A study on dielectric characteristics of fluorinated polyimide thin film

In this work, the effects of fluorination of polyimide thin films on surface and dielectric characteristics were studied using X-ray photoelectron spectroscopy (XPS) and dielectric spectrometry, respectively. The thermal and mechanical properties of the film were characterized by thermogravimetric analysis (TGA) and tensile strengths, respectively. The fluorine content of the polyimide thin film was increased with increasing treatment concentration, resulting in decreasing dielectric constant of the film. It was found that the replacement of fluorine led to the decrease of the local electronic polarizability of polyimide, or to the increase of the free volume, which can be attributed to the relatively large size of fluorine. Nevertheless, the fluorination did not significantly affect thermal or mechanical properties of the polyimide film under mild conditions in this system.     

A study of atmospheric-pressure CHF3/Ar plasma treatment on dielectric characteristics of polyimide films

In this work, the influence of atmospheric-pressure CHF(3)/Ar plasma treatment on surface dielectric properties of polyimide films was investigated using X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM), and contact angle measurements. The dielectric characteristics of the films were studied using a dielectric spectrometer. From the results, it was found that the plasma treatment introduced fluorine functional groups onto the polyimide surfaces. F 1s/C 1s ratios of the polyimides were enhanced with the increase of plasma treatment time. Consequently, the fluorine groups led to a decrease of the surface free energy and dielectric constant of the polyimide films, which can largely be attributed to the decrease of the deformation polarizability or London dispersive component of surface free energy of the solid surface studied.     

含氟丙烯酸酯共聚乳液及其膜表面特性的研究

以十二烷基硫酸钠 (SDS)和OP 10混合乳化剂 ,制备了甲基丙烯酸全氟辛基乙酯 (FMA8) 甲基丙烯酸丁酯 (BMA) 甲基丙烯酸 (MAA)共聚乳液 .通过DSC、FT IR、1 H NMR对共聚物的结构、组成进行了表征研究 .采用JZHY 180界面张力仪研究了共聚乳液膜表面的性质 ,结果表明 ,随着共聚物中全氟单体含量的增加 ,共聚物膜的表面能显著降低 ,当全氟单体的含量达到 2 5wt %时 ,其表面能降低到 19 74mJ m2 .X ray光电子能谱(XPS)对共聚物表面原子组成的分析结果表明 ,共聚物表面氟的含量远高于其平均含量 ,证明了含氟基团的趋表现象 .经退火处理 ,共聚物膜表面的氟含量增加 ,表面自由能降低     

A simple approach toward low‐dielectric polyimide nanocomposites: Blending the polyimide precursor with a fluorinated polyhedral oligomeric silsesquioxane

This article describes a new and simple method for preparing polyimide nanocomposites that have very low dielectric constants and good thermal properties: simply through blending the polyimide precursor with a fluorinated polyhedral oligomeric silsesquioxane derivative, octakis(dimethylsiloxyhexafluoropropyl) silsesquioxane (OF). The low polarizability of OF is compatible with polyimide matrices, such that it can improve the dispersion and free volume of the resulting composites. Together, the higher free volume and lower polarizability of OF are responsible for the lower dielectric constants of the PI‐OF nanocomposites. This simple method for enhancing the properties of polyimides might have potential applicability in the electronics industry. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 6296–6304, 2008     

Effect of atmospheric-pressure plasma on adhesion characteristics of polyimide film

In this work, the effect of atmospheric-pressure plasma treatments on surface properties of polyimide film are investigated in terms of X-ray photoelectron spectroscopy (XPS), contact angles, and atomic force microscopy (AFM). The adhesion characteristics of the film are also studied in the peel strengths of polyimide/copper film. As experimental results, the polyimide surfaces treated by plasma lead to an increase of oxygen-containing functional groups or the polar component of the surface free energy, resulting in improving the adhesion characteristics of the polyimide/copper foil. Also, the roughness of the film surfaces, confirmed by AFM observation, is largely increased. These results can be explained by the fact that the atmospheric-pressure plasma treatment of polyimide surface yields several oxygen complexes in hydrophobic surfaces, which can play an important role in increasing the surface polarity, wettability, and the adhesion characteristics of the polyimide/copper system.     

