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基于ITERCHHCSBTBM的设计特点,设计了相关的氚工艺辅助系统。描述了氚提取系统(TES)、冷却剂纯化系统(CPS)、氚测量系统(TMS)的功能、设计参数和工艺流程等。TES用于氚提取、储存、同位素的分离;CPS实现氧氮等杂质和氚的去除及冷却剂的定量处理和分析等功能;TMS不仅可以定量分析氚含量,而且必要时可替代TES。氚渗透及氚安全的分析表明,通过CHHCSBTBM以及辅助系统向环境释放的氚可控制在ITER的氚安全限度内。     

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Based on the CFD software platform FLUENT, three-dimensional numerical simulation was carried out for thermal hydraulics characteristics of the breeder zone pebble bed for China helium cooled ceramic breeder-test blanket module (HCCB-TBM). According the actual operating conditions of ITER, such as the nuclear heat distributions in the breeder zone and structure wall, the inlet velocities and temperatures of purge gas helium and coolant helium, the flow field and heat transfer characteristics of the purge gas helium carrying the tritium flowing over the lithium silicate pebble bed were obtained, and the temperature distribution and pressure drop were presented as well. The calculation results show that the permutation mode of the lithium silicate spheres in the pebble bed have an influence on the flow field and the maximum temperature of the pebble-bed. The maximum temperature of the pebble-bed and the structure wall does not exceed the designed temperature under the ITER operating conditions. The results will be benefit for the design verification of the breeder zone thermal hydraulics scheme and improving the following experiments of the purge gas.     

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HL-2A和HL-1M装置采用了激光吹气注入高Z杂质来缓减大破裂中的等离子体电流衰竭,并给出了初步实验结果。在HL-2A装置上建立了利用MHD扰动的参量预报放电破裂先兆的报警系统,研制了MHD实时检测与处理系统,实现了放电破裂先兆的预报、快速触发激光吹气、形成阻性高辐射等离子体、消耗热能和磁能,缓减大破裂。实验证明,这是一种使得大型聚变实验装置在放电破裂之前显著减少等离子体中热能和磁能,而且能安全终止放电的简单、快速和有效的途径。     

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对中国氦冷固态增殖剂实验包层模块(CH HCSB TBM)第一壁的重力分析结果表明,由重力导致的应力和位移形变很小,可以忽略其影响;而第一壁的热结构分析表明,第一壁铍保护板的应力偏大,从结构设计角度出发建议采用钨铜合金代替铍作为第一壁的保护材料。     

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使用有限元分析方法,初步分析了中国ITER实验包层模块(CHHCSBTBM)在等离子体大破裂时的电磁安全特性。根据CHHCSBTBM设计结构建立了TBM及其子模块的电磁分析模型,模拟了等离子体大破裂情况下的电磁场边界条件,对CHHCSBTBM及其子模块进行了涡流、应力计算,得到了相应的感生涡流和应力分布。根据得到的应力分布,计算出在等离子体大破裂的不同时刻CHHCSBTBM及其子模块受到的电磁扭矩。用计算结果与材料的容许值相比较,确定了TBM设计的电磁安全性。     

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基于ITER装置窗口C,完成了中国氦冷固态增殖剂试验包层模块的设计改进,给出了模块主要性能参数和设计参数。改进后的TBM包层模块外围尺寸为环向484mm、纵向1660mm和极向675mm。根据该模块设计的结构特点,对研制用材料CLF-1钢真空扩散连接和真空电子束焊等关键工艺进行了研究,初步探索了第一壁等关键部件的研制工艺流程,并最终成功试制了第一壁和子模块冷却板模拟件。     

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在ITER试验包层模块HC-SB TBM结构设计和热工计算分析的基础上,对包层模块中的重要部件第一壁做了优化分析。利用有限元分析软件ANSYS的可编程命令流模式,对HC-SB TBM第一壁前壁进行了温度和应力的数值模拟,在满足结构材料的许用温度和应力的前提下,给出了第一壁前壁的最佳设计方案。     

