Femtosecond pulsed laser ablation of thin gold film

Laser micromachining on 1000 nm-thick gold film using femtosecond laser has been studied. The laser pulses that are used for this study are 400 nm in central wavelength, 150 fs in pulse duration, and the repetition rate is 1 kHz. Plano-concave lens with a focal length of 19 mm focuses the laser beam into a spot of 3 μm (1/e² diameter). The sample was translated at a linear speed of 400 μm/s during machining. Grooves were cut on gold thin film with laser pulses of various energies. The ablation depths were measured and plotted. There are two ablation regimes. In the first regime, the cutting is very shallow and the edges are free of molten material. While in the second regime, molten material appears and the cutting edges are contaminated. The results suggest that clean and precise microstructuring can be achieved with femtosecond pulsed laser by controlling the pulse energy in the first ablation regime.     

Femtosecond pulsed laser ablation with spatial filtering

With the rise in demand for miniaturized features with better acute edge acuity and negligible thermal damage zone, one of the key vital areas lies in the refinement of the quality of the laser beam itself. Spatial filter is routinely used in optical micromachining systems to smoothen the Gaussian profile of the machining spot in order to obtain a feature of the desired quality. However, its profile smoothening effect has never been investigated for femtosecond pulsed laser micromachining process since the extremely high peak power of femtosecond pulses will cause damage on the filtering aperture of spatial filter. During the development of an acousto-optical micromachining system using femtosecond pulses, we found that if the damage of the filtering aperture can be circumvented, spatial filter can improve the machining quality of femtosecond pulse ablation, especially when ablation is conducted at low-fluency range (just above the ablation threshold fluency). In this paper, we investigate and demonstrate both the improvement and potential that beam refinement can bring about. In our experiment, a series of test patterns were ablated with a 400 nm second-harmonic Ti:Sapphire femtosecond laser of 150 fs duration at varying pulse energy ranging from 31 to 39 nJ. The specimen used in the experiment is a platinum- (Pt) sputtered coating of 100 nm thickness on a quartz substrate. The results show a significant improvement in the constancy of the shape as well as the size of ablated feature, revealing an improved beam profile and beam energy distribution due to spatial filtering.     

Micromachining of a thin film by laser ablation using femtosecond laser with masks

A gold thin film was machined by laser ablation using a femtosecond laser with mask patterns in the shape of lines and numbers. The patterns were successfully transferred with proper focusing and laser fluence. The optimal femtosecond laser fluence to keep the line width was about 5.2 mJ/cm² on the mask, and 99 mJ/cm² on the film. The processing resolution was 13 μm, and the narrowest line width was about 4 μm.     

Femtosecond laser ablation of polypropylene for breathable film

A polypropylene (PP) film was ablated using a femtosecond laser with a center wavelength of 785 nm, a pulse width of 184 fs and a repetition rate of 1 kHz. Increments of both the pulse energy and the shot number of pulses lead to co-occurrence of photochemical and thermal effect, demonstrated by the spatial expansion of rim on the surface of PP. The shapes of the laser-ablated PP films were imaged by a scanning electron microscope (SEM) and measured by a 3D optical measurement system (NanoFocus). And, the gas and water vapor transmission rate, mechanical properties of PP film micropatterned by fs laser pulses was characterized. Our results demonstrate that a femtosecond pulsed laser is an efficient tool for breathable packaging films in modifying the flow of air and gas, where the micropatterns are specifically tailored in size, location and number of which is easily controlled by laser processing conditions.     

Femtosecond laser ablation of DAST

High rate femtosecond (fs) laser ablation of the organic salt 4-N,N-dimethylamino-4-N-methyl-stilbazolium tosylate (DAST), an organic crystal with very high optical nonlinearities has been demonstrated. The threshold fluence and the ideal fluence range for damage free ablation for the wavelengths 550, 600, and 775 nm have been determined and the quality of the produced grooves has been investigated. The threshold fluences are in the order of 10–70 mJ/cm² and the ideal fluence range for damage free ablation is ranging from 30 to 300 mJ/cm², depending on the wavelength. The optimal focussing for ablation has been investigated and first results towards the structuring of a ridge waveguide are presented. We conclude that this method is most promising for waveguide patterning of DAST surfaces for integrated optics applications.     

Femtosecond laser ablation of silver foil with single and double pulses

The average ablation depth per pulse of silver foil by 130 fs laser pulses has been measured in vacuum over a range of three orders of magnitude of pulse fluence up to 900 J cm⁻². In addition, double pulses with separations up to 3.4 ns have been used to probe time scales of relevance for femtosecond ablation. The double pulse ablation depth, when each pulse fluence is 0.7 J cm⁻², falls to that of a single pulse as the pulse separation is increased from 0 ps to 700 ps. This time scale decreases to only 4 ps as the fluence is increased to 11 J cm⁻². It then jumps to 500 ps across a transition fluence where the slope of the ablation depth versus logarithmic fluence characteristic changes abruptly to a higher value. In addition, for pulse separations near 1000 ps, the second pulse can cause re-deposition of ejecta from the first pulse resulting in a double pulse ablation depth only 40% that of the first pulse alone. This has important implications for the interpretation of double pulse femto-LIBS intensities. Our results suggest that the optical properties of nano or mesoparticles play a significant role in double pulse ablation with large pulse separations.     