Highly Transparent and Colorless Polyimide Film with Low Dielectric Constant by Introducing Meta-substituted Structure and Trifluoromethyl Groups

An effective design strategy for preparing highly transparent polyimide film with low dielectric constant is presented. The key to the strategy is to simultaneously introduce meta-substituted structure and trifluoromethyl in polymer chains. By using this design strategy, a highly transparent polyimide film with low-k was synthesized from 3,5-diaminobenzotrifluoride(m-TFPDA) and 4,4′-(hexafluoroisopropylidene)diphthalic anhydride(6 FDA) through a two-step method. The obtained m-TFPDA/6 FDA(CPI) film(～30 μm) possesses high optical transparency(λ_(cutoff)=334 nm, T_(450nm)=85.26%, Haze=0.31) and is close to colorless(L*=96.03, a*=-0.34, b*=2.12, yellow index=3.96). The intrinsic k and dielectric loss value of the film are 2.27 and 0.0013 at 10 kHz, respectively. More importantly, such low dielectric performance could remain stable up to280 °C, and the film shows a low moisture rate(～0.51%), which helps to maintain the low-k property stability in different humid environments.Meanwhile, the film also shows good thermal stability and mechanical properties, with a glass transition temperature(T_g) of 296 °C and the 5 wt%decomposition temperature(T_(d,5%)) of 522 °C under N_2. The tensile strength and tensile modulus of the film are 85.1 MPa and 1.96 GPa,respectively. In addition, the film is soluble in common solvents, which allows simple solution processing and low-cost, continuous roll-to-roll processes. This design strategy is beneficial to improving the transparency, lightening yellow color, lowering the dielectric constant and meanwhile maintaining the comprehensive properties of polyimide films, which is mainly due to the introduced meta-substituted and trifluoromethyl structures effectively inhibiting the transfer of charge transfer complex(CTC) effects and increasing the free volume of film. This design strategy could also be extended to other high-performance polymer systems.     

Dielectric properties of oxydianiline‐based polyimide thin films according to the water uptake

For polyimide thin films, the dielectric properties were investigated with the capacitance and optical methods. The dielectric constants of the 4,4′‐oxydianiline (ODA)‐based polyimide thin films varied from 2.49 to 3.10 and were in the following decreasing order: 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA)–ODA > 1,2,4,5‐benzenetetracarboxylic dianhydride (PMDA)–ODA > 4,4′‐hexafluoroisopropylidene diphthalic dianhydride (6FDA)–ODA. According to the absorption of water, the diffusion coefficients in the films varied from 4.8 × 10^?10 to 7.2 × 10^?10 cm²/s and were in the following increasing order: BPDA–ODA < PMDA–ODA < 6FDA–ODA. The dielectric constants and diffusion coefficients of the polyimides were affected by the morphological structures, including the molecular packing order. However, because of the water uptake, the changes in the dielectric constants in the polyimide thin films varied from 0.49 to 1.01 and were in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. Surprisingly, 6FDA–ODA with bulky hexafluoroisopropylidene groups showed less of a change in its dielectric constant than PMDA–ODA. The total water uptake for the polyimide thin films varied from 1.43 to 3.19 wt % and was in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. This means that the changes in the dielectric constants in the polyimide thin films were significantly related to the morphological structure and hydrophobicity of hexafluoroisopropylidene groups. Therefore, the morphological structure and chemical affinity in the polyimide thin films were important factors in controlling the dielectric properties. © 2002 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 40: 2190–2198, 2002     

高耐热、低介电常数含氟聚酰亚胺材料的合成与性能研究

合成了一系列新型含氟耐高温、低介电常数聚酰亚胺 (PI)材料 ,并对其进行了热性能、电性能等方面的测试 .结果表明 ,这类分子结构中含吡啶环单元的材料可保持PI固有的耐热性能 ,其在氮气下的热分解温度为 5 4 5～ 6 0 1℃ ;而侧链的双三氟甲基取代结构一方面使分子具有较高的氟含量 ,另一方面增大了分子的自由体积 ,这两方面的共同作用使得这类材料具有优良的介电性能 ,其介电常数为 2 86～ 2 91;击穿电压为15 0 4～ 197 3kV mm .     

UV-curable low surface energy fluorinated polycarbonate-based polyurethane dispersion

UV-curable low surface energy fluorinated polycarbonate-based polyurethane dispersions were synthesized by incorporating a hydroxy-terminated perfluoropolyether (PFPE) into the soft segment of polyurethane. The effects of the PFPE content on the UV-curing behavior, physical, surface, thermal properties and refractive index were investigated. The UV-curing behavior was analyzed by photo-differential scanning calorimetry. The surface free energy of the UV-cured film, which is related to the water or oil repellency, was calculated from contact angle measurements using the Lewis acid-base three liquids method. The surface free energy decreased significantly with increasing fluorine concentration because PFPE in the soft segment was tailored to the surface and produced a UV-cured film with a hydrophobic fluorine enriched surface, as confirmed by X-ray photoelectron spectroscopy. With increasing the fluorine content, the refractive indices of UV-cured films decreased. However, the UV-curing rate and final conversion was decreased with increasing contents of PFPE, which resulted in the decrease of the glass transition temperature (T(g)), crosslink density, tensile strength and surface hardness.     

