沉积温度和快速退火对磁控溅射法制备的AZO薄膜性能的影响

探究了不同衬底温度下由磁控溅射法制备的氧化锌掺铝(AZO)薄膜的结构、光学和电学性能,以及快速退火处理对样品电学性能的改善作用.实验结果表明:随着衬底温度的升高,薄膜样品的载流子浓度、霍尔迁移率和电导率提高,并在400℃附近达到较好水平,但高温的衬底沉积出的样品薄膜的XRD图谱半高全宽相对于低温衬底并没有明显变小.测量退火处理后的样品薄膜的电学性质,发现短时间的真空退火能改善低温沉积的AZO薄膜的电导率,与提高衬底温度有类似的改善效果,700℃的退火温度能达到最好效果.     

退火氛围对掺杂ZnO薄膜磁性的影响

采用直流磁控反应共溅法制备了非磁性元素Al和磁性元素Co掺杂的ZnO薄膜, 样品原位真空退火后再空气退火处理. 利用X射线衍射仪(XRD) 和物理性能测量仪(PPMS) 对薄膜的结构和磁性进行了表征. XRD和PPMS结果表明, 不同的退火氛围对掺杂薄膜的结构和磁性有着很大的影响. 真空退火的Al掺杂ZnO薄膜没有观察到铁磁性, 而空气退火的样品却显示出明显的室温铁磁性, 铁磁性的来源与空气退火后导致Al和ZnO基体间电荷转移增强有关. 而对于Co掺杂ZnO薄膜, 真空退火后再空气退火, 室温铁磁性明显减弱. 其磁性变化与Co离子和ZnO基体间电荷转移导致磁性增强和间隙Co原子被氧化导致磁性减弱有关.     

金属有机物化学气相沉积法生长Ga2(1-χ)In2χO3薄膜的结构及光电性能研究

采用金属有机物化学气相沉积(MOCVD)法在蓝宝石(0001)衬底上制备出了Ga2(1-χ)In2χO3(χ=0.1-0.9)薄膜,研究了薄膜的结构、电学和光学特性以及退火处理对薄膜性质的影响.测量结果表明:当In组分χ=0.2时,样品为单斜β-Ga2O3,结构;χ=0.5的样品,薄膜呈现非晶结构,退火处理后薄膜结构得到明显的改善,由非晶结构转变为具有(222)单一取向的立方In2O3结构;对于χ=0.8,薄膜为立方In2O3,结构,退火后薄膜的晶体质量得到提高.在可见光区薄膜本身的透过率均达到了85%以上,带隙宽度随样品中Ga含量的改变在3.76-4.43 eV之间变化,且经退火处理后带隙宽度明显增大.     

退火对多晶ZnO薄膜结构与发光特性的影响

用射频反应溅射法在Si（111）衬底上制备了C轴取向的多晶ZnO薄膜，通过不同温度的退火处理，研究了退火对多晶ZnO薄膜结构和发光特性的影响.由x射线衍射得知，随退火温度的升高，晶粒逐渐变大，薄膜中压应力由大变小至出现张应力.光致发光测量发现，样品在430nm附近有一光致发光峰, 峰的强度随退火温度升高而减弱，联合样品电阻率随退火温度升高而逐渐变大的测量及能级图，推测出ZnO薄膜中的蓝光发射主要来源于锌填隙原子缺陷能级与价带顶能级间的跃迁. 关键词： ZnO薄膜 退火 光致发光 射频反应溅射     

退火温度对硼掺杂纳米金刚石薄膜微结构和p型导电性能的影响

采用热丝化学气相沉积法制备硼掺杂纳米金刚石 (BDND) 薄膜, 并对薄膜进行真空退火处理, 系统研究退火温度对BDND薄膜微结构和电学性能的影响. Hall效应测试结果表明掺B浓度为5000 ppm (NHB) 的样品的电阻率较掺B浓度为500 ppm (NLB) 的样品的低, 载流子浓度高, Hall迁移率下降. 1000 ℃退火后, NLB和NHB 样品的迁移率分别为53.3和39.3 cm²·V^-1·s^-1, 薄膜的迁移率较未退火样品提高, 电阻率降低. 高分辨透射电镜、紫外和可见光拉曼光谱测试结果表明, NLB样品的金刚石相含量较NHB样品高, 高的硼掺杂浓度使薄膜中的金刚石晶粒产生较大的晶格畸变. 经1000 ℃退火后, NLB和NHB薄膜中纳米金刚石相含量较未退火时增大, 说明薄膜中部分非晶碳转变为金刚石相, 为晶界上B扩散到纳米金刚石晶粒中提供了机会, 使得纳米金刚石晶粒中B浓度提高, 增强纳米金刚石晶粒的导电能力, 提高薄膜电学性能. 1000 ℃退火能够恢复纳米金刚石晶粒的晶格完整性, 减小由掺杂引起的内应力, 从而提高薄膜的电学性能. 可见光Raman光谱测试结果表明, 1000℃退火后, Raman谱图中反式聚乙炔 (TPA) 的1140 cm^-1峰消失, 此时薄膜电学性能较好, 说明TPA减少有利于提高薄膜的电学性能. 退火后金刚石相含量的增大、金刚石晶粒的完整性提高及TPA含量的大量减少有利于提高薄膜的电学性能. 关键词： 硼掺杂纳米金刚石薄膜 退火 微结构 电学性能     

