改进的微悬浮聚合法制备聚合物微球

微悬浮聚合法是制备聚合物微球的方法之一,它是先将单体相分散为一定粒度的微液滴,再在低速搅拌(75～100r/min)下进行聚合反应~[1,2],对聚合设备无特殊要求,且避免了悬浮聚合法制备微球时连续数小时的高速搅拌~[3],只要有合适的均化器即可大批量制备1～50μm的聚合物微球,且可适当控制粒度.但由于一般单体在分散介质中均有一定的溶解性,且液滴粒径越小单体溶解度越大,致使聚合过程中单体可通过介质扩散而产生单体在不同粒     

乙酸中沉淀聚合制备窄分散聚二乙烯基苯微球

在沉淀聚合中利用含无毒的乙酸溶剂合成出窄分散交联聚二乙烯基苯(PDVB-55)微球,用扫描电镜(SEM)对其表面形态和粒度进行了表征,结果显示PDVB-55微球均匀且互相分离,平均粒径是2.69μm.X射线光电能谱(XPS)分析表面化学组成显示,微球表面有大量残余双键.     

磁性聚合物微球的制备及其热重曲线的特征分析

采用改进的种子乳液聚合法制得了微米尺度表面羧基功能化的超顺磁性复合微球.通过动态光散射粒度仪(DLS)、透射电子显微镜(TEM)、振动样品磁强计(VSM)对所制备的磁性功能聚合物微球的各项性能进行了表征.通过热失重分析(TGA)、热质联用分析(TGA-MS)、拉曼光谱(RS)、X射线光电子能谱(XPS)对磁性功能聚合物...     

草莓型PMMA/SiO2有机-无机复合微球的合成与表征

在纳米二氧化硅水分散介质中,借助于正离子单体甲基丙烯酰氧乙基三甲基氯化铵(MTC)与未改性纳米二氧化硅颗粒之间的电荷作用,通过MTC与甲基丙烯酸甲酯(MMA)的自由基共聚合,制备了草莓型的PMMA/SiO2复合微球.整个制备反应过程中,纳米二氧化硅无需表面处理,体系中无需另外加入乳化剂或助乳化剂,微球表面吸附的纳米二氧化硅对颗粒起稳定作用.详细讨论了纳米二氧化硅初始添加量、MTC浓度对复合微球的平均粒径、复合微球中二氧化硅含量及微球形态的影响.动态光散射粒度分布仪(DLS)测得复合微球粒径在180~300 nm之间,热重分析(TGA)表明复合微球中二氧化硅含量介于16.4%~40.8%之间.透射电镜(TEM)显示所得复合微球具有草莓型结构,二氧化硅于表面富集.     

反应诱导相分离法制备双马来酰亚胺树脂微球

从聚醚酰亚胺(PEI)/[双马来酰亚胺(BMI)单体+烯丙基双酚A(DBA)]共混体系出发,通过反应诱导相分离,制备了约3μm尺寸的、单分散的BMI树脂微球.用扫描电镜(SEM)观察BMI树脂微球的形态,用激光粒度仪(LPS)表征BMI树脂微球的粒度及其分布,差示扫描量热法(DSC)测试BMI树脂微球的Tg.研究结果表明:PEI和聚酯酰亚胺(PEsI)的主链结构对BMI树脂微球形态有很大影响;PEI-A的用量增加,BMI树脂微球粒径减小,且粒度分布呈不均匀-均匀-不均匀变化;BMI树脂微球的Tg为215~218℃,略低于纯BMI树脂的Tg(225℃).     

草莓型SiO2/PMMA纳米复合微球的制备

在纳米二氧化硅水分散体系中,借助于碱性辅助单体1-乙烯基咪唑(1-VID)与未改性纳米二氧化硅表面羟基之间的酸-碱作用,通过1-VID与甲基丙烯酸甲酯(MMA)的自由基共聚合,制备了草莓型的SiO2/PMMA复合微球.整个反应过程中,纳米二氧化硅无需表面处理,体系中无需另外加入乳化剂或助乳化剂,微球表面吸附的纳米二氧化硅对颗粒起稳定作用.用动态光散射粒度分布仪测得复合微球粒径在120-330nm之间,热重分析结果表明,复合微球中二氧化硅含量介于15%-20%之间.透射电镜和扫描电镜显示所得复合微球具有草莓型结构,二氧化硅富集在表面.     

