution has satisfactory accuracy. It is clear from [2] that this method cannot be admitted as a general statement [1], although it has long been assumed to be correct. The cause is that one cannot reasonably justify neglecting the second term in the Williams representation of the stress components in the plane case in the form of eigenfunction series; the contribution of this term in the rectangular coordinate system x, y is independent of the distance from the crack tip. This method may result in a serious mistake, from both the qualitative and quantitative viewpoints, in the prediction of local stresses, displacements, and related variables that are of interest. Apparently, this can best be demonstrated by an example of biaxial loading of a plate with a crack [1]. The unfounded neglect of the second term (whose contribution is independent of the distance from the crack tip) in the series representing the stress components is the source of the above-mentioned difficulties. In this problem, the influence of the load applied in the direction parallel to the crack plane manifests itself only in the second term of the series [3]. Therefore, this term should be clearly determined and studied in detail in the case of technological welding defects (faulty fusions, incomplete fusions, undercuts, and slag inclusions) and crack-like defects (scratches and cuts) in the base metal. The influence of the stress σ _OX along the crack axis on the stress tensor σ _x , σ _y , τ _xy and on the displacements u _x and u _y is confirmed by experimental studies of cracks by the photoelasticity method [4].     

A phase field model of electromechanical fracture

Structural reliability analyses of piezoelectric solids need the modeling of failure under coupled electromechanical actions. However, the numerical simulation of failure due to fracture based on sharp crack discontinuities may suffer in situations with complex crack topologies. This can be overcome by a diffusive crack modeling based on the introduction of a crack phase field. In this work, we develop a framework of diffusive fracture in piezoelectric solids. We start our investigation with the definition of a crack surface functional of the phase field that Γ-converges for vanishing length-scale parameter to a sharp crack topology. This functional provides the basis for the definition of suitable dissipation functions which govern the evolution of the crack phase field. Based on experimental results available in the literature, we suggest a non-associative dissipative framework where the fracture phase field is driven by the mechanical part of the coupled electromechanical driving force. This accounts for a hierarchical view that considers (i) the decrease of stiffness due to mechanical rupture as the primary action that is followed by (ii) the decrease of electric permittivity due to the generated free space. The proposed definition of mechanical and electrical parts of the fracture driving force follows in a natural format from a kinematic assumption, that decomposes the total strains and the total electric field into energy-enthalpy-producing parts and fracture parts, respectively. Such an approach allows the insertion of well-known anisotropic piezoelectric storage functions without change. We end up with a three-field-problem that couples the displacement with the electric potential and the fracture phase field. The latter is governed by a micro-balance equation, which appears in a very transparent form in terms of a history field containing a maximum fracture source obtained in the time history of the electromechanical process. This representation allows the construction of a very robust algorithmic treatment based on a operator split scheme, which successively updates in a typical time step the history field, the crack phase field and finally the two piezoelectric fields. The proposed model is considered to be the canonically simple scheme for the simulation of diffusive electromechanical crack propagation in solids. We demonstrate its modeling capacity by means of representative numerical examples.     

Dynamic mechanical and fracture properties of an infiltrated TiC-1080 steel cermet

The dynamic mechanical and fracture properties of a TiC porous network infiltrated with1080 steel are reported. Following infiltration, the cermet is subjected to various heat treatments that affect essentially the steel matrix. Dynamic compression tests show that the heat treatments increase the fracture strength of the cermet. The quasi-static fracture toughness (K_Ic) is also increased by the heat treatments. The dynamic (initiation) fracture toughness (K_Id) is substantially higher (by about a factor of 3) than its static counterpart. Failure mechanisms consist mainly of cleavage of the TiC and matrix grains, along with minor interfacial decohesion. However, dynamic loading induces substantial damage around the crack tip, consisting essentially of cleavage of TiC grains. Microcrak toughnening is believed to be responsible for the high dynamic toughness of the material. The critical microstructural fracture event is thus identified as the spreading of TiC cleavage microcracks into the neighboring steel grains.     

A mode III crack in a piezoelectric semiconductor of crystals with 6 mm symmetry

A finite mode III crack in a piezoelectric semiconductor of 6 mm crystals is analyzed. Fourier transform is employed to reduce the mixed boundary value problem to a pair of dual-integral equations. Numerical solution of these equations yields coupled electromechanical fields, the intensity factor and the energy release rate near the crack tip. Numerical results are presented graphically to show the fracture behavior which is affected by the semiconduction.     

In-plane and out-of-plane constraint effects under pressurized thermal shocks

Transferability of fracture toughness data obtained on small scale specimens to a full-scale cracked structure is one of the key issues in integrity assessment of engineering structures. In order to transfer fracture toughness under different constraints, both in-plane and out-of-plane constraint effect should be considered for the specimens and structures. In this paper both in-plane and out-of-plane constraint effects of a crack in a reference reactor pressure vessel (RPV) subjected to pressurized thermal shocks (PTSs) are analyzed by two-parameter and three-parameter methods. The comparison between elastic and elastic–plastic analysis shows that the constraint effect varies with the material property. T₁₁ (the second term of William’s extension acting parallel to the crack plane) generally displays a reversed relation to the stress intensity factor (SIF) with the transient time, which indicates that the loading (SIF) plays an important role on the in-plane constraint effect. The thickness at the crack tip contributes more than the loading to the out-of-plane constraint, such that T₃₃ (the second term of William’s extension acting along the thickness) displays a similar relation to ε₃₃ (strain along the thickness direction) and a different relation to T₁₁ during the transient. The results demonstrate that both in-plane and out-of-plane constraint effect should be analyzed separately in order to describe precisely the stress distribution ahead of the crack tip.     