钙钛矿薄膜的微结构和光电特性优化

分别以纯二甲基甲酰胺、纯二甲基亚砜以及二者不同比例的混合物作为前驱体溶剂,制备钙钛矿薄膜样品.将薄膜样品分为两组,分别将其置于氮气氛围中进行热退火和二甲基亚砜蒸汽氛围中进行溶剂退火,并对薄膜样品的微观结构和光电特性进行系统研究分析.结果表明,与热退火相比,经溶剂退火后样品的平均晶粒尺寸和均匀性显著提升,从而减小了薄膜中晶粒边界或界面的体积分数.采用混合前驱体溶剂和后续溶剂退火增加了薄膜的厚度和可见光的利用率,有效改善了薄膜形貌,优化了结晶质量.同时薄膜光致发光强度的增加,表明薄膜缺陷态密度降低.采用优化后的钙钛矿薄膜作为吸收层制备太阳电池,其光电转换效率达到15.7%.     

NiFe2O4外延薄膜的制备及后退火效应研究

本文利用脉冲激光沉积方法制备了NiFe2O4磁性绝缘薄膜.X-射线衍射线性扫描测量表明,在MgO(110)单晶衬底上可以生长出高质量的NiFe2O4外延薄膜,原子力显微镜显示其具有平整的表面形貌.我们还研究了后退火处理对样品结构、表面形貌和磁性的影响.结果表明,后退火后薄膜的结构和表面形貌都发生了明显的改变,样品的磁性得到增强.这些效应可归结为在氧气氛下退火处理导致的氧含量的变化以及退火过程中阳离子分布和价态发生改变.     

不同退火温度下晶化硅薄膜的电学输运性质

采用等离子体化学气相沉积技术制备氢化非晶硅薄膜,经过不同温度下的热退火处理,使薄膜由非晶结构向晶化结构转变,得到含有纳米晶粒的晶化硅薄膜.在晶化过程中,采用Raman技术对样品的结构进行表征.通过变温电导率的测试,对薄膜的电学输运性质进行了分析.研究结果表明：退火温度为700 ℃时,样品中开始有纳米晶形成,随着退火温度的增加,样品的晶化比增大,在1000 ℃时,薄膜的晶化比达到90%以上.在700 ℃退火时,薄膜中晶化成分较低,载流子的传输特性主要受到与硅悬挂键有关的缺陷态影响,表现为带尾定域态的跳跃电导 关键词： 氢化非晶硅 退火 纳米硅 电输运     

高温退火对非晶CNx薄膜场发射特性的影响

采用射频磁控溅射方法在纯N2气氛中沉积了非晶CNx薄膜样品,并在真空中退火至900 ℃.对高温退火引起的CNx薄膜化学成分、键合结构及其场发射特性方面的变化进行研究.用傅里叶变换红外光谱和x射线光电子能谱分析样品的内部成分及键合结构的变化,其中sp2键及薄膜中N的含量与薄膜的场发射特性密切相关.退火实验的结果表明高温退火可以导致CNx薄膜中N含量大量损失,并在薄膜中形成大量sp2键,这些化学成分及键合结构上的变化将直接影响CNx薄膜的场发射特性.与其他温度退火样品相比,750 ℃退火的样品具有最低的阈值电场,显示出较好的场发射特性.     