阴阳离子聚氨酯/羟基磷灰石复合微球的制备及其自组装

分别以2,2-双羟基丙酸(DMPA)和N-甲基二乙醇胺(MDEA)作扩链剂,采用自乳化法成功制备出带有正、负电荷的阳、阴离子聚氨酯/羟基磷灰石(PU/HA)微球,并考察HA的复合比例对微球形貌、理化性能的影响。在此基础上,通过微球间的静电作用力,将制备出的阴、阳离子复合微球自组装形成凝胶体系,并对其力学性能进行探究。SEM、ζ电位和激光粒度结果显示成功制备出具有一定形貌的带电微球,其中当扩链剂含量为15%(n/n)、HA含量为10%(w/w)时,微球形貌较佳且粒度分布均匀;X射线衍射、热分析结果表明,微球确为一定比例的HA与PU复合产物;自组装体系的流变学测试结果表明,微球组装后的产物呈类凝胶状态,具有较高的弹性模量,并有一定的可注射性。同时,骨髓间充质干细胞(BMSCs)可在组装材料表面粘附、铺展,生长良好。     

碳纳米管复合微球修饰L-色氨酸及其对LDL的吸附性能

本文以多孔碳纳米管/活性炭复合微球为载体,以L-色氨酸为配基,采用环氧氯丙烷偶联法,制得修饰L-色氨酸的碳纳米管/活性炭复合微球(L-CNTs/AC)。采用扫描电镜、氮气吸附、傅立叶红外光谱、热分析、X射线光电子能谱等对复合微球进行表征;通过体外静态吸附法对其低密度脂蛋白(LDL)吸附能力进行初步研究。结果表明:环氧氯丙烷偶联法可接枝上L-色氨酸。复合微球中碳纳米管加入量越多,对LDL的吸附能力越强;当碳纳米管加入量为45wt%时,对LDL的吸附量达4.623 mg·g-1,是未添加碳纳米管的2.3倍多。这是因为碳纳米管不仅可促进复合微球中20~100 nm孔的形成,而且还可促进复合微球配基修饰量的增多,从而大大增强了复合微球对LDL的吸附能力。此复合微球可望开发成一种新型的血液灌流LDL吸附剂。     

多级结构NiO微球的构筑及对刚果红染料的吸附性能

无需加入模板和表面活性剂,采用简单的溶剂热法合成多级结构NiO微球前驱体,再经450℃热处理,得到多级结构NiO微球纳米材料.利用X射线粉末衍射(XRD)、扫描电子显微镜(SEM)、透射电子显微镜(TEM)和氮气吸附-脱附等技术对制备的材料进行结构及形貌分析.结果 表明,合成的NiO微球直径600～ 800 nm,构筑...     

碳助剂对完全液相法制备的 Cu-Zn-Al 催化剂性能的影响

 采用完全液相法制备了 Cu-Zn-Al 催化剂, 研究了碳纳米管和碳微球的加入对该催化剂 CO 加氢合成低碳醇反应性能的影响, 并用 X 射线粉末衍射、氮气吸附、氢气程序升温还原和氨气程序升温脱附-质谱等方法对催化剂进行了表征. 结果表明, 用完全液相法制备的 Cu-Zn-Al 甲醇合成催化剂具有一定的合成低碳醇和低碳烃的能力, 这种能力归结于较大 Cu0 晶粒的产生. 一定量碳微球的加入可大大减小 Cu0 晶粒度, 从而大幅度提高甲醇选择性.     

Preparation of Solder Powders and Properties of Low-Temperature Solder Creams Based on a Polyester Resin and Dimethylethylphenylammonium Iodide

Solder powders were prepared, and properties of solder creams based on rosin-modified polyester resin and dimethylethylphenylammonium iodide were studied. The possibility of using dimethylethylphenylammonium iodide as a flux in low-temperature solder creams was examined.     

Sn-Pb-RE钎料的塑性变形抗力研究

利用拉伸实验方法研究了室温下Ｓｎ－Ｐｂ－ＲＥ钎料的塑性变形抗力。钎料的变形抗力随稀土含量的增加而提高。稀土垢加入使钎料组织均匀细化，导致位垒硬化和多滑移硬化作用增强。同时，稀土存在晶界偏聚，牵制了晶界的运动，因此提高了钎料的变形抗力。     

Microbial Leaching of Waste Solder for Recovery of Metal

This study proposes an environment-friendly bioleaching process for recovery of metals from solders. Tin-copper (Sn-Cu), tin-copper-silver (Sn-Cu-Ag), and tin-lead (Sn-Pb) solders were used in the current study. The culture supernatant of Aspergillus niger removed metals faster than the culture supernatant of Acidithiobacillus ferrooxidans. Also, the metal removal by A. niger culture supernatant is faster for Sn-Cu-Ag solder as compared to other solder types. The effect of various process parameters such as shaking speed, temperature, volume of culture supernatant, and increased solder weight on bioleaching of metals was studied. About 99 (±1.75)?% metal dissolution was achieved in 60 h, at 200-rpm shaking speed, 30 °C temperature, and by using 100-ml A. niger culture supernatant. An optimum solder weight for bioleaching was found to be 5 g/l. Addition of sodium hydroxide (NaOH) and sodium chloride (NaCl) in the bioleached solution from Sn-Cu-Ag precipitated tin (85?±?0.35 %) and silver (80?±?0.08 %), respectively. Passing of hydrogen sulfide (H₂S) gas at pH 8.1 selectively precipitated lead (57.18?±?0.13 %) from the Sn-Pb bioleached solution. The proposed innovative bioleaching process provides an alternative technology for recycling waste solders to conserve resources and protect environment.     