Metal thin film ablation with femtosecond pulsed laser

Micromachining thin metal films coated on glass are widely used to repair semiconductor masks and to fabricate optoelectrical and MEMS devices. The interaction of lasers and materials must be understood in order to achieve efficient micromachining. This work investigates the morphology of thin metal films after machining with femtosecond laser ablation using about 1 μm diameter laser beam. The effect of the film thickness on the results is analyzed by comparing experimental images with data obtained using a two-temperature heat transfer model. The experiment was conducted using a high numerical aperture objective lens and a temporal pulse width of 220 fs on 200- and 500-nm-thick chromium films. The resulting surface morphology after machining was due to the thermal incubation effect, low thermal diffusivity of the glass substrate, and thermodynamic flow of the metal induced by volumetric evaporation. A Fraunhofer diffraction pattern was found in the 500-nm-thick film, and a ripple parallel to the direction of the laser light was observed after a few multiple laser shots. These results are useful for applications requiring micro- or nano-sized machining.     

Surface ablation of lithium tantalate by femtosecond laser

We report measurements of the laser induced breakdown threshold in lithium tantalate with different number of pulses delivered from a chirped pulse amplification Ti: sapphire system. The threshold fluences were determined from the relation between the diameter D² of the ablated area and the laser fluence F₀. The threshold of lithium tantalite under single-shot is found to be 1.84 J/cm², and the avalanche rate was determined to be 1.01 cm²/J by calculation. We found that avalanche dominates the ablation process, while photoionization serves as a free electron provider.     

Femtosecond laser ablation on dental hard tissues—Analysis of ablated profile near an interface using local effective intensity

This study evaluated the process of ablation produced by a Ti:Sapphire femtosecond laser under different average powers taking place at the enamel/dentin interface. Based on the geometry of ablated microcavities the effective intensity for ablation was obtained. This study shows the validity for the local effective intensity analysis and allows a quantification of the variation in the ablation geometry taking place at the interface of two naturally different materials. It shows that the variation of the diameter of the ablated region as a function of the cavity depth comes essentially from a mechanism of effective intensity attenuation, as a result of a series of complex effects. Additionally, our data are sufficient to predict that a discontinuity on the ablation profile will occur on the interface between two biological media: enamel-dentin, showing a suddenly jump on the ablated cavity dimensions.     

Investigation of nanoparticle generation during femtosecond laser ablation of metals

The production of nanoparticles via femtosecond laser ablation of gold and copper is investigated experimentally involving measurements of the ablated mass, plasma diagnostics, and analysis of the nanoparticle size distribution. The targets were irradiated under vacuum with a spot of uniform energy distribution. Only a few laser pulses were applied to each irradiation site to make sure that the plume expansion dynamics were not altered by the depth of the laser-produced crater. Under these conditions, the size distribution of nanoparticles does not exhibit a maximum and the particle abundance monotonously decreases with size. Furthermore, the results indicate that two populations of nanoparticles exist within the plume: small clusters that are more abundant in the fast frontal plume component and larger particles that are located mostly at the back. It is shown that the ablation efficiency is strongly related to the presence of nanoparticles in the plume.     

Femtosecond laser writing of nanostructures on bulk Al via its ablation in air and liquids

We report on the formation of self-organized nanostructures (NS) on bulk Al under its ablation in air and liquids with femtoseconds (fs) laser pulses. In case of exposure into liquids, NS are regularly formed on the Al surface with an average period of about 200 nm, independent of the laser polarization. A dispersion of Al nanoparticles (NPs) into the liquid additionally occurs. Irregular nano-bumps are produced when the irradiation is performed in air. NP dispersions as well as NS formed on Al surface show a characteristic absorption peak in the near UV which has been attributed to plasmon oscillation of electrons. The wings of this peak extending to the visible, lead to a distinct yellow coloration of the processed Al surface and the liquid dispersions. Ultrafast laser processing of bulk Al in liquids may be potentially a promising technique for efficient production of nanosized aluminum.     

大气环境下飞秒激光对铝靶烧蚀过程的研究

利用时间分辨的光阴影成像技术研究了在大气环境下飞秒激光烧蚀铝靶的动态过程. 在入射激光能量为4 mJ, 激光光斑超过1 mm时, 激光烧蚀区表面物质以近似平面冲击波形式向外喷射; 在同样激光能量下、激光光斑较小时(约0.6 mm), 激光烧蚀区以近似半球型冲击波形式向外喷射. 当激光能量比较大时(7 mJ), 发现空气的电离对于激光烧蚀靶材有着重要影响. 在光轴附近烧蚀产生的喷射物具有额外的柱状和半圆型的结构, 叠加在平面冲击波结构上.     