氧离子注入纳米金刚石薄膜的微结构和电化学性能研究

在纳米金刚石薄膜中注入剂量为1012cm-2的氧离子,并进行700,800,900和1000?C的真空退火处理,系统研究薄膜的微结构和电化学性能结果表明,氧离子注入未退火(O120)和氧离子注入1000?C退火(O121000)电极的电势窗口分别为4.60 V和3.61 V,远大于其他电极的电势窗口,并且这两个样品的电极传质效率较高,说明氧离子注入和高温退火有利于提高电极的传质效率.红外光谱测试表明,样品O120和O121000的表面没有碳氢基团终止层,而其他样品均含有氢终止层,说明氧离子注入和高温退火破坏了薄膜表面含碳氢基团的氢终止层,提高了薄膜的电化学性能Raman光谱测试结果表明,金刚石含量较高、内应力较小和非晶石墨相无序化程度较大的样品具有较好的电化学性能;并且薄膜晶界处的非晶碳的团簇数量或者尺寸减小,样品的电化学性能提高.     

Comparison of implantation and diffusion behavior of Ti, Sb and N in ion-implanted single crystal and polycrystalline ZnO: A SIMS study

Implantation and diffusion behavior of Sb, Ti and N in ZnO single crystal and sputter deposited thin films were studied through secondary ion mass spectrometric studies on ion-implanted and thermally annealed samples. Sb was implanted and Ti and N were co-implanted into ZnO single crystals and polycrystalline thin films on Si substrates at room temperature. The implanted samples were then annealed at 800 °C. Depth profiles of implant distributions before and after annealing were examined by Secondary Ion Mass Spectrometry (SIMS). As expected, implant range is sensitive to the mass of the dopants; and the dopant distribution is broadened as implanted elements migrate deeper into the film on thermal annealing. While diffusion of N in the ZnO thin film is not significant, Ti tends to diffuse deeper into the sample during annealing. For Ti and N co-implanted single crystal, annealing induced diffusion causes more redistribution of the lighter N than Ti. In general, implanted dopants diffuse more easily in thin films compared to the single crystal due to the presence of grain boundaries in the latter.     

热退火对Mn离子注入非故意掺杂GaN微结构、光学及磁学特性的影响

通过Mn离子注入非故意掺杂GaN外延层制备了GaN:Mn薄膜,并研究了退火温度对GaN:Mn薄膜的微结构、光学及磁学特性的影响.对不同退火温度处理后的GaN:Mn薄膜的拉曼谱测试显示,出现了由与离子注入相关的缺陷的局域振动(LV)和(Ga,Mn)N中Mn离子的LV引起的新的声子模.在GaN:Mn薄膜的光致发光谱中观察到位于2.16,2.53和2.92 eV处的三个新发光峰(带),其中位于2.16 eV处的新发光带不能排除来自Mn相关辐射复合的贡献.对GaN:Mn薄膜的霍尔测试显示,退火处理后样品表现出n型体材料特征.对GaN:Mn薄膜的振动样品磁强计测试显示,GaN:Mn薄膜具有室温铁磁性,其强弱受Mn相关杂质带中参与调节磁相互作用的空穴浓度的影响.     

退火处理对磁控溅射制备LaCoO_3薄膜性能的影响

采用磁控溅射法在硅衬底上制备了LaCoO_3(LCO)薄膜,研究了退火温度对LCO薄膜组织结构、表面形貌及热电特性的影响,并利用X射线衍射仪、原子力显微镜(AFM)、激光导热仪等对LCO薄膜的晶体结构、表面形貌、热扩散系数等进行测量与表征.结果表明:退火温度对LCO薄膜的结晶度、晶粒尺寸和薄膜表面形貌都有较大影响;退火前后LCO薄膜的热扩散系数都随温度的升高而减小,且变化速率逐渐减缓; LCO薄膜的热扩散系数随退化温度的升高先增大后减小.LCO薄膜经过700℃退火后得到最佳的综合性能,其薄膜表面致密、平整,结晶质量最好,热扩散系数最小,热电性能最好.     

Post-annealing influence on properties of N-In codoped ZnO thin films prepared by ion beam enhanced deposition method

N-In codoped ZnO thin films were prepared by ion beam enhanced deposition method (IBED) and were annealed in nitrogen and oxygen ambient after deposition. The influence of post-annealing on structure, electrical and optical properties of thin films were investigated. As-deposited and all post-annealed samples showed preferential orientation along (0 0 2) plane. Electrical property studies indicated that the as-deposited ZnO film showed p-type with a sheet resistance of 67.5 kΩ. For ZnO films annealed in nitrogen with the annealing temperature increasing from 400 to 800 °C, the conduction type of the ZnO film changed from p-type to n-type. However, for samples annealed in oxygen the resistance increased sharply even at a low annealing temperature of 400 °C and the conduction type did not change. Room temperature PL spectra of samples annealed in N₂ and in O₂ showed UV peak located at 381 and 356 nm, respectively.     