PREPARATION OF POLYIMIDE-BaTiO3 HYBRID FILMS BY A DISPERSION PROCESS AND THEIR MICROSTRUCTURE*

 Barium titanate (BaTiO₃) powders with particle sizes of 30～50 nm were prepared from barium stearate, titanium alkoxides and stearic acid by stearic acid-gel method. Dispersing the agglomerate of BaTiO₃ nanoparticles into poly(amic acid) solution followed by curing led to the formation of polyimide hybrid films. The hybrid films were transparent and well distributed with BaTiO3 nanoparticles when the BaTiO₃ content was less than 1 wt%. Highly loaded hybrid film containing 30 wt % BaTiO₃ was tough, had a smooth surface and possessed much higher dielectric and piezoelectric constants than the parent polyimide.     

Biasing effect of non-conductive solids in x-ray photoelectron spectra

The effect of biasing the sample holder was investigated in a range of ?300 to +300 V, in order to study the surface charging of non-conductive samples. Shifts in kinetic energies of photoelectron and peak broadening were compared to the dielectric constants and the volume resistivity of the solid.     

The Effect of –(C6F4)– on the Surface Free Energy of Main‐Chain Liquid Crystalline and Crystalline Polymers

Novel fluorinated main‐chain liquid‐crystalline/crystalline polymers were prepared through thin film polymerization to investigate the effect of –(C₆F₄)– on the surface free energy. The fluorine in the phenyl rings does not lower the total surface free energy of the thin copolymer films, compared to those without fluorine. Interestingly, the Lewis acid components (γ⁺) of the surface free energy of the fluorine‐containing polymers increase with an increase in the –(C₆F₄)– content, indicating the increasing electron accepting character of the surface.     

Photo-induced liquid crystal alignment on polyimide containing fluorinated groups

Polyimides were prepared from pyromellitic dianhydride, 4,4'-bis[2-(4-aminophenyl)hexafluoroprop-2-yl]diphenyl ether and 4,4'-diamodiphenyl ether (PMDA-BDAF-ODA) and used for liquid crystal alignment using linearly polarized UV exposure. The alignment properties of a LC on the polyimide films were found to depend on the fluorine content in the PMDA-BDAF-ODA alignment layer and on the UV exposure time. Pretilt angles were obtained in the range 0° to 90° dependent upon the fluorine content in the polyimide film and the UV exposure time. These effects seem to be closely related to the surface energy of the photo-alignment layer.     

Conformational rigidity and dielectric properties of polyimides

On the basis of two series of polyimides it was shown that the conformational rigidity and the presence of side voluminous substituents determine the packing of macromolecular chains in glassy state. The presence of hexafluoroisopropylidene groups leads to the increase of free volume of polymers due to the repulsion of such groups belonging to different macromolecular chains. The physical properties studied here, such as dielectric permittivity and electrets properties depend on the size of free volume. The normalized surface potential is determined by the mass fraction of fluorine content and by the conformational rigidity of those polymers.     

Preparation and dielectric properties of polyimide foams containing crosslinked structures

In order to obtain cellular materials with low dielectric properties, crosslinked polyimide foams were prepared using 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA), 4,4′‐oxydianiline (ODA) and 2,4,6‐triaminopyrimidine (TAP) as monomer via a poly(ester‐amine salt) precursor process. The structures of the precursors and the polyimide foams were characterized by thermogravimetric analysis (TGA) and FT‐IR, while the morphologies of the polyimide foams were viewed from scanning electron microscopy (SEM) measurements. The results revealed that the poly(ester‐amine salt) precursor containing TAP could successfully be converted to a crosslinked polyimide foam with relatively uniform cell structure. Also, the crosslinking of TAP improved the mechanical properties of foams in comparison with the non‐crosslinking systems. With increasing content of TAP, the dielectric constants of the polyimide foams decreased gradually. For the foam with TAP molar ratio at 15%, the dielectric constant was as low as 1.77 at the frequency of 10 kHz. Though the thermal resistance decreased slightly for crosslinked foams, the decomposition temperatures were still maintained above 520°C. Copyright © 2006 John Wiley & Sons, Ltd.     