含稀土Sn-Zn-Bi系无铅钎料润湿性能的研究

通过向Sn-Zn-Bi系钎料合金中添加适量合金元素Ga,Cu和La,制备了对Cu母材具有较好润湿性能的Sn-8.9Zn-2.7Bi-1.0Ga-0.5Cu-0.2La无铅钎料,其润湿角为25.1°。同时,还研究了无铅钎料中稀土元素La以及合金元素Ga的微量变化对钎料的润湿性及与母材金属结合界面组织结构的影响。研究发现,La和合金元素Ga的含量对Sn-Zn-Bi系无铅钎料润湿性能有较大影响,适量添加无论是在空气中还是在氮气保护下,均可以改善钎料的润湿性。     

A Study on the Thermal Behaviour of Solder Glass

Vitreous solder glasses, such as Mansol #40 and FEG-2002, are commercialized solder glasses, which are compression sealing glasses that can be used to solder materials with expansions between 55-68⊙10^-7°C^-1, such as Al₂O₃. In order to understand and tailor the thermal behaviour of solder glasses, cylindrical-like glasses were first carefully ground with a stainless steel mortar and pestle. Initially, no exothermic or endothermic data were obtained from the DTA/DSC curves except those relating to melting. However, exothermic peaks appeared after the glass samples were re-melted. In this work, kinetic parameters such as the activation energy, and the morphology of the devitrification mechanisms for two kinds of solder glasses were also investigated, using non-isothermal DTA techniques. The activation energies ranged from 220 to 235 kJ mol^-1 and the devitrification mechanism parameters were close to 1. This indicates that the devitrification mechanisms of the two kinds of solder glasses involve surface nuclei. This revised version was published online in July 2006 with corrections to the Cover Date.     

大面积功率器件软钎料的焊接失效分析

针对大面积功率器件软钎料的失效问题,运用扫描电子显微镜(SEM)分析了SnPb软钎料的微观结构并运用能谱仪对其进行成分分析,找出了失效的主要原因:对软钎料进行刚玉抛光后,未能将残留在软钎料内的Al2O3成分完全去除,以至于器件的可焊性变差.根据分析提出了改进意见,较好地解决了SnPb软钎料的失效问题.     

火焰原子吸收光谱法测定焊锡中铜铁锌

焊锡中微量元素铜、铁、锌的含量影响焊接质量,当含量超过规定的允许量,会造成焊接不牢或虚焊.在焊接过程中,这些元素的含量还可能有变化,因而需要时常检验,以监控焊锡的质量.目前检测焊锡中微量元素常用的方法是ICP-AES法[1,2],原子吸收光谱法也有报道[3],使用溴化氢-溴水溶样,有时须分离铅.本文对火焰原子吸收光谱法测定焊锡的工作条件和基体影响进行了研究,不用分离锡、铅,可直接测定,能满足焊锡测定的要求.     

Sn-In-Zn三元系相图和无铅钎料成分的探讨

Sn－In－Zn三元体系的液相限相图进行了实验和探讨，发现体系存在一个三元低共熔点E：46Sn－52ln－2Zn（100ω），其熔点为108℃．在相图研究的基础上，得出该体系作为无铅焊料的最佳组分为6．7Zn－8．0In－85．3Sn（100ω），其熔化温度为188℃。     

Second Generation Lead-free Solder Alloys – A Challenge to Thermodynamics

Summary. For environmental reasons, lead has to be removed from solder alloys used for interconnection purposes in electronics equipment. A new series of alloys, mainly based upon tin, and often containing copper and silver, has been evolved by empirical reasoning. A more theoretical approach is now being pursued, using thermodynamic principles, to produce the second generation of solder alloys. The paper outlines the soldering process, the requirements of solder alloys, and the various mechanisms (such as overload, fatigue, creep, and thermomechanical fatigue) that are potential causes of failure in service. It also describes from the manufacturing and the performance perspectives, the physical and mechanical properties necessary for reliable solder joints. These include conductivity, melting point, strength, ductility, and thermal stability of microstructure. The challenging question is posed as to how can thermodynamics contribute to prescribing and developing an improved series of alloys?     

印制电子用阻焊油墨及其发展趋势

本文介绍了PCB制造过程中所用阻焊油墨的研究现状及其发展趋势,重点介绍了可喷墨打印阻焊油墨、柔性电路板用阻焊油墨、水溶性碱显影感光阻焊油墨和LED封装用白色阻焊油墨的研究现状及趋势。