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利用通用有限元程序ANSYS对中国氦冷固态氚增殖剂实验包层模块(CH HCSB TBM)第一壁进行了稳态热分析。结果表明,第一壁铍保护板和RAFM钢的最高温度符合热工安全设计要求。对第一壁表面热流密度随时间变化的瞬态情况进行了分析,给出了随时间变化的结果。对第一壁两种典型的事故情形开展了初步分析,并对分析结果和事故影响进行了相应讨论。     

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为了研究靶材料对快电子能量分布的影响,采用电子谱仪测量了飞秒激光与Cu和CH靶相互作用中在靶前和靶后产生的快电子能谱。结果显示,在靶前Cu和CH靶的快电子能谱相似,反应了快电子发射对靶材料的依赖性较弱;在靶后Cu和CH靶的快电子能谱具有明显的差异,说明电子的输运过程与靶材料密切相关。冷电子环流以及自生磁场是导致Cu靶快电子能谱"软化"的原因,而对于CH靶麦克斯韦分布的快电子能谱主要由碰撞机制决定。     

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用通用计算流体力学程序FLUENT计算了中国氦冷固体增殖实验包层模块(TBM)冷却剂丧失事故中的冷却剂排放瞬态过程。并为中国氦冷固体增殖实验包层模块冷却剂丧失事故(LOCA)分析开发了一维喷放和余热排除计算模型。典型LOCA事故的分析结果显示,TBM诱发事故或ITER其它部件诱发TBM事故对整个ITER系统安全造成的总风险不严重。     

HL-2M偏滤器CFC/CuCrZr靶板的非晶钎焊工艺研究

在采用商用的STEMET-1101非晶钎料、温度为710~750°C的真空钎焊下,对CFC/OFC(氯氟烃/无氧铜)复合块与CuCrZr(铬锆铜)的钎焊进行了研究。首先,通过X-射线衍射(XRD)和差式扫描量热分析对钎料的结构和熔化行为进行了表征;然后,通过光学显微镜、电子探针微分析和拉伸试验等方法对焊缝的组织形貌、元素成分分布、相结构和力学性能进行了分析;最后,通过高热负荷装置对CFC/OFC/CuCrZr钎焊模块的热疲劳性能进行测试。结果表明,在710~750°C钎焊温度内焊缝由Cu固溶体、(Cu, Ni)3P和Ni(Cu ,Cr)2P金属间化合物组成,焊缝平整无裂纹;特别是在750°C/15min情况下,抑制了焊缝金属间化合物的连续分布,OFC/CuCrZr的焊接强度大于OFC的抗拉强度,CuCrZr/CuCrZr的结合强度为210MPa,并呈现部分韧性断裂。在750°C/15min情况下制备的CFC/Cu/CuCrZr模块可以承受1000次7MW·m^-2的循环热负荷。     

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As the ITER first wall Be/CuCrZr hot isostatic pressing (HIP) bonding intermediate transition layer, Ti/Cu layer can form a multi-layer intermediate metal phase, and defects such as cracks occur between the Ti/Cu metal phases. CuCrZr was used instead of Be, and a number of CuCrZr/Ti/Cu/CuCrZr joints were fabricated by the same HIP process as Be/CuCrZr to analyze the Ti/Cu joints. The effects of stress relief annealing on joint strength and defect distribution of the joints unannealed, annealed at 400°C and 500°C respectively were studied. The results show that three layers of Ti/Cu diffusion layers are formed on both sides of the intermediate titanium layer, namely Cu₄Ti, CuTi and CuTi₂. The thickness of Cu₄Ti on the pure copper side is thicker than that on the CuCrZr side, so that the crack is almost entirely distributed at the junction of Cu₄Ti and CuTi on the pure copper side where brittle fracture is easy to occur in the tensile samples. As the annealing temperature increases, the generation and propagation of cracks decreases.     