On the crack face boundary conditions in electromechanical fracture and an experimental protocol for determining energy release rates

The fracture mechanics of electromechanical materials has been investigated for well over a decade, yet there still exists controversy over the appropriate crack face boundary conditions for non-conducting cracks. In this paper an experimental protocol for measuring the energy release rate in a non-linear reversible electromechanical body is proposed and summarized. The potential results from the proposed experimental approach are capable of shedding light on the true physical nature of the conditions prevailing at the crack surface and in the space within the crack. The experimental procedure is simulated numerically for a linear piezoelectric specimen in a four point bending configuration subjected to electrical loading perpendicular to the crack. The focus of these investigations is on a comparison between the commonly used exact crack face boundary condition and the recently proposed energetically consistent boundary conditions. To perform the numerical calculation with a wide range of electrical and mechanical loadings, two efficient finite element formulations are presented for the general analysis of crack problems with non-linear crack face boundary conditions. Methods for the numerical determination of the crack tip energy release rate and the simulation of the experimental method for obtaining the total energy release rate are developed. Numerical results for the crack tip and total energy release rate are given for both the exact and energetically consistent boundary conditions. It is shown that the crack tip energy release rate calculated under energetically consistent boundary conditions is equal to the total energy release rate generated from the simulated experimental method. When the exact boundary conditions are used, there is no such agreement.     

An experimental investigation of crack-path directional stability

Using the criterion that a crack will extend perpendicular to the maximum circumferential stress,σ _θ, we show that the directional stability of crack growth is governed by the location of microcrack initiation ahead of the crack tip. At distances greater than a geometrical radiusr _o, the maximum value ofσ _θ deviates from the position of symmetry. Thus, if we assume that the physical processes involved in fracture lead to crack initiation at a distancer _c ahead of the crack tip, the criterion for directional stability isr _o>r _c. Experimental and theoretical values ofr _o verify that, asr _o becomes small, the crack's directional stability deteriorates. Observing that a lengthwise compressive stress increasesr _o, a center-cracked specimen was developed which allows the application of controlled lengthwise compression independently of the opening-mode load. A detailed photoelastic analysis of the specimen has provided the value ofr _o as a function of the crack length. The value ofr _o is then compared with the expected microcrack initiation distances in ductile fracture. By applying sufficient lengthwise compression, we are able to make the crack grow straight and obtain numerous data points from this specimen which would otherwise be directionally unstable. The results indicate that, as the total lengthwise tensile stress at the crack tip increases, the fracture toughness also increases. Using this information we can then adjustK _Ic for zero lengthwise loading and obtain a geometry independent fracture toughness.     

Anomalies associated with energy release parameters for cracks in piezoelectric materials

For a central crack in a piezoelectric plate, the mode-I stress intensity factor (K_I), electric displacement intensity factor (K_D), energy release rates (G, G_M) and energy density factor (S) are obtained from the finite element results. For the impermeable crack, the numerical results of K_I and K_D are coupled; this error is contrary to the uncoupled analytical solutions. The error has little effect on the total energy release rate G and energy density factor S, but in some cases, large errors in the mechanical energy release rate G_M are observed. G is global while SED is local. Also G is negative which defies physics where energy cannot be created while crack attempts to extend as implied by G. Computations should be made for the J-integral and also show that J becomes negative. What this shows is that the global fracture energy criterion is not suitable to address the local release of energy because it includes the overall energy which are irrelevant to fracture initiation being a local behavior. In addition, the case study shows that the energy density theory is the better fracture criterion for the piezoelectric material. According to the results of S, it retards the crack growth when the external electric field and piezoelectric poling are on opposite directions. This conclusion agrees with analytical and experimental evidence in the past references.     

Analysis of electric boundary condition effects on crack propagation in piezoelectric ceramics

There are three types of cracks: impermeable crack, permeable crack and conducting crack, with different electric boundary conditions on faces of cracks in piezoelectric ceramics, which poses difficulties in the analysis of piezoelectric fracture problems. In this paper, in contrast to our previous FEM formulation, the numerical analysis is based on the used of exact electric boundary conditions at the crack faces, thus the common assumption of electric impermeability in the FEM analysis is avoided. The crack behavior and elasto-electric fields near a crack tip in a PZT-5 piezoelectric ceramic under mechanical, electrical and coupled mechanical-electrical loads with different electric boundary conditions on crack faces are investigated. It is found that the dielectric medium between the crack faces will reduce the singularity of stress and electric displacement. Furthermore, when the permittivity of the dielectric medium in the crack gap is of the same order as that of the piezoelectric ceramic, the crack becomes a conducting crack, the applied electric field has no effect on the crack propagation. The project supported by the National Natural Science Foundation of China (19672026, 19891180)     