Near-field scanning microwave microscope application on Cu-phthalocyaninethin-film organic field-effect transistor

By the standard vacuum evaporation technique Cu(II)-phthalocyanine (Cu-Pc) thin films have been fabricated. For the samples, prepared at room temperature and post-annealed from 100°C to 350°C temperatures, optical spectra in the visible and near IR ranges have been measured. By using nondestructive near-field scanning microwave microscopy organic field-effect transistor (OFET) based on Cuphthalocyanine thin films have been investigated. The changes of crystal structure of Cuphthalocyanine thin film from the α- to the β-phase were controlled by the temperature of annealing. The values of holes’ mobility and the electroconductivity of Cu-phthalocyanine thin films have been obtained depending on the annealing temperature.     

Non-vacuum, single-step conductive transparent ZnO patterning by ultra-short pulsed laser annealing of solution-deposited nanoparticles

A solution-processable, high-concentration transparent ZnO nanoparticle (NP) solution was successfully synthesized in a new process. A highly transparent ZnO thin film was fabricated by spin coating without vacuum deposition. Subsequent ultra-short-pulsed laser annealing at room temperature was performed to change the film properties without using a blanket high temperature heating process. Although the as-deposited NP thin film was not electrically conductive, laser annealing imparted a large conductivity increase and furthermore enabled selective annealing to write conductive patterns directly on the NP thin film without a photolithographic process. Conductivity enhancement could be obtained by altering the laser annealing parameters. Parametric studies including the sheet resistance and optical transmittance of the annealed ZnO NP thin film were conducted for various laser powers, scanning speeds and background gas conditions. The lowest resistivity from laser-annealed ZnO thin film was about 4.75×10⁻² Ω cm, exhibiting a factor of 10⁵ higher conductivity than the previously reported furnace-annealed ZnO NP film and is even comparable to that of vacuum-deposited, impurity-doped ZnO films within a factor of 10. The process developed in this work was applied to the fabrication of a thin film transistor (TFT) device that showed enhanced performance compared with furnace-annealed devices. A ZnO TFT performance test revealed that by just changing the laser parameters, the solution-deposited ZnO thin film can also perform as a semiconductor, demonstrating that laser annealing offers tunability of ZnO thin film properties for both transparent conductors and semiconductors.     

KTN thin films prepared by pulsed laser deposition on transparent single crystal quartz(100)

Using the Sol-Gel method to produce the KTN ultrafine powder and the sintering technique with K2O atmosphere to prepare KTN ceramics as the targets instead of the KTN single crystal, highly oriented KTN thin films were produced on the transparent single crystal quartz (100) by the pulsed laser deposition (PLD). Since the thermal stress sustained by the quartz is relatively small, the limit temperature of the quartz substrates (300℃) is much lower than that of the P-Si substrates (560℃); the prepared thin film is at amorphous state. Increasing the pulsed laser energy density in the process incorporated with annealing the film after deposition at different temperatures converts the amorphous films into crystal. The optimal pulsed laser energy density and annealing temperature were 2.0 J/cm2 and 600℃, respectively. A discussion was made to understand the mechanism of film production at relatively low substrate temperature by PLD and effects of the annealing temperatures on the forming of the perovskite p     

退火温度和Ga含量对溶液法制备InGaZnO薄膜晶体管性能的影响

采用溶液法在玻璃衬底上制备InGaZnO薄膜,并以InGaZnO为沟道层制备底栅顶接触型薄膜晶体管,研究了退火温度和Ga含量对InGaZnO薄膜和晶体管电学性能的影响.研究表明,退火可以明显改善溶液法制备InGaZnO薄膜晶体管的电学性能.退火温度的升高会导致薄膜晶体管阈值电压的负向漂移,并且饱和迁移率和电流开关比增大.X射线光电子能谱测量表明,随退火温度的增加,InGaZnO薄膜表面吸附氧减少,沟道层中氧空位增多导致电子浓度增大.退火温度为380?C时,晶体管获得最佳性能.饱和迁移率随Ga含量的增加而减小.In:Ga:Zn摩尔比为5:1.3:2时,晶体管达到最佳性能:饱和迁移率为0.43 cm~2/(V·s),阈值电压为1.22 V,开关电流比为4.7×10~4,亚阈值摆幅为0.78 V/decade.