退火对钛/铜热等静压扩散连接界面的影响

钛/铜(Ti/Cu)作为ITER 第一壁Be/CuCrZr 热等静压连接中间过渡层,形成了多层中间金属相结构,容易在Ti/Cu 金属相之间产生裂纹等缺陷。采用CuCrZr 代替Be,经过与Be/CuCrZr 相同的热等静压工艺,制作了多个CuCrZr/Ti/Cu/CuCrZr 连接件,对Ti/Cu 连接接头进行深入分析。对连接件分别进行未退火、400℃和500℃ 退火处理,去应力退火后对接头强度和缺陷分布的影响进行了研究。研究结果表明,中间钛层的两侧都形成了三层Ti/Cu 扩散层,分别为Cu₄Ti、CuTi 和CuTi₂。纯铜侧的Cu₄Ti 厚度比CuCrZr 侧的厚,使得裂纹几乎全部分布于铜侧的Cu₄Ti 与CuTi 交界处,拉伸样品极易在此处发生脆性断裂。随着退火温度升高,裂纹的产生和扩展减少。     

溅射Al对AlN的“润湿”与钎焊

由于润湿性不佳, 难以实现金属钎料对陶瓷的无过渡层直接钎焊, 本文在研究了溅射Al薄膜对AlN的“润湿”作用的基础上, 通过磁控溅射的方法在AlN表面沉积Al基薄膜作为钎料, 在真空条件下对AlN陶瓷进行了直接钎焊. 采用高景深光学显微镜、扫描电子显微镜和X射线能量分散谱表征了钎焊接头和剪切断口的组织及形貌. 结果表明, 高能量溅射Al粒子对AlN的撞击可以形成只有850 ℃以上高温才可获得的Al-N化学键, 实现Al对AlN的“润湿”, 使Al基薄膜钎料能够在较低的温度(≥ 510 ℃)对AlN直接钎焊. 此方法获得的Al/AlN接头的剪切强度达到104 MPa, 含3.8 at.% Cu的Al合金钎料接头强度可进一步提高到165 MPa, 它们的剪切断裂都产生于钎缝金属之中; 增加钎料中的Cu含量至9.1 at.%后, Cu在钎缝与陶瓷界面的偏聚使接头的剪切强度降低为95 MPa. Al-20 at.% Ge合金可以将钎焊温度降低至510 ℃, 但Ge在钎缝与陶瓷界面的偏聚使接头在48 MPa发生断裂.     

���ɲ��ȶ�Be/CuCrZr �ȵȾ�ѹ��������Ӱ��

Beryllium (PVD coated on Ti, 10μm, Cu, 10μm), different thickness of oxygen-free cooper (OFC) sheets as transitionlayer and CuCrZr/316L(N) explosive bi-metallic plates are bonded by hot isostatic pressing (HIP), optical microscope, scanning electron microscope(SEM), Electron Probe Micro-analyzer(EPMA), X-ray diffraction( XRD), shearing tests are used to verify the diffusion bonding performance. Results turn out to be all kinds of mock-ups successfully bonded, no any cracks have been found in the diffusion bonding interface, three different kinds of diffusion layers are found between titanium and copper which are CuTi₂??CuTi and Cu₄Ti, respectively. The thicker of the OFC layer is, the better the shearing testing performance is.     

过渡层厚度对Be/CuCrZr热等静压连接性能影响

在铍上用物理气相沉积(PVD)镀上10μmTi 和10μmCu,再添加不同厚度的(分别为0.00mm、0.25mm、 0.50mm、0.75mm、1.00mm)无氧铜作为中间过渡层,与CuCrZr/316L(N)复合板基座铜合金侧通过热等静压连接。采用光学显微镜、扫描电镜(SEM)与电子探针(EPMA)、X 射线衍射仪(XRD)、剪切试验等方法确定了界面组织与性能。试验结果表明：各厚度无氧铜模块连接成功,界面无裂纹、空洞等缺陷,钛铜间出现三层明显的反应层,分别为CuTi₂、CuTi 以及Cu₄Ti。添加无氧铜厚度越大,剪切强度越大。     

Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder

In this investigation, ultrasonic-assisted soldering at 260 °C in air produced high strength and high melting point Cu connections in 60 s using Ni foam reinforced Sn composite solder. Systematically examined were the microstructure, grain morphology, and shear strength of connections made with various porosities of Ni foam composite solders. Results shown that Ni foams as strengthening phases could reinforce Sn solder effectively. The addition of Ni foam accelerated the metallurgical reaction due to great amount of liquid/solid interfaces, and refined the intermetallic compounds (IMCs) grains by ultrasonic cavitation. The joints had different IMCs by using Ni foam with different porosity. Layered (Cu,Ni)₆Sn₅ and (Ni,Cu)₃Sn₄ phases both existed in Cu/Ni60-Sn/Cu joint while only (Cu,Ni)₆Sn₅ IMCs grew in Cu/Ni98-Sn/Cu joint. As ultrasonic time increasing, Ni skeletons were dissolved and the IMCs were peeled off from substrates and broken into small particles. And then, the IMCs gradually dissociated into refined particles and distributed homogeneously in the whole soldering seam under cavitation effects. Herein, the Cu/Ni60-Sn/Cu joint ultrasonically soldered for 60 s exhibited the highest shear strength of 86.9 MPa, as well as a high melting point about 800 ℃ for the solder seam composed of Ni skeletons and Ni-Cu-Sn IMCs. The characterization indicated that the shearing failure mainly occurred in the interlayer of the soldering seam. The homogeneous distributed granular IMCs and Ni skeletons hindered the crack propagation and improved the strength of Cu alloy joints.     

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以CuCrZr合金板为基板,316L(N)-IG不锈钢板为复板,制作了CuCrZr/316L(N)-IG爆炸复合板用于ITER第一壁热沉部件。对其进行了金相试验、硬度测试以及拉伸试验等。结果显示,复合板界面层具有明显的波状组织,平均波长和波高分别为1200μm和500μm,室温下抗拉强度达到394MPa。用复合板制作了6个第一壁小模块,进行质量认证试验,结果表明其满足ITER要求。     

ITER第一壁CuCrZr/316L(N)复合板的制作及检测

以CuCrZr合金板为基板,316L(N)-IG不锈钢板为复板,制作了CuCrZr/316L(N)-IG爆炸复合板用于ITER第一壁热沉部件。对其进行了金相试验、硬度测试以及拉伸试验等。结果显示,复合板界面层具有明显的波状组织,平均波长和波高分别为1200μm和500μm,室温下抗拉强度达到394MPa。用复合板制作了6个第一壁小模块,进行质量认证试验,结果表明其满足ITER要求。     

Interfacial reaction of intermetallic compounds of ultrasonic-assisted brazed joints between dissimilar alloys of Ti6Al4V and Al4Cu1Mg

Ultrasonic-assisted brazing of Al4Cu1Mg and Ti6Al4V using Zn-based filler metal (without and with Si) has been investigated. Before brazing, the Ti6Al4V samples were pre-treated by hot-dip aluminizing and ultrasonic dipping in a molten filler metal bath in order to control the formation of intermetallic compounds between the Ti6Al4V samples and the filler metal. The results show that the TiAl(3) phase was formed in the interface between the Ti6Al4V substrate and the aluminized coating. For the Zn-based filler metal without Si, the Ti6Al4V interfacial area of the brazed joint did not change under the effect of the ultrasonic wave, and only consisted of the TiAl(3) phase. For the Zn-based filler metal with Si, the TiAl(3) phase disappeared and a Ti(7)Al(5)Si(12) phase was formed at the interfacial area of the brazed joints under the effect of the ultrasonic wave. Due to the TiAl(3) phase completely changing to a Ti(7)Al(5)Si(12) phase, the morphology of the intermetallic compounds changed from a block-like shape into a lamellar-like structure. The highest shear strength of 138MPa was obtained from the brazed joint free of the block-like TiAl(3) phase.