An improved experimental method for the determination of the critical stress intensity factor KIc of brittle materials

The critical stress intensity factor K_Ic is determined by a simple and accurate method, using small test specimens and a simple procedure in this paper.Single edge V-notched tension specimens made of PMMA are subjected to a load which is slowly increased until the crack begins to move from the notch tip. During the crack propagation event shadow patterns at the tip of the crack are recorded in a video recorder. Under these loading conditions, the creating real crack propagate slowly until the crack propagation velocity take an abrupt increase and the entire fracture of the specimen takes place. The stress intensity factor which correspond to the transition from the slow to fast crack speed, is the critical stress intensity factor K_Ic and it can be the fracture toughness of the material.The results are accurate and in good agreement with those values of K_Ic which are calculated by approximate theoretical expressions.The purpose of this paper is to introduce an improved, simple and accurate experimental method for the determination of fracture toughness of brittle materials.     

On the relationship between critical tensile stress and fracture toughness in mild steel

An analysis is presented which relates the critical value of tensile stress (σ_f) for unstable cleavage fracture to the fracture toughness (K_Ic) for a high-nitrogen mild steel under plane strain conditions. The correlation is based on (i) the model for cleavage cracking developed by E. Smith and (ii) accurate plastic-elastic solutions for the stress distributions ahead of a sharp crack derived by J. R. Rice and co-workers. Unstable fracture is found to be consistent with the attainment of a stress intensification close to the tip such that the maximum principal stress σ_yy exceeds σ_f over a characteristic distance, determined as twice the grain size. The model is seen to predict the experimentally determined variation of K_Ic with temperature over the range -150 to -75°C from a knowledge of the yield stress and hardening properties. It is further shown that the onset of fibrous fracture ahead of the tip can be deduced from the position of the maximum achievable stress intensification. The relationship between the model for fracture ahead of a sharp crack, and that ahead of a rounded notch, is discussed in detail.     

Study on fracture behavior of ferroelectric ceramics under combined electromechanical loading by using a moiré interferometry technique

This paper discusses an in situ observation of fracture behavior around a crack tip in ferroelectric ceramics under combined electromechanical loading by use of a moiré interferometry technique. The deformation field induced by the electric field and the stress concentration near the crack tip in three-points bending experiments was measured. By analysis of the moiré images it is found that under a constant mechanical load, the electric field almost has no effect on the crack extension in the case that the directions of the poling, electric field and crack extension are perpendicular to each other. When the poling direction is parallel to the crack extension direction and perpendicular to the electric field, the strain decreases faster than that calculated by FEM with and without electrical loading as one goes away from the crack tip. In addition, as the electric field intensity increases, the strain near the crack tip increases, and the strain concentration becomes more significant. The project supported by the National Natural Science Foundation of China (10132010, 10025209, 10232023)     

Dynamic steady crack growth in elastic-plastic solids—propagation of strong discontinuities

The near-tip field of a mode I crack growing steadily under plane strain conditions is studied. A key issue is whether strong discontinuities can propagate under dynamic conditions. Theories which impose rather restrictive assumptions on the structure of an admissible deformation path through a dynamically propagating discontinuity have been proposed recently. Asymptotic solutions for dynamic crack growth, based on such theories, do not contain any discontinuities. In the present work a broader family of deformation paths is considered and we show that a discontinuity can propagate dynamically without violating any of the mechanical constitutive relations of the material. The proposed theory for the propagation of strong discontinuities is corroborated by very detailed finite element calculations. The latter shows a plane of strong discontinuity emanating from the crack tip (with its normal pointing in the direction of crack advance) and moving with the tip. Elastic unloading ahead of and/or behind the plane of discontinuity and behind the crack tip have also been observed.The numerical investigation is performed within the framework of a boundary layer formulation whereby the remote loading is fully specified by the first two terms in the asymptotic solution of the elasto-dynamic crack tip field, characterized by K₁, and T. It is shown that the family of near-tip fields, associated with a given crack speed, can be arranged into a one-parameter field based on a characteristic length, L_g, which scales with the smallest dimension of the plastic zone. This extends a previous result for quasi-static crack growth.     

The interaction between crack and electric dipole of piezoelectricity

Discrete dipoles located near the crack tip play an important role in nonlinear electric field induced fracture of piezoelectric ceramics. A physico-mathematical model of dipole is constructed of two generalized concentrated piezoelectric forces with equal density and opposite sign. The interaction between crack and electric dipole in piezoelectricity is analyzed. The closed form solutions, including those for stress and electric displacement, crack opening displacement and electric potential, are obtained. The function of piezoelectric anisotropic direction,p _a (θ)=cosθ+p _a sinθ, can be used to express the influence of a dipole's direction. In the case that a dipole locates near crack tip, the piezoelectric stress intensity factor is a power function with −3/2 index of the distance between dipole and crack tip. Supported by National Natural Science Foundation of China(No. 10072033)