飞秒激光光镊横向光学力的理论分析

旨在将飞秒激光脉冲序列视为对连续光的周期抽样结果,分析飞秒激光脉冲序列作为光镊光源捕获电介质微粒时产生的横向光学力,并给出受光微粒所受横向光学势阱力的理论模型及计算公式.数值计算结果表明,飞秒激光脉冲所产生的横向光学力能抵消由于布朗运动引起的微粒中心偏移的影响,实现对微粒的稳定束缚.     

Intensity profile distortion at the processing image plane of a focused femtosecond laser below the critical power: Analysis and counteraction

Femtosecond laser surface processing of materials allows for precise micro or sub-micrometer machining with restricted detrimental side effects. Thus, fine control of the laser intensity distribution (repeatability) in the processing plane is of outmost importance for industrial implementation. In this paper, we study the influence on non-linear effects on the machining quality. We experimentally study the profiles of cavities machined at the image plane of a focused femtosecond laser for a large set of fluences on stainless steel below the critical power. A strong distortion of the cavities is observed for high energetic levels. A beam analysis performed in the machining conditions reveals that the cavity profile follows the laser beam profile even at high fluences where the beam undergoes an increasing distortion. Numerical calculations of the laser beam distribution taking a Kerr effect into account are presented showing a good agreement with the experimental laser profile. To counteract the beam distortion at high fluences, we propose and successfully employ a robust solution consisting in geometrically forming the image processing plane before the laser focusing point. This ensures a beam profile free of distortion even at high fluences. Experimental evidence is made, showing a significant quality increase of the cavity profiles with an image plane placed before the focus point.     

High-speed and crack-free direct-writing of microchannels on glass by an IR femtosecond laser

Fabrication of high-resolution 3D structures with laser radiation on the surface of brittle materials has always been a challenging task. Even with femtosecond laser machining, micro-cracks and edge chipping occur. In order to evaluate processing modes optimal both in quality and productivity, we investigated high-speed (50 kHz) femtosecond laser processing of BK7 glass with the use of design of experiments and regression analysis. An automated inspection technique was developed to extract quality characteristics of test-objects. A regression model was obtained appropriate to fabricate microchannels with a predefined depth in the range of 1–30 µm with average accuracy of 5%. It was found that high quality machining modes are in the range of 0.91–2.27 µJ energy pulses, overlap of 53–62%, three and more number of passes. A material removal rate higher than 0.3 mm³/min was reached and microfluidic structures were formed based on data obtained.     

Effect of energy above laser-induced damage thresholds in the micromachining of silicon by femtosecond pulse laser

A 400 nm second harmonic Ti : sapphire femtosecond laser was applied to structure silicon base on a direct-write process in air. A series of lines were ablated with pulses of 300-fs duration at varying power densities ranging from 50 to 100 nJ of energy on 2″ silicon (1 1 1) wafers. In this event, we investigate and report extensive laser induced thermal damage and redeposition encompassing the ablated lines at high energy levels above the damage threshold of the silicon. In addition, the effect of polarisation on the direction of micromachining is also observed and discussed. The resolution and quality of these lines were also found to hold a linear relationship to the laser energy up to its thermal threshold limit.     

Preparation of nano-sized functional materials using laser ablation in liquids

We propose a convenient technique applicable for investigations of various functions of nanoparticles produced by laser ablation in liquids. It was demonstrated that nanoparticles of anatase-TiO₂, a electrode material for lithium secondary batteries, produced by laser ablation in acetone could be efficiently deposited on a substrate by using an electrophoresis technique. Analysis of the electrochemical properties of nanoparticles become much more facile with those deposited nanoparticles than with dispersed nanoparticles. In addition, it was demonstrated that comparison of the electrochemical properties between nanoparticles and microparticles were possible by means of this technique.     

Physical mechanism of silicon ablation with long nanosecond laser pulses at 1064 nm through time-resolved observation

Nanosecond (ns) laser ablation can provide a competitive solution for silicon micromachining in many applications. However, most of the previous studies focus on ns lasers at visible or ultraviolet (UV) wavelengths. The research is very limited for ns lasers at infrared (e.g., 1064 nm) wavelengths (which often have the advantage of much lower cost per unit average output power), and the research is even less if the ns laser also has a long pulse duration on the order of ∼100 ns. In this paper, time-resolved observation using an ICCD (intensified charge-coupled device) camera has been performed to understand the physical mechanism of silicon ablation by 200-ns and 1064-nm laser pulses. This kind of work has been rarely reported in the literature. The research shows that for the studied conditions, material removal in laser silicon ablation is realized through surface vaporization followed by liquid ejection that occurs at a delay time of around 200-300 ns. The propagation speed is on the order of ∼1000 m/s for laser-induced plasma (ionized vapor) front, while it is on the order of ∼100 m/s or smaller for the front of ejected liquid. It has also been found that the liquid ejection is very unlikely due to phase explosion, and its exact underlying physical mechanism requires further investigations.