基于多层结构设计的高储能密度氧化石墨烯/聚酰亚胺复合材料

采用逐层涂布、 分层控制固化程度的方法, 利用聚酰胺酸(PAA, 聚酰亚胺前体)溶液和含有氧化石墨烯（GO）的PAA溶液制备了一系列由高绝缘性PI层与GO@PI介电层交替组合而成的界面清晰且紧密衔接的多层复合薄膜. 通过调控介电层中GO含量及分层结构, 使多层复合薄膜兼具高介电常数和高击穿强度特征. 结果表明, 三层复合薄膜PI/1.0GO@PI/PI的击穿强度为261.5 kV/mm, 储能密度达到1.27 J/cm³, 与相同介电层厚度的单层薄膜相比, 击穿强度和储能密度分别提高了97%和144%, 同时, 其介电损耗也保持在较低水平(tanδ=0.0079). 绝缘层和高介电常数层的协同作用提升了氧化石墨烯/聚酰亚胺复合薄膜的储能密度. 这种简单的多层结构设计有利于氧化石墨烯/聚合物复合材料在介质储能领域的应用.     

Fluorinated polyimide/POSS hybrid polymers with high solubility and low dielectric constant

A series of fluorinated polyimide/POSS hybrid polymers(FPI-4-FPI-16) were prepared via a facile synthetic route using 2,2'-bis(trifluoromethyl)benzidine, 4,4'-oxydiphthalic dianhydride and monofunctional POSS as starting materials. The hybrid polymers showed excellent solubility and film formation ability. Flexible and robust hybrid films could be conveniently obtained via solution-casting. The hybrid films demonstrated low dielectric constants and high thermal stability. Their dielectric constants were in the range of 2.47–2.92 at 1 MHz measured for their capacitance, and were tunable and decreased with an increase of POSS content. Their 10% weight loss temperatures were in the range of 539-591 ℃ and the weight residual at 800 ℃ ranged from 48% to 53% in nitrogen atmosphere. These hybrid films also possessed good mechanical properties and hydrophobic characteristics. This work could provide a potential strategy for the preparation of fluorinated polyimide/POSS hybrid polymers.     

A study of the transition of liquid-crystal alignment from homeotropic to planar on a polyimide layer

The alignment of nematic liquid crystals by rubbed polyimide surfaces has been well-studied and developed. A novel polyimide film which induced a homeotropic alignment of the nematic liquid crystal without rubbing or with weak rubbing strength was presented. However, there was a transition from homeotropic to planar alignment of the nematic liquid crystal after strong rubbing. In order to study the transition, the polyimide surface was investigated by atomic force microscopy, surface free energy measurement and angle-resolved analysis X-ray photo-electron spectroscopy before and after rubbing with a velvet fabric. It was found that both the change of surface polarity and surface morphology were not the reasons for the transition. The droop of the side chain on the polyimide surface after the rubbing treatment was detected by angle-resolved analysis X-ray photo-electron spectroscopy. Owing to the special structure of the novel polyimide, the X-ray photo-electron spectroscopy was successfully used for the first time to analyse the conformational change of the side chain of a polymer. In conclusion, the transition of nematic liquid crystal alignment from homeotropic to planar after rubbing was influenced by the side chain conformation of the polyimide.     

Atomic beam-induced fluorination of polyimide and its application to site-selective Cu metallization

Metallization methods of polyimide by hyperthermal atomic oxygen and atomic fluorine beams were developed. An atomic fluorine beam with a translational energy of 6.2 eV modified the wettability of polyimide surfaces to provide an advancing water contact angle of 132 degrees. It was confirmed that in-air storage for 2 months did not alter the hydrophobic property created by the atomic fluorine beam. This stable beam-induced surface fluorination technique was then applied to site-selective electroless Cu plating on polyimide. It was demonstrated that changing the exposure sequence could create both positive- and negative-type plating processes.     

Synthesis of Low Dielectric Constant Polyetherimide Films

As the demand for downsizing in microelectronics is increasing, devices require material with lower dielectric constant accordingly. The dielectric constants for most polyimide (PI), including polyetherimide (PEI), films are ∼3.5. In this study, we modified the PEI by incorporating various monomers (fluorinated dianhydride 6FDA and phenylene ether diamines) to reduce the dielectric constant. The dielectric constants of synthesized PEIs decreased with increasing amounts of 6FDA content and phenylene ether units. The T_g decreased gradually with PEI containing longer phenylene ether units, but increased with the content of 6FDA. The thermal decomposition temperatures at 10% weight loss were ∼550 °C, indicating that these PEIs have high thermal stability. Both the tensile strength and the modulus decreased with the PEI containing longer phenylene ether units. The PEI synthesized with 40% 6FDA dianhydride and 1,4-bis(4-aminophenoxy)benzene (pBAB) diamine has the lowest dielectric constant of 2.78 at 1